Silicon wafer drying machine

Abstract

The utility model discloses a silicon wafer drying machine, which comprises a first bin, a second bin, a third bin and a fourth bin, the second bin is provided with a discharge hole for taking out the flower basket; the third bin is arranged between the first bin and the second bin, an inner bin and a circulating air duct are formed in the third bin, the circulating air duct is arranged on the peripheral side of the inner bin, a first separation part is arranged in the third bin and divides the inner bin into an upper bin and a lower bin, and an air outlet communicated with the circulating air duct is formed in the lower bin; an air inlet communicated with the circulating air duct is formed in the upper bin; the drying part is arranged in the upper bin and conveys hot air into the lower bin so as to dry the silicon wafers; the conveying part is configured to convey flower baskets and sequentially passes through the first bin, the lower bin and the second bin; the exhaust channel is communicated with the circulating air channel; a plurality of drying stations are arranged in the third bin, the conveying part conveys a plurality of flower baskets at the same time, and the flower baskets stay on any drying station for preset time. According to the scheme, the silicon wafer drying efficiency can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaic, and particularly to a silicon wafer dryer. Background Art

[0002] The silicon wafers taken out from the cleaning tank need to be dried by a dryer. The silicon wafer dryer includes an independent drying tank with an open top, a cover is provided at the open part, heating tubes and air ducts are arranged on the left and right sides of the drying tank, and a circulation fan is arranged at the bottom of the drying tank. The tooling flower basket carrying the silicon wafers is moved into the drying tank, and through the circulation fan, hot air circulation in the tank is caused, and then the silicon wafers in the flower basket are dried. After the silicon wafers are dried, the dried silicon wafers need to be taken out, and then new silicon wafers to be dried are put into the drying tank for drying. The drying operation of the silicon wafers is not continuous and the efficiency is low.

[0003] The above information disclosed in this background art is only used to increase the understanding of the background art of this application. Therefore, it may include prior art that is not known to those of ordinary skill in the art. Summary of the Invention

[0004] In view of the problems pointed out in the background art, the utility model proposes a silicon wafer dryer with high drying efficiency.

[0005] To achieve the above-mentioned utility model purpose, the utility model adopts the following technical solutions to be realized:

[0006] In some embodiments, a silicon wafer dryer is provided, the silicon wafers are carried by a flower basket, and the dryer includes:

[0007] A first bin, an inlet through which the flower basket can enter is arranged on the first bin;

[0008] A second bin, an outlet through which the flower basket can be taken out is arranged on the second bin;

[0009] A third bin, the third bin is arranged between the first bin and the second bin, an inner bin and a circulation air duct are formed in the third bin, the circulation air duct is arranged on the outer peripheral side of the inner bin, a first partition part is arranged in the third bin, the first partition part divides the inner bin into an upper bin and a lower bin, an air outlet communicated with the circulation air duct is arranged on the lower bin, and an air inlet communicated with the circulation air duct is arranged on the upper bin;

[0010] A drying part, arranged in the upper bin, and the drying part is configured to convey hot air into the lower bin to dry the silicon wafers;

[0011] A conveying part, configured to convey the flower basket, and the conveying part sequentially passes through the first bin, the lower bin and the second bin;

[0012] An exhaust air duct, which is communicated with the circulation air duct;

[0013] Wherein, a plurality of drying stations are arranged in the third bin, the conveying part conveys a plurality of the flower baskets simultaneously, and the flower baskets stay at any one of the drying stations for a preset time.

[0014] In some embodiments, a second partition part is arranged in the upper bin, the second partition part divides the upper bin into a plurality of sub-upper bins, the plurality of sub-upper bins are arranged in sequence along the conveying direction of the conveying part, a drying part is arranged in any one of the sub-upper bins, a ventilation opening communicated with the lower bin is arranged at the bottom of any one of the sub-upper bins, and an air inlet is arranged at the top of any one of the sub-upper bins;

[0015] The flower baskets in the lower bin stay at a position below any one of the ventilation openings for a preset time.

