Double-station laser mass transfer equipment

Abstract

The utility model relates to a double-station laser mass transfer device which comprises a working platform unit, a feeding and discharging assembly and a laser processing light path assembly. The upper working platform assembly and the laser processing light path assembly are both installed on the lower working platform assembly, the upper working platform assembly is located in the middle of the lower working platform assembly in the front-back direction, the laser processing light path assembly is located above the upper working platform assembly, and the ground on the side portion of the lower working platform assembly is provided with the feeding and discharging assembly. According to the utility model, the problem of low efficiency of mass transfer is solved, the processing process is ensured to be continuously carried out, the equipment does not have the conditions of waiting for feeding and taking materials, the productivity of a chip factory is improved, and the cost is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a double-station laser mass transfer device. Background Art

[0002] Laser Mass Transfer Equipment is a key technical equipment in the manufacturing of micro-nano electronic devices such as Micro LED and Mini LED. It plays a crucial role especially in the process of efficiently transferring a large number of tiny LED chips from the growth substrate to the target substrate. With the continuous development of display technology, Micro LED has become a hot spot for the next-generation display technology due to its advantages such as high brightness, high contrast, low power consumption, and long lifespan. However, in the manufacturing process of Micro LED, how to efficiently and accurately transfer millions or even tens of millions of micron-sized LED chips to the driving circuit substrate has become a key bottleneck restricting its mass production. Laser mass transfer technology has emerged under this background, enabling the rapid and large-scale transfer of chips through precise control of lasers.

[0003] Laser Mass Transfer Equipment mainly utilizes the ablation or thermal expansion effect of a laser beam on a specific material layer to separate the chip from the original substrate and transfer it to the target substrate. The specific process includes multiple steps such as laser lift-off, chip pickup, transfer, and positioning. Among them, laser lift-off is achieved by irradiating a laser beam onto a specific layer (such as a sacrificial layer) between the chip and the original substrate, causing it to thermally expand or ablate, thereby separating the chip; chip pickup is to pick up the separated chip using a transfer head or other mechanical devices; transfer and positioning are to accurately place the chip at a specified position on the target substrate and form good electrical connections and mechanical fixings with the circuit.

[0004] After a large number of searches, it is found that the Chinese patent publication number CN217995984U discloses a mass transfer device. To solve the problems of inconvenient loading and unloading and low loading and unloading efficiency caused by existing devices, when loading, the first substrate and the second substrate are placed on a moving mechanism. The moving mechanism can drive the first substrate to move below the adsorption mechanism, and the adsorption mechanism adsorbs the first substrate. The moving mechanism moves the second substrate below the first substrate, and the laser can process the first substrate, so that the chips on the first substrate are transferred to the second substrate. After the transfer is completed, the first substrate and the second substrate are removed simultaneously, which is convenient for loading and unloading. The method of placing two substrates on the same moving mechanism when loading, although solving the problem of non-simultaneous loading and unloading, still has the problem that the processing needs to be paused during the pick-up and placement of materials.

[0005] After a massive search, it is found that the existing Chinese patent publication number is CN114743914A, which discloses a laser lift-off and massive transfer device based on a composite support platform. By means of the rapid macro movement of the upper and lower guide platforms and the use of the magnetic support adjustment platform on the lower platform to achieve high-precision and rapid fine adjustment of the substrate and the glass plate, laser lift-off and massive transfer are achieved under the combined action of the two. Although this method can improve the alignment accuracy of the substrate and the glass plate, it is still insufficient to improve the transfer speed of the chips and cannot meet the production capacity requirements of display panel factories. First, rough alignment and fine alignment in two stages are required to achieve precise positioning; second, after the chip transfer is completed, the processing needs to be paused, and the moving platform has to move from the processing area to the material taking area to complete the material discharging and taking actions, and then return to the processing area to start processing again.

[0006] To improve production efficiency, the transfer device needs to have the ability of rapid transfer to meet the needs of large-scale production. However, currently existing massive transfers all have only one working station. After each processing is completed, the moving mechanism needs to leave the processing position, move to the position for taking and placing the substrate to take and place the materials, and then move back to the processing position for processing. During the entire material taking process, the laser does not perform processing, so it will affect production efficiency. Therefore, the present utility model proposes a dual-station laser massive transfer device to solve the above existing problems.

[0007] In view of the above defects, the designer actively conducts research and innovation in order to create a dual-station laser massive transfer device, making it more valuable in industrial applications. Summary of the Utility Model

[0008] To solve any of the above technical problems, the purpose of the present utility model is to provide a dual-station laser massive transfer device.

