Wafer ring bearing device and wafer film pasting equipment

Abstract

The embodiment of the utility model provides a wafer ring bearing device and wafer film pasting equipment. The wafer ring bearing device comprises a bearing platform which is used for being connected with wafer film pasting equipment; the moving mechanism is movably arranged on the bearing platform; the placing mechanism is connected to the moving mechanism and is used for placing sheet rings; the locking mechanism is connected to the bearing platform and used for locking the moving mechanism when the moving mechanism moves into the bearing platform and releasing the moving mechanism when the moving mechanism moves out of the bearing platform to add the sheet ring. Compared with a wafer ring feeding mode of manually going deep into the inner side of the equipment frame in the related technology, the wafer ring feeding method has the advantages that the placing mechanism can be moved out of the bearing platform through the moving mechanism, then the wafer rings are moved out of the wafer film pasting equipment, and the mode of adding the wafer rings outside the wafer film pasting equipment is convenient for manual operation and high in efficiency. Meanwhile, the labor intensity of workers is also reduced. In addition, the wafer ring feeding time of the wafer film pasting equipment can be remarkably shortened, and the production efficiency is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of semiconductor processing, and in particular, to a wafer ring carrier device and a wafer film pasting device. Background Art

[0002] In semiconductor processing technology, wafer film pasting is an important process in the chip processing, generally located after grinding and thinning, and is used to paste a film on the grinding surface of the wafer to protect the wafer in processes such as lithography and cutting, which is usually completed by a film pasting device.

[0003] In the related art, during the film pasting process of the film pasting device, the wafer and the film are generally fixed to the wafer ring together. At present, the operation of loading the wafer ring material onto the film pasting device needs to be completed manually. Workers need to enter the inside of the frame of the film pasting device many times for handling. The number of wafer rings handled each time is large, and the workload is large. This not only increases the labor intensity of the workers, but also reduces the production efficiency. Summary of the Utility Model

[0004] In view of this, the embodiments of the present application provide a wafer ring carrier device and a wafer film pasting device to at least partially solve the above problems.

[0005] According to a first aspect of the embodiments of the present application, there is provided a wafer ring carrier device for a wafer film pasting device. The device includes: a loading platform for connecting to the wafer film pasting device; a moving mechanism movably disposed on the loading platform; a placing mechanism connected to the moving mechanism for placing wafer rings; and a locking mechanism connected to the loading platform for locking the moving mechanism when the moving mechanism moves into the loading platform, and releasing the moving mechanism when adding wafer rings and moving out of the loading platform.

[0006] Further, in the above wafer ring carrier device, the placing mechanism is detachably connected to the moving mechanism, and at least two groups of the placing mechanisms are provided, so that the placing mechanism with pre-placed wafer rings can be replaced when the moving mechanism moves out of the loading platform.

[0007] Further, in the above wafer ring carrier device, the placing mechanism is placed on the moving mechanism; the moving mechanism is provided with a locking assembly for locking or releasing the placing mechanism; and the placing mechanism and the moving mechanism are detachably connected by locking or releasing the locking assembly.

[0008] Further, in the above wafer ring carrier device, the moving mechanism is provided with a positioning member for positioning the placing mechanism.

[0009] Furthermore, in the above-mentioned sheet ring carrying device, the locking mechanism includes: a positioning plate fixedly connected to the carrying platform; a guiding plate movably connected to the carrying platform and arranged in parallel with the positioning plate, the guiding plate being movable in a direction close to or away from the positioning plate, and the moving mechanism can be moved into the space between the positioning plate and the guiding plate; a first driving unit installed on the carrying platform and connected to the guiding plate for driving the guiding plate to move to clamp or release the moving mechanism.

[0010] Furthermore, in the above-mentioned sheet ring carrying device, the positioning plate and the guiding plate are correspondingly formed with a guiding angle at the first end for facilitating the moving mechanism to move in.

[0011] Furthermore, in the above-mentioned sheet ring carrying device, the moving mechanism is provided with guiding wheels on the side walls in contact with the positioning plate and the guiding plate; the positioning plate and the guiding plate are correspondingly provided with guide grooves, and the guiding wheels are slidably embedded in the guide grooves.

[0012] Furthermore, in the above-mentioned sheet ring carrying device, the locking mechanism includes: a limiting plate fixedly connected to the carrying platform; a clamping member telescopically passing through the carrying platform and arranged opposite to the limiting plate, the clamping member being used for clamping and fixing the moving mechanism between them when extended and releasing the moving mechanism when retracted; a second driving unit installed on the carrying platform and connected to the clamping member for driving the clamping member to move.

[0013] Furthermore, in the above-mentioned sheet ring carrying device, the clamping member is a first wedge block; the moving mechanism is provided with a second wedge block; the first wedge block is pressed against the second wedge block, and the first wedge block is used for squeezing the second wedge block to push the moving mechanism towards the limiting plate.

[0014] Furthermore, in the above-mentioned sheet ring carrying device, the moving mechanism is provided with guiding wheels on the side wall in contact with the limiting plate; the limiting plate is correspondingly provided with a guide groove, and the guiding wheels are slidably embedded in the guide groove.

[0015] Furthermore, in the above-mentioned sheet ring carrying device, the locking mechanism further includes: a detection unit installed on the limiting plate for detecting whether the moving mechanism is in contact with the limiting plate; a control unit electrically connected to both the detection unit and the second driving unit for controlling the second driving unit to drive the clamping member to clamp and fix when detecting that the moving mechanism is in contact with the limiting plate.

[0016] Further, in the above-mentioned chip ring carrier device, the locking mechanism includes: a third driving unit installed on the carrier platform; a pressing component connected to the third driving unit and placed above the moving mechanism, and the third driving unit is used to drive the pressing component to move in a direction close to or away from the moving mechanism, so as to press or release the moving mechanism.

[0017] Further, in the above-mentioned chip ring carrier device, the third driving unit is a spinning cylinder.

[0018] Further, in the above-mentioned chip ring carrier device, the pressing component includes: a bracket connected to the output end of the third driving unit; a ball pressing part connected to the bracket and provided with balls at the end for pressing against the moving mechanism.

