Flexible circuit board and pressure sensing unit
By setting a structural reinforcement board and an insulating layer in the flexible circuit board and a conductive via hole between the flexible body, the problem of the flexible circuit board being closed in a certain direction is solved, and the full direction expansion and high adaptability are achieved, and the structural strength and flexibility are enhanced.
Patent Information
- Application Number
- CN202421706210.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-18
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-07-18
AI Technical Summary
The dual-panel or multi-layer board flexible circuit board is closed in one direction, which limits its full-direction expansion and use, resulting in a lower degree of adaptation.
A structural reinforcement plate and an insulating layer are arranged between the flexible main bodies. The insulating layer is located in the circumference of the structural reinforcement plate. The conductive through holes are arranged in the insulating layer or the flexible main body to fit the position. The flexible main body is interconnected by the conductive through holes. The structural reinforcement plate is made of steel plates and other materials. The insulating layer is an epoxy film layer.
The omnidirectional expansion of flexible circuit boards is achieved, the adaptability is improved, so that they can be adapted according to different environments, the structural strength and flexibility are enhanced, and more application scenarios are adapted.
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Figure CN223093944U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of flexible circuit board manufacturing and processing, in particular to a flexible circuit board and a pressure sensing unit. Background Art
[0002] A flexible printed circuit (FPC), also known as a flexible circuit board or a flexible printed circuit board, is favored for its excellent characteristics such as light weight, thin thickness, and free bending and folding.
[0003] During the manufacturing process of a flexible circuit board, a curing board is often added to it, so that the flexible circuit board has a certain strength, combines the advantages of a rigid circuit board and a flexible circuit board, and provides good mechanical properties for the flexible circuit board. According to the number of circuit etching surfaces on the flexible circuit board, it can be divided into a single-sided board, a double-sided board or a multi-layer board.
[0004] Since the curing board is often sandwiched between the plates by folding the plate 180 degrees during manufacturing, the conventional double-sided board is often closed in one direction when provided with a curing board, resulting in the inability of the double-sided board or multi-layer board to meet the full-direction expansion use, limiting the application scenarios and having a low adaptation degree. Summary of the Utility Model
[0005] In order to solve the defect of low adaptation degree of double-sided boards or multi-layer boards, the utility model provides a flexible circuit board and a pressure sensing unit.
[0006] The technical solution adopted by the utility model is that a flexible circuit board includes at least two flexible bodies, and a structure strengthening plate and an insulating layer are press-connected between two adjacent flexible bodies, and the insulating layer is located in the circumferential direction of the structure strengthening plate.
[0007] Preferably, any two flexible bodies are interconnected through conductive through holes at positions outside the structure strengthening plate.
[0008] Preferably, a structure strengthening plate and an insulating layer are press-connected between a part of areas of two adjacent flexible bodies, and the other part of areas are attached to each other.
[0009] Preferably, the conductive through holes are arranged at the position of the insulating layer and / or the position where the two flexible bodies are attached to each other.
[0010] Preferably, the structure strengthening plate is wrapped by the insulating layer, and an insulating layer is press-connected between two adjacent flexible bodies.
[0011] Preferably, a plurality of structure strengthening plates are press-connected between two adjacent flexible bodies.
[0012] Preferably, the structure strengthening plate is a steel plate.
[0013] Preferably, the insulating layer is an epoxy adhesive film layer.
[0014] The present utility model further provides a pressure sensing unit, which includes a flexible circuit board as described above.
[0015] Preferably, the flexible circuit board is connected with a pressure sensing module for identifying external pressure.
[0016] Compared with the prior art, the present utility model has the following beneficial effects:
[0017] The present application discloses a flexible circuit board. The insulating layer is located circumferentially of the structural reinforcement board and is used to prevent current from passing between two adjacent flexible bodies at positions where communication is not required, so that the flexible circuit board can be used normally. By pressing a structural reinforcement board and an insulating layer between two adjacent flexible bodies, it is possible to press the structural reinforcement board through the area between two adjacent flexible bodies instead of clamping the structural reinforcement board between the flexible bodies by folding, so that a closed situation in a certain direction will not occur on the flexible circuit board.