[0009] To achieve the above purpose, the present utility model adopts the following technical solutions:

[0010] The dual-station laser massive transfer device includes a working platform unit, a loading and unloading component, and a laser processing optical path component;

[0011] The working platform unit successively includes an upper working platform component and a lower working platform component from top to bottom. The upper working platform component and the laser processing optical path component are both installed on the lower working platform component. The upper working platform component is located in the middle of the lower working platform component along the front-back direction. The laser processing optical path component is located above the upper working platform component. The lower working platform component is installed on the base component, and the base component is located on the ground. Loading and unloading components are arranged on the ground on the side of the lower working platform component;

[0012] The upper working platform assembly includes a support base. The second moving mechanism installed on the support base drives the first moving mechanism to move in the front-rear direction, and the first moving mechanism drives the first adsorption mechanism to move in the left-right direction;

[0013] The first adsorption mechanism includes a bearing plate, and a number of adsorption rings are installed on the bearing plate;

[0014] The lower working platform assembly includes a support platform, and a first bearing platform assembly and a second bearing platform assembly are respectively installed on the front and rear sides of the support platform;

[0015] The first bearing platform assembly includes a third moving mechanism, a fourth moving mechanism, a first lifting mechanism, a first rotating mechanism and a second adsorption mechanism. The third moving mechanism installed on the support platform drives the fourth moving mechanism to move in the front-rear direction, the fourth moving mechanism drives the first lifting mechanism to move in the left-right direction, the first lifting mechanism drives the first rotating mechanism to move in the vertical direction, and the first rotating mechanism drives the second adsorption mechanism to rotate;

[0016] The second adsorption mechanism includes a first substrate adsorption area, and a first loading adsorption area and a first unloading adsorption area located on the left and right sides of the first substrate adsorption area;

[0017] The second bearing platform assembly includes a fifth moving mechanism, a sixth moving mechanism, a second lifting mechanism, a second rotating mechanism and a third adsorption mechanism. The fifth moving mechanism installed on the support platform drives the sixth moving mechanism to move in the front-rear direction, the sixth moving mechanism drives the second lifting mechanism to move in the left-right direction, the second lifting mechanism drives the second rotating mechanism to move in the vertical direction, and the second rotating mechanism drives the third adsorption mechanism to rotate;

[0018] The third adsorption mechanism includes a second substrate adsorption area, and a second loading adsorption area and a second unloading adsorption area located on the left and right sides of the second substrate adsorption area.

[0019] As a further improvement of the present invention, a number of adsorption rings that is a multiple of 3 are installed on the bearing plate.

[0020] As a further improvement of the present invention, an adsorption ring one, an adsorption ring two and an adsorption ring three are sequentially installed on the bearing plate along the front-rear direction.

[0021] As a further improvement of the present invention, the loading and unloading assembly includes a first loading and unloading assembly located in front of the lower working platform assembly, and a second loading and unloading assembly located behind the lower working platform assembly.

[0022] As a further improvement of the present utility model, the first loading and unloading assembly includes a first manipulator, a first wafer cassette, a first substrate cassette, and a first cassette carrier frame. The first wafer cassette and the first substrate cassette are respectively installed inside the first cassette carrier frame. The first manipulator is installed on the lower working platform assembly, and two sets of suction claws adapted to the first wafer cassette and the first substrate cassette are provided on the first manipulator.

[0023] As a further improvement of the present utility model, the second loading and unloading assembly includes a second manipulator, a second wafer cassette, a second substrate cassette, and a second cassette carrier frame. The second wafer cassette and the second substrate cassette are respectively installed inside the second cassette carrier frame. The second manipulator is installed on the lower working platform assembly, and two sets of suction claws adapted to the second wafer cassette and the second substrate cassette are provided on the second manipulator.

[0024] As a further improvement of the present utility model, the laser processing optical path assembly includes a laser, a processing optical path, and an optical support beam. The optical support beam is installed on the lower working platform assembly along the left-right direction, and the laser and a processing optical path adapted to the above-mentioned laser are installed on the optical support beam.

[0025] As a further improvement of the present utility model, it further includes a fine alignment assembly. The fine alignment assembly includes a first fine alignment platform and a second fine alignment platform. The first fine alignment platform is installed on the lower working platform assembly on one side of the first carrier platform assembly, and the second fine alignment platform is installed on the lower working platform assembly on one side of the second carrier platform assembly.

[0026] As a further improvement of the present utility model, the first fine alignment platform includes a first support beam, a first camera, and a first lens. The first support beam is installed on the lower working platform assembly along the left-right direction, and the first camera and a first lens adapted to the above-mentioned first camera are installed on the first support beam; the second fine alignment platform includes a second support beam, a second camera, and a second lens. The second support beam is installed on the lower working platform assembly along the left-right direction, and the second camera and a second lens adapted to the above-mentioned second camera are installed on the second support beam.

[0027] As a further improvement of the present utility model, the base assembly includes a frame. A plurality of floor feet are installed at the bottom of the frame, a vibration isolation pad is installed on the frame, and the support platform is installed on the vibration isolation pad.

