Semiconductor packaging clamp

Abstract

The utility model relates to the technical field of chip packaging, and provides a semiconductor packaging clamp, which comprises a base; the longitudinal clamping assembly comprises two clamping strips arranged in parallel and a first elastic assembly connected to the clamping strips, and the first elastic assembly is suitable for pushing the clamping strips to slide relative to the base in the longitudinal direction; and the transverse clamping assembly comprises two parallel clamping plates, a second elastic assembly and a locking assembly, the second elastic assembly and the locking assembly are connected to the clamping plates, the second elastic assembly is suitable for pushing the clamping plates to slide relative to the base in the transverse direction, and the locking assembly is suitable for fixing the clamping plates to preset positions so as to limit transverse sliding of the clamping plates. According to the semiconductor chip clamping device, the locking assembly is arranged, the transverse clamping assembly can be locked in advance, and the locking assembly is unlocked after the longitudinal clamping assembly completes clamping of the semiconductor chip, so that the transverse clamping assembly completes transverse clamping of the semiconductor chip, and the convenience of clamping the semiconductor chip and the efficiency of completing clamping are improved.

Description

Technical Field

[0001] The present application relates to the technical field of chip packaging, and particularly relates to a semiconductor packaging fixture. Background Art

[0002] At present, with the rapid development of new industries and the continuous improvement of semiconductor chip technology, semiconductor chips are gradually developing towards being thinner, lighter, and more miniature. In order to protect semiconductor chips, enhance heat dissipation performance, realize the connection between semiconductor chips and external circuits, and provide a stable and reliable working environment, semiconductor chips need to be packaged.

[0003] Currently, when packaging semiconductor chips, most of them directly place the semiconductor chips on the base, and the base does not have the function of limiting the semiconductor chips, which easily causes the semiconductor chips to be placed obliquely. This easily leads to damage to the semiconductor chips when clamping them, and even results in the scrapping of the semiconductor chips. Additionally, if the semiconductor chips are placed obliquely, the position of the semiconductor chips needs to be adjusted, which will reduce the packaging efficiency of the semiconductor chips. Summary of the Utility Model

[0004] To solve the above problems, the present application provides a semiconductor packaging fixture, which is ingeniously designed and has a simple structure. By setting a locking component, the transverse clamping component can be pre-locked, and the locking component is unlocked after the longitudinal clamping component completes the clamping of the semiconductor chip, so that the transverse clamping component completes the transverse clamping of the semiconductor chip. This improves the convenience of clamping the semiconductor chip and the efficiency of completing the clamping. The technical solutions adopted by the present application are as follows:

[0005] A semiconductor packaging fixture, comprising:

[0006] A base; a longitudinal clamping component, including two clamping bars arranged in parallel and a first elastic component connected to the clamping bars, the first elastic component being adapted to push the clamping bars to slide longitudinally relative to the base; a transverse clamping component, including two clamping plates arranged in parallel and a second elastic component and a locking component connected to the clamping plates, the second elastic component being adapted to push the clamping plates to slide transversely relative to the base, and the locking component being adapted to fix the clamping plates at a preset position to limit the transverse sliding of the clamping plates.

[0007] By setting a locking component, the transverse clamping component can be pre-locked, and the locking component is unlocked after the longitudinal clamping component completes the clamping of the semiconductor chip, so that the transverse clamping component completes the transverse clamping of the semiconductor chip. This improves the convenience of clamping the semiconductor chip and the efficiency of completing the clamping.

[0008] In some embodiments, a first mounting plate is erected on the base, and a telescopic rod is connected to the first mounting plate. One end of the telescopic rod is fixed to the first mounting plate, and the other end is a free end, and the free end abuts against the clamping plate. The free end is adapted to push the clamping plate to slide horizontally, and the first mounting plate and the telescopic rod form the second elastic component.

[0009] By abutting the clamping plate against the free end of the telescopic rod instead of connecting them together, the disassembly, installation or replacement efficiency of the clamping plate can be improved on the premise of ensuring that the telescopic rod can push the clamping plate to slide horizontally when it extends.

