Diaphragm, grinding mechanism and chemical mechanical polishing device

Abstract

The utility model provides a diaphragm, a grinding mechanism and a chemical mechanical polishing device.The diaphragm comprises a diaphragm body and an extending part arranged on the diaphragm body in a protruding mode, and a force conduction structure is arranged on the extending part; the force transmission structure transmits the force, acting on the diaphragm, of the two air bags to the weak stress area on the diaphragm and merges the force in the weak stress area, and the weak stress area merges the force applied by the two air bags and then transmits the force to the position, corresponding to the weak stress area, of the wafer. Therefore, the weak stress area on the diaphragm transmits the acting force applied by the air bag to the surface of the wafer so as to prevent the air bag from forming a stress vacuum area on the wafer.

Description

Technical Field

[0001] This application belongs to the technical field of diaphragms for chemical mechanical polishing of wafers. More specifically, it relates to a diaphragm, a grinding mechanism, and a chemical mechanical polishing device. Background Art

[0002] Chemical Mechanical Polishing (CMP) is a technology widely used in the semiconductor device manufacturing process, mainly used for planarizing silicon wafers or other substrate materials. This technology combines the dual effects of chemical corrosion and mechanical grinding, and can achieve high-precision planarization of the material surface at the nanoscale.

[0003] CMP includes two parts: a grinding mechanism and a cleaning mechanism. The main components of the grinding mechanism are a diaphragm, a grinding disc, and a grinding head, which cooperate with each other to provide a stable process environment for the wafer. Among the components of the grinding mechanism, the grinding head is one of the most important components. The grinding head first sucks the wafer and places it on the diaphragm, then pressurizes and rotates the wafer to form a relative movement with the diaphragm, achieving the purpose of grinding and planarization.

[0004] Among them, multiple annular and independent pressurizing areas are provided on the diaphragm, and any two adjacent pressurizing areas are separated by a diaphragm. The annular pressurizing area is pressurized by an airbag, thereby realizing the pressurization of the wafer. The problem caused by adopting the above technical solution is that since the two adjacent pressurizing areas are separated by a diaphragm, when the diaphragm covers the wafer and pressurizes the wafer through the diaphragm, the area corresponding to the diaphragm on the diaphragm is prone to form a force vacuum area, resulting in the external force exerted on the diaphragm by the airbag when pressurizing the wafer not being transmitted to the area corresponding to the diaphragm on the diaphragm, thereby causing a force vacuum area to be formed on the wafer when the diaphragm pressurizes the wafer. Summary of the Invention

[0005] The purpose of the embodiments of this application is to provide a diaphragm, a grinding mechanism, and a chemical mechanical polishing device to solve the technical problem of the force vacuum area existing in the diaphragm in the prior art when pressurizing the wafer.

[0006] To achieve the above purpose, the first aspect of this application provides a diaphragm, including:

[0007] A diaphragm body extending along a preset plane and having opposite first side walls and second side walls in a direction perpendicular to the preset plane;

[0008] An extension part is convexly provided on the first side wall and is arranged at an angle with the diaphragm body. The extension part forms a stress-weak area on the diaphragm body. The stress-weak area is located between the first side wall and the second side wall, and the position of the stress-weak area corresponds to the position of the extension part along the direction perpendicular to the preset plane.

[0009] A force conduction structure is provided on the extension part. The force conduction structure is located between the extension part and the diaphragm body. The force conduction structure is used to conduct the acting force into the stress-weak area, and the stress-weak area conducts the acting force to the corresponding position on the wafer.

[0010] Adopting the above technical solution, along the extension direction of the preset plane, the length dimension of the stress-weak area is equal to the width dimension of the extension part.

[0011] Two air bags can respectively apply acting forces to the diaphragm on the left and right sides of the extension part. When the air bags are inflated, they apply acting forces to the diaphragm, and the diaphragm conducts the acting forces applied by the air bags to the wafer.

[0012] When the two air bags apply acting forces to the diaphragm, the force conduction structure conducts part of the acting forces in the two air bags to the stress-weak area on the diaphragm and combines them in the stress-weak area.