[0019] Further, in the above-mentioned chip ring carrier device, the moving mechanism includes: a carrier plate on which the placing mechanism is placed; a moving part arranged at the bottom of the carrier plate and used to drive the carrier plate to move; a locking component installed on the carrier plate and used to lock the placing mechanism.

[0020] Further, in the above-mentioned chip ring carrier device, the moving mechanism further includes: a handle connected to the carrier plate.

[0021] Further, in the above-mentioned chip ring carrier device, the moving mechanism further includes: a vertical plate connected to the carrier plate and provided with a slide rail along a direction perpendicular to the carrier plate, and the placing mechanism is slidably connected to the slide rail; a driving mechanism installed on the vertical plate and connected to the placing mechanism for driving the placing mechanism to slide along the slide rail.

[0022] Further, in the above-mentioned chip ring carrier device, the placing mechanism includes: a carrier table connected to the moving mechanism and used to place the chip ring; at least three positioning columns, each of the positioning columns blocking the outer edge of the chip ring, and one end of each positioning column is connected to the carrier table and the other end is a free end.

[0023] Further, in the above-mentioned chip ring carrier device, the placing mechanism further includes: a limiting column, a notch is formed in the outer edge of the chip ring, and the limiting column is connected to the carrier table and is engaged with the notch.

[0024] Further, in the above-mentioned chip ring carrier device, the moving mechanism is provided with a positioning pin; correspondingly, the carrier table is provided with a positioning hole, and the positioning pin is matched with the positioning hole.

[0025] It can be seen that compared with the method of manually feeding the wafer ring deep into the inner side of the device frame in the related art, in the embodiment of the present application, the placement mechanism can be moved out of the carrier platform by the moving mechanism, and then the wafer ring can be added outside the wafer laminating device. This method of adding the wafer ring outside the wafer laminating device is not only convenient for manual operation, but also reduces the labor intensity of workers. In addition, it can significantly shorten the wafer ring feeding time of the wafer laminating device and improve production efficiency.

[0026] According to a second aspect of the embodiments of the present application, there is provided a wafer laminating device, which includes: a support body, a wafer ring grasping device installed on the support body, a loading manipulator and a laminating mechanism, and any one of the above wafer ring carrier devices; wherein, the carrier platform in the wafer ring carrier device is installed on the support body and corresponds to the wafer ring grasping device, and the wafer ring grasping device is used to send the wafer ring in the wafer ring carrier device to the laminating mechanism; the loading manipulator is used to send the wafer to be laminated to the laminating mechanism; and the laminating mechanism is used to perform a laminating process on the wafer ring and the wafer.

[0027] Further, in the above wafer laminating device, the support body is provided with a ramp structure, the ramp structure is docked with the carrier platform, and the moving mechanism moves into or out of the carrier platform through the ramp structure.

[0028] Further, in the above wafer laminating device, the laminating mechanism is a rolling laminating mechanism; or, the laminating mechanism is a vacuum laminating mechanism.

[0029] Since the wafer ring carrier device has the above technical effects, the wafer laminating device having this wafer ring carrier device also has corresponding technical effects.

[0030] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. Description of the Drawings

[0031] By describing the exemplary embodiments of the present application in more detail in conjunction with the drawings, the above and other objects, features, and advantages of the present application will become more obvious. Among them, in the exemplary embodiments of the present application, the same reference numerals generally represent the same components.

[0032] Figure 1 Schematic diagram of the wafer ring carrier device proposed in the embodiment of the present application;

[0033] Figure 2 Schematic diagram of the carrier platform and the locking mechanism in the wafer ring carrier device proposed in the embodiment of the present application;

[0034] Figure 3 Schematic diagram of the moving mechanism in the wafer ring carrier device shown in the embodiment of the present application;

[0035] Figure 4 Another schematic diagram of the wafer ring carrier device proposed in the embodiment of the present application;

[0036] Figure 5 Schematic diagram of the wafer film pasting device proposed in the embodiment of the present application;

[0037] Figure 6 Planar schematic diagram of the wafer film pasting device proposed in the embodiment of the present application;

[0038] Figure 7 Schematic diagram of the transfer and flipping mechanism in the wafer film pasting device proposed in the embodiment of the present application;

[0039] Figure 8 Schematic diagram of the wafer ring grasping mechanism in the wafer film pasting device proposed in the embodiment of the present application;

[0040] Figure 9 Schematic diagram of the film pasting mechanism in the wafer film pasting device proposed in the embodiment of the present application. Detailed implementation manners

[0041] The preferred embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0042] The terms used in the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms of "a", "said" and "the" used in the present application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0043] It should be understood that although the terms "first", "second", "third", etc. may be used in the present application to describe various components, these components should not be limited to these terms. These terms are only used to distinguish components of the same type from each other. For example, without departing from the scope of the present application, the first component may also be referred to as the second component, and similarly, the second component may also be referred to as the first component. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present application, "a plurality" means two or more unless otherwise specifically defined.

[0044] In the description of the present application, it should be understood that the orientation or positional relationships indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings. These are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0045] Unless otherwise clearly defined and limited, the terms "mounted", "connected", "coupled", "fixed", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0046] In semiconductor processing, after grinding and thinning the wafer, a film pasting process is usually performed on the wafer to protect the wafer during subsequent processing, and the film pasting process is generally completed by a film pasting device. The film pasting devices in related technologies usually include a loading manipulator, a wafer ring stacking mechanism, a film pasting mechanism, etc. The loading manipulator is used to place the wafer in place, the wafer ring stacking mechanism is responsible for the storage and loading of wafer rings, and the film pasting mechanism is used to complete the lamination of the wafer, wafer ring and film.

[0047] During the film pasting process, the wafer and the film are fixed to the wafer ring together, which not only facilitates the handling of the wafer but also helps to protect the wafer during processing. Currently, the operation of loading wafer ring materials onto the wafer ring stacking mechanism needs to be completed manually. Workers need to enter the inner side of the frame of the film pasting device multiple times for handling, and the number of wafer rings handled each time is relatively large, resulting in a large workload. For example, for some film pasting devices, 200 - 250 steel wafer rings need to be loaded each time, with each wafer ring weighing about 0.3 kg. This not only increases the labor intensity of the workers, but also takes a long time to load the wafer rings, thus reducing the production efficiency.