[0010] In some embodiments, a second mounting plate is connected to the first mounting plate. The second mounting plate is provided with a through hole, and a locking pin is arranged in the through hole; a guide cylinder is further arranged on the first mounting plate, and a guide block is clamped in the guide cylinder. The guide block can slide horizontally in the guide cylinder, and one end of the guide block away from the guide cylinder is connected to the clamping plate; the guide block is provided with a locking groove adapted to the locking pin. When the locking groove is aligned with the through hole, one end of the locking pin enters the locking groove to fix the clamping plate; the first mounting plate, the second mounting plate, the locking pin, the guide cylinder and the guide block form the locking component.

[0011] By providing the guide cylinder and the guide block, the horizontal sliding of the clamping plate can be guided, the moving direction of the clamping plate can be restricted, and the risk of the position deviation of the semiconductor chip can be reduced by preventing the moving direction of the clamping plate from deviating. In addition, through the cooperation of the through hole on the second mounting plate, the locking pin in the through hole and the locking groove on the guide block, when the locking groove is aligned with the through hole and the locking pin enters the locking groove, the guide block is fixed and cannot slide in the guide cylinder, thereby preventing the horizontal sliding of the clamping plate and playing a role in locking the clamping plate.

[0012] In some embodiments, the through hole is a threaded hole, and the locking pin is provided with an external thread. By screwing the locking pin, one end of the locking pin enters or leaves the locking groove.

[0013] By designing the through hole as a threaded hole and the locking pin having an external thread, the locking pin is not easily loosened accidentally after being screwed into the threaded hole, so that the locking pin releases the locking of the clamping plate, making the locking of the locking pin on the clamping plate more stable.

[0014] In some embodiments, one end of the guide block away from the guide cylinder is detachably connected to the clamping plate.

[0015] Through the detachable connection between the guiding block and the clamping plate, the clamping plate is convenient for installation, disassembly and replacement. For semiconductor chips of different sizes, corresponding clamping plates can be replaced, improving the adaptability of the fixture.

[0016] In some embodiments, an installation groove is provided at one end of the guiding block close to the clamping plate, and a through-threaded hole is provided on the groove wall of the installation groove; an installation block is provided on one side of the clamping plate close to the guiding block, and the installation block is provided with an insertion hole aligned with the threaded hole; the installation block is placed in the installation groove, and the detachable connection between the guiding block and the clamping plate is completed by screws provided in the threaded hole and the insertion hole.

[0017] In some embodiments, the first elastic component includes a slider and a spring. The base is provided with a longitudinal sliding groove, the slider is clamped in the sliding groove and connected to the clamping strip; the spring is arranged in the sliding groove and one end of the spring abuts against the slider to enable the slider to slide longitudinally in the sliding groove.

[0018] In some embodiments, the base includes a base body and a carrier. The base body is provided with a receiving groove, the carrier is arranged in the receiving groove, and the sliding groove is arranged on the carrier.

[0019] In some embodiments, each clamping strip is at least connected with two first elastic components arranged in parallel.

[0020] By providing at least two first elastic components on one clamping strip, the risk of deviation during the longitudinal sliding of the clamping strip can be reduced. At the same time, the stress uniformity of the semiconductor chip when the clamping strip clamps the semiconductor chip is improved, and the risk of damage or even scrapping of the semiconductor chip due to uneven stress is reduced.

[0021] In some embodiments, the bearing surface of the carrier is provided with an alignment groove. The alignment groove includes a transverse groove extending in the transverse direction and a longitudinal groove extending in the longitudinal direction. The two clamping strips are symmetrically arranged with respect to the transverse groove, and the two clamping plates are symmetrically arranged with respect to the longitudinal groove.

[0022] By providing the alignment groove, a reference for the clamping posture of the semiconductor chip is provided. When the clamping posture of the semiconductor chip is incorrect, it is easy to detect and correct, reducing the risk of damage to the semiconductor chip.

