Power module and power conversion device

Abstract

The utility model provides a power module and an electric power conversion device with the same. The power module comprises a first device group, a second device group, a third device group, a first heat dissipation plate and a second heat dissipation plate. The second device group and the third device group are electrically connected with the first device group. The first device group is arranged on one side of the first heat dissipation plate in the thickness direction, the second device group and the third device group are respectively arranged on two opposite sides of the second heat dissipation plate in the thickness direction, and the first heat dissipation plate and the second heat dissipation plate are arranged at an included angle. According to the arrangement mode, the plurality of heat dissipation plates and the plurality of device groups are arranged compactly, the space utilization rate is high, the circuit transmission efficiency is high, the resistance is small, and the stray inductance is small.

Description

Technical Field

[0001] The utility model relates to the technical field of power electronics, and in particular, to a power module and a power conversion device having the same. Background Art

[0002] A power conversion device can realize the conversion between direct current and alternating current and is popular in power application scenarios such as power generation, power transmission, and power consumption. For example, a power conversion device can be applied to an electric vehicle and play a role between a battery system and a power grid / load. A power module is the core part of a power conversion device and is composed of a plurality of device groups. During operation, heat is generated by the device groups. To avoid overheating, the device groups are installed on a heat sink. In the conventional power module, the arrangement of the device groups and the heat sink is not reasonable enough, resulting in an insufficiently compact arrangement and a small space utilization rate. Summary of the Utility Model

[0003] In view of this, the utility model provides a power module and a power conversion device having the same to solve the problem of insufficiently compact arrangement and small space utilization rate caused by the unreasonable arrangement of the device groups and the heat sink.

[0004] The power module provided by the embodiment of the utility model includes a first device group, a second device group, and a third device group, and both the second device group and the third device group are electrically connected to the first device group. The power module further includes: a first heat sink, on one side of the first heat sink in the thickness direction, the first device group is installed; and a second heat sink, on opposite sides of the second heat sink in the thickness direction, the second device group and the third device group are respectively installed. The first heat sink and the second heat sink are arranged at an angle.

[0005] In a possible implementation manner, the first device group and the second heat sink are located on the same side of the first heat sink in the thickness direction.

[0006] In a possible implementation manner, the power module further includes a bus bar, the bus bar provides a first DC terminal, a second DC terminal, and a third DC terminal, and the second heat sink is located between the first heat sink and the bus bar. The first device group is electrically connected to an AC terminal, the second device group is electrically connected to the first DC terminal and the second DC terminal, and the third device group is electrically connected to the second DC terminal and the third DC terminal.

[0007] In a possible implementation manner, the second heat sink is inclined towards the first heat sink in a direction away from the bus bar.

[0008] In a possible implementation manner, the second heat sink and the first heat sink have an included angle α, and the included angle α satisfies: 110°≤α≤160°. Preferably, the included angle α satisfies: 130°≤α≤140°.

[0009] In a possible implementation, the power module further includes a first row and a second row that respectively connect the second device group and the third device group to the first device group. The first row includes a first A bending portion, a first B bending portion, and a first C bending portion that are sequentially connected. The second row includes a second A bending portion and a second B bending portion that are connected. The first A bending portion and the second A bending portion are both parallel to the first heat sink and are both connected to the first device group. The first C bending portion and the second B bending portion are both parallel to the second heat sink. The first C bending portion is connected to the second device group, and the second B bending portion is connected to the third device group. The first A bending portion and the second A bending portion both extend beyond the second heat sink along a direction away from the bus bar.

[0010] In a possible implementation, the second heat sink is arranged at an angle to the bus bar.

[0011] In a possible implementation, the second heat sink and the bus bar have an included angle β, and the included angle β satisfies: 20° ≤ β ≤ 70°. Preferably, the included angle β satisfies: 40° ≤ β ≤ 50°.

[0012] In a possible implementation, the power module further includes a third row and a fourth row that respectively connect the second device group and the third device group to the bus bar. The third row includes a third A bending portion, a third B bending portion, and a third C bending portion that are sequentially connected. The fourth row includes a fourth A bending portion and a fourth B bending portion that are connected. The third A bending portion and the fourth A bending portion are both parallel to the bus bar. The third C bending portion and the fourth B bending portion are both parallel to the second heat sink. The third A bending portion and the fourth A bending portion both extend beyond the second heat sink along a direction away from the first heat sink.

[0013] In a possible implementation, the first heat sink and the second heat sink are arranged perpendicular to each other.

[0014] In a possible implementation, the power module further includes a first row and a second row that respectively connect the second device group and the third device group to the first device group. The first row includes a first A bending portion, a first B bending portion, a first C bending portion, and a first D bending portion that are sequentially connected. The second row includes a second A bending portion, a second B bending portion, a second C bending portion, and a second D bending portion that are sequentially connected. The first A bending portion and the second A bending portion are both parallel to the first heat sink and are connected to the first device group. The first B bending portion and the second B bending portion are parallel to the second heat sink and extend between the first heat sink and the second heat sink. The first C bending portion and the second C bending portion extend towards opposite sides along the thickness direction of the second heat sink. The first D bending portion and the second D bending portion are both parallel to the second heat sink and are respectively connected to the second device group and the third device group.