[0016] In some embodiments, the drying part includes a first blower and a heating element, and the heating element is arranged on the air outlet side of the first blower.

[0017] In some embodiments, an air inlet channel is arranged at the top of the third bin, one end of the air inlet channel is communicated with the atmosphere, and the other end is communicated with the circulation air duct.

[0018] In some embodiments, a plurality of air inlet channels are arranged at the top of the third bin, and the plurality of air inlet channels are arranged in sequence along the conveying direction of the conveying part.

[0019] In some embodiments, one end of the exhaust air duct is communicated with the circulation air duct located below, and the other end is communicated with the air inlet channel;

[0020] A dual-airflow heat exchanger is arranged in the air inlet channel, and a second blower is arranged on the side of the air inlet channel.

[0021] In some embodiments, the conveying part is a conveyor belt.

[0022] In some embodiments, a material inlet is arranged at the top of the first bin, and a first door body is arranged at the material inlet.

[0023] In some embodiments, a discharge outlet is arranged at the top of the second bin, and a second door body is arranged at the discharge outlet.

[0024] Compared with the prior art, the advantages and positive effects of the present utility model are:

[0025] The dryer is provided with a plurality of drying stations, the flower baskets for placing silicon wafers pass through the plurality of drying stations in sequence for drying, the dryer can realize the simultaneous drying operation of a plurality of flower baskets and the continuous drying operation of a plurality of flower baskets, thereby improving the silicon wafer drying efficiency.

[0026] The inlet and outlet of the dryer are arranged at opposite ends of the conveying part. The inlet and outlet of the flower basket are independent of each other, realizing continuous feeding and continuous discharging of the flower basket, which helps to improve the operation efficiency.

[0027] A drying part is arranged in the upper bin, and the flower basket is conveyed in the lower bin. The independent arrangement of the two spaces helps to improve the gas heating effect and the hot air blowing effect, thereby improving the drying efficiency of the silicon wafer.

[0028] After reading the specific embodiments of the present invention in conjunction with the accompanying drawings, other features and advantages of the present invention will become clearer. Description of the Drawings

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0030] Figure 1 A front view of a silicon wafer dryer according to some embodiments;

[0031] Figure 2 A side view of a silicon wafer dryer according to some embodiments;

[0032] Reference Numerals:

[0033] 1. Flower basket;

[0034] 100. First bin; 110. Inlet; 120. First door body;

[0035] 200. Second bin; 210. Outlet; 220. Second door body;

[0036] 300. Third bin; 310. Inner bin; 311. Upper bin; 312. Lower bin; 313. Sub-upper bin; 314. Air inlet; 315. Air outlet; 320. Circulation air duct; 330. First partition; 340. Second partition;

[0037] 400. Drying part; 410. First fan; 420. Heating element;

[0038] 500. Exhaust air duct;

[0039] 600. Air inlet duct;

[0040] 700. Double-airflow heat exchanger;

[0041] 800. Conveying part;

[0042] 900, the second fan. Specific embodiments

[0043] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0044] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present application.

[0045] The terms "first" and "second" are only used for descriptive purposes, and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0046] In the description of the present application, it should be noted that, unless otherwise clearly defined and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the communication between two elements inside. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0047] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include direct contact between the first and second features, or may include indirect contact between the first and second features through additional features therebetween. Moreover, the first feature being "above", "over" and "on" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature has a higher horizontal height than the second feature. The first feature being "below", "under" and "beneath" the second feature includes the first feature being directly below and obliquely below the second feature, or simply indicating that the first feature has a lower horizontal height than the second feature.

