Laser diode light source heat dissipation structure

Abstract

The utility model discloses a laser diode light source heat dissipation structure which comprises a light source shell, a plurality of laser diodes are installed on the upper surface of the light source shell, a heat conduction plate used for making contact with the laser diodes for heat conduction is installed on the upper portion of the light source shell, and receding holes used for allowing pins of the laser diodes to penetrate out are formed in the heat conduction plate. A heat dissipation device used for cooling the heat conduction plate is arranged on the upper portion of the heat conduction plate. The heat conduction plate is in direct contact with the laser diode for heat conduction, the heat dissipation device is in direct contact with the heat conduction plate for heat dissipation of the heat conduction plate, the heat conduction path is short, the heat conduction efficiency is improved, the heat dissipation effect is good, and therefore rapid heat conduction of the laser diode is achieved. Meanwhile, the heat dissipation device is located above the light source shell, heat dissipation is directly conducted on the heat conduction plate, the complexity of the overall structure is effectively reduced, and the structural size is reduced.

Description

Technical Field

[0001] The present application relates to the field of laser diode heat dissipation technology, and in particular to a laser diode light source heat dissipation structure. Background Art

[0002] Due to the transient high heat generation of the laser diode, when the laser diode starts working or the input suddenly increases, it will generate instantaneous high temperature. The laser diode is a heat-sensitive device, and high temperature will cause the light output efficiency to decrease.

[0003] In order to ensure the stable and efficient light output of the laser diode, a corresponding heat dissipation structure needs to be set up to promptly conduct away the high heat generated by the laser diode. How to set up the heat dissipation structure to control the temperature of the laser diode at a stable value is the main problem that needs to be solved. Utility Model Content

[0004] The embodiment of the present application provides a laser diode light source heat dissipation structure, which is used to timely dissipate the high temperature generated by the laser diode during operation, so that the laser diode can operate in a temperature-stable environment.

[0005] In order to achieve the above-mentioned application purpose, the present application provides a laser diode light source heat dissipation structure, including a light source housing, a plurality of mounting holes for mounting laser diodes are arranged on the upper surface of the light source housing, the laser diodes are installed in the corresponding mounting holes, a heat conducting plate for contacting and conducting heat with each laser diode is installed on the upper part of the light source housing, the heat conducting plate is provided with clearance holes for the pins of each laser diode to pass through, and a heat dissipation device for cooling the heat conducting plate is arranged on the upper part of the heat conducting plate.

[0006] In the present application, the heat conduction plate is in contact with the laser diode for heat conduction, and the heat dissipation device is in direct contact with the heat conduction plate to dissipate the heat of the heat conduction plate. The heat conduction path is short, the heat conduction efficiency is improved, and the heat dissipation effect is good, thereby realizing the rapid extraction of heat from the laser diode. At the same time, the heat dissipation device is located above the light source housing and directly dissipates the heat of the heat conduction plate, which effectively reduces the complexity of the overall structure and reduces the structural volume.

[0007] Preferably, the laser diode is arranged to emit a light beam into the light source housing.

[0008] Preferably, the clearance holes and the mounting holes are arranged in one-to-one correspondence.

[0009] Optionally, a thermally conductive gasket is provided at the bottom of the heat conducting plate, and the thermally conductive gasket is provided with holes for the pins of each laser diode to pass through. The pins of the laser diode extend into the corresponding clearance holes of the thermally conductive plate through the corresponding holes on the thermally conductive gasket. The thermally conductive gasket is pressed into contact with each laser diode for heat conduction. The thermally conductive plate is in contact with each laser diode through the thermally conductive gasket for heat conduction, and the heat generated by the laser diode is conducted to the thermally conductive plate through the thermally conductive gasket.

[0010] Preferably, a support plate is installed on the outer side of the heat conduction plate. A flexible circuit board is arranged on the support plate. The flexible circuit board has a plurality of flexible circuit board legs extending above the pins of each laser diode, and the flexible circuit board legs are welded to the pins of the laser diode.

[0011] In this application, the laser diode is connected through the flexible circuit board legs. Compared with connecting the laser diode with a rigid circuit board, the threading difficulty of the pins of the laser diode is reduced. Each laser diode can be individually threaded and welded, or can be individually disassembled, replaced and desoldered, which is convenient for individual detection or maintenance, reduces the assembly difficulty, and facilitates the replacement, repair and maintenance of the laser diode 102.