[0015] In a possible implementation, the first heat dissipation plate has opposite first and second ends along its width direction, the first end is closer to the second heat dissipation plate than the second end, and the second heat dissipation plate has opposite first and second sides along its thickness direction. Wherein, in the width direction of the first heat dissipation plate, the first end of the first heat dissipation plate is located between the first side and the second side of the second heat dissipation plate.

[0016] In a possible implementation, the power module further includes a bus bar, the bus bar provides a first DC terminal, a second DC terminal, and a third DC terminal, and the second heat dissipation plate is parallel to the bus bar. The first device group is electrically connected to the AC terminal, the second device group is electrically connected to the first DC terminal and the second DC terminal, and the third device group is electrically connected to the second DC terminal and the third DC terminal.

[0017] In a possible implementation, the power module further includes a third wire row, a fourth wire row, and a conductive post. The third wire row and the fourth wire row respectively connect the second device group and the third device group to the conductive post. The conductive post is connected to the bus bar and perpendicular to the bus bar. The third wire row includes a 3A bending portion, a 3B bending portion, and a 3C bending portion connected in sequence. The fourth wire row includes a 4A bending portion, a 4B bending portion, and a 4C bending portion connected in sequence. The 3A bending portion and the 4A bending portion are parallel to the second heat dissipation plate and connected to the conductive post. The 3B bending portion and the 4B bending portion extend along the thickness direction of the second heat dissipation plate towards opposite sides. The 3C bending portion and the 4C bending portion are both parallel to the second heat dissipation plate and respectively connected to the second device group and the third device group.

[0018] In a possible implementation, the power module further includes a bus bar, the bus bar provides a first DC terminal, a second DC terminal, and a third DC terminal, and the second heat dissipation plate is perpendicular to the bus bar. The first device group is electrically connected to the AC terminal, the second device group is electrically connected to the first DC terminal and the second DC terminal, and the third device group is electrically connected to the second DC terminal and the third DC terminal.

[0019] In a possible implementation, the power module further includes a third wire row and a fourth wire row. The bus bar includes a main body portion and a connection portion. The main body portion is perpendicular to the second heat dissipation plate, and the connection portion is bent towards the side where the second heat dissipation plate is located to be parallel to the second heat dissipation plate. The third wire row and the fourth wire row respectively connect the second device group and the third device group to the connection portion. The third wire row includes a 3A bending portion, a 3B bending portion, and a 3C bending portion connected in sequence. The fourth wire row includes a 4A bending portion, a 4B bending portion, and a 4C bending portion connected in sequence. The 3A bending portion and the 4A bending portion are parallel to the second heat dissipation plate and connected to the connection portion. The 3B bending portion and the 4B bending portion extend along the thickness direction of the second heat dissipation plate towards opposite sides. The 3C bending portion and the 4C bending portion are both parallel to the second heat dissipation plate and respectively connected to the second device group and the third device group.

[0020] In a possible implementation, the first device group, the second device group, and the third device group are all IGBT device groups, and each IGBT device group includes a plurality of parallel-connected IGBT devices.

[0021] On the other hand, the present utility model further provides a power conversion device, which is characterized by comprising a cabinet body, and a DC fuse, a DC disconnector, a power module, a reactor, an AC filter capacitor, and an AC circuit breaker that are housed in the cabinet body and connected in sequence. The power module is the power module described above.

[0022] According to the power module and the power conversion device provided by the utility model, a plurality of heat dissipation plates and a plurality of device groups are arranged in a relatively compact manner, and the space utilization rate is relatively high. In addition, according to this arrangement method, the distance from the second device group to the first device group and the distance from the third device group to the first device group are short and relatively close, and the lengths of the first row and the second row are short and relatively close, so that the circuit transmission efficiency is high, the resistance is small, and the stray inductance is small. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 FIG. is a schematic structural diagram of a power module according to an embodiment of the present utility model.

[0024] Figure 2 For Figure 1 the power module, a schematic structural diagram observed from another viewing direction.

[0025] Figure 3 For Figure 1 the power module, an exploded schematic diagram.

[0026] Figure 4 For Figure 1 the power module, a schematic structural diagram of the heat dissipation plate and the device group.

[0027] Figure 5 For Figure 1 the power module, a schematic structural diagram of the heat dissipation plate and the heat dissipation plate from another perspective.

[0028] Figure 6 For Figure 2 a partial enlarged view of the power module in

[0029] Figure 7 For Figure 2 another partial enlarged view of the power module in

[0030] Figure 8 FIG. is a schematic structural diagram of a power module according to another embodiment of the present utility model.

[0031] Figure 9 FIG. is a schematic structural diagram of a power module according to another embodiment of the present utility model. Detailed Implementation Modes

[0032] Many specific details will be listed below to provide an understanding of the structure, function, and use of the embodiments described in the specification and shown in the drawings. It can be understood that the embodiments described and shown herein are non-limiting examples, so it can be recognized that the specific structural and functional details disclosed herein can be representative and illustrative. Without departing from the scope of the claims, these embodiments can be modified and changed.