[0018] Compared with the prior art, a flexible circuit board disclosed in the present application can achieve the purpose of improving the adaptation degree.
[0019] The present application also discloses a pressure sensing unit, which includes a flexible circuit board as described above. By using the flexible circuit board, the flexible circuit board can be extended in any direction, so that the pressure sensing unit can be adapted to different environments and its adaptation performance can be improved.
[0020] Compared with the prior art, a pressure sensing unit disclosed in the present application can achieve the purpose of improving the adaptation performance. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The present utility model will be described in detail below with reference to the embodiments and the drawings, wherein:
[0022] Figure 1 FIG. shows a schematic structural diagram of a flexible circuit board provided according to an embodiment of the present utility model;
[0023] Figure 2 FIG. shows a schematic structural diagram of a flexible circuit board provided according to another embodiment of the present utility model;
[0024] Figure 3 FIG. shows a schematic structural diagram of a flexible circuit board provided according to still another embodiment of the present utility model;
[0025] Figure 4 FIG. shows a schematic structural diagram of a flexible circuit board provided according to yet another embodiment of the present utility model.
[0026] Description of reference numerals:
[0027] 10. Flexible body; 20. Structural reinforcement plate; 30. Insulating layer; 40. Conductive via hole. Detailed implementation manners
[0028] To make the objectives, technical solutions and advantages of the present utility model clearer, the following will further describe the implementation manners of the present utility model in detail with reference to the accompanying drawings. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar components or components with the same or similar functions from beginning to end. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present utility model, and cannot be construed as a limitation to the present utility model.
[0029] The present utility model discloses a flexible circuit board. Please refer to Figures 1 to 4 , which includes at least two flexible bodies 10. A structural reinforcement plate 20 and an insulating layer 30 are press-connected between two adjacent flexible bodies 10, and the insulating layer 30 is located in the circumferential direction of the structural reinforcement plate 20.
[0030] The insulating layer 30 is located in the circumferential direction of the structural reinforcement plate 20 and is used to prevent current from passing between two adjacent flexible bodies 10 at positions where connection is not required, so that the flexible circuit board can be used normally. By pressing a structural reinforcement plate 20 and an insulating layer 30 between two adjacent flexible bodies 10, it is possible to press the structural reinforcement plate 20 through the area between two adjacent flexible bodies 10 instead of clamping the structural reinforcement plate 20 between the flexible bodies 10 by folding, so that a situation where a certain direction is closed will not occur on the flexible circuit board. Compared with the prior art, a flexible circuit board disclosed in the present application can achieve the purpose of improving the adaptation degree.
[0031] It should be noted that since the flexible body 10 in the present application does not need to be folded, it is more convenient to realize the length change between different flexible bodies 10 (please refer to Figure 3 ), as well as the change in the bending degree, so as to form flexible circuit boards of different shapes, not limited to flat flexible circuit boards. In addition, different flexible bodies 10 may have different structural features. For example, one flexible body 10 is a single-sided board, and the other flexible body 10 may be a double-sided board, or different treatments may be performed on different flexible bodies 10. That is to say, by setting independent flexible bodies 10, the structure of the flexible circuit board can have more possibilities. If it is folded, the structures above and below the structural reinforcement plate 20 are symmetrically arranged, and obviously, the flexible circuit board cannot form more types of structures.
[0032] For a flexible circuit board formed by at least three flexible bodies 10, an operator can choose whether to set a structural reinforcement plate 20 between two adjacent flexible bodies 10 according to the required structural strength of the flexible circuit board. Taking the flexible circuit board formed by three flexible bodies 10 as an example, if the operator needs a flexible circuit board with higher structural strength, the structural reinforcement plates 20 can be installed between any two adjacent flexible bodies 10. If not, the structural reinforcement plates 20 can be installed between any one pair of adjacent flexible bodies 10.