[0023] A semiconductor packaging fixture provided by the present application has at least one of the following beneficial effects:

[0024] 1. A semiconductor packaging fixture provided by the present application can pre-lock the lateral clamping assembly by setting a locking assembly, and then unlock the locking assembly after the longitudinal clamping assembly completes the clamping of the semiconductor chip, so that the lateral clamping assembly completes the lateral clamping of the semiconductor chip, which improves the convenience of clamping the semiconductor chip and the efficiency of completing the clamping.

[0025] 2. A semiconductor packaging fixture provided by the present application can improve the installation, disassembly or replacement efficiency of the clamping plate by abutting the clamping plate against the free end of the telescopic rod instead of connecting them together, on the premise of ensuring that the telescopic rod can push the clamping plate to slide laterally when it extends.

[0026] 3. A semiconductor packaging fixture provided by the present application can guide the lateral sliding of the clamping plate by setting a guide cylinder and a guide block, limit the moving direction of the clamping plate, prevent the moving direction of the clamping plate from deviating, and thus reduce the risk of the position deviation of the semiconductor chip. In addition, through the cooperation of the through hole on the second mounting plate, the locking pin in the through hole and the locking groove on the guide block, when the locking groove is aligned with the through hole and the locking pin enters the locking groove, the guide block is fixed and cannot slide in the guide cylinder, thereby preventing the lateral sliding of the clamping plate and playing a role in locking the clamping plate.

[0027] 4. A semiconductor packaging fixture provided by the present application can make the locking of the locking pin to the clamping plate more stable by designing the through hole as a threaded hole and the locking pin having an external thread, so that the locking pin is not easily loosened accidentally after being screwed into the threaded hole, resulting in the unlocking of the locking pin from the clamping plate.

[0028] 5. A semiconductor packaging fixture provided by the present application makes the clamping plate easy to install, disassemble and replace through the detachable connection between the guide block and the clamping plate. For semiconductor chips of different sizes, the corresponding clamping plate can be replaced, which improves the adaptability of the fixture.

[0029] 6. A semiconductor packaging fixture provided by the present application can reduce the risk of deviation when the clamping strip slides longitudinally by setting at least two first elastic components on one clamping strip, and at the same time improve the force uniformity of the semiconductor chip when the clamping strip clamps the semiconductor chip, reducing the risk of damage or even scrapping of the semiconductor chip due to uneven force.

[0030] 7. A semiconductor packaging fixture provided by the present application provides a reference for the clamping posture of the semiconductor chip by setting a positioning groove. When the clamping posture of the semiconductor chip is incorrect, it is easy to find and correct, reducing the risk of damage to the semiconductor chip. Description of the Drawings

[0031] The above characteristics, technical features, advantages and implementation methods of a semiconductor packaging fixture will be further described below in a clear and understandable manner in conjunction with the accompanying drawings:

[0032] Figure 1 is a schematic diagram of the overall structure of an embodiment of the present application;

[0033] Figure 2 is Figure 1 an enlarged view of part A in

[0034] Figure 3 is a partial schematic diagram after the overall horizontal sectioning;

[0035] Figure 4 is an exploded view of the horizontal clamping assembly;

[0036] Figure 5 is Figure 4 another perspective of

[0037] Figure 6 is a schematic diagram of the longitudinal clamping assembly;

[0038] Figure 7 is Figure 6 a schematic diagram after hiding the carrier stage in the embodiment;

[0039] Figure 8 is a top view of an embodiment of the present application.

[0040] Explanation of the reference numerals in the drawings:

[0041] Base body 1, clamping strip 2, clamping plate 3, first mounting plate 4, telescopic rod 5, second mounting plate 6, through hole 7, locking pin 8, guide cylinder 9, guide block 10, locking groove 11, mounting groove 12, threaded hole 13, mounting block 14, jack 15, screw 16, slider 17, spring 18, sliding groove 19, carrier stage 20, receiving groove 21, alignment groove 22. Specific embodiments

[0042] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the specific embodiments of the present application will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings, and other embodiments can also be obtained.

[0043] To simplify the drawings, only the parts relevant to the present application are schematically shown in each figure, and they do not represent the actual structure of the product. Additionally, to simplify the drawings and facilitate understanding, in some figures, only one of the components with the same structure or function is schematically shown, or only one of them is labeled. In this document, "one" not only means "only this one" but also can mean "more than one" situation.