[0013] The stress-weak area combines the forces applied by the two air bags and then conducts them to the corresponding position on the wafer. In this way, the stress-weak area on the diaphragm conducts the acting forces applied by the air bags to the surface of the wafer, thereby avoiding the formation of a stress vacuum area by the air bags on the wafer.

[0014] Optionally, along the extension direction of the preset plane, the cross-sectional area of the force conduction structure is smaller than the cross-sectional area of the extension part.

[0015] Optionally, the force conduction structure includes a third side wall and a fourth side wall.

[0016] Wherein, the third side wall is located on the left side of the force conduction structure and is arranged at a first angle with the first side wall. The fourth side wall is located on the right side of the force conduction structure and is arranged at a second angle with the first side wall. And along the direction from the extension part to the diaphragm body, the distance between the third side wall and the fourth side wall gradually decreases.

[0017] When the air bag contacts the diaphragm, after the air bag is inflated, its outer wall abuts against the first side wall on the diaphragm body, the third side wall and the fourth side wall on the force conduction mechanism.

[0018] When the outer wall of the airbag abuts against the first sidewall, the airbag exerts a force on the first sidewall in a direction perpendicular to the preset plane, and the diaphragm conducts the force exerted by the airbag to the wafer in a direction perpendicular to the preset plane.

[0019] When the sidewall of the airbag on the left side of the extension portion abuts against the third sidewall, the extension direction of a part of the force in the airbag is the same as the extension direction of the third sidewall and faces the weak force area. When the sidewall of the airbag on the right side of the extension portion abuts against the fourth sidewall, the extension direction of a part of the force in the airbag is the same as the extension direction of the fourth sidewall and faces the weak force area.

[0020] The two airbags on the left and right sides of the extension portion conduct the acting forces to the weak force area on the diaphragm along the extension directions of the third sidewall and the fourth sidewall respectively, and form a resultant force in the weak force area. The weak force area combines the acting forces exerted by the two airbags and conducts them to the position on the wafer corresponding to the weak force area.

[0021] Optionally, the first angle is equal to the second angle.

[0022] Adopting the above technical solution, since the first angle is equal to the second angle, when the acting forces exerted by the two airbags on the diaphragm body are equal, the intersection point of the acting force exerted by the airbag on the weak force area through the third sidewall and the acting force exerted by the airbag on the weak force area through the fourth sidewall is located at the middle position of the weak force area.

[0023] Optionally, fillets are provided between the third sidewall and the fourth sidewall and the first sidewall.

[0024] Adopting the above technical solution, by providing fillets between the third sidewall and the fourth sidewall and the first sidewall, when the airbag is inflated to exert a force on the diaphragm, it is ensured that the sidewall of the airbag can be in full contact with the connection part between the third sidewall and the first sidewall and the connection part between the fourth sidewall and the first sidewall, so as to ensure the uniformity of the force exerted by the airbag on the weak force area.

[0025] Optionally, both the first angle and the second angle are between 60° and 80°;

[0026] The fillet radius of the fillet is between 0.2 mm and 0.4 mm.

[0027] Optionally, the extension portion is perpendicular to the first sidewall.

[0028] Optionally, the number of the extensions is plural, and the plural extensions are arranged at intervals along the extension direction of the preset plane on the first side wall, and a pressure chamber is formed between any two adjacent extensions.

[0029] By adopting the above technical solution, a plurality of pressure chambers are arranged on the diaphragm body, and in each pressure chamber, a corresponding airbag is respectively used to apply a force to the pressure chamber.

[0030] The beneficial effect of the diaphragm provided in this application is that: compared with the prior art, the diaphragm provided in this application includes a diaphragm body and extensions protruding from the diaphragm body, and a force conduction structure is provided on the extensions. When a force is applied to the diaphragm body by the airbag, the force conduction structure conducts the forces applied by the two airbags on the diaphragm to the force-weakened area on the diaphragm and combines them within the force-weakened area. The force-weakened area combines the forces applied by the two airbags and then conducts them to the position on the wafer corresponding to the force-weakened area, so that the force-weakened area on the diaphragm conducts the force applied by the airbag to the surface of the wafer, so as to prevent the airbag from forming a force vacuum area on the wafer.