[0048] The following disclosure provides many different embodiments or examples for implementing different structures of the present utility model. To simplify the disclosure of the present utility model, components and settings of specific examples are described below. Of course, they are only examples and are not intended to limit the present utility model. In addition, the present utility model may repeat reference numerals and / or reference letters in different examples. Such repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between various embodiments and / or settings discussed. In addition, the present utility model provides examples of various specific processes and materials, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0049] In some embodiments, a silicon wafer dryer is provided for drying silicon wafers taken out of a cleaning tank. The silicon wafers are transported by a carrier 1.

[0050] Referring to Figure 1 and Figure 2 , the dryer includes a first chamber 100, a second chamber 200, and a third chamber 300. The third chamber 300 is disposed between the first chamber 100 and the second chamber 200. For example, the first chamber 100, the third chamber 300, and the second chamber 200 are arranged in a straight line in sequence.

[0051] An inlet 110 for the carrier 1 to enter is provided on the first chamber 100. The carrier 1 taken out of the cleaning tank is placed into the first chamber 100 by a mechanical truss.

[0052] An outlet 210 for the carrier 1 to be taken out is provided on the second chamber 200. The carrier 1 is taken out of the second chamber 200 by a mechanical truss. The silicon wafers in the carrier 1 taken out of the second chamber 200 are dried silicon wafers.

[0053] An inner chamber 310 and a circulation air duct 320 are formed in the third chamber 300. The circulation air duct 320 is disposed on the outer peripheral side of the inner chamber 310.

[0054] A first partition 330 is provided in the third chamber 300. For example, the first partition 330 is a partition plate. The first partition 330 divides the inner chamber 310 into an upper chamber 311 and a lower chamber 312. The upper chamber 311 is disposed above the lower chamber 312. An air outlet 315 communicating with the circulation air duct 320 is provided on the lower chamber 312, and an air inlet 314 communicating with the circulation air duct 320 is provided on the upper chamber 311.

[0055] The dryer includes a drying unit 400. The drying unit 400 is disposed in the upper chamber 311 and is configured to convey hot air into the lower chamber 312 to dry the silicon wafers.

[0056] The drying section 400 conveys hot air downward into the lower bin 312. The hot air dries the silicon wafers in the carrier 1, and then the hot air flows into the circulation air duct 320 through the air outlet 315. The gas in the circulation air duct 320 circulates into the upper bin 311 through the air inlet 314, and the gas is heated by the drying section 400 again. By circulating in this way, the heating effect of the gas is improved, which helps to improve the drying efficiency of the silicon wafers.

[0057] The dryer includes a conveying section 800. The conveying section 800 is configured to convey the carrier 1, and the conveying section 800 sequentially passes through the first bin 100, the lower bin 312, and the second bin 200.

[0058] The drying section 400 includes an exhaust air duct 500, and the exhaust air duct 500 communicates with the circulation air duct 320.

[0059] Among them, multiple drying stations are arranged in the third bin 300. The conveying section 800 conveys multiple carriers 1 at the same time, and the carrier 1 stays at any drying station for a preset time.

[0060] When the dryer is working, the carrier 1 taken out from the cleaning tank is placed into the first bin 100 by the mechanical truss. The carrier 1 is placed on the conveying section 800, and this carrier 1 enters the lower bin 312 along with the conveying section 800;

[0061] After the carrier 1 entering the lower bin 312 reaches the first drying station, the conveying section 800 stops, and the carrier 1 stays at the first drying station for a preset time. The drying section 400 blows hot air onto the carrier 1 to dry the silicon wafers in the carrier 1. At the same time, the next carrier 1 is placed on the conveying section 800 in the first bin 100 and waits;

[0062] After a preset time, the conveying section 800 starts, and the conveying section 800 drives the carrier 1 to move to the second drying station. The carrier 1 stays at the second drying station for a preset time. The drying section 400 blows hot air onto the carrier 1 to dry the silicon wafers in the carrier 1. At the same time, the carrier 1 in the first bin 100 reaches the first drying station along with the conveying section 800 for drying;

[0063] And so on, the carrier 1 is dried successively through multiple drying stations. The dried carrier 1 enters the second bin 200 along with the conveying section 800, and the carrier 1 is taken out by the mechanical truss.