[0033] <Exemplary Power Module>

[0034] An embodiment of the present utility model provides a power module 10. For ease of understanding, the overall structure of the power module 10 will be exemplified below. It should be understood that the structure of the power module 10 should not be limited to the following description. For example, one or several of the elements (components or parts) introduced below can be omitted or replaced, and the layout relationship between them can be replaced.

[0035] Reference Figures 1 to 5 , the power module 10 may include a busbar 11, a plurality of capacitors 12, a plurality of device groups 13, a plurality of AC terminals 14, a plurality of busbars 15, a plurality of gate plates 16, and a plurality of heat dissipation plates 17.

[0036] The busbar 11 can provide a plurality of DC terminals. For example, the plurality of DC terminals may include a first DC terminal, a second DC terminal, and a third DC terminal. For example, the first DC terminal may be the P extreme, the second DC terminal may be the O extreme, and the third DC terminal may be the N extreme. The P extreme can be connected to the positive pole of the DC power supply or DC load in the energy storage system. The N extreme can be connected to the negative pole of the DC power supply or DC load. The O extreme can be connected to the neutral point in the energy storage system, that is, the O extreme can be grounded.

[0037] By way of example only, as Figure 3 shown, the busbar 11 may include stacked first plate 11-1, second plate 11-2, and third plate 11-3. The second plate 11-2 may be located between the first plate 11-1 and the third plate 11-3. The third plate 11-3 may be located on the side of the first plate 11-1 away from the three heat dissipation plates 17. The first plate 11-1 can provide the N extreme, the second plate 11-2 can provide the O extreme, and the third plate 11-3 can provide the P extreme.

[0038] A plurality of capacitors 12 can be connected to the bus bar 11. In particular, a plurality of capacitors 12 can be directly mounted on the bus bar 11 on a side opposite to the two heat dissipation plates 17 in the thickness direction of the bus bar 11. The plurality of capacitors 12 can help maintain the voltage stability when the working current fluctuates, reduce the influence of the current on the voltage, and avoid faults such as overvoltage or undervoltage. In addition, the plurality of capacitors 12 can filter out noise and interference signals, smooth the current, and improve the working stability and performance.

[0039] As Figure 4 and Figure 5 shown, a plurality of device groups 13 can include a plurality of first device components 13a, a plurality of second device groups 13b, and a plurality of third device groups 13c. One first device component 13a, one second device group 13b, and one third device group 13c can form a phase unit. Each phase unit can be connected to the P extreme end of the bus bar 11, the N extreme end of the bus bar 11, the O extreme end of the bus bar 11, and an AC terminal 14.

[0040] As an example, the power module 100 can include three phase units, which can be respectively connected to three AC terminals 14a - c. Through the corresponding AC terminals 14, each phase unit is connected to one of the three phases of the AC power supply or the AC load in the energy storage system. For example, the AC terminal 14a can be connected to the U phase of the AC power supply or the AC load, the AC terminal 14b can be connected to the V phase of the AC power supply or the AC load, and the AC terminal 14c can be connected to the W phase of the AC power supply or the AC load.

[0041] Between the device groups 13 and between the device groups 13 and the bus bar 11 can be electrically connected through the wire rows 15. For example, the second device group 13b can be electrically connected to the first device group 13a through the first wire row 15a, the third device group 13c can be electrically connected to the first device group 13a through the second wire row 15b, the second device group 13b can be electrically connected to the bus bar 11 through the third wire row 15c, and the third device group 13c can be electrically connected to the bus bar 11 through the fourth wire row 15d.

[0042] By way of example only, the second device group 13b can be connected to the P extreme end and the O extreme end of the bus bar 11 through the third wire row 15c, and the third device group 13c can be connected to the N extreme end and the O extreme end of the bus bar 11 through the fourth wire row 15d. By way of example only, the third wire row 15c can include two stacked wire boards, and the second device group 13b can be respectively connected to the P extreme end and the O extreme end through these two wire boards; similarly, the fourth wire row 15d can also include two stacked wire boards, and the third device group 13c can be respectively connected to the N extreme end and the O extreme end through these two wire boards.

[0043] The gate plate 16 may also be referred to as a drive plate. The plurality of gate plates 16 are used to control the plurality of device groups 13 respectively. During the operation of the power module 10, the plurality of gate plates 16 convert the control signal into a drive signal, and the drive signal acts on the gates of the plurality of device groups 13 to control the on and off of the plurality of device groups 13, thereby realizing power conversion from DC to AC or from AC to DC.

[0044] During operation, the device group 13 generates heat. To avoid overheating, the device group 13 is mounted on a heat sink 17. For example, the heat sink 17 can be implemented as a liquid cooling plate, which can have a flow path for a coolant to flow through, so that the heat is removed by the flowing coolant. Of course, other types of heat sinks 17 such as air-cooled heat sinks with heat dissipation fins or gas-liquid phase change plates are foreseeable.

[0045] The power module 100 may include two heat sinks 17, namely a first heat sink 17a and a second heat sink 17b. The two heat sinks 17 have the same length direction, that is, Figure 2 The direction perpendicular to the paper is also Figure 4 and Figure 5 The three phase units can be arranged along the length direction of the two heat sinks 17. For ease of understanding, Figure 4 and Figure 5 In the figure, different phase units are separated by dot-dash lines.