[0048] In view of the above problems, an embodiment of the present utility model provides a wafer ring carrying device 100, which can reduce the labor intensity of workers, and at the same time can also shorten the time for loading wafer rings and improve the production efficiency.

[0049] The technical solutions of the embodiments of the present application will be described in detail below with reference to the drawings.

[0050] Referring to Figures 1 to 3 , a wafer ring carrying device 100 according to an embodiment of the present utility model includes: a carrying platform 110, a moving mechanism 120, a placing mechanism 130, and a locking mechanism 140. Among them,

[0051] The carrier platform 110 is used to connect with a wafer film pasting device. It can be understood that the film pasting device should be provided with a wafer ring grasping mechanism for grasping the wafer ring to the film pasting mechanism, and the carrier platform 110 corresponds to the position of the wafer ring grasping device. Specifically, the carrier platform 110 can be fixedly connected with the wafer film pasting device, such as by welding, gluing, riveting, etc., or can be detachably connected, such as by bolt connection, snap connection, clamping connection through a fixture, etc. The present embodiment does not make any limitation on the specific connection form between the carrier platform 110 and the wafer film pasting device.

[0052] In the present embodiment, the moving mechanism 120 is movably arranged on the carrier platform 110. Specifically, the moving mechanism 120 can move relative to the carrier platform 110, and can move onto the carrier platform 110 or move out of the carrier platform 110.

[0053] In the present embodiment, the placing mechanism 130 is connected to the moving mechanism 120, and the placing mechanism 130 is used to place the wafer rings 200. Multiple wafer rings 200 can be stacked on the placing mechanism 130. In the present embodiment, the placing mechanism 130 is fixed on the moving mechanism 120, and the moving mechanism 120 can drive the placing mechanism 130 to move, and thus move in or out of the carrier platform 110 together. Specifically, the placing mechanism 130 can be fixed on the moving mechanism 120 by means of bolt connection, locking connection, welding, integral molding, etc.

[0054] In the present embodiment, when the moving mechanism 120 moves into the carrier platform 110, the wafer rings 200 are provided to the wafer film pasting device; when the wafer rings 200 in the placing mechanism 130 are used up, the moving mechanism 120 drives the placing mechanism 130 to move out of the carrier platform 110 to add wafer rings 200 to the placing mechanism 130.

[0055] In the present embodiment, the locking mechanism 140 is connected to the carrier platform 110 and is used to lock the moving mechanism 120 when the moving mechanism 120 moves into the carrier platform 110, so as to fix the moving mechanism 120 when the wafer ring grasping device grasps the wafer ring 200 from the placing mechanism 130. The locking mechanism 140 is also used to release the moving mechanism 120 when the moving mechanism 120 needs to move out of the carrier platform 110 to add wafer rings 200.

[0056] It can be seen that compared with the method of manually feeding the wafer rings deep inside the device frame in the related art, in the embodiment of the present application, the placing mechanism 130 can be moved out of the carrier platform 110 by the moving mechanism 120, and then the wafer rings 200 are added outside the wafer film pasting device. This method of adding wafer rings 200 outside the wafer film pasting device is not only convenient for manual operation, but also reduces the labor intensity of workers. In addition, it can significantly shorten the wafer ring feeding time of the wafer film pasting device and improve production efficiency.

[0057] In some embodiments, the placement mechanism 130 is detachably connected to the moving mechanism 120, and there are at least two sets of the placement mechanism 130, so that when the moving mechanism 120 moves out of the bearing platform 110, the placement mechanism 130 that has been pre-placed with the wafer ring 200 can be replaced.

[0058] Specifically, the number of the placement mechanism 130 can be two or more, and the specific quantity can be determined according to the actual situation. One set of the placement mechanism 130 is installed on the moving mechanism 120, and the remaining placement mechanisms 130 are pre-placed with the wafer rings 200. When the moving mechanism 120 moves out of the bearing platform 110, the empty placement mechanism 130 is detached from the moving mechanism 120, and then the placement mechanism 130 that is pre-filled with the wafer rings is hoisted onto the moving mechanism 120 as a whole.

[0059] It can be seen that compared with the method of adding the wafer rings 200 to the placement mechanism 130 when the moving mechanism 120 moves out, in this embodiment, the placement mechanism that is pre-loaded with the wafer rings can be hoisted onto the moving mechanism 120 as a whole, which not only improves the material change efficiency, but also eliminates the need for manual handling. In addition, since the placement mechanism 130 can pre-place the wafer rings 200, the process of loading the wafer rings basically does not occupy the machine working hours, and the film sticking efficiency of the wafer film sticking equipment can be significantly improved.

[0060] In some embodiments, continue to refer to Figures 1 to 3 , the placement mechanism 130 is placed on the moving mechanism 120, and the moving mechanism 120 is provided with a locking component 121 for locking or releasing the placement mechanism 130. The placement mechanism 130 and the moving mechanism 120 are detachably connected by locking or releasing the locking component 121.

[0061] In a specific implementation, the locking component 121 can be one or more clamps that can be manually, electrically or pneumatically operated to clamp the placement mechanism 130 on the moving mechanism 120. In another specific implementation, the locking component 121 includes a buckle and a clamping body. One of the placement mechanism 130 and the moving mechanism 120 is provided with the buckle, and the other is provided with the clamping body, and the buckle and the clamping body are connected in a pluggable manner. Of course, the locking component 121 can also fix the placement mechanism 130 by magnetic attraction and other means, which will not be listed one by one in this embodiment.

[0062] In this embodiment, the placement mechanism 130 is fixed on the moving mechanism 120 by the locking component 121. This locking connection method can realize the rapid disassembly and assembly between the placement mechanism 130 and the moving mechanism 120, save the replacement time, and improve the efficiency of loading the wafer rings.

[0063] In some embodiments, refer to Figure 3, the moving mechanism 120 includes: a locking assembly 121, a carrier plate 122, and a moving part 123. Among them, the placing mechanism 130 is placed on the carrier plate 122, and the moving part 123 is arranged at the bottom of the carrier plate 122 and is used to drive the carrier plate 122 to move. The locking assembly 121 is installed on the carrier plate 122 and is used to lock or release the placing mechanism 130.