[0012] At the same time, the flexible circuit board legs can absorb a certain amount of force deformation. Compared with the rigid circuit board, it can effectively reduce the force deformation on the laser diode during the assembly process, not only avoiding damage to the laser diode, but also ensuring the accuracy of the light emitting direction of the laser diode and the coupling efficiency of the light source.

[0013] Preferably, grooves matching with the flexible circuit board legs are arranged on the upper surface of the heat conduction plate, and the grooves extend from the edge of the upper surface of the heat conduction plate to the relief holes. Further preferably, the depth of the grooves is not less than the thickness of the flexible circuit board legs.

[0014] Preferably, the upper surface of the support plate is lower than the upper surface of the heat conduction plate. Further preferably, a step surface for supporting the support plate is arranged on the outer edge of the heat conduction plate. The step surface is parallel to the upper surface of the heat conduction plate and the height is lower than the upper surface of the heat conduction plate, and the support plate is installed on the step surface.

[0015] Further preferably, the support plate is annular and has a middle hole for accommodating the heat conduction plate in the middle. The support plate is sleeved on the outer side of the heat conduction plate, and the upper surface of the support plate is lower than the upper surface of the heat conduction plate.

[0016] Preferably, an insulating filler is installed in the relief hole, and the insulating filler has through holes for the pins of each laser diode to be correspondingly matched one by one.

[0017] Optionally, the heat conduction plate is fixedly connected to the light source housing. The number and position of the mounting holes on the side surface of the light source housing are set according to the working conditions, and there is no limitation on this.

[0018] Generally, the laser diode is fixedly installed in the mounting hole through processes such as welding and bonding, and emits light beams into the light source housing through the mounting hole.

[0019] Optionally, the heat dissipation device can adopt an air-cooled heat dissipation device or a liquid-cooled heat dissipation device, or can also adopt components with an active refrigeration function.

[0020] Further optionally, the heat dissipation device includes a TEC (ThermoElectric Cooler, semiconductor cooler) and a radiator. The cold end of the TEC is closely attached to the heat conduction plate. The radiator includes a bottom plate and a plurality of heat dissipation fins connected to the bottom plate. The bottom plate is closely attached to the hot end of the TEC. Further preferably, a heat dissipation fan is installed on the radiator.

[0021] One or more technical solutions in the embodiments of the present application have at least the following technical effects or advantages:

[0022] In the present application, the heat conduction plate directly contacts the laser diode for heat conduction, and the heat dissipation device directly contacts the heat conduction plate to dissipate heat from the heat conduction plate. The heat conduction path is short, the heat conduction efficiency is improved, and the heat dissipation effect is good, thereby realizing the rapid export of the heat of the laser diode. At the same time, the heat dissipation device is located above the light source housing and directly dissipates heat from the heat conduction plate, effectively reducing the complexity of the overall structure and reducing the structure volume. Description of the Drawings

[0023] Figure 1 It is a structural schematic diagram of the present utility model;

[0024] Figure 2 It is a structural schematic diagram of the present utility model after removing the heat dissipation device;

[0025] Figure 3 For Figure 2 an exploded structural schematic diagram of the components shown;

[0026] Figure 4 It is a mounting structural schematic diagram of the TEC. Detailed Embodiments

[0027] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present application.

[0028] Combined with Figure 1 、 Figure 2 、 Figure 3As shown in the figure, an embodiment of the present application provides a heat dissipation structure for a laser diode light source, including a light source housing 100. A plurality of mounting holes 101 for mounting laser diodes 102 are provided on one side of the light source housing 100. The laser diodes 102 are mounted in the corresponding mounting holes 101 and are configured to emit light beams into the light source housing 100. Taking the side of the light source housing 100 where the mounting holes 101 are provided as the upper surface, a heat conducting plate 200 for thermally conducting with each laser diode 102 is mounted on the upper part of the light source housing 100. A relief hole 201 for allowing the pins of each laser diode 102 to pass through is provided on the heat conducting plate 200. The relief holes 201 are arranged in one-to-one correspondence with the mounting holes 101. The pins of the laser diodes 102 are located in the corresponding relief holes 201 on the heat conducting plate 200. A heat dissipation device for cooling the heat conducting plate 200 is provided on the upper part of the heat conducting plate 200.