[0028] By means of the above solution, the present utility model has at least the following advantages:

[0029] The present utility model solves the problem of low mass transfer efficiency, ensures the continuous progress of the processing process, there is no situation of waiting for loading and unloading materials in the equipment, improves the production capacity of the chip factory, and saves costs;

[0030] The present utility model proposes a new layout of a dual-station platform for laser mass transfer equipment in the field, with a wide range of applicability.

[0031] The present utility model provides a method for transferring wafers of mixed sizes, which is no longer limited to the barrier that only wafers of the same size can be transferred. The wafers can be transferred and processed onto the lower substrate in any combination of 4-inch, 6-inch, or 8-inch wafers, solving the existing practical problems in chip factories.

[0032] The above description is only an overview of the technical solution of the present utility model. In order to better understand the technical means of the present utility model and be able to implement it according to the content of the specification, the following will describe in detail with reference to the preferred embodiments of the present utility model and the accompanying drawings. Brief Description of the Drawings

[0033] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required for the embodiments. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0034] Figure 1 is a schematic structural diagram of a dual-station laser mass transfer device of the present utility model;

[0035] Figure 2 is Figure 1 a schematic structural diagram of the first adsorption mechanism in

[0036] Figure 3 is Figure 1 a schematic structural diagram of the lower working platform assembly in

[0037] Figure 4 is Figure 1 a schematic structural diagram of the first carrier platform assembly in

[0038] Figure 5 is Figure 1 a schematic structural diagram of the second carrier platform assembly in

[0039] Figure 6 is Figure 1 a schematic structural diagram of the first loading and unloading assembly in

[0040] Figure 7 is Figure 1 a schematic structural diagram of the second loading and unloading assembly in

[0041] Figure 8 is Figure 1 a schematic structural diagram of the first fine alignment platform in

[0042] Figure 9 is Figure 1 a schematic structural diagram of the second fine alignment platform in

[0043] Figure 10 is Figure 1 a schematic structural diagram of the base assembly in

[0044] Among them, the meanings of the reference numerals in the figures are as follows.

[0045] Upper working platform assembly 100, lower working platform assembly 200, loading and unloading assembly 300, laser processing optical path assembly 400, fine alignment assembly 500, base assembly 600;

[0046] First adsorption mechanism 110, first moving mechanism 120, second moving mechanism 130, support base 140;

[0047] Carrier plate 111, adsorption ring 112, adsorption ring 113, adsorption ring 114;

[0048] First carrier platform assembly 210, second carrier platform assembly 220, support platform 230;

[0049] Third moving mechanism 211, fourth moving mechanism 212, first lifting mechanism 213, first rotating mechanism 214, second adsorption mechanism 215;

[0050] First substrate adsorption area 2151, first loading adsorption area 2152, first unloading adsorption area 2153;

[0051] Fifth moving mechanism 221, sixth moving mechanism 222, second lifting mechanism 223, second rotating mechanism 224, third adsorption mechanism 225;

[0052] Second substrate adsorption area 2251; second loading adsorption area 2252; second unloading adsorption area 2253;

[0053] First loading and unloading assembly 310, second loading and unloading assembly 320;

[0054] First manipulator 311, first wafer cassette 312, first substrate cassette 313, first cassette carrier rack 314;

[0055] Second manipulator 321, second wafer cassette 322, second substrate cassette 323, second cassette carrier rack 324;

[0056] Laser 410, processing optical path 420, optical support beam 430;

[0057] First fine alignment platform 510, second fine alignment platform 520;

[0058] The first support beam 511, the first camera 512, and the first lens 513;

[0059] The second support beam 521, the second camera 522, and the second lens 523;

[0060] The floor feet 610, the frame 620, and the vibration isolation pad 630. Detailed implementation manners

[0061] The following will further describe in detail the specific implementation manners of the present utility model in conjunction with the accompanying drawings and embodiments. The following embodiments are used to illustrate the present utility model, but are not used to limit the scope of the present utility model.

[0062] In order to enable those skilled in the art of this technology to better understand the solution of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Usually, the components of the embodiments of the present utility model described and shown in the accompanying drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the present utility model claimed, but only represents the selected embodiments of the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of the present utility model.