[0064] In specific implementation, the moving part 123 can be a bearing ball or the like, which can enable the moving mechanism 120 to move in any direction.

[0065] Furthermore, in some embodiments, the moving mechanism 120 further includes: a handle 124. Among them, the handle 124 is connected to the carrier plate 122, facilitating the operation of moving the moving mechanism 120 in and out.

[0066] In some embodiments, referring to Figure 1 and Figure 4 , the moving mechanism 120 further includes: a vertical plate 125 and a driving mechanism (not shown in the figure). Among them, the vertical plate 125 is connected to the carrier plate 122 and is provided with a slide rail 1251 along a direction perpendicular to the carrier plate 122. The placing mechanism 130 is slidably connected to the slide rail 1251. The driving mechanism is installed on the vertical plate 125 and is connected to the placing mechanism 130, and is used to drive the placing mechanism 130 to slide along the slide rail 1251.

[0067] In this embodiment, when the chip ring grasping device takes away a chip ring 200, the driving mechanism will drive the placing mechanism 130 to move upward automatically (relative to Figure 4 the state shown), so as to facilitate the chip ring grasping device to accurately take away the uppermost chip ring 200.

[0068] In some embodiments, continuing to refer to Figure 1 , the placing mechanism 130 includes: a carrier table 131 and at least three positioning columns 132. Among them, the carrier table 131 is connected to the moving mechanism 120 and is used to place the chip ring 200. Each positioning column 132 blocks the outer edge of the chip ring 200, and one end of each positioning column 132 is connected to the carrier table 131, and the other end is a free end.

[0069] In some embodiments, referring to Figure 3 , the moving mechanism 120 is provided with a positioning member 126 for positioning the placing mechanism 130. In a specific implementation, the positioning member 126 is a positioning pin. Correspondingly, the carrier table 131 of the placing mechanism 130 is provided with a positioning hole, and the positioning of the two is realized through the cooperation of the positioning pin and the positioning hole.

[0070] In some embodiments, referring to Figure 1 and Figure 4, the placing mechanism 130 further includes: a limit post 133. Wherein, a notch 210 is formed on the outer edge of the sheet ring 200, and the limit post 133 is connected to the carrier table 110 and is engaged with the notch 210 to limit the sheet ring 200. Specifically, the notch can be in the shape of a V shape, an arc shape, etc.

[0071] In some embodiments, referring to Figure 2 , the locking mechanism 140 includes: a positioning plate 141, a guide plate 142, and a first driving unit 143. Among them, the positioning plate 141 is fixedly connected to the carrier platform 110, the guide plate 142 is movably connected to the carrier platform 110 and is arranged in parallel with the positioning plate 141. The guide plate 142 can move along a direction close to or away from the positioning plate 141, and the moving mechanism 120 can be moved into the space between the positioning plate 141 and the guide plate 142. The first driving unit 143 is installed on the carrier platform 110 and is connected to the guide plate 142 for driving the guide plate 142 to move to clamp or release the moving mechanism 120.

[0072] In this embodiment, the moving mechanism 120 is clamped and fixed in the first direction, and the first direction here is the relative movement direction of the guide plate 142 and the positioning plate 141. In a specific implementation, the first driving unit 143 can be a power source such as an electric motor or a pneumatic motor. Both the positioning plate 141 and the guide plate 142 can be long strip-shaped plates, and the moving mechanism 120 moves into the space between the positioning plate 141 and the guide plate 142 along the length direction of the positioning plate 141 and the guide plate 142. The distance between the positioning plate 141 and the guide plate 142 is greater than the dimension of the moving mechanism 120 in the first direction, which is convenient for the moving mechanism 120 to enter.

[0073] Further, in some embodiments, referring to Figure 2 , the positioning plate 141 and the guide plate 142 are correspondingly outwardly extended at the first end ( Figure 2 the left end shown in the figure) with a guiding angle for facilitating the entry of the moving mechanism 120. The setting of this guiding angle makes the positioning plate 141 and the guide plate 142 outwardly extended into a flared shape at the entrance, which is convenient for the moving mechanism 120 to enter.

[0074] Further, in some embodiments, referring to Figure 3 , the moving mechanism 120 is provided with guiding wheels 127 on the side walls in contact with the positioning plate 141 and the guide plate 142. Correspondingly, the positioning plate 141 and the guide plate 142 are correspondingly provided with guide grooves (not shown in the figure), and the guiding wheels 127 are slidably embedded in the guide grooves. Specifically, the guide grooves are long strip-shaped through grooves opened along the length direction of the positioning plate 141 and the guide plate 142, and the guiding wheels 127 are embedded in the through grooves and can slide along the through grooves, playing a guiding role during the process of the moving mechanism 120 entering the space between the positioning plate 141 and the guide plate 142.

[0075] In some other embodiments, referring to Figure 2 , the locking mechanism 140 includes: a limit plate 144, a clamping member 145, and a second driving unit (not shown in the figure). Among them, the limit plate 144 is fixedly connected to the carrying platform 110, the clamping member 145 is telescopically disposed through the carrying platform 110 and is arranged opposite to the limit plate 144. The clamping member 145 is used to cooperate with the limit plate 144 to clamp and fix the moving mechanism 120 between the movements when extended, and to release the moving mechanism 120 when retracted. The second driving unit is installed on the carrying platform 110 and is connected to the clamping member 145 for driving the clamping member 145 to move.

[0076] In this embodiment, the carrying platform 110 is provided with a through hole, and the second driving unit drives the clamping member 145 to perform vertical (relative to Figure 1 , Figure 2 the state shown) telescopic movement along the through hole. When the clamping member 145 moves upward, the clamping member 145 contacts the moving mechanism 120 and pushes the moving mechanism 120 towards the limit plate 144, thereby clamping and fixing the moving mechanism 120 placed between the limit plate 144 and the clamping member 145.

[0077] In a specific implementation, the clamping member 145 is a first wedge block, and the moving mechanism 120 is provided with a second wedge block 128. The second wedge block 128 can be arranged at the end of the carrier plate 122, referring to Figure 3 . When the clamping member 145 moves upward, the first wedge block is pressed against the second wedge block 128, and the first wedge block pushes the moving mechanism 120 towards the limit plate 144 by squeezing the second wedge block 128, thereby clamping the moving mechanism 120.