[0031] In a second aspect, this application provides a grinding mechanism, including:

[0032] A diaphragm, where the diaphragm is the diaphragm described in any one of the above.

[0033] The beneficial effect of the grinding mechanism provided in this application is that: compared with the prior art, the diaphragm in the grinding mechanism provided in this application includes a diaphragm body and extensions protruding from the diaphragm body, and a force conduction structure is provided on the extensions. When a force is applied to the diaphragm body by the airbag, the force conduction structure conducts the forces applied by the two airbags on the diaphragm to the force-weakened area on the diaphragm and combines them within the force-weakened area. The force-weakened area combines the forces applied by the two airbags and then conducts them to the position on the wafer corresponding to the force-weakened area, so that the force-weakened area on the diaphragm conducts the force applied by the airbag to the surface of the wafer, so as to prevent the airbag from forming a force vacuum area on the wafer.

[0034] In a third aspect, this application provides a chemical mechanical polishing device, including:

[0035] A grinding mechanism, where the grinding mechanism is the grinding mechanism described above

[0036] The beneficial effects of the chemical mechanical polishing device provided by this application are as follows: Compared with the prior art, the chemical mechanical polishing device provided by this application includes a grinding mechanism. The diaphragm in the grinding mechanism includes a diaphragm body and an extension protruding from the diaphragm body. A force conduction structure is provided on the extension. When a force is applied to the diaphragm body through an airbag, the force conduction structure conducts the forces applied by the two airbags on the diaphragm to the force-weak area on the diaphragm and combines them within the force-weak area. The force-weak area combines the forces applied by the two airbags and conducts them to the position on the wafer corresponding to the force-weak area, so that the force-weak area on the diaphragm conducts the force applied by the airbag to the surface of the wafer, avoiding the formation of a force vacuum area by the airbag on the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of this application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0038] Figure 1 is a schematic structural diagram of a diaphragm in the prior art;

[0039] Figure 2 is a schematic structural diagram of an extension in the prior art;

[0040] Figure 3 is a schematic structural diagram of a diaphragm provided by an embodiment of this application;

[0041] Figure 4 is a schematic structural diagram of a force conduction structure in this application;

[0042] Figure 5 is a schematic structural diagram of a pressure chamber provided by an embodiment of this application;

[0043] Figure 6 is a schematic diagram when the force conduction structure in this application conducts force.

[0044] Among them, the reference numerals in the drawings are as follows:

[0045] 10. Diaphragm body; 11. First side wall; 12. Second side wall; 13. Pressure chamber; 20. Extension; 30. Force conduction structure; 31. Third side wall; 32. Fourth side wall; 33. Rounded corner; 40. Wafer; 50. Airbag;

[0046] S1. Force vacuum area; S2. Force-weak area. DETAILED DESCRIPTION

[0047] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application clearer and more understandable, the following further details this application in combination with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not used to limit this application.

[0048] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0049] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to this application.

[0050] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of this application, "a plurality of" means two or more, unless otherwise specifically defined.

[0051] Please refer to Figure 1 and Figure 2 , in the prior art, the diaphragm body 10 extends along a preset plane, and an extension portion 20 protrudes from a side wall of the diaphragm body 10 in a direction perpendicular to the preset plane. Among them, the width dimension of the extension portion 20 in the direction perpendicular to the preset plane is equal, that is, the cross-sectional shape of the extension portion 20 is a rectangular structure.

[0052] Since the width dimension of the extension portion 20 in the direction perpendicular to the preset plane is equal, when the diaphragm body 10 is attached to the wafer 40 and the airbag 50 applies pressure to the diaphragm body 10, the pressure of the gas in the airbag 50 is conducted to the diaphragm body 10 along the extending direction of the side wall of the extension portion 20, and the diaphragm body 10 conducts the pressure applied by the airbag 50 to the wafer 40. With the above technical solution, since the extension portion 20 and the diaphragm body 10 are perpendicular to each other, a force vacuum area S1 with a width dimension equal to that of the extension portion 20 will be generated on the surface of the wafer 40 at the position corresponding to the extension portion 20 on the diaphragm body 10.