[0063] As Figures 1 to 10 shown, a double-station laser mass transfer device includes a working platform unit, a loading and unloading component 300, and a laser processing optical path component 400;

[0064] The working platform unit sequentially includes an upper working platform component 100 and a lower working platform component 200 from top to bottom. Both the upper working platform component 100 and the laser processing optical path component 400 are installed on the lower working platform component 200. The upper working platform component 100 is located in the middle of the lower working platform component 200 along the front-back direction. The laser processing optical path component 400 is located above the upper working platform component 100. The lower working platform component 200 is installed on the base component 600. The base component 600 is located on the ground. The loading and unloading component 300 is provided on the ground on the right side of the lower working platform component 200;

[0065] The upper working platform component 100 includes a support base 140. The second moving mechanism 130 installed on the support base 140 drives the first moving mechanism 120 to move in the front-back direction, and the first moving mechanism 120 drives the first adsorption mechanism 110 to move in the left-right direction;

[0066] The first adsorption mechanism 110 includes a carrier plate 111, on which a number of adsorption rings are installed;

[0067] The lower working platform assembly 200 includes a support platform 230, on the front and rear sides of which a first carrier platform assembly 210 and a second carrier platform assembly 220 are respectively installed;

[0068] The first carrier platform assembly 210 includes a third moving mechanism 211, a fourth moving mechanism 212, a first lifting mechanism 213, a first rotating mechanism 214 and a second adsorption mechanism 215. The third moving mechanism 211 installed on the support platform 230 drives the fourth moving mechanism 212 to move in the front-rear direction, the fourth moving mechanism 212 drives the first lifting mechanism 213 to move in the left-right direction, the first lifting mechanism 213 drives the first rotating mechanism 214 to move in the vertical direction, and the first rotating mechanism 214 drives the second adsorption mechanism 215 to rotate;

[0069] The second adsorption mechanism 215 includes a first substrate adsorption area 2151, and a first loading adsorption area 2152 and a first unloading adsorption area 2153 located on the left and right sides of the first substrate adsorption area 2151;

[0070] The second carrier platform assembly 220 includes a fifth moving mechanism 221, a sixth moving mechanism 222, a second lifting mechanism 223, a second rotating mechanism 224 and a third adsorption mechanism 225. The fifth moving mechanism 221 installed on the support platform 230 drives the sixth moving mechanism 222 to move in the front-rear direction, the sixth moving mechanism 222 drives the second lifting mechanism 223 to move in the left-right direction, the second lifting mechanism 223 drives the second rotating mechanism 224 to move in the vertical direction, and the second rotating mechanism 224 drives the third adsorption mechanism 225 to rotate;

[0071] The third adsorption mechanism 225 includes a second substrate adsorption area 2251, and a second loading adsorption area 2252 and a second unloading adsorption area 2253 located on the left and right sides of the second substrate adsorption area 2251.

[0072] Preferably, a number of adsorption rings that is a multiple of 3 are installed on the carrier plate 111.

[0073] Preferably, an adsorption ring one 112, an adsorption ring two 113 and an adsorption ring three 114 are sequentially installed on the carrier plate 111 along the front-rear direction.

[0074] Preferably, the loading and unloading assembly 300 includes a first loading and unloading assembly 310 located in front of the lower working platform assembly 200, and a second loading and unloading assembly 320 located behind the lower working platform assembly 200.

[0075] Preferably, the first loading and unloading assembly 310 includes a first manipulator 311, a first wafer cassette 312, a first substrate cassette 313, and a first cassette carrier rack 314. The first wafer cassette 312 and the first substrate cassette 313 are respectively installed in the first cassette carrier rack 314. The first manipulator 311 is installed on the lower working platform assembly 200. Two sets of suction claws adapted to the first wafer cassette 312 and the first substrate cassette 313 are provided on the first manipulator 311.

[0076] Preferably, the second loading and unloading assembly 320 includes a second manipulator 321, a second wafer cassette 322, a second substrate cassette 323, and a second cassette carrier rack 324. The second wafer cassette 322 and the second substrate cassette 323 are respectively installed in the second cassette carrier rack 324. The second manipulator 321 is installed on the lower working platform assembly 200. Two sets of suction claws adapted to the second wafer cassette 322 and the second substrate cassette 323 are provided on the second manipulator 321.

[0077] Preferably, the laser processing optical path assembly 400 includes a laser 410, a processing optical path 420, and an optical support beam 430. The optical support beam 430 is installed on the lower working platform assembly 200 along the left - right direction. The laser 410 and the processing optical path 420 adapted to the above - mentioned laser 410 are installed on the optical support beam 430.

[0078] Preferably, it further includes a fine alignment assembly 500. The fine alignment assembly 500 includes a first fine alignment platform 510 and a second fine alignment platform 520. The first fine alignment platform 510 is installed on the lower working platform assembly 200 on one side of the first carrier platform assembly 210, and the second fine alignment platform 520 is installed on the lower working platform assembly 200 on one side of the second carrier platform assembly 220.

[0079] Preferably, the first fine alignment platform 510 includes a first support beam 511, a first camera 512, and a first lens 513. The first support beam 511 is installed on the lower working platform assembly 200 along the left - right direction. The first camera 512 and the first lens 513 adapted to the above - mentioned first camera 512 are installed on the first support beam 511; the second fine alignment platform 520 includes a second support beam 521, a second camera 522, and a second lens 523. The second support beam 521 is installed on the lower working platform assembly 200 along the left - right direction. The second camera 522 and the second lens 523 adapted to the above - mentioned second camera 522 are installed on the second support beam 521.