[0064] The dryer is provided with multiple drying stations. The carrier 1 for placing silicon wafers is dried successively through multiple drying stations. The dryer can realize the simultaneous drying operation of multiple carriers 1 and the continuous drying operation of multiple carriers 1, thereby improving the drying efficiency of the silicon wafers.

[0065] The inlet 110 and the outlet 210 of the dryer are arranged at opposite ends of the conveying part 800. The inlet and outlet of the flower basket 1 are independent of each other, realizing the continuous feeding and continuous discharging of the flower basket 1, which helps to improve the operation efficiency.

[0066] The drying part 400 is arranged in the upper bin 311, and the flower basket 1 is conveyed in the lower bin 312. The independent setting of the two spaces helps to improve the gas heating effect and the hot air blowing effect, thereby improving the drying efficiency of the silicon wafers.

[0067] In some embodiments, a second partition part 340 is arranged in the upper bin 311. For example, the second partition part 340 is a partition board. The second partition part 340 divides the upper bin 311 into multiple sub-upper bins 313, and the multiple sub-upper bins 313 are arranged in sequence along the conveying direction of the conveying part 800.

[0068] A drying part 400 is arranged in any one of the sub-upper bins 313. A ventilation opening communicating with the lower bin 312 is arranged at the bottom of any one of the sub-upper bins 313, and an air inlet 314 is arranged at the top of any one of the sub-upper bins 313. The flower basket 1 in the lower bin 312 stays for a preset time below any one of the ventilation openings.

[0069] The gas in the circulation air duct 320 enters the sub-upper bin 313 through the air inlet 314. The gas is heated by the drying part 400 to become hot air. The hot air flows into the lower bin 312 through the ventilation opening. The hot air blows directly on the flower basket 1 located below the ventilation opening to dry the silicon wafers. The hot air in the lower bin 312 then flows into the circulation air duct 320 through the air outlet 315.

[0070] The multiple sub-upper bins 313 are independent of each other, and a drying part 400 is arranged in any one of the sub-upper bins 313, which helps to improve the heating efficiency of the gas and further improve the drying efficiency of the silicon wafers.

[0071] In some embodiments, the drying part 400 includes a first fan 410 and a heating element 420. The heating element 420 is arranged on the air outlet side of the first fan 410. The gas is blown out by the first fan 410 and is heated into hot air when flowing through the heating element 420 during the process of flowing downward to the lower bin 312. The heating element 420 is, for example, a heating coil.

[0072] In some embodiments, an air inlet passage 600 is arranged at the top of the third bin 300. One end of the air inlet passage 600 communicates with the atmosphere, and the other end communicates with the circulation air duct 320. Under the action of the first fan 410, the outside gas flows into the circulation air duct 320 through the air inlet passage 600 and then flows into the upper bin 311 through the air inlet 314.

[0073] In some embodiments, a plurality of air inlet passages 600 are arranged at the top of the third bin 300, and the plurality of air inlet passages 600 are arranged in sequence along the conveying direction of the conveying part 800.

[0074] Multiple air inlet channels 600 help to increase the air inlet volume, enabling a sufficient amount of gas to flow into any sub-upper bin 313 to meet the air volume requirement for drying silicon wafers.

[0075] In some embodiments, the exhaust air channel 500 is located outside the third bin 300. One end of the exhaust air channel 500 is connected to the circulating air duct 320 located below, and the other end is connected to the air inlet channel 600.

[0076] A dual-airflow heat exchanger 700 is provided in the air inlet channel 600, and a second fan 900 is provided on the side of the air inlet channel 600. The second fan 900 is, for example, an exhaust fan.

[0077] After the gas in the lower bin 312 acts on the silicon wafers, the humidity of the gas increases. The wet gas enters the air inlet channel 600 through the exhaust air channel 500 to exchange heat with the dual-airflow heat exchanger 700, and then is discharged through the second fan 900.