[0046] By way of example only, refer to Figure 4 and Figure 5 Each device group 13 may include a plurality of devices 131 connected in parallel, and the plurality of devices 131 may be arranged along the length direction of the heat sink 17. As an example, the device 131 may be an IGBT device. It is understood that the IGBT device mentioned in this article may be the same as the previous IGBT device. For the purpose of brevity, the structure and working principle of the IGBT device will not be described in detail in this article.

[0047] Understandably, although Figure 4 and Figure 5 In the embodiment, each device group 13 includes four devices 131, but in other embodiments of the present invention, each device group 13 may include other numbers of devices 131. For example, in some examples, each device group 13 may include two, three, five or more devices 131.

[0048] As discussed above, each phase unit includes three device groups 13, namely a first device group 13a, a second device group 13b and a third device group 13c. The following describes the arrangement of the three device groups 13 of the same phase unit on the heat sink 17.

[0049] refer toFigure 2 and 3 ,a first device group 13a is mounted on one side in the thickness direction of a first heat dissipation plate 17a, a second device group 13b and a third device group 13c are respectively mounted on opposite sides in the thickness direction of a second heat dissipation plate 17b, and the first heat dissipation plate 17a and the second heat dissipation plate 17b can be arranged at an angle to each other.

[0050] According to this arrangement method, multiple heat dissipation plates and multiple device groups are arranged relatively compactly, and the space utilization rate is relatively high. In addition, according to this arrangement method, the distance from the second device group 13b to the first device group 13a and the distance from the third device group 13c to the first device group 13a are short and relatively close, and the lengths of the first row 15a and the second row 15b are short and relatively close, so that the circuit transmission efficiency is relatively high, the resistance is small, and the stray inductance is small.

[0051] Continue to refer to Figure 2 and Figure 3 ,the first device group 13a and the second heat dissipation plate 17b can be located on the same side in the thickness direction of the first heat dissipation plate 17a. In this way, the second device group 13b, the third device group 13c and the first device group 13a will be located on the same side in the thickness direction of the first heat dissipation plate 17a, which helps to shorten the distance from the second device group 13b and the third device group 13c to the first device group 13a and shorten the lengths of the first row 15a and the second row 15b, thereby further improving the circuit transmission efficiency, reducing the resistance and reducing the stray inductance.

[0052] Continue to refer to Figure 2 and Figure 3 ,the second heat dissipation plate 17b can be located between the first heat dissipation plate 17a and the bus bar 11. Accordingly, the distances from the second device group 13b and the third device group 13c to the bus bar 11 and to the first device group 13a are both short. Therefore, this arrangement method helps to shorten the lengths of the row 15 connected between the two device groups 13 and the row 15 connected between the bus bar 11 and the device group 13, thereby further improving the circuit transmission efficiency, reducing the resistance and reducing the stray inductance.

[0053] Continue to refer to Figure 2 and Figure 3 ,the second heat dissipation plate 17b can be inclined towards the first heat dissipation plate 17a along the direction away from the bus bar 11. From Figure 2From this perspective, the second heat dissipation plate 17b can gradually incline downward and then gradually to the left. If the first heat dissipation plate 17a and the second heat dissipation plate 17b are arranged in parallel, the distance from the second device group 13b to the first device group 13a is relatively large, and the distance from the third device group 13c to the first device group 13a is relatively small. The difference between the two distances is large, which will result in a large difference in the lengths of the first row of lines 15a and the second row of lines 15b, increasing the stray inductance. In contrast, in the embodiment of the present utility model, since the second heat dissipation plate 17b is arranged to incline towards the first heat dissipation plate 17a along the direction away from the bus bar 11, the distance from the second device group 13b to the first device group 13a will be shortened, and the distance from the third device group 13c to the first device group 13a will be increased. The difference between the two distances is small, and the difference in the lengths of the first row of lines 15a and the second row of lines 15b will be small, resulting in a lower stray inductance.

[0054] Continuing to refer to Figure 2 and Figure 3 , the first heat dissipation plate 17a and the second heat dissipation plate 17b can have an included angle α, and the included angle α can satisfy 110° ≤ α ≤ 160°. If the included angle α is too large, the first heat dissipation plate 17a and the second heat dissipation plate 17b are close to being arranged in parallel; as discussed above, this will result in a large difference in the lengths of the first row of lines 15a and the second row of lines 15b, increasing the stray inductance. If the included angle α is too small, that is, close to 90°, the distance from the second device group 13b to the first device group 13a is relatively small, and the distance from the third device group 13c to the first device group 13a is relatively large. The difference between the two distances is large, which will result in a large difference in the lengths of the first row of lines 15a and the second row of lines 15b, increasing the stray inductance. Setting the included angle α to satisfy the above range of the embodiment of the present utility model helps to ensure that the difference in the lengths of the first row of lines 15a and the second row of lines 15b is small, thereby helping to reduce the stray inductance.

[0055] Preferably, the included angle α can satisfy 130° ≤ α ≤ 140°. In this way, the lengths of the first row of lines 15a and the second row of lines 15b can be further made to tend to be the same, so as to further reduce the stray inductance.