[0044] It should also be further understood that the term "and / or" used in the description of the present application and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0045] In this document, it should be noted that unless otherwise clearly specified and defined, the terms "install", "connect", and "couple" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0046] In addition, in the description of the present application, the terms "first", "second", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0047] Referring Figures 1-8 , the present application provides a semiconductor packaging fixture, including: a base, a longitudinal clamping assembly, and a transverse clamping assembly; the longitudinal clamping assembly includes two clamping bars 2 arranged in parallel and a first elastic assembly connected to the clamping bars 2, and the first elastic assembly is adapted to push the clamping bars 2 to slide longitudinally relative to the base; the transverse clamping assembly includes two clamping plates 3 arranged in parallel, a second elastic assembly and a locking assembly connected to the clamping plates 3, the second elastic assembly is adapted to push the clamping plates 3 to slide transversely relative to the base, and the locking assembly is adapted to fix the clamping plates 3 at a preset position to limit the transverse sliding of the clamping plates 3.

[0048] Specifically, in practical applications, the base is fixed on the workbench of the semiconductor packaging system. The base and the workbench can be fixed by screwing, clamping, or magnetic attraction. It should be noted that the above connection methods are only for illustrative purposes and do not specifically limit the connection method between the base and the workbench. It can be understood that the "longitudinal" and "transverse" in the longitudinal clamping component and the transverse clamping component are only used to define the relativity of the clamping directions of the longitudinal clamping component and the transverse clamping component, and do not specifically limit the placement posture or placement position of the fixture. In other words, the longitudinal clamping component and the transverse clamping component achieve the clamping of the semiconductor chip in two orthogonal directions.

[0049] It can be understood that when it is necessary to complete the clamping of the semiconductor chip in two orthogonal directions, it is necessary to first complete the clamping in one direction and then complete the clamping in the other direction. When completing the clamping in the first direction, it is necessary to control the clamping component in the other direction to be clamped to prevent the clamping component in the other direction to be clamped from affecting the smooth progress of the clamping in the first direction. In this embodiment, by setting the locking component, the transverse clamping component can be locked in advance, and the locking component is unlocked after the longitudinal clamping component completes the clamping of the semiconductor chip, so that the transverse clamping component completes the transverse clamping of the semiconductor chip, which improves the convenience of clamping the semiconductor chip and the efficiency of completing the clamping.

[0050] Reference Figures 1-5 , in one embodiment, a first mounting plate 4 is erected on the base. A telescopic rod 5 is connected to the first mounting plate 4. One end of the telescopic rod 5 is fixed to the first mounting plate 4, and the other end is a free end, and the free end abuts against the clamping plate 3. The free end is adapted to push the clamping plate 3 to slide horizontally. The first mounting plate 4 and the telescopic rod 5 form a second elastic component. By abutting the clamping plate 3 against the free end of the telescopic rod 5 instead of connecting them together, the disassembly efficiency or replacement efficiency of the clamping plate 3 can be improved on the premise of ensuring that the telescopic rod 5 can push the clamping plate 3 to slide horizontally when it extends.

[0051] Reference Figures 1-5 、 Figure 8 , on the basis of the above embodiment, a second mounting plate 6 is connected to the first mounting plate 4. The second mounting plate 6 is provided with a through hole 7, and a locking pin 8 is arranged in the through hole 7; a guide cylinder 9 is also arranged on the first mounting plate 4, and a guide block 10 is clamped in the guide cylinder 9. The guide block 10 can slide horizontally in the guide cylinder 9. One end of the guide block 10 away from the guide cylinder 9 is connected to the clamping plate 3; the guide block 10 is provided with a locking groove 11 adapted to the locking pin 8. When the locking groove 11 is aligned with the through hole 7, one end of the locking pin 8 enters the locking groove 11 to realize the fixation of the clamping plate 3; the first mounting plate 4, the second mounting plate 6, the locking pin 8, the guide cylinder 9 and the guide block 10 form a locking component.