[0078] In another specific implementation, the second driving unit can drive the clamping member 145 to perform vertical telescopic movement and move towards the limit plate 144. The second driving unit can include two power machines, respectively used to drive the clamping member 145 to perform telescopic movement and move towards the direction close to the limit plate 144, thereby clamping the moving mechanism 120.

[0079] It can be understood that in specific implementation, the second driving unit can be a motor or a pneumatic motor, etc.

[0080] It should be noted that the locking mechanism 140 provided in this embodiment can lock and fix the moving mechanism 120 alone, or can cooperate with the locking mechanism in the first direction provided in the above embodiment to perform double locking and fixing on the moving mechanism 120.

[0081] When they cooperate with each other, referring to Figure 1 and Figure 2, in this embodiment, the locking mechanism 140 can be arranged along the second direction to lock and fix the moving mechanism 120 in the second direction. It should be noted that the second direction in this embodiment is a direction perpendicular to the first direction.

[0082] Specifically, referring to Figure 1 and Figure 2 , the limiting plate 144 can be arranged between the positioning plate 141 and the guiding plate 142. The limiting plate 144 can be a through plate or multiple arranged plates. The positioning plate 141, the guiding plate 142 and the limiting plate 144 enclose a clamping space with one end open, and the open end is used for the moving mechanism 120 to move into the clamping space. The clamping member 145 is arranged at the open end, and the telescopic movement of the clamping member 145 can also cooperate with the moving in or out of the moving mechanism 120.

[0083] Further, in some embodiments, the moving mechanism 120 is provided with a guiding wheel 129 on the side wall in contact with the limiting plate 144. Referring to Figure 3 , correspondingly, a guiding groove (not shown in the figure) is opened at a position corresponding to the limiting plate 144, and the guiding wheel 129 is slidably embedded in the guiding groove, so that when the guiding plate 142 pushes the moving mechanism 120 to move along the first direction, it can play a guiding role for the moving mechanism 120.

[0084] Further, in some embodiments, the locking mechanism 140 further includes: a detection unit 146 and a control unit (not shown in the figure). Among them, the detection unit 146 is installed on the limiting plate 144 and is used to detect whether the moving mechanism 120 is in contact with the limiting plate 144. The control unit is electrically connected to both the detection unit 146 and the second driving unit, and is used to control the second driving unit to drive the clamping member 145 to perform clamping and fixing when it detects that the moving mechanism 120 is in contact with the limiting plate 144. Specifically, the detection unit 146 can be a photoelectric sensor, a pressure sensor, etc.

[0085] In some other embodiments, continuing to refer to Figure 1 and Figure 2 , the locking mechanism 140 includes: a third driving unit 147 and a pressing component 148. Among them, the third driving unit 147 is installed on the bearing platform 110, and the pressing component 148 is connected to the third driving unit 147 and is placed above the moving mechanism 120 (relative to Figure 1 the state shown), and the third driving unit 147 is used to drive the pressing component 148 to move in a direction close to or away from the moving mechanism 120 to press or release the moving mechanism. Specifically, the pressing component 148 can be set to one, two or more than two, and the specific number of the pressing component 148 is not limited in this embodiment. The third driving unit 147 can be a motor, a pneumatic motor, etc.

[0086] It can be seen that in this embodiment, the moving mechanism 120 can be clamped and fixed in the third direction. It should be noted that the third direction in this embodiment is a direction perpendicular to the first direction and the second direction.

[0087] In some embodiments, referring to Figure 2 , the pressing assembly 148 may include a bracket 1481 and a ball pressing part 1482. Among them, the bracket 1481 is installed at the output end of the third driving unit 147, the ball pressing part 1482 is installed on the bracket 1481, and the end of the ball pressing part 1482 for pressing against the moving mechanism 120 is provided with balls to avoid damaging the moving mechanism 120.

[0088] Furthermore, in some embodiments, the third driving unit 147 is a spinning cylinder. Since the spinning cylinder can not only drive the pressing assembly 148 to perform a clamping motion, but also perform a rotational motion in a plane, the pressing position of the pressing assembly 148 on the moving mechanism 120 can be adjusted.

[0089] It should be noted that the locking mechanism provided in this embodiment can lock and fix the moving mechanism 120 alone, or cooperate with the locking mechanisms in the first direction and / or the second direction to achieve a better locking effect.

[0090] In some embodiments, the first driving unit 143 and the third driving unit 147 can also be connected to the control unit to realize the control of the locking mechanisms in three directions through the control unit.

[0091] It can be understood that in specific implementation, the control unit should be provided with a control switch. A safety door can be set in the space of the wafer laminating device for placing the wafer ring carrier device 100, and the control switch of the control unit can be set on this safety door.

[0092] The process of loading the wafer ring when locking mechanisms 140 are provided in all of the first direction, the second direction, and the third direction is described as follows:

[0093] Referring to Figure 1, manually press the control switch on the safety door of the wafer ring carrier device 100. After that, the first driving unit 143 retracts the guide plate 142 to the right, the second driving unit lowers the first wedge block, and the third driving unit 147 rotates and raises the pressing assembly 148 to the initial position; then manually open the safety door and pull out the moving mechanism 120 from the wafer laminating device (a ramp structure can be set outside the device frame to facilitate the movement of the moving mechanism 120 in and out). Manually lift the wafer rings 200 onto the placing mechanism 130 multiple times until the required quantity, and then push the moving mechanism 120 along the positioning plate 141 and the guide plate 142 until it contacts the limiting plate 144, and close the safety door; after the detection unit 146 detects that the moving mechanism 120 contacts the limiting plate 144, the control unit controls the third driving unit 147 to rotate and lower the pressing assembly 148 to press the carrier plate 122 of the moving mechanism 120, the first driving unit 143 pushes the moving mechanism 120 to be fixed to the positioning plate 141 with the guide plate 142, and the second driving unit raises the first wedge block to squeeze the second wedge block 128 on the moving mechanism 120 to push the moving mechanism 120 towards the limiting plate 144 for clamping and fixing. Thus, the wafer ring loading is completed.