[0056] More preferably, the included angle α can satisfy α = 135°. In this way, the lengths of the first row of lines 15a and the second row of lines 15b can be further made to tend to be the same, so as to further reduce the stray inductance.

[0057] Alternatively, the included angle α can also be any value among 115°, 120°, 125°, 145°, and 155°.

[0058] Continuing to refer to Figure 2 and Figure 3, the second heat dissipation plate 17b can be arranged at an angle with respect to the bus bar 11. If the second heat dissipation plate 17b is arranged parallel to the bus bar 11, the distance from the second device group 13b to the bus bar 11 (for example, the distance to the conductive post 111 of the bus bar 11) is relatively large, and the distance from the third device group 13c to the bus bar 11 is relatively small. The difference between the two distances is large, which will result in a large difference in the lengths of the third wire row 15c and the fourth wire row 15d, increasing the stray inductance. In contrast, in the embodiment of the present utility model, since the second heat dissipation plate 17b is arranged at an angle with respect to the bus bar 11, the distance from the second device group 13b to the bus bar 11 will be shortened, and the distance from the third device group 13c to the bus bar 11 will be increased. The difference between the two distances is small. Accordingly, the difference in the lengths of the third wire row 15c and the fourth wire row 15d will be small, which helps to further reduce the stray inductance.

[0059] Continuing to refer to Figure 2 , the second heat dissipation plate 17b and the bus bar 11 may have an included angle β, and the included angle β satisfies: 20° ≤ β ≤ 70°. If the included angle β is too small, the second heat dissipation plate 17b is close to being arranged parallel to the bus bar 11; as discussed above, this will result in a large difference in the lengths of the third wire row 15c and the fourth wire row 15d, increasing the stray inductance. If the included angle β is too large, that is, close to 90°, the distance from the second device group 13b to the bus bar 11 is small, and the distance from the third device group 13c to the bus bar 11 is large. The difference between the two distances is large, which will result in a large difference in the lengths of the third wire row 15c and the fourth wire row 15d, increasing the stray inductance. Setting the included angle β to satisfy the above range of the embodiment of the present utility model helps to ensure that the difference in their lengths is small and reduces the stray inductance.

[0060] Preferably, the included angle β can satisfy 40° ≤ β ≤ 50°. In this way, the lengths of the third wire row 15c and the fourth wire row 15d can be further made to tend to be the same to further reduce the stray inductance.

[0061] More preferably, the included angle β can satisfy β = 45°. In this way, the lengths of the third wire row 15c and the fourth wire row 15d can be further made to tend to be the same to further reduce the stray inductance.

[0062] Alternatively, the included angle β can also be any value among 25°, 35°, 40°, 50°, 55°, and 65°.

[0063] Refer to Figure 2 and Figure 6, the first row of conductors 15a may include successively connected first A bending portions 151a, first B bending portions 152a, and first C bending portions 153a, and the second row of conductors 15b may include connected second A bending portions 151b and second B bending portions 152b. Both the first A bending portions 151a and the second A bending portions 151b are parallel to the first heat sink 17a and are both connected to the first device group 13a. Both the first C bending portions 153a and the second B bending portions 152b are parallel to the second heat sink 17b. The first C bending portions 153a are connected to the second device group 13b, and the second B bending portions 152b are connected to the third device group 13c. Both the first A bending portions 151a and the second A bending portions 151b extend beyond the second heat sink 17b along the direction away from the bus bar 11.

[0064] According to this structure, the lengths of the first row of conductors 15a and the second row of conductors 15b are shorter and closer, which helps to improve the circuit transmission efficiency, reduce the resistance, and reduce the stray inductance. Additionally, according to this structure, the second heat sink 17b will not block the first A bending portions 151a and the second A bending portions 151b, enabling the first A bending portions 151a and the second A bending portions 151b to be more conveniently connected to the first device group 13a, for example, by fasteners such as screws.

[0065] Reference Figure 2 and Figure 7 , the third row of conductors 15c includes successively connected third A bending portions 151c, third B bending portions 152c, and third C bending portions 153c, and the fourth row of conductors 15d includes connected fourth A bending portions 151d and fourth B bending portions 152d. Both the third A bending portions 151c and the fourth A bending portions 151d are parallel to the bus bar 11 and are both connected to the bus bar 11 (for example, to the conductive posts 111 of the bus bar 11). Both the third C bending portions 153c and the fourth B bending portions 152d are parallel to the second heat sink 17b. The third C bending portions 153c are connected to the second device group 13b, and the fourth B bending portions 152d are connected to the third device group 13c. Both the third A bending portions 151c and the fourth A bending portions 151d extend beyond the second heat sink 17b along the direction away from the first heat sink 17a.

[0066] According to this structure, the lengths of the third row of conductors 15c and the fourth row of conductors 15d are shorter and closer, which helps to improve the circuit transmission efficiency, reduce the resistance, and reduce the stray inductance. Additionally, according to this structure, the second heat sink 17b will not block the third A bending portions 151c and the fourth A bending portions 151d, enabling the third A bending portions 151c and the fourth A bending portions 151d to be more conveniently connected to the bus bar 11, for example, by fasteners such as screws.