[0052] It is understandable that by providing the guide cylinder 9 and the guide block 10, the lateral sliding of the clamping plate 3 can be guided, the moving direction of the clamping plate 3 can be restricted, and the risk of the position deviation of the semiconductor chip can be reduced by preventing the moving direction of the clamping plate 3 from deviating. In addition, through the cooperation of the through hole 7 on the second mounting plate 6, the locking pin 8 in the through hole 7 and the locking groove 11 on the guide block 10, when the locking groove 11 is aligned with the through hole 7 and the locking pin 8 enters the locking groove 11, the guide block 10 is fixed and cannot slide in the guide cylinder 9, thereby preventing the lateral sliding of the clamping plate 3 and playing a role in locking the clamping plate 3.

[0053] It should be noted that in this embodiment, the through hole 7 can be a threaded hole with internal threads or a general through hole without internal threads. When the through hole 7 is a general through hole, the locking pin 8 can be directly inserted into the locking groove 11 without screwing; when the through hole 7 is a threaded hole, it is understandable that the locking pin 8 is provided with external threads adapted to the threaded hole. By screwing the locking pin 8, one end of the locking pin 8 enters or leaves the locking groove 11, thereby achieving the purpose of locking or unlocking. By designing the through hole 7 as a threaded hole and the locking pin 8 having external threads, the locking pin 8 is not easily loosened accidentally after being screwed into the threaded hole, so that the locking pin 8 is prevented from releasing the locking of the clamping plate 3, making the locking of the clamping plate 3 by the locking pin 8 more stable.

[0054] Reference Figures 2-5 , in one embodiment, one end of the guide block 10 away from the guide cylinder 9 is detachably connected to the clamping plate 3. It is easy to understand that by the detachable connection between the guide block 10 and the clamping plate 3, the clamping plate 3 is convenient for installation, disassembly and replacement, and the corresponding clamping plate 3 can be replaced for semiconductor chips of different sizes, improving the adaptability of the fixture.

[0055] Specifically, referring to Figures 2-5 , an installation groove 12 is provided at one end of the guide block 10 close to the clamping plate 3, and a through threaded hole 13 is provided on the groove wall of the installation groove 12; an installation block 14 is provided on one side of the clamping plate 3 close to the guide block 10, and the installation block 14 is provided with an insertion hole 15 aligned with the threaded hole 13; the installation block 14 is placed in the installation groove 12, and the detachable connection between the guide block 10 and the clamping plate 3 is completed by the screw 16 provided in the threaded hole 13 and the insertion hole 15.

[0056] Reference Figure 1 , Figure 2 , Figures 6-8 , in one embodiment, the first elastic component includes a slider 17 and a spring 18. The base is provided with a longitudinal sliding groove 19, the slider 17 is clamped in the sliding groove 19 and connected to the clamping strip 2; the spring 18 is arranged in the sliding groove 19 and one end of the spring 18 abuts against the slider 17 to enable the slider 17 to longitudinally slide in the sliding groove 19.

[0057] Reference Figure 2 、 Figures 6-8 In one embodiment, the base includes a base body 1 and a carrier 20. The base body 1 is provided with a receiving groove 21, the carrier 20 is disposed in the receiving groove 21, and a sliding groove 19 is disposed on the carrier 20.

[0058] It should be noted that, with reference to Figure 1 、 Figures 6-8 In one embodiment, each clamping strip 2 is at least connected with two first elastic components arranged in parallel. By arranging at least two first elastic components on one clamping strip 2, the risk of deviation during the longitudinal sliding of the clamping strip 2 can be reduced. At the same time, the force uniformity of the semiconductor chip when the clamping strip 2 clamps the semiconductor chip is improved, and the risk of damage or even scrapping of the semiconductor chip due to uneven force is reduced.