[0053] To solve the above technical problems, the first aspect of the present application is to provide a separator.

[0054] Please refer to Figures 3 to 6 together, and now the separator provided by the embodiment of the present application will be described.

[0055] A separator includes a diaphragm body 10 and an extension part 20.

[0056] First, the preset plane in the present application will be described. Preferably, the preset plane is Figure 1 and Figure 3 a horizontal plane.

[0057] Specifically, the diaphragm body 10 is a sheet-like structure extending along the preset plane, and has opposite first side walls 11 and second side walls 12 in a direction perpendicular to the preset plane.

[0058] The extension part 20 is an annular sheet-like structure. The extension part 20 protrudes from the first side wall 11 and is arranged at an angle with the diaphragm body 10. The extension part 20 forms a stress weak area S2 on the diaphragm body 10. The stress weak area S2 is located between the first side wall 11 and the second side wall 12, and the position of the stress weak area S2 corresponds to the position of the extension part 20 in a direction perpendicular to the preset plane.

[0059] A force conduction structure 30 is provided on the extension part 10, and the force conduction structure 30 is located between the extension part 20 and the diaphragm body 10. The force conduction structure 30 is used to conduct the acting force applied on the diaphragm body 10 into the stress weak area S2.

[0060] With the above technical solution, pressure can be applied to the separator through two air bags 50. The two air bags 50 are respectively located on the left and right sides of the extension part 20 in a direction perpendicular to the preset plane.

[0061] When the air bag 50 contacts the diaphragm body 10, after the air bag 50 is inflated, its outer wall abuts against the first side wall 11 on the diaphragm body 10. When the outer wall of the air bag 50 abuts against the first side wall 11, the air bag 50 applies an acting force to the first side wall 11 in a direction perpendicular to the preset plane, and the diaphragm body 10 conducts the acting force applied by the air bag 50 to the wafer 40 in a direction perpendicular to the preset plane.

[0062] And after the air bag 50 is inflated, part of the pressure in the two air bags 50 is conducted into the stress weak area S2 on the diaphragm body 10 along the extending direction of the force conduction structure 30, and after merging in the stress weak area S2, it is conducted to the position on the wafer 40 corresponding to the stress weak area S2 to avoid the formation of a stress vacuum area S1 by the air bag 50 on the wafer 40.

[0063] Compared with the prior art, the diaphragm provided by the present application includes a diaphragm body 10 and an extension part 20 protruding from the diaphragm body 10. A force conduction structure 30 is provided on the extension part 10. When a force is applied to the diaphragm body 10 through the air bags 50, the force conduction structure 30 conducts the forces exerted by the two air bags 50 on the diaphragm to the weak force-bearing area S2 on the diaphragm and combines them within the weak force-bearing area S2. The weak force-bearing area S2 combines the forces exerted by the two air bags 50 and conducts them to the position on the wafer 40 corresponding to the weak force-bearing area S2, so that the weak force-bearing area S2 on the diaphragm conducts the acting force exerted by the air bag 50 to the surface of the wafer 40 to avoid the formation of a force vacuum area S1 by the air bag 50 on the wafer 40.

[0064] In the present application, along the extension direction of the preset plane, the cross-sectional area of the force conduction structure 30 is smaller than the cross-sectional area of the extension part 20.

[0065] Specifically, by setting the cross-sectional area of the force conduction structure 30 to be smaller than the cross-sectional area of the extension part 20, when the air bag 50 is inflated and pressurized to apply pressure to the diaphragm body 10, the part of the side wall of the air bag 50 close to the force conduction structure 30 fits with the side wall of the force conduction structure 30, so that part of the acting force in the air bag 50 is conducted along the extension direction of the side wall of the force conduction structure 330 to the weak force-bearing area S2.

[0066] In the present application, the force conduction structure 30 includes a third side wall 31 and a fourth side wall 32.