[0067] Another embodiment of the present utility model further provides a power module 10a, which is in Figure 8Shown in. The power module 10a is substantially the same as the aforementioned power module 10, with the main differences lying in the positional relationship of the heat dissipation plate 17 and the connection relationship between the device groups 13. The power module 10a will be exemplified below.

[0068] Reference Figure 8 , the first heat dissipation plate 17a and the second heat dissipation plate 17b can be arranged perpendicular to each other, and the second heat dissipation plate 17b can be arranged parallel to the bus bar 11. This arrangement helps to reduce the overall size of the two heat dissipation plates 17 in the direction perpendicular to the bus bar 11 (i.e., Figure 8 the up and down direction in

[0069] Continue to refer to Figure 8 , the first line row 15a can include a first 1A bending portion 151a, a first 1B bending portion 152a, a first 1C bending portion 153a, and a first 1D bending portion 154a connected in sequence, and the second line row 15b can include a second 2A bending portion 151b, a second 2B bending portion 152b, a second 2C bending portion 153b, and a second 2D bending portion 154b connected in sequence. The first 1A bending portion 151a and the second 2A bending portion 151b are both parallel to the first heat dissipation plate 17a and connected to the first device group 13a. The first 1B bending portion 152a and the second 2B bending portion 152b are parallel to the second heat dissipation plate 17b and extend between the first heat dissipation plate 17a and the second heat dissipation plate 17b. The first 1C bending portion 153a and the second 2C bending portion 153b extend along the thickness direction of the second heat dissipation plate 17b towards opposite sides. The first 1D bending portion 154a and the second 2D bending portion 154b are both parallel to the second heat dissipation plate 17b and are respectively connected to the second device group 13b and the third device group 13c.

[0070] According to this structure, the lengths of the first line row 15a and the second line row 15b are shorter and closer, which helps to improve the circuit transmission efficiency, reduce the resistance, and reduce the stray inductance. In addition, according to this structure, there will be sufficient space between the entirety of the first 1A bending portion 151a and the second 2A bending portion 151b and the first 1C bending portion 153a, enabling the first 1A bending portion 151a and the second 2A bending portion 151b to be more conveniently connected to the first device group 13a, for example, through fasteners such as screws.

[0071] Continue to refer to Figure 8, the first heat sink 17a may have opposite first and second ends (i.e., the upper end and the lower end in the figure) along its width direction. The first end may be closer to the second heat sink 17b than the second end. The second heat sink 17b may have opposite first and second sides (i.e., the upper side and the lower side in the figure) along its thickness direction. In the width direction of the first heat sink 17a, that is, in the thickness direction of the second heat sink 17b, which is the up-and-down direction in the figure, the first end of the first heat sink 17a is located between the first and second sides of the second heat sink 17b. According to this configuration, the lengths of the first line row 15a and the second line row 15b can be made to tend to be the same, so as to further reduce the stray inductance.

[0072] Continue to refer to Figure 8 , the third line row 15c and the fourth line row 15d respectively connect the second device group 13b and the third device group 13c to the conductive post 111, and the conductive post 111 is connected to the bus bar 11 and perpendicular to the bus bar 11. The third line row 15c may include a 3A bent portion 151c, a 3B bent portion 152c, and a 3C bent portion 153c connected in sequence. The fourth line row 15d includes a 4A bent portion 151d, a 4B bent portion 152d, and a 4C bent portion 153d connected in sequence. The 3A bent portion 151c and the 4A bent portion 151d are parallel to the second heat sink 17b and connected to the conductive post 111. The 3B bent portion 152c and the 4B bent portion 152d extend along the thickness direction of the second heat sink 17b towards opposite sides. The 3C bent portion 153c and the 4C bent portion 153d are both parallel to the second heat sink 17b and respectively connected to the second device group 13b and the third device group 13c.

[0073] According to this configuration, the lengths of the third line row 15c and the fourth line row 15d are short and relatively close, which helps to improve the circuit transmission efficiency, reduce the resistance, and reduce the stray inductance. In addition, according to this configuration, the second heat sink 17b will not block the 3A bent portion 151c and the 4A bent portion 151d, making it possible to conveniently connect the 3A bent portion 151c and the 4A bent portion 151d to the bus bar 11, for example, by fasteners such as screws.

[0074] Another embodiment of the present invention also provides a power module 10b, which is shown in Figure 9 . The power module 10b is substantially the same as the foregoing power module 10a, and the main difference lies in the positional relationship between the second heat sink 17b and the bus bar 11. The power module 10b will be described by way of example below.

[0075] Refer to Figure 9, the first heat dissipation plate 17a can be perpendicular to the second heat dissipation plate 17b, and the second heat dissipation plate 17b can be perpendicular to the bus bar 11. According to this structure, the first device group 13a, the second device group 13b, the third device group 13c, and the bus bar 11 will be farther away from each other, with less influence on each other, improving the heat dissipation performance, and also providing sufficient layout space for related circuits, such as the circuits connecting the gate plates 16 of each device group 13.