[0080] Preferably, the base assembly 600 includes a frame 620. A plurality of floor feet 610 are installed at the bottom of the frame 620. A vibration isolation pad 630 is installed on the frame 620. The support platform 230 is installed on the vibration isolation pad 630.

[0081] The first embodiment of the present utility model:

[0082] The present utility model relates to a chip mass transfer technology, and particularly to a double-station laser mass transfer device. The device includes an upper working platform assembly 100, a lower working platform assembly 200, a loading and unloading assembly 300, a laser processing optical path assembly 400, a fine alignment assembly 500, and a base assembly 600.

[0083] The upper working platform assembly is fixed on the lower working platform assembly, and the laser processing optical path assembly is also fixed on the lower working platform assembly. The laser processing optical path assembly is located above the upper platform working assembly in the height direction. The lower platform assembly is installed on the base assembly, and the loading and unloading assembly is located on both sides of the lower platform assembly. The fine alignment assembly is fixed on the lower working platform assembly. The base assembly is located on the ground.

[0084] The upper working table assembly 110 includes a first adsorption mechanism 110, a first moving mechanism 120, a second moving mechanism 130, and a support seat 140. The support seat is made of marble or a steel frame and is installed on the support platform of the lower platform assembly. The second moving mechanism is installed on the support seat and provides displacement in the front-rear direction. The second moving mechanism can adopt a mechanism of a linear motor and a linear guide rail slider or a mechanism of a linear motor and an air-floating guide rail. The first moving mechanism is installed below the second moving mechanism in an inverted posture. The first moving mechanism can also adopt a mechanism of a linear motor and a linear guide rail slider or a mechanism of a linear motor and an air-floating guide rail. It provides displacement in the left-right direction, and the moving paths of the first moving mechanism and the second moving mechanism are orthogonal.

[0085] The first adsorption mechanism is installed below the first moving mechanism in an inverted posture. The first adsorption mechanism 110 includes a carrier plate 111, an adsorption ring one 112, an adsorption ring two 113, and an adsorption ring three 114. The number of adsorption rings is N (where N is a positive integer, preferably an integer multiple of 3). Because the wafers to be transferred usually have three types: R, G, and B. The types of adsorption rings include but are not limited to five size types: 4 inches, 6 inches, 8 inches, 10 inches, and 12 inches. There are multiple adsorption ring installation positions on the carrier plate. The adsorption rings are installed on the carrier plate and can be quickly replaced. At the same time, the adsorption rings are equipped with an adjustment mechanism to adjust the coplanarity between the adsorption rings.

[0086] The lower working platform component 200 includes a first carrier platform component 210, a second carrier platform component 220, and a support platform 230. The support platform is made of marble or steel plate. The support platform is installed on the vibration isolation pad of the base component. The first carrier platform component 210 includes a third moving mechanism 211, a fourth moving mechanism 212, a first lifting mechanism 213, a first rotating mechanism 214, and a second adsorption mechanism 215. The second carrier platform component 220 includes a fifth moving mechanism 221, a sixth moving mechanism 222, a second lifting mechanism 223, a second rotating mechanism 224, and a third adsorption mechanism 225.

[0087] The third moving mechanism provides displacement in the front-back direction, and can adopt a mechanism of a linear motor and a linear guide rail slider or a mechanism of a linear motor and an air-floating guide rail. The fourth moving mechanism, which provides displacement in the left-right direction, can adopt a mechanism of a linear motor and a linear guide rail slider or a mechanism of a linear motor and an air-floating guide rail. The first lifting mechanism provides displacement in the up-down direction, and can adopt a lifting table with a wedge block structure or a ball screw structure. The first rotating mechanism provides a rotational movement in the horizontal direction. A DD motor can be adopted. The second adsorption mechanism 215 includes a first substrate adsorption area 2151, a first loading adsorption area 2152, and a first unloading adsorption area 2153. The first substrate adsorption area can be compatible with substrates of 4 - 12 inches. The first loading adsorption area can adsorb wafers of 4 - 8 inches, and the first unloading adsorption area can adsorb wafers of 4 - 8 inches. The third moving mechanism is installed on the support platform. And the third moving mechanism is parallel to the second moving mechanism in the movement path. The fourth moving mechanism is installed on the third moving mechanism, and the movement paths are in an orthogonal relationship. The first lifting mechanism is installed on the fourth moving mechanism, and the first rotating mechanism is installed on the first lifting mechanism. Optionally, the first lifting mechanism and the first rotating mechanism can be combined into one moving mechanism to provide two movements of up-down and horizontal rotation simultaneously. The second adsorption mechanism is installed above the first rotating mechanism. Optionally, the center of the first substrate adsorption area coincides with the center of the first rotating mechanism, and the first loading adsorption area and the first unloading adsorption area are on the sides of the first substrate adsorption area.