[0094] Further, when there are two or more groups of placing mechanisms 130, when the moving mechanism 120 pulls out the upper wafer ring, loosen the locking assembly 121, lift out the empty placing mechanism 130, then lift the placing mechanism 130 pre-filled with wafer rings as a whole onto the moving mechanism 120, and use the locking assembly 121 for locking and fixing, and the upper wafer ring efficiency can be significantly improved.

[0095] It can be seen that the locking mechanism 140 in an embodiment of the present application can automatically and quickly position and fix the moving mechanism 120.

[0096] An embodiment of the present application further provides a wafer laminating device 300, see Figure 5 and Figure 6 . The device includes: a support body 310, a wafer ring grasping mechanism 320 installed on the support body 310, a loading manipulator 330, a laminating mechanism 340, and any one of the wafer ring carrier devices 100 in the above embodiments.

[0097] It can be understood that in specific implementation, the wafer laminating device 300 may further include a transfer and flipping mechanism 350, a marking mechanism 360, and a unloading mechanism 370 installed on the support body 310.

[0098] In a specific implementation, see Figure 5, the support 310 is provided with a bottom platform 311 and a top platform 312. The wafer ring gripping device 320, the loading manipulator 330, the film pasting mechanism 340, the transfer and flipping mechanism 350, the marking mechanism 360 and the unloading mechanism 370 can be arranged on the top platform 312. The wafer ring carrying device 100 is placed on the bottom platform 311 and corresponds to the wafer ring gripping device 320. The wafer ring gripping device 320 is used to send the wafer ring 200 in the wafer ring carrying device 100 to the film pasting mechanism 340, and the film pasting mechanism 340 is used to paste a film on the wafer ring and the wafer.

[0099] In some embodiments of the present application, the wafer ring carrying device 100 can be removed from the wafer film pasting equipment 300 to add the wafer ring 200. This way of adding the wafer ring outside the wafer film pasting equipment 300 is not only convenient for manual operation, but also reduces the labor intensity of workers. In addition, it can significantly shorten the wafer ring loading time of the wafer film pasting equipment, greatly improving the production efficiency.

[0100] In some embodiments, the support 310 is provided with a ramp structure (not shown in the figure) that facilitates the movement mechanism 120 to move in and out, and the ramp structure is docked with the carrying platform 110.

[0101] In some embodiments, the film pasting mechanism 340 is a rolling film pasting mechanism.

[0102] It can be understood that in this embodiment, refer to Figure 5 , Figure 6 and Figure 9 , the loading manipulator 330 can include an X-direction moving module, a Z-direction moving module and an XY-plane rotating arm. The X-direction moving module and the Z-direction moving module can drive the XY-plane rotating arm to move along the X-direction and the Z-direction. The loading manipulator 330 can suck the wafer from the table 410 of the cleaning mechanism of the thinning equipment 400 and place it on the moving table 3411 of the rolling film pasting mechanism. Refer to Figure 9 .

[0103] In this embodiment, the wafer ring gripping mechanism 320 is placed directly above the wafer ring carrying device 100. Refer to Figure 8 , the wafer ring gripping mechanism 320 includes a Z-direction driving component 321, a Z-direction servo driving module 322 and a suction cup component 323. Among them, the suction cup component 323 is connected to the Z-direction servo driving module 322, and the Z-direction servo driving module 322 can drive the suction cup component 323 to lift along the Z-direction. The Z-direction servo driving component 322 is also connected to the Z-direction driving component 321, and the Z-direction driving component 321 can simultaneously drive the Z-phase servo driving component and the suction cup component 323 to lift along the Z-direction.

[0104] When picking up the wafer ring 200, the Z-direction driving component 321 first moves downward along the Z-direction to the in-place position, and then the Z-direction servo driving component 322 continues to drive the suction cup component 323 to descend according to the current height of the wafer ring. After the suction cup component 323 picks up the wafer ring 200 from the wafer ring carrying device 100, the Z-direction pneumatic driving component 321 and the Z-direction servo driving module 322 return to their original positions. When the suction cup component 323 places the wafer ring 200, the moving table 341 of the film pasting mechanism 340 reaches the wafer ring loading position below the wafer ring grasping mechanism 320. The Z-direction servo driving module 322 drives the suction cup component 323 to descend by a set height, and the suction cup component 323 places the wafer ring on the wafer ring placing table 342. Refer to Figure 9 . It should be noted that the up and down in this embodiment are relative to Figure 8 the state shown.

[0105] It can be understood that in specific implementation, the Z-direction driving component 321 and the Z-direction servo driving module 322 can be powered by pneumatic, electric or other power sources. This embodiment does not make any limitation on their specific driving forms.

[0106] In this embodiment, refer to Figure 9 , the rolling film pasting mechanism includes a moving table 341, a moving table Y-direction driving module (not shown in the figure) and a rolling film pasting component (not shown in the figure). Among them, the moving table 341 includes a wafer placing table 3411, a wafer ring placing table 3412, an XY plane rotating component 3413 and a Z-direction driving component 3414. Among them, the wafer placing table 3411 is fixed on the XY plane rotating component 3413, and the two are fixed on the Z-direction driving component 3414 together.

[0107] The moving table Y-direction driving module drives the moving table 341 to move in the Y-direction. The moving table 341 has five working positions in the Y-direction, which are: wafer loading position, camera photographing position, wafer ring loading position, film pasting starting position and wafer-wafer ring transfer position.

[0108] At the wafer loading position, the Z-direction driving component 3414 drives the wafer placing table 1411 to move in the Z-direction to adjust the height, and cooperate with the loading manipulator 330 to load the wafer onto the wafer placing table 1411. At the camera photographing position, the XY plane rotating component 3413 drives the wafer placing table 3411 to rotate in the XY plane, and at the same time uses the camera to take an image of the wafer, and compares it with the pre-stored image to confirm the position difference of the notch on the captured image and the pre-stored image, so that the notch of each wafer is at a preset angle, and further makes the wafers entering the film pasting process consistent. At the film pasting starting position, the Z-direction driving component 3414 drives the wafer placing table 3411 to move in the Z-direction to adjust the height, so that the height of the wafer matches the preset value for convenient film pasting. It should be noted that the preset angle and preset value in this embodiment can be determined according to the actual situation, and this embodiment does not make any limitation here.