[0033] Specifically, the multiple flexible bodies 10 are separately arranged from each other, and each component is fixedly connected by an adhesive. When the flexible circuit board does not have conductive vias 40 to conduct between different flexible bodies 10, different flexible bodies 10 can be conducted through external wiring.
[0034] In some embodiments, please refer to Figures 1 to 4 , any two flexible bodies 10 are interconnected through conductive vias 40 at positions outside the structural reinforcement plate 20.
[0035] Specifically, the conductive vias 40 can connect any two flexible bodies 10, whether the two flexible bodies 10 are adjacent or not. When the two flexible bodies 10 are not adjacent, after drilling, insulation treatment can be carried out in the hole, and then copper plating can be carried out, so that the two flexible bodies 10 are electrically connected. In addition, the conductive vias 40 are not set at the position of the structural reinforcement plate 20. On the one hand, the material of the structural reinforcement plate 20 is harder and more difficult to drill. On the other hand, the material of the structural reinforcement plate 20 may not be an insulating material, so it may affect the normal use of the flexible circuit board.
[0036] It should be noted that the structural reinforcement plate 20 can be made of materials such as steel plates, aluminum foil plates, polyester plates, polyimide plates, and fiberglass plates.
[0037] In some specific embodiments, please refer to Figure 1 , a structural reinforcement plate 20 and an insulating layer 30 are crimped between a part of regions of two adjacent flexible bodies 10, and the other part of the regions are attached to each other.
[0038] Specifically, when the flexible circuit board is in use, it is not necessary to install the structural reinforcement plate 20 on the entire area of the flexible circuit board to enhance its structural strength. For example, the structural reinforcement plate 20 is only installed at the position where the flexible circuit board is fixed to other devices, so that the flexible circuit board is more robust at this position and can be better fixed to other devices. In the present application, by fitting two adjacent flexible bodies 10 to each other at the position where the structural reinforcement plate 20 and the insulating layer 30 are not crimped, higher flexibility can still be achieved at the fitting position. In addition, the thickness in this area can also be reduced, so as to adapt to more application scenarios. In other embodiments, there are multiple areas where two adjacent flexible bodies 10 are fitted to each other. For example, the structure of the flexible circuit board is cross-shaped, and the structural reinforcement plate 20 and the insulating layer 30 are crimped at the middle intersection area, and they are fitted to each other at other positions. Thus, more application scenarios can be adapted.
[0039] In some more specific embodiments, the conductive vias 40 are disposed at the position of the insulating layer 30 and / or at the position where two adjacent flexible bodies 10 are fitted to each other.
[0040] It should be noted that in addition to the conductive vias 40 being disposed at the position of the insulating layer 30, the conductive vias 40 can also be disposed at the position where two adjacent flexible bodies 10 are fitted to each other, so that the flexible circuit board can determine where to dispose the conductive vias 40 according to the specific usage situation.
[0041] In some embodiments, please refer to Figure 2 , the structural reinforcement plate 20 is wrapped by the insulating layer 30, and the insulating layer 30 is crimped between two adjacent flexible bodies 10.
[0042] Specifically, to make the installation of the structural reinforcement plate 20 more stable, the structural reinforcement plate 20 can be wrapped by the insulating layer 30 to prevent the adhesive from having a poor bonding effect on the structural reinforcement plate 20 of certain types of materials, resulting in unstable bonding.
[0043] In some embodiments, multiple structural reinforcement plates 20 are crimped between two adjacent flexible bodies 10.
[0044] It should be noted that multiple structural reinforcement plates 20 can be crimped between the same two adjacent flexible bodies 10, so as to be distributed at the positions on the flexible circuit board where the structural strength needs to be enhanced, further improving the adaptability of the flexible circuit board.
[0045] In some embodiments, the structural reinforcement plate 20 is a steel plate.
[0046] Specifically, the steel plate has higher strength. Therefore, a steel plate with a thinner thickness can be selected under the condition of meeting the same structural strength, thereby reducing the thickness of the flexible circuit board to adapt to different application scenarios.