[0029] In the present application, heat is conducted from the laser diode 102 through the heat conducting plate 200, and the heat dissipation device directly contacts the heat conducting plate 200 to dissipate heat from the heat conducting plate 200. The heat conduction path is short, the heat conduction efficiency is improved, and the heat dissipation effect is good, thereby realizing the rapid export of the heat of the laser diode 102. At the same time, the heat dissipation device is located above the light source housing 100, directly dissipating heat from the heat conducting plate 200, effectively reducing the complexity of the overall structure and reducing the structural volume.

[0030] Preferably, a heat conducting gasket 500 is provided at the bottom of the heat conducting plate 200. A hole for allowing the pins of each laser diode 102 to pass through is provided on the heat conducting gasket 500. The pins of the laser diodes 102 extend into the corresponding relief holes 201 of the heat conducting plate 200 through the corresponding holes on the heat conducting gasket 500. The heat conducting gasket 500 conducts heat with each laser diode 102, and the heat conducting plate 200 conducts heat with each laser diode 102 through the heat conducting gasket 500. The heat generated by the laser diode 102 is conducted to the heat conducting plate 200 through the heat conducting gasket 500. The heat conducting gasket 500 can realize the flexible contact between the laser diode 102 and the heat conducting plate 200, has a buffering effect, and avoids phenomena such as damage to the laser diode 102 or deviation of the light emitting direction caused by the direct contact between the heat conducting plate 200 and the laser diode 102.

[0031] Preferably, a support plate 302 is mounted on the outside of the heat conducting plate 200. A flexible circuit board 300 is provided on the support plate 302. The flexible circuit board 300 has a plurality of flexible circuit board legs 301 extending above the pins of each laser diode 102. The flexible circuit board legs 301 are welded to the pins of the laser diodes 102. Further preferably, the flexible circuit board 300 and the support plate 302 form a flexible circuit board assembly with a rigid member, which is convenient for the fixed installation of the flexible circuit board and also convenient for electronic components to be mounted on the flexible circuit board.

[0032] In this application, the laser diode 102 is connected through the flexible circuit board leg 301. Compared with connecting the laser diode 102 using a rigid circuit board, the penetration difficulty of the pins of the laser diode 102 is reduced. This enables each laser diode 102 to be individually penetrated, welded, and also individually disassembled, replaced, and desoldered, facilitating individual detection or maintenance, reducing the assembly difficulty, and making it convenient to replace, repair, and maintain the laser diode 102.

[0033] At the same time, the flexible circuit board leg 301 can absorb a certain amount of force-induced deformation. Compared with a rigid circuit board, it can effectively reduce the force-induced deformation on the laser diode 102 during the assembly process, avoiding damage to the laser diode 102 and ensuring the accuracy of the light-emitting direction of the laser diode 102, thereby ensuring the coupling efficiency of the light source.

[0034] Preferably, a groove 202 matching with each flexible circuit board leg 301 is provided on the upper surface of the heat-conducting plate 200, and the groove 202 extends from the edge of the upper surface of the heat-conducting plate 200 to the relief hole 201. Further preferably, the depth of the groove 202 is not less than the thickness of the flexible circuit board leg 301.

[0035] Preferably, the upper surface of the support plate 302 is lower than the upper surface of the heat-conducting plate 200. Further preferably, a stepped surface for supporting the support plate 302 is provided at the outer edge of the heat-conducting plate 200. The stepped surface is parallel to the upper surface of the heat-conducting plate 200 and has a height lower than the upper surface of the heat-conducting plate 200, and the support plate 302 is installed on the stepped surface.

[0036] Further preferably, the support plate 302 is annular, with a central hole for accommodating the heat-conducting plate 200 in the middle. The support plate 302 is sleeved on the outside of the heat-conducting plate 200, and the upper surface of the support plate 302 is lower than the upper surface of the heat-conducting plate 200.

[0037] Preferably, an insulating filler 203 is installed in the relief hole 201, and the insulating filler 203 has through holes for the respective pins of the laser diode 102 to fit one by one.

[0038] The heat-conducting plate 200 is fixedly connected to the light source housing 100. The number and position of the mounting holes 101 on the side surface of the light source housing 100 are set according to the working conditions, and there is no limitation on this.

[0039] Generally, the laser diode 102 is fixedly installed in the mounting hole 101 through processes such as welding and bonding, and emits a light beam into the light source housing 100 through the mounting hole 101.