[0088] The fifth moving mechanism provides displacement in the front-back direction, and can adopt a mechanism of a linear motor plus a linear guide rail slider or a mechanism of a linear motor plus an air-floating guide rail. The sixth moving mechanism, which provides displacement in the left-right direction, can adopt a mechanism of a linear motor plus a linear guide rail slider or a mechanism of a linear motor plus an air-floating guide rail. The second lifting mechanism provides displacement in the up-down direction, and can adopt a lifting table with a wedge block structure or a ball screw structure. The second rotating mechanism provides a rotational movement in the horizontal direction. A DD motor can be adopted. The third adsorption mechanism 225 includes a second substrate adsorption area 2251, a second loading adsorption area 2252, and a second unloading adsorption area 2253. The second substrate adsorption area can be compatible with substrates of 4-12 inches. The second loading adsorption area can adsorb wafers of 4-8 inches, and the second unloading adsorption area can adsorb wafers of 4-8 inches. The fifth moving mechanism is installed on the support platform. And the fifth moving mechanism is parallel to the second moving mechanism in the movement path. The sixth moving mechanism is installed on the fifth moving mechanism, and the movement paths are in an orthogonal relationship. The second lifting mechanism is installed on the sixth moving mechanism, and the second rotating mechanism is installed on the second lifting mechanism. Optionally, the second lifting mechanism and the second rotating mechanism can be combined into one moving mechanism to provide two movements of up-down and horizontal rotation simultaneously. The third adsorption mechanism is installed above the second rotating mechanism. Optionally, the center of the second substrate adsorption area coincides with the center of the second rotating mechanism, and the second loading adsorption area and the second unloading adsorption area are on the sides of the second substrate adsorption area.

[0089] The loading and unloading assembly 300 includes a first loading and unloading assembly 310 and a second loading and unloading assembly 320. The first loading and unloading assembly 310 includes a first manipulator 311, a first wafer cassette 312, a first substrate cassette 313, and a first cassette carrying rack 314. The second loading and unloading assembly includes a second manipulator 321, a second wafer cassette 322, a second substrate cassette 323, and a second cassette carrying rack 324.

[0090] The manipulators in the first loading and unloading component and the second loading and unloading component are fixed to the lower platform component. The manipulator is equipped with two sets of suction claws. When one set of suction claws picks up wafers or substrates in the loading box, the other set of suction claws can simultaneously pick up the wafers or substrates transported back by the first carrier component and the second carrier component. The cassette carrier racks in the first loading and unloading component and the cassette carrier racks in the second loading and unloading component are respectively fixed to the rack component in the base component. The wafer cassette and the substrate cassette are respectively installed on the cassette carrier rack. The wafer cassette can be compatible with wafers of multiple sizes, and the substrate cassette can be compatible with substrates of multiple sizes. The number of wafer cassettes and substrate cassettes in the first loading and unloading component and the second loading and unloading component is greater than or equal to 1. Preferably, 6 wafer cassettes (2 red wafers, 2 green wafers, 2 blue wafers) are combined with 2 substrate cassettes and distributed to the cassette load-bearing racks in the two loading and unloading components according to the process requirements. According to the different wafer sizes in different batches, in the transfer process, there will also be a combination of 5 wafer cassettes (2 red wafers, 1 green wafer, 2 blue wafers) and 3 substrate cassettes. The combination of the wafer cassette and the substrate cassette can be adjusted at any time according to the actual process needs.

[0091] The laser processing optical path component 400 includes a laser 410, a processing optical path 420, and an optical support beam 430. The processing optical path is installed on the optical support beam, and the optical support beam is installed on the support platform in the lower working component. The laser can emit laser light, which passes through the processing optical path and irradiates the chips on the wafer. The chips are separated from the wafer and transferred to the lower substrate.

[0092] The fine alignment component 500 includes a first fine alignment platform 510 and a second fine alignment platform 520. The first fine alignment platform includes a first support beam 511, a first camera 512, and a first lens 513. The second fine alignment platform 520 includes a second support beam 521, a second camera 522, and a second lens 523. The first support beam is fixed to the support platform and is on the same side as the first loading and unloading component. The second support beam is fixed to the support platform and is on the same side as the second loading and unloading component.

[0093] The base component 600 includes feet 610, a rack 620, and vibration isolation pads 630. The feet support on the ground or on a steel sub-pressure plate, and the number is a positive integer greater than or equal to 4. The rack is installed on the feet. The rack is a steel welded structure or a casting structure, and the center of gravity of the rack coincides with the action point of the resultant force of the support force provided by the feet. The vibration isolation pads are made of damping materials and are installed on the upper surface of the rack.