[0076] Continue to refer to Figure 9 , the bus bar 11 can include a main body portion 110 and a connection portion 112. The main body portion 110 can be perpendicular to the second heat dissipation plate 17b, and the connection portion 112 can be bent toward the side where the second heat dissipation plate 17b is located to be parallel to the second heat dissipation plate 17b. The third bus bar 15c and the fourth bus bar 15d respectively connect the second device group 13b and the third device group 13c to the connection portion 112. The third bus bar 15c can include a 3A bending portion 151c, a 3B bending portion 152c, and a 3C bending portion 153c connected in sequence, and the fourth bus bar 15d can include a 4A bending portion 151d, a 4B bending portion 152d, and a 4C bending portion 153d connected in sequence. The 3A bending portion 151c and the 4A bending portion 151d are parallel to the second heat dissipation plate 17b and connected to the connection portion 112. The 3B bending portion 152c and the 4B bending portion 152d extend along the thickness direction of the second heat dissipation plate 17b toward opposite sides. The 3C bending portion 153c and the 4C bending portion 153d are both parallel to the second heat dissipation plate 17b and are respectively connected to the second device group 13b and the third device group 13c.

[0077] According to this structure, the lengths of the third bus bar 15c and the fourth bus bar 15d are shorter and closer, which helps to improve the circuit transmission efficiency, reduce the resistance, and reduce the stray inductance. In addition, according to this structure, the second heat dissipation plate 17b will not block the 3A bending portion 151c and the 4A bending portion 151d, enabling the 3A bending portion 151c and the 4A bending portion 151d to be more conveniently connected to the bus bar 11, such as by fasteners such as screws.

[0078] Continue to refer to Figure 9, the first heat dissipation plate 17a may have opposite first and second ends (i.e., the right end and the left end in the figure) along its width direction. The first end may be closer to the second heat dissipation plate 17b than the second end. The second heat dissipation plate 17b may have opposite first and second sides (i.e., the left side and the right side in the figure) along its thickness direction. In the width direction of the first heat dissipation plate 17a, that is, in the thickness direction of the second heat dissipation plate 17b, that is, the left-right direction in the figure, the first end of the first heat dissipation plate 17a is located between the first side and the second side of the second heat dissipation plate 17b. According to this structure, the lengths of the first line row 15a and the second line row 15b can be made to tend to be the same, so as to further reduce the stray inductance.

[0079] <Exemplary Power Conversion Device>

[0080] The present invention provides a power conversion device. The power conversion device includes a cabinet body, and a DC fuse, a DC disconnector, the power module provided in the foregoing aspect, a reactor, an AC filter capacitor, and an AC circuit breaker that are received in the cabinet body and are connected in sequence.

[0081] It should be understood that the "parallel" and "perpendicular" mentioned herein should be understood as "substantially parallel" and "substantially perpendicular" respectively, and a reasonable error range should be included. For example, the error range can be ±5°.

[0082] It should be understood that the term "including" and its variations used in the embodiments of the present invention are open-ended, that is, "including but not limited to". The term "according to" is "at least partially according to". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least another embodiment".

[0083] It should be understood that although terms such as "first" or "second" may be used in the embodiments of the present invention to describe various elements, for example, the first heat dissipation plate and the second heat dissipation plate, these elements are not set by these terms, and these terms are only used to distinguish one element from another.

[0084] The protection scope of the present invention is not limited to the above embodiments. Any person skilled in the art in the technical field disclosed by the present invention can think of changes or substitutions, which should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A power module, characterized in that, Comprising a first device group, a second device group, and a third device group all electrically connected to the first device group, the power module further includes: A first heat sink, with the first device group mounted on one side in the thickness direction of the first heat sink; and A second heat sink, with the second device group and the third device group respectively mounted on opposite sides in the thickness direction of the second heat sink, and the first heat sink and the second heat sink are arranged at an angle.

2. The power module according to claim 1, characterized in that, The first device group and the second heat sink are located on the same side in the thickness direction of the first heat sink.

3. The power module according to claim 2, characterized in that It further includes a bus bar providing a first DC terminal, a second DC terminal, and a third DC terminal. The second heat sink is located between the first heat sink and the bus bar. Among them, the first device group is electrically connected to an AC terminal, the second device group is electrically connected to the first DC terminal and the second DC terminal, and the third device group is electrically connected to the second DC terminal and the third DC terminal.

4. The power module according to claim 3, wherein The second heat sink is inclined towards the first heat sink in a direction away from the bus bar.

5. The power module according to claim 4, characterized in that, The second heat sink and the first heat sink have an included angle α, and the included angle α satisfies: 110° ≤ α ≤ 160°.

6. The power module according to claim 5, characterized in that, The included angle α satisfies: 130° ≤ α ≤ 140°.

7. The power module according to claim 4, characterized in that It further includes a first wire row and a second wire row respectively connecting the second device group and the third device group to the first device group. The first wire row includes a sequentially connected 1A bending portion, a 1B bending portion, and a 1C bending portion. The second wire row includes a connected 2A bending portion and a 2B bending portion. The 1A bending portion and the 2A bending portion are both parallel to the first heat sink and are both connected to the first device group. The 1C bending portion and the 2B bending portion are both parallel to the second heat sink. The 1C bending portion is connected to the second device group, the 2B bending portion is connected to the third device group, and the 1A bending portion and the 2A bending portion both extend beyond the second heat sink in a direction away from the bus bar.

