Circuit board and battery protection board
The line route board integrates internal grounding loops and signal ground networks to provide effective EMI shielding, addressing the need for miniaturization and high density without external shields, enhancing reliability and reducing short-circuit risks.
Patent Information
- Application Number
- CN202420814944.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-18
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-04-18
AI Technical Summary
Existing circuit boards lack anti-interference capabilities in high-density integrated circuits. Traditional external shielding technology occupies a large space and is complex in process, making it difficult to adapt to the needs of thinner and high-density.
Multi-layer grounding loops and electrical Internet network structures are designed on the circuit board to form a signal ground network structure, and electromagnetic isolation is achieved using the circuit board's own wiring design to enhance anti-interference ability.
Without increasing space occupation, the electromagnetic shielding effect