[0109] Those skilled in the art should understand that the roll - pressing film - pasting component generally includes a feeding roller, a guiding roller, a tension roller, a recovery roller, a die - pressing component and a cutting component. Through the cooperation of each mechanism, the film is pasted on the sheet ring and the wafer to become an integral whole. This mechanism is a mature existing technology and will not be elaborated here.

[0110] In this embodiment, referring to Figure 7 , the transfer and flipping mechanism 350 includes an X - direction driving component 351, a Z - direction driving component 352 and a YZ - plane rotating gripper component 353. Among them, the YZ - plane rotating gripper component 353 is connected to the Z - direction driving component 352, and the Z - direction driving component 352 is slidably connected to the X - direction driving component 351. The X - direction driving component 351 can drive the Z - direction driving component and the YZ - plane rotating gripper component 353 to move along the X - direction.

[0111] The transfer and flipping mechanism 350 can pick up the sheet - ring wafer on the moving table 341. When grasping, the transfer and flipping mechanism 350 can move along the X - direction under the drive of the X - direction driving component 351, and can also move along the Z - direction under the drive of the Z - direction driving component 352, and place the sheet - ring wafer on the transfer table of the marking mechanism 360. During the movement of the transfer and flipping mechanism 350 along the X - direction, the wafer sheet - ring is flipped 180° through the YZ - plane rotating gripper component 353, so that the film - pasting side of the wafer sheet - ring placed on the transfer table of the marking mechanism 360 is located below.

[0112] It can be understood that the marking mechanism 360 generally includes a marking machine, a labeling component and a transfer table. The transfer table includes a Y - direction driving module, and two Y - direction working positions, namely a wafer sheet - ring receiving position and a marking position. The transfer table receives the wafer sheet - ring transmitted by the transfer and flipping mechanism 350, moves along the Y - direction to the labeling position below the labeling component for labeling, and then sends the wafer sheet - ring back to the wafer sheet - ring receiving position in the Y - direction, waiting for the unloading manipulator to pick up the part. The labeling component generally includes a Z - direction moving component, which can descend with the label conveyed by the marking machine and fix it on the film of the wafer sheet - ring.

[0113] It can be understood that in this embodiment, the unloading mechanism 370 generally includes a material box and an unloading manipulator. Among them, the unloading manipulator includes a Y - direction moving arm, a Z - direction moving arm, an XY - plane rotating arm and a gripper. The unloading manipulator picks up the wafer sheet - ring (referred to as the sheet - ring) on the transfer table at the wafer sheet - ring receiving position, makes a Y - direction movement and an XY - plane rotation, and sends it to the position of the material box, and adjusts the Z - direction height through the Z - direction moving arm and puts it into the partition layer of the material box.

[0114] Specifically, a sensor can be arranged in the material box to send a signal after the material box is full to remind to replace the empty material box.

[0115] In this embodiment, the working process of the wafer film sticking device is as follows: The loading manipulator 330 grabs the wafer from the table 410 of the cleaning mechanism of the thinning device 400 and moves it to the wafer loading position. At this time, the moving table 341 of the rolling film sticking mechanism has moved to the wafer loading position, and the loading manipulator 1 places the wafer on the wafer placement table 3411. At the same time, the suction cup assembly 323 in the wafer ring grabbing mechanism 320 descends to suck the wafer ring 200 in the wafer ring carrying device 100, and then ascends and resets. The moving table 341 drives the wafer to the camera photographing position. After photographing and comparison, the wafer placement table 3411 drives the wafer to rotate the angle so that the notch is consistent with the preset angle. While the wafer placement table 3411 is rotating, the moving table 341 moves along the Y direction to the wafer ring loading position. The suction cup assembly 323 drives the wafer ring 200 to descend and places the wafer ring 200 on the wafer ring placement table 3412. The moving table 341 drives the wafer ring 200 and the wafer to the starting position of rolling film sticking, and moves in the Y direction to cooperate with the rolling film sticking assembly for film sticking. After film sticking, the moving table 341 drives the wafer and wafer ring to move in the Y direction to the wafer and wafer ring transfer position below the transfer and flipping mechanism 350. The YZ plane rotating gripper assembly 353 of the transfer and flipping mechanism 350 descends to the moving table 341 to pick up the wafer and wafer ring, then ascends, and moves along the X direction to the wafer and wafer ring receiving position of the marking machine 360. During the movement in the X direction, the YZ plane rotating gripper assembly 353 rotates 180° at the same time to rotate the film sticking surface of the wafer and wafer ring to the bottom. At this time, the transfer table is at the wafer and wafer ring receiving position, and the YZ plane rotating gripper assembly 353 descends to place the wafer on the transfer table. The transfer table moves in the Y direction to the labeling position below the labeling assembly, and the labeling assembly drives the label to move down for marking. After labeling, the transfer table moves in the Y direction to the wafer and wafer ring receiving position, and the unloading manipulator of the unloading mechanism 370 picks up the wafer and wafer ring and places them in the partition of the material box.

[0116] It can be seen that the wafer film sticking device in this embodiment includes seven mechanisms. Among them, when loading the wafer ring on the wafer ring carrying device, it does not occupy the machine working hours, and the other six mechanisms occupy the machine working hours, so the film sticking efficiency is relatively high. In addition, the structure of this device is relatively compact.

[0117] In some other embodiments, the film sticking mechanism 340 is a vacuum film sticking mechanism. The specific implementation process can refer to the above rolling film sticking mechanism, and this embodiment will not be elaborated here.

[0118] In summary, in the embodiment of the present application, when adding the wafer ring, the wafer ring carrying device 100 can be removed from the wafer film sticking device 300. This adding method is not only convenient for manual operation, but also reduces the labor intensity of workers, and can significantly shorten the wafer ring loading time of the wafer film sticking device, greatly improving the production efficiency.

[0119] Obviously, those skilled in the art can make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalent technologies, this application is also intended to cover these changes and modifications.

Claims

1. A wafer film attaching device is provided with a wafer film attaching device, characterized in that, Comprising: A carrying platform for connecting with the wafer laminating device; A moving mechanism movably arranged on the carrying platform; A placing mechanism connected to the moving mechanism for placing the wafer ring; A locking mechanism connected to the carrying platform for locking the moving mechanism when the moving mechanism moves into the carrying platform, and releasing the moving mechanism when adding a wafer ring and moving out of the carrying platform.