[0040] The heat dissipation device can adopt an air-cooled heat dissipation device or a liquid-cooled heat dissipation device, or can also adopt components with an active refrigeration function.

[0041] Further optionally, in combination with Figure 1 , Figure 4 As shown, the heat dissipation device includes a TEC (ThermoElectric Cooler, semiconductor cooler) 401 and a radiator 402. The cold end of the TEC 401 is closely attached to the heat conduction plate 200. The radiator 402 includes a bottom plate and a plurality of heat dissipation fins connected to the bottom plate. The bottom plate is closely attached to the hot end of the TEC 401. Further preferably, a heat dissipation fan 403 is installed on the radiator 402.

[0042] It should be noted that the above embodiments illustrate the present application rather than limit the present application, and those skilled in the art can design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" or "including" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The use of the words first, second, and third, etc. does not denote any order and these words can be interpreted as names.

[0043] All features disclosed in this specification, except for mutually exclusive features, can be combined in any way.

[0044] Any feature disclosed in this specification (including any additional claims, abstract, and drawings), unless specifically recited, can be replaced by other equivalent or similar-purpose alternative features. That is, unless specifically recited, each feature is only an example of a series of equivalent or similar features.

[0045] The present application is not limited to the foregoing specific embodiments. The present application extends to any new feature or any new combination disclosed in this specification, as well as any new method or process step or any new combination disclosed.

Claims

1. A heat dissipation structure for a laser diode light source, characterized in that, It includes a light source housing, and a plurality of mounting holes for mounting laser diodes are arranged on the upper surface of the light source housing. The laser diodes are installed in the corresponding mounting holes. A heat conducting plate for contacting and conducting heat with the laser diodes is installed on the upper part of the light source housing. The heat conducting plate is provided with clearance holes for the pins of the laser diodes to pass through. The pins of the laser diodes are located in the corresponding clearance holes on the heat conducting plate. A heat dissipation device for cooling the heat conducting plate is arranged on the upper part of the heat conducting plate.

2. The heat dissipation structure of a laser diode light source according to claim 1, characterized in that, The laser diode is arranged to emit a light beam into the light source housing.

3. The heat dissipation structure of a laser diode light source according to claim 1, characterized in that A support plate is installed outside the heat conducting plate, on which a flexible circuit board is arranged. The flexible circuit board has a plurality of flexible circuit board legs extending above each laser diode pin, and the flexible circuit board legs are welded and connected to the pins of the laser diode.

4. The heat dissipation structure of a laser diode light source according to claim 3, characterized in that, The upper surface of the heat conducting plate is provided with grooves matched with the legs of each flexible circuit board, and the grooves extend from the edge of the upper surface of the heat conducting plate to the clearance hole.

5. The heat dissipation structure of a laser diode light source according to claim 4, wherein The depth of the groove is not less than the thickness of the flexible circuit board foot.

6. The heat dissipation structure of a laser diode light source according to claim 1, wherein, A thermally conductive gasket is provided at the bottom of the heat conducting plate. The thermally conductive gasket is provided with holes for the pins of each laser diode to pass through. The pins of the laser diode extend into the corresponding holes of the thermally conductive plate through the corresponding holes on the thermally conductive gasket. The thermally conductive gasket is pressed into contact with each laser diode for heat conduction. The thermally conductive plate is in contact with each laser diode through the thermally conductive gasket for heat conduction. The heat generated by the laser diode is conducted to the thermally conductive plate through the thermally conductive gasket.

7. A heat dissipation structure for a laser diode light source according to claim 1, characterized in that, An insulating filling piece is installed in the clearance hole, and the insulating filling piece has through holes for each pin of the laser diode to match one by one.

8. The heat dissipation structure of a laser diode light source according to claim 1, characterized in that, The heat dissipation device includes an air-cooled heat dissipation device, a liquid-cooled heat dissipation device or a component with an active cooling function.

9. The heat dissipation structure of a laser diode light source according to claim 8, characterized in that, The heat dissipation device comprises a semiconductor refrigerator and a radiator. The cold end of the semiconductor refrigerator is tightly fitted with the heat conduction plate. The radiator comprises a base plate and a plurality of heat dissipation fins connected to the base plate. The base plate is tightly fitted with the hot end of the semiconductor refrigerator.

10. The heat dissipation structure of a laser diode light source according to claim 9, characterized in that, The radiator is equipped with a cooling fan.

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