[0067] Specifically, please refer to Figures 3 to 6 , wherein, the third side wall 31 is located on the left side of the force conduction structure 30 and is arranged at a first angle with the first side wall 11. The fourth side wall 32 is located on the right side of the force conduction structure 30 and is arranged at a second angle with the first side wall 11, and along the direction from the extension part 20 to the diaphragm body 10, the distance between the third side wall 31 and the fourth side wall 32 gradually decreases.

[0068] When the side wall of the air bag 50 on the left side of the extension part 20 abuts against the third side wall 31, the extension direction of part of the acting force in the air bag 50 is the same as the extension direction of the third side wall 31 and faces the weak force-bearing area S2; when the side wall of the air bag 50 on the right side of the extension part 20 abuts against the fourth side wall 32, the extension direction of part of the acting force in the air bag 50 is the same as the extension direction of the fourth side wall 32 and faces the weak force-bearing area S2.

[0069] The two air bags 50 conduct the acting forces to the weak force-bearing area S2 on the diaphragm along the extension directions of the third side wall 31 and the fourth side wall 32 respectively to form a resultant force within the weak force-bearing area S2. The weak force-bearing area S2 combines the acting forces exerted by the two air bags 50 and conducts them to the position on the wafer 40 corresponding to the weak force-bearing area S2.

[0070] In one embodiment of the present application, the first angle is equal to the second angle.

[0071] Since the first angle is equal to the second angle, when the acting forces applied by the two airbags 50 are equal, the intersection point of the acting force applied by the airbag 50 on the force-weak area S2 through the third side wall 31 and the acting force applied by the airbag 50 on the force-weak area S2 through the fourth side wall 32 is located at the middle position of the force-weak area S2.

[0072] Please refer to Figure 4 , in one embodiment of the present application, fillets 33 are provided between the third side wall 31 and the fourth side wall 32 and the first side wall 11.

[0073] By providing fillets 33 between the third side wall and the fourth side wall 32 and the first side wall 11, when the two airbags 50 are inflated to apply acting forces on the diaphragm body 10, it is ensured that the side wall of the airbag 50 on the left side of the extension part 20 can be fully attached to the connecting part of the third side wall 31 and the first side wall 11, and it is ensured that the side wall of the airbag 50 on the right side of the extension part 20 can be fully attached to the connecting part of the fourth side wall 32 and the first side wall 11, thereby ensuring the uniformity of the acting force applied by the airbag 50 on the force-weak area S2.

[0074] In the present application, both the first angle and the second angle are between 60° and 80°, such as the first angle and the second angle are both 60°, 70°, 75° or 80°. The chamfer radius of the fillet 33 is between 0.2 mm and 0.4 mm, such as the chamfer radius of the fillet 33 is 0.2 mm, 0.3 mm or 0.4 mm.

[0075] Preferably, in the present application, both the first angle and the second angle are 75°, and the chamfer radius of the fillet 33 is 0.3 mm.

[0076] In one embodiment of the present application, the extension part 20 is perpendicular to the first side wall 11.

[0077] In another embodiment of the present application, the included angle between the extending direction of the extension part 20 and the first side wall 11 is set to be an acute angle.

[0078] In the present application, the number of the extension parts 20 is multiple, and the multiple extension parts 20 are arranged at intervals along the extending direction of the preset plane on the first side wall 11, and a pressure chamber 13 is formed between any two adjacent extension parts 20.

[0079] Specifically, please refer to Figure 3 , Figure 5 and Figure 6, by providing a plurality of pressure chambers 13 on the diaphragm body 10, and respectively applying a corresponding airbag 50 to each pressure chamber 13 to apply a force to the pressure chamber 13, different pressures can be applied to the airbags 50 located in different pressure chambers 13 as needed, so as to ensure independent regulation of the forces in different pressure chambers 13 and mutual cooperation between different pressure chambers 13.

[0080] In a second aspect, the present application provides a grinding mechanism, including:

[0081] A diaphragm, where the diaphragm is the diaphragm of any one of the above.