2. The wafer ring carrying device according to claim 1, wherein: The placing mechanism is detachably connected to the moving mechanism, and there are at least two groups of the placing mechanisms, so that the placing mechanism pre-placed with a wafer ring can be replaced when the moving mechanism moves out of the carrying platform.

3. The wafer ring carrying device according to claim 2, wherein: The placing mechanism is placed on the moving mechanism; The moving mechanism is provided with a locking assembly for locking or releasing the placing mechanism; The placing mechanism and the moving mechanism are detachably connected by locking or releasing of the locking assembly.

4. The wafer ring carrying device according to claim 2, wherein: The moving mechanism is provided with a positioning member for positioning the placing mechanism.

5. The chip ring carrier device according to claim 1, characterized in that, The locking mechanism includes: A positioning plate fixedly connected to the carrying platform; A guiding plate movably connected to the carrying platform and arranged in parallel with the positioning plate, the guiding plate can move along a direction close to or away from the positioning plate, and the moving mechanism can move into the space between the positioning plate and the guiding plate; A first driving unit installed on the carrying platform and connected to the guiding plate for driving the guiding plate to move to clamp or release the moving mechanism.

6. The wafer ring carrying device according to claim 5, wherein: The positioning plate and the guiding plate are correspondingly formed with a guiding angle at the first end for facilitating the moving mechanism to move in.

7. The wafer ring carrying device according to claim 5, wherein: The moving mechanism is provided with guiding wheels on the side walls in contact with the positioning plate and the guiding plate; The positioning plate and the guiding plate are correspondingly provided with guiding grooves, and the guiding wheels are slidably embedded in the guiding grooves.

8. The chip ring carrier device according to claim 1, wherein, The locking mechanism includes: A limiting plate fixedly connected to the carrying platform; A clamping member telescopically passing through the carrying platform and oppositely arranged with the limiting plate, the clamping member is used for clamping and fixing the moving mechanism between them when extending out, and releasing the moving mechanism when retracting; A second driving unit installed on the carrying platform and connected to the clamping member for driving the clamping member to move.

9. The wafer ring carrying device according to claim 8, wherein: The clamping member is a first wedge block; The moving mechanism is provided with a second wedge block; The first wedge block is pressed against the second wedge block, and the first wedge block is used for squeezing the second wedge block to push the moving mechanism towards the limiting plate.

10. The wafer ring carrying device according to claim 8, wherein: The moving mechanism is provided with guide wheels on the side wall in contact with the limiting plate; A guide groove is correspondingly formed at the position of the limiting plate, and the guide wheels are slidably embedded in the guide groove.

11. The sheet ring carrier device according to claim 8, wherein, The locking mechanism further includes: A detection unit, installed on the limiting plate, for detecting whether the moving mechanism is in contact with the limiting plate; A control unit, electrically connected to both the detection unit and the second driving unit, for controlling the second driving unit to drive the clamping member to perform clamping and fixing when it is detected that the moving mechanism is in contact with the limiting plate.

12. The chip ring carrier device according to claim 1, wherein, The locking mechanism includes: A third driving unit, installed on the carrying platform; A pressing assembly, connected to the third driving unit and placed above the moving mechanism, and the third driving unit is used to drive the pressing assembly to move in a direction close to or away from the moving mechanism to press or release the moving mechanism.

13. The sheet ring carrying device according to claim 12, wherein The third driving unit is a spinning cylinder.

14. The chip ring carrier device according to claim 12, wherein The pressing assembly includes: A bracket, connected to the output end of the third driving unit; A ball pressing part, connected to the bracket and provided with balls at the end for pressing against the moving mechanism.

15. The chip ring carrier device according to claim 1, wherein The moving mechanism includes: A carrying plate, on which the placing mechanism is placed; A moving part, arranged at the bottom of the carrying plate, for driving the carrying plate to move; A locking assembly, installed on the carrying plate, for locking the placing mechanism.

16. The chip ring carrier device according to claim 15, characterized in that, The moving mechanism further includes: A handle, connected to the carrying plate.

17. The chip ring carrier device according to claim 15, wherein, The moving mechanism further includes: A vertical plate, connected to the carrying plate and provided with a slide rail along a direction perpendicular to the carrying plate, and the placing mechanism is slidably connected to the slide rail; A driving mechanism, installed on the vertical plate and connected to the placing mechanism, for driving the placing mechanism to slide along the slide rail.

18. The chip ring carrier device according to claim 1, wherein The placing mechanism includes: A carrying table, connected to the moving mechanism, for placing the sheet ring; At least three positioning columns, each of the positioning columns blocking the outer edge of the sheet ring, and one end of each positioning column is connected to the carrying table and the other end is a free end.

19. The chip ring carrier device according to claim 18, wherein, The placing mechanism further includes: A limiting column, a notch is formed on the outer edge of the sheet ring, and the limiting column is connected to the carrying table and is engaged with the notch.

20. The sheet ring carrying device according to claim 18, wherein The moving mechanism is provided with a positioning pin; correspondingly, The carrying table is provided with a positioning hole, and the positioning pin is matched with the positioning hole.

21. A wafer film attaching device, characterized in that, Including: A support body, a sheet ring grasping device installed on the support body, a loading manipulator and a film pasting mechanism, and the sheet ring carrying device according to any one of claims 1 to 20; wherein, The carrying platform in the sheet ring carrying device is installed on the support body and corresponds to the sheet ring grasping device, and the sheet ring grasping device is used to send the sheet ring in the sheet ring carrying device to the film pasting mechanism; The loading manipulator is used to send the wafer to be pasted with film to the film pasting mechanism; The film pasting mechanism is used to perform film pasting treatment on the sheet ring and the wafer.

22. The wafer film attaching equipment according to claim 21, characterized in that: The support body is provided with a slope structure, the slope structure is connected to the bearing platform, and the moving mechanism moves into or out of the bearing platform through the slope structure.

23. The wafer film attaching equipment according to claim 21, characterized in that: The film sticking mechanism is a rolling film sticking mechanism; or, The film sticking mechanism is a vacuum film sticking mechanism.

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