8. The power module according to claim 3, characterized in that, The second heat sink is arranged at an angle with the bus bar.

9. The power module according to claim 8, characterized in that The second heat sink and the bus bar have an included angle β, and the included angle β satisfies: 20° ≤ β ≤ 70°.

10. The power module according to claim 9, characterized in that, The included angle β satisfies: 40° ≤ β ≤ 50°.

11. The power module according to claim 9, characterized in that, It further includes a third wire row and a fourth wire row respectively connecting the second device group and the third device group to the bus bar. The third wire row includes a sequentially connected 3A bending portion, a 3B bending portion, and a 3C bending portion. The fourth wire row includes a connected 4A bending portion and a 4B bending portion. The 3A bending portion and the 4A bending portion are both parallel to the bus bar. The 3C bending portion and the 4B bending portion are both parallel to the second heat sink. The 3A bending portion and the 4A bending portion both extend beyond the second heat sink in a direction away from the first heat sink.

12. The power module according to claim 1, characterized in that The first heat sink and the second heat sink are arranged perpendicular to each other.

13. The power module according to claim 12, characterized in that, It further includes a first row of leads and a second row of leads that respectively connect the second device group and the third device group to the first device group. The first row of leads includes a 1A bending portion, a 1B bending portion, a 1C bending portion, and a 1D bending portion that are sequentially connected. The second row of leads includes a 2A bending portion, a 2B bending portion, a 2C bending portion, and a 2D bending portion that are sequentially connected. The 1A bending portion and the 2A bending portion are both parallel to the first heat sink and connected to the first device group. The 1B bending portion and the 2B bending portion are parallel to the second heat sink and extend between the first heat sink and the second heat sink. The 1C bending portion and the 2C bending portion extend along the thickness direction of the second heat sink toward opposite sides. The 1D bending portion and the 2D bending portion are both parallel to the second heat sink and are respectively connected to the second device group and the third device group.

14. The power module according to claim 12, characterized in that, The first heat sink has opposite first and second ends along its width direction, and the first end is closer to the second heat sink than the second end. The second heat sink has opposite first and second sides along its thickness direction. Wherein, in the width direction of the first heat sink, the first end of the first heat sink is located between the first side and the second side of the second heat sink.

15. The power module according to claim 12, characterized in that, The power module further includes a bus bar that provides a first DC terminal, a second DC terminal, and a third DC terminal. The second heat sink is parallel to the bus bar. Wherein, the first device group is electrically connected to an AC terminal, the second device group is electrically connected to the first DC terminal and the second DC terminal, and the third device group is electrically connected to the second DC terminal and the third DC terminal.

16. The power module according to claim 15, wherein, It further includes a third row of leads, a fourth row of leads, and conductive posts. The third row of leads and the fourth row of leads respectively connect the second device group and the third device group to the conductive posts. The conductive posts are connected to the bus bar and perpendicular to the bus bar. The third row of leads includes a 3A bending portion, a 3B bending portion, and a 3C bending portion that are sequentially connected. The fourth row of leads includes a 4A bending portion, a 4B bending portion, and a 4C bending portion that are sequentially connected. The 3A bending portion and the 4A bending portion are parallel to the second heat sink and connected to the conductive posts. The 3B bending portion and the 4B bending portion extend along the thickness direction of the second heat sink toward opposite sides. The 3C bending portion and the 4C bending portion are both parallel to the second heat sink and are respectively connected to the second device group and the third device group.

17. The power module according to claim 12, wherein, The power module further includes a bus bar that provides a first DC terminal, a second DC terminal, and a third DC terminal. The second heat sink is perpendicular to the bus bar. Wherein, the first device group is electrically connected to an AC terminal, the second device group is electrically connected to the first DC terminal and the second DC terminal, and the third device group is electrically connected to the second DC terminal and the third DC terminal.

18. The power module according to claim 17, wherein It further includes a third row of wires and a fourth row of wires. The bus bar includes a main body portion and a connecting portion. The main body portion is perpendicular to the second heat sink. The connecting portion is bent towards the side where the second heat sink is located until it is parallel to the second heat sink. The third row of wires and the fourth row of wires respectively connect the second device group and the third device group to the connecting portion. The third row of wires includes a 3A bending portion, a 3B bending portion, and a 3C bending portion connected in sequence. The fourth row of wires includes a 4A bending portion, a 4B bending portion, and a 4C bending portion connected in sequence. The 3A bending portion and the 4A bending portion are parallel to the second heat sink and connected to the connecting portion. The 3B bending portion and the 4B bending portion extend towards opposite sides along the thickness direction of the second heat sink. The 3C bending portion and the 4C bending portion are both parallel to the second heat sink and respectively connected to the second device group and the third device group.

19. The power module according to any one of claims 1 to 18, characterized in that, The first device group, the second device group, and the third device group are all IGBT device groups. Each IGBT device group includes a plurality of parallel-connected IGBT devices.

20. A power conversion device, characterized in that, It includes a cabinet body and a DC fuse, a DC disconnector, a power module, a reactor, an AC filter capacitor, and an AC circuit breaker that are housed in the cabinet body and connected in sequence. The power module is the power module according to any one of claims 1 to 19.

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