[0094] The working process of the present utility model:

[0095] The first carrier stage assembly moves into the working area of the manipulator of the first loading and unloading assembly. At the same time, the second carrier stage assembly also moves into the working area of the manipulator of the second loading and unloading assembly. First, the first manipulator takes out a wafer from the first wafer cassette and places it on the first loading adsorption area on the first carrier stage assembly. At the same time, the second manipulator takes out a wafer from the second wafer cassette and places it on the second loading adsorption area on the second carrier stage assembly. The first carrier stage assembly moves to the working area of the first fine alignment platform for fine alignment processing. At the same time, the second carrier stage assembly moves to the working area of the second fine alignment platform for fine alignment processing. Then the first carrier stage assembly moves to below the adsorption ring one of the upper working platform assembly, aligning the center of the wafer with the center of the adsorption ring one. The first lifting mechanism rises, causing the wafer to contact and be adsorbed by the adsorption ring one. The first lifting mechanism descends, and the first carrier stage assembly moves back into the working area of the manipulator of the first loading and unloading assembly. At the same time, the second carrier stage assembly moves to below the adsorption ring three of the upper working platform assembly, aligning the center of the wafer with the center of the adsorption ring three. The second lifting mechanism rises, causing the wafer to contact and be adsorbed by the adsorption ring three. The second lifting mechanism descends, and the second carrier stage assembly moves back into the working area of the manipulator of the second loading and unloading assembly.

[0096] When the first carrier stage assembly returns to the working area of the manipulator of the first loading and unloading assembly, the first manipulator sequentially places the wafers in the first wafer cassette on the first loading adsorption area and the substrates in the first substrate cassette on the first substrate adsorption area. Repeating the above actions, the first carrier stage assembly transports the wafers to the adsorption ring two. At this time, the loading of the three adsorption rings is completed. At this time, the upper working platform assembly and the first carrier stage assembly move synchronously to the working area of the laser processing optical path assembly for transfer processing. When the substrates on the first carrier stage assembly are filled with the transferred chips, the first carrier stage assembly retreats to the working area of the manipulator of the first loading and unloading assembly, and the manipulator performs the operations of taking the substrate and placing a new substrate. At the same time, the second carrier stage assembly, carrying the substrate, moves synchronously with the upper working platform assembly to continue the transfer processing. Repeating the above steps until the chips on the wafers on the upper working platform assembly are all transferred. The corresponding loading and unloading adsorption area of the carrier stage assembly on the lower working platform assembly performs the operation of taking the wafers. The carrier stage assembly retreats to the working area of the manipulator to perform the operations of taking the transferred wafers and placing new wafers. Then continue a new round of transfer processing.

[0097] The utility model solves the problem of low efficiency of massive transfer, ensures the continuous progress of the processing process, there is no situation of waiting for feeding and taking materials in the equipment, improves the production capacity of the chip factory, and saves costs;

[0098] It proposes a new layout of the double-station platform for laser massive transfer equipment in the field, and has a wide range of applicability;

[0099] A method for transferring wafers of mixed sizes is provided, breaking the barrier that only wafers of the same size can be transferred. The wafers can be transferred and processed onto the lower substrate in any combination of 4-inch, 6-inch, or 8-inch wafers, solving the existing practical problems in chip factories.

[0100] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings. These are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0101] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium; it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood through specific circumstances.

[0102] The above is only the preferred embodiment of the present invention and is not used to limit the present invention. It should be pointed out that for those of ordinary skill in the art in this technical field, without departing from the technical principle of the present invention, several improvements and modifications can still be made, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. Double-station laser mass transfer equipment, comprising a working platform unit, a loading and unloading component (300) and a laser processing optical path component (400); characterized in that: The working platform unit sequentially includes an upper working platform component (100) and a lower working platform component (200) from top to bottom. The upper working platform component (100) and the laser processing optical path component (400) are both installed on the lower working platform component (200). The upper working platform component (100) is located in the middle of the lower working platform component (200) along the front-back direction. The laser processing optical path component (400) is located above the upper working platform component (100). The lower working platform component (200) is installed on the base component (600), and the base component (600) is located on the ground. Loading and unloading components (300) are provided on the ground on the side of the lower working platform component (200). The upper working platform component (100) includes a support base (140). The second moving mechanism (130) installed on the support base (140) drives the first moving mechanism (120) to move in the front-back direction, and the first moving mechanism (120) drives the first adsorption mechanism (110) to move in the left-right direction. The first adsorption mechanism (110) includes a carrier plate (111), and a number of adsorption rings are installed on the carrier plate (111). The lower working platform component (200) includes a support platform (230), and a first carrier platform component (210) and a second carrier platform component (220) are respectively installed on the front and rear sides of the support platform (230). The first carrier platform component (210) includes a third moving mechanism (211), a fourth moving mechanism (212), a first lifting mechanism (213), a first rotating mechanism (214), and a second adsorption mechanism (215). The third moving mechanism (211) installed on the support platform (230) drives the fourth moving mechanism (212) to move in the front-back direction. The fourth moving mechanism (212) drives the first lifting mechanism (213) to move in the left-right direction. The first lifting mechanism (213) drives the first rotating mechanism (214) to move in the vertical direction. The first rotating mechanism (214) drives the second adsorption mechanism (215) to rotate. The second adsorption mechanism (215) includes a first substrate adsorption area (2151), and a first loading adsorption area (2152) and a first unloading adsorption area (2153) located on the left and right sides of the first substrate adsorption area (2151). The second carrier platform component (220) includes a fifth moving mechanism (221), a sixth moving mechanism (222), a second lifting mechanism (223), a second rotating mechanism (224), and a third adsorption mechanism (225). The fifth moving mechanism (221) installed on the support platform (230) drives the sixth moving mechanism (222) to move in the front-back direction. The sixth moving mechanism (222) drives the second lifting mechanism (223) to move in the left-right direction. The second lifting mechanism (223) drives the second rotating mechanism (224) to move in the vertical direction. The second rotating mechanism (224) drives the third adsorption mechanism (225) to rotate. The third adsorption mechanism (225) includes a second substrate adsorption area (2251), and a second loading adsorption area (2252) and a second unloading adsorption area (2253) located on the left and right sides of the second substrate adsorption area (2251).