[0047] Preferably, the steel plate is a stainless steel plate, so that rusting will not occur to affect the normal use of the flexible circuit board.
[0048] In some embodiments, the insulating layer 30 is an epoxy adhesive film layer.
[0049] Specifically, by setting the insulating layer 30 as an epoxy adhesive film, on the one hand, insulation protection can be carried out, and on the other hand, it has its own viscosity and does not require an external binder for bonding.
[0050] The present utility model also discloses a pressure sensing unit, including the above flexible circuit board.
[0051] By using the flexible circuit board, the flexible circuit board can be extended in any direction, so that the pressure sensing unit can be adapted according to different environments, improving its adaptability. Compared with the prior art, a pressure sensing unit disclosed in the present application can achieve the purpose of improving the adaptability.
[0052] In some embodiments, the flexible circuit board is connected with a pressure sensing module for identifying external pressure.
[0053] In the description of this specification, if terms such as "Embodiment 1", "this embodiment", "in one embodiment", etc. appear, it means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the utility model or the utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example; moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in an appropriate manner.
[0054] In the description of this specification, terms such as "connection", "installation", "fixation", "setting", "having", etc. are all understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0055] In the description of this specification, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, such that a process, method, article or apparatus comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or apparatus. Without further limitation, an element defined by the statement "comprising an..." does not exclude the existence of additional identical elements in the process, method, article or apparatus comprising said element.
[0056] The above description of the embodiments is for the convenience of those of ordinary skill in the art to understand and apply the technology of this case. It is obvious that those who are familiar with the technology in this field can easily make various modifications to these examples and apply the general principles described herein to other embodiments without creative efforts. Therefore, this case is not limited to the above embodiments, and the following modifications should be within the protection scope of this case: ① A new technical solution implemented based on the technical solution of the present utility model in combination with the existing common knowledge, and the technical effect produced by this new technical solution does not exceed the technical effect of the present utility model; ② An equivalent replacement of some features of the technical solution of the present utility model using well-known technologies, and the technical effect produced is the same as the technical effect of the present utility model; ③ Expansion based on the technical solution of the present utility model, and the substantial content of the expanded technical solution does not exceed the technical solution of the present utility model; ④ An equivalent transformation made using the content of the specification and drawings of the present utility model, directly or indirectly applied in other related technical fields.
Claims
1. A flexible circuit board, characterized in that, Comprising at least two flexible bodies, a structural reinforcement plate and an insulating layer are crimped between two adjacent flexible bodies, and the insulating layer is located circumferentially of the structural reinforcement plate.
2. The flexible circuit board according to claim 1, wherein Any two flexible bodies are interconnected through conductive vias at positions outside the structural reinforcement plate.
3. A flexible circuit board according to claim 2, characterized in that, A part of the regions between two adjacent flexible bodies are crimped with the structural reinforcement plate and the insulating layer, and another part of the regions are in contact with each other.
4. A flexible circuit board according to claim 3, characterized in that, The conductive vias are provided at the position of the insulating layer and / or at the position where the two flexible bodies are in contact with each other.
5. A flexible circuit board according to claim 1, characterized in that, The structural reinforcement plate is wrapped by the insulating layer, and the insulating layer is crimped between two adjacent flexible bodies.
6. A flexible circuit board according to claim 1, wherein A plurality of the structural reinforcement plates are crimped between two adjacent flexible bodies.
7. A flexible circuit board according to any one of claims 1 to 6, characterized in that, The structural reinforcement plate is a steel plate.
8. A flexible circuit board according to any one of claims 1 to 6, characterized in that, The insulating layer is an epoxy film layer.
9. A pressure sensing unit, characterized in that, Comprising a flexible circuit board according to any one of claims 1 to 8.
10. A pressure sensing unit according to claim 9, characterized in that, The flexible circuit board is connected with a pressure sensing module for identifying external pressure.