[0082] Compared with the prior art, the diaphragm in the grinding mechanism provided by the present application includes a diaphragm body 10 and an extension portion 20 protruding from the diaphragm body 10. A force conduction structure 30 is provided on the extension portion 10. When forces are applied to the diaphragm body 10 by the airbags 50 respectively, the force conduction structure 30 conducts the forces exerted by the two airbags 50 on the diaphragm to the force-weakened area S2 on the diaphragm and combines them within the force-weakened area S2. The force-weakened area S2 conducts the combined forces applied by the two airbags 50 to the position on the wafer 40 corresponding to the force-weakened area S2, so that the force-weakened area S2 on the diaphragm conducts the force exerted by the airbag 50 to the surface of the wafer 40, so as to prevent the airbag 50 from forming a force vacuum area S1 on the wafer 40.

[0083] In a third aspect, the present application provides a chemical mechanical polishing device, including a grinding mechanism, and the grinding mechanism is the grinding mechanism provided in the above embodiment.

[0084] Compared with the prior art, the chemical mechanical polishing device provided by the present application includes a grinding mechanism. The diaphragm in the grinding mechanism includes a diaphragm body 10 and an extension portion 20 protruding from the diaphragm body 10. A force conduction structure 30 is provided on the extension portion 10. When forces are applied to the diaphragm body 10 by the airbags 50 respectively, the force conduction structure 30 conducts the forces exerted by the two airbags 50 on the diaphragm to the force-weakened area S2 on the diaphragm and combines them within the force-weakened area S2. The force-weakened area S2 conducts the combined forces applied by the two airbags 50 to the position on the wafer 40 corresponding to the force-weakened area S2, so that the force-weakened area S2 on the diaphragm conducts the force exerted by the airbag 50 to the surface of the wafer 40, so as to prevent the airbag 50 from forming a force vacuum area S1 on the wafer 40.

[0085] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A diaphragm, characterized in that, Comprising: A diaphragm body extending along a preset plane and having opposite first and second sidewalls in a direction perpendicular to the preset plane; An extension part protruding from the first sidewall and disposed at an angle to the diaphragm body, the extension part forming a stress-weak area on the diaphragm body, the stress-weak area being located between the first sidewall and the second sidewall, and the position of the stress-weak area corresponding to the position of the extension part in the direction perpendicular to the preset plane; A force conduction structure is provided on the extension part, the force conduction structure is located between the extension part and the diaphragm body, and the force conduction structure is used to conduct an acting force into the stress-weak area, and the stress-weak area conducts the acting force to a position corresponding to the stress-weak area on the wafer.

2. The diaphragm according to claim 1, wherein In the extending direction of the preset plane, the cross-sectional area of the force conduction structure is smaller than the cross-sectional area of the extension part.

3. The diaphragm according to claim 1 or 2, characterized in that, The force conduction structure includes: A third sidewall disposed at a first angle to the first sidewall; A fourth sidewall disposed at a second angle to the first sidewall, and along the direction from the extension part to the diaphragm body, the distance between the third sidewall and the fourth sidewall gradually decreases.

4. The diaphragm according to claim 3, wherein The first angle is equal to the second angle.

5. The diaphragm according to claim 4, wherein Round corners are provided between the three sidewalls and the fourth sidewall and the first sidewall.

6. The diaphragm according to claim 5, wherein: Both the first angle and the second angle are between 60° and 80°; The chamfer radius of the round corner is between 0.2 mm and 0.4 mm.

7. The diaphragm according to claim 6, wherein The extension part is perpendicular to the first sidewall.

8. The diaphragm according to claim 7, wherein The number of the extension parts is multiple, and the multiple extension parts are arranged at intervals on the first sidewall in the extending direction of the preset plane, and a pressure chamber is formed between any two adjacent extension parts.

9. A grinding mechanism, characterized in that, Comprising: A diaphragm, the diaphragm being the diaphragm according to any one of claims 1-8.

10. A chemical mechanical polishing device, characterized in that, Comprising: A grinding mechanism, the grinding mechanism being the grinding mechanism according to claim 9.

Images