[0059] It should be noted that, with reference to Figure 6 、 Figure 8 In one embodiment, the bearing surface of the carrier 20 is provided with alignment grooves 22. The alignment grooves 22 include a transverse groove extending in the transverse direction and a longitudinal groove extending in the longitudinal direction. The two clamping strips 2 are symmetrically arranged with respect to the transverse groove, and the two clamping plates 3 are symmetrically arranged with respect to the longitudinal groove. By providing the alignment grooves 22, a reference for the clamping posture of the semiconductor chip is provided. When the clamping posture of the semiconductor chip is incorrect, it is easy to find and correct, reducing the risk of damage to the semiconductor chip.

[0060] It should be noted that the above embodiments can be freely combined as needed. The above are only the preferred embodiments of the present application. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present application, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present application.

Claims

1. A semiconductor packaging fixture, characterized in that, Comprising: A base; A longitudinal clamping assembly, including two clamping bars arranged in parallel and a first elastic assembly connected to the clamping bars, the first elastic assembly being adapted to push the clamping bars to slide longitudinally relative to the base; A transverse clamping assembly, including two clamping plates arranged in parallel, a second elastic assembly and a locking assembly connected to the clamping plates, the second elastic assembly being adapted to push the clamping plates to slide transversely relative to the base, and the locking assembly being adapted to fix the clamping plates at a preset position to limit the transverse sliding of the clamping plates.

2. The semiconductor packaging fixture according to claim 1, wherein, A first mounting plate is erected on the base, and a telescopic rod is connected to the first mounting plate. One end of the telescopic rod is fixed to the first mounting plate, and the other end is a free end, and the free end abuts against the clamping plate. The free end is adapted to push the clamping plate to slide transversely, and the first mounting plate and the telescopic rod form the second elastic assembly.

3. The semiconductor packaging fixture according to claim 2, wherein A second mounting plate is connected to the first mounting plate, the second mounting plate is provided with a through hole, and a locking pin is arranged in the through hole; A guide cylinder is further arranged on the first mounting plate, a guide block is clamped in the guide cylinder, and the guide block can slide transversely in the guide cylinder. One end of the guide block away from the guide cylinder is connected to the clamping plate; The guide block is provided with a locking groove adapted to the locking pin. When the locking groove is aligned with the through hole, one end of the locking pin enters the locking groove to fix the clamping plate; The first mounting plate, the second mounting plate, the locking pin, the guide cylinder and the guide block form the locking assembly.

4. A semiconductor package fixture according to claim 3, characterized in that, The through hole is a threaded hole, the locking pin is provided with an external thread, and by screwing the locking pin, one end of the locking pin enters or leaves the locking groove.

5. The semiconductor encapsulation fixture according to claim 3, wherein, One end of the guide block away from the guide cylinder is detachably connected to the clamping plate.

6. The semiconductor packaging fixture according to claim 5, wherein, An installation groove is arranged at one end of the guide block close to the clamping plate, and a through threaded hole is arranged on the groove wall of the installation groove; an installation block is arranged on one side of the clamping plate close to the guide block, and the installation block is provided with an insertion hole aligned with the threaded hole; the installation block is placed in the installation groove, and the detachable connection between the guide block and the clamping plate is completed by screws arranged in the threaded hole and the insertion hole.

7. A semiconductor packaging fixture according to any one of claims 1-6, characterized in that, The first elastic assembly includes a slider and a spring. The base is provided with a longitudinal sliding groove, the slider is clamped in the sliding groove and connected to the clamping bar; the spring is arranged in the sliding groove and one end of the spring abuts against the slider to enable the slider to slide longitudinally in the sliding groove.

8. A semiconductor packaging fixture according to claim 7, wherein, The base includes a base body and a carrier table. The base body is provided with a receiving groove, the carrier table is arranged in the receiving groove, and the sliding groove is arranged on the carrier table.

9. A semiconductor packaging fixture according to claim 7 or 8, characterized in that Each clamping bar is connected with at least two first elastic assemblies arranged in parallel.

10. A semiconductor packaging fixture according to claim 8, characterized in that, The bearing surface of the carrier table is provided with alignment grooves, the alignment grooves include a transverse groove extending transversely and a longitudinal groove extending longitudinally, the two clamping bars are symmetrically arranged with respect to the transverse groove, and the two clamping plates are symmetrically arranged with respect to the longitudinal groove.

Images