[0078] Recycling heat through the dual-airflow heat exchanger 700 helps to reduce energy consumption.

[0079] In some embodiments, the connecting end of the exhaust air channel 500 and the air inlet channel 600 is arranged opposite to the second fan 900, which helps to improve the exhaust efficiency.

[0080] In some embodiments, the conveying part 800 is a conveyor belt to achieve stable conveyance of the carrier 1. By adjusting the start and stop of the conveyor belt, the carrier 1 is conveyed between different drying stations and stays.

[0081] In some embodiments, a feeding port 110 is provided at the top of the first bin 100, and a first door body 120 is provided at the feeding port 110.

[0082] In some embodiments, a discharging port 210 is provided at the top of the second bin 200, and a second door body 220 is provided at the discharging port 210.

[0083] In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in a suitable manner in any one or more embodiments or examples.

[0084] The above is only the specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A silicon wafer dryer, wherein the silicon wafers are carried by a flower basket, characterized in that, The dryer includes: A first bin, on which there is a feeding port for the flower basket to enter; A second bin, on which there is a discharging port for the flower basket to be taken out; A third bin, which is arranged between the first bin and the second bin. An inner bin and a circulation air duct are formed in the third bin. The circulation air duct is arranged on the outer peripheral side of the inner bin. A first partition part is arranged in the third bin. The first partition part divides the inner bin into an upper bin and a lower bin. An air outlet communicated with the circulation air duct is arranged on the lower bin, and an air inlet communicated with the circulation air duct is arranged on the upper bin; A drying part, which is arranged in the upper bin and is configured to convey hot air into the lower bin to dry the silicon wafers; A conveying part, which is configured to convey the flower basket. The conveying part sequentially passes through the first bin, the lower bin and the second bin; An exhaust air channel, which is communicated with the circulation air duct; Wherein, a plurality of drying stations are arranged in the third bin. The conveying part conveys a plurality of the flower baskets simultaneously, and the flower basket stays at any one of the drying stations for a preset time.

2. The silicon wafer dryer according to claim 1, wherein A second partition part is arranged in the upper bin. The second partition part divides the upper bin into a plurality of sub-upper bins. The plurality of sub-upper bins are arranged in sequence along the conveying direction of the conveying part. The drying part is arranged in any one of the sub-upper bins. A ventilation opening communicated with the lower bin is arranged at the bottom of any one of the sub-upper bins, and the air inlet is arranged at the top of any one of the sub-upper bins; The flower basket in the lower bin stays at a position below any one of the ventilation openings for a preset time.

3. The silicon wafer dryer according to claim 1, wherein The drying part includes a first fan and a heating element. The heating element is arranged on the air outlet side of the first fan.

4. The silicon wafer dryer according to claim 1, wherein An air inlet channel is arranged at the top of the third bin. One end of the air inlet channel is communicated with the atmosphere, and the other end is communicated with the circulation air duct.

5. The silicon wafer dryer according to claim 4, wherein A plurality of air inlet channels are arranged at the top of the third bin. The plurality of air inlet channels are arranged in sequence along the conveying direction of the conveying part.

6. The silicon wafer dryer according to claim 4, wherein One end of the exhaust air channel is communicated with the circulation air duct located below, and the other end is communicated with the air inlet channel; A double-airflow heat exchanger is arranged in the air inlet channel, and a second fan is arranged on the side part of the air inlet channel.

7. The silicon wafer dryer according to any one of claims 1 to 6, wherein The conveying part is a conveyor belt.

8. The silicon wafer dryer according to any one of claims 1 to 6, wherein The feeding port is arranged at the top of the first bin, and a first door body is arranged at the feeding port.

9. The silicon wafer dryer according to any one of claims 1 to 6, wherein The discharging port is arranged at the top of the second bin, and a second door body is arranged at the discharging port.

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