2. The double-station laser mass transfer device according to claim 1, wherein A multiple of 3 adsorption rings are installed on the carrier plate (111).

3. The dual-station laser mass transfer device according to claim 2, characterized in that, An adsorption ring one (112), an adsorption ring two (113), and an adsorption ring three (114) are sequentially installed on the carrier plate (111) along the front-back direction.

4. The dual-station laser mass transfer device according to claim 1, wherein, The loading and unloading assembly (300) includes a first loading and unloading assembly (310) located on the front side of the lower working platform assembly (200), and a second loading and unloading assembly (320) located on the rear side of the lower working platform assembly (200).

5. The dual-station laser mass transfer device according to claim 4, wherein, The first loading and unloading assembly (310) includes a first manipulator (311), a first wafer cassette (312), a first substrate cassette (313), and a first cassette carrier frame (314). The first wafer cassette (312) and the first substrate cassette (313) are respectively installed in the first cassette carrier frame (314). The first manipulator (311) is installed on the lower working platform assembly (200). Two groups of suction claws respectively adapted to the first wafer cassette (312) and the first substrate cassette (313) are provided on the first manipulator (311).

6. The dual-station laser mass transfer device according to claim 4, wherein The second loading and unloading assembly (320) includes a second manipulator (321), a second wafer cassette (322), a second substrate cassette (323), and a second cassette carrier frame (324). The second wafer cassette (322) and the second substrate cassette (323) are respectively installed in the second cassette carrier frame (324). The second manipulator (321) is installed on the lower working platform assembly (200). Two groups of suction claws respectively adapted to the second wafer cassette (322) and the second substrate cassette (323) are provided on the second manipulator (321).

7. The double-station laser mass transfer device according to claim 1, wherein, The laser processing optical path assembly (400) includes a laser (410), a processing optical path (420), and an optical support beam (430). The optical support beam (430) is installed on the lower working platform assembly (200) along the left-right direction. The laser (410) and a processing optical path (420) adapted to the above laser (410) are installed on the optical support beam (430).

8. The dual-station laser mass transfer device according to claim 1, characterized in that, It further includes a fine alignment assembly (500). The fine alignment assembly (500) includes a first fine alignment platform (510) and a second fine alignment platform (520). The first fine alignment platform (510) is installed on the lower working platform assembly (200) on one side of the first carrier platform assembly (210). The second fine alignment platform (520) is installed on the lower working platform assembly (200) on one side of the second carrier platform assembly (220).

9. The dual-station laser mass transfer device according to claim 8, wherein The first fine alignment platform (510) includes a first support beam (511), a first camera (512) and a first lens (513). The first support beam (511) is installed on the lower working platform assembly (200) along the left-right direction. A first camera (512) and a first lens (513) adapted to the first camera (512) are installed on the first support beam (511). The second fine alignment platform (520) includes a second support beam (521), a second camera (522) and a second lens (523). The second support beam (521) is installed on the lower working platform assembly (200) along the left-right direction. A second camera (522) and a second lens (523) adapted to the second camera (522) are installed on the second support beam (521).

10. The dual-station laser mass transfer device according to claim 1, wherein The base assembly (600) includes a frame (620). A plurality of floor feet (610) are installed at the bottom of the frame (620). A vibration isolation pad (630) is installed on the frame (620). The support platform (230) is installed on the vibration isolation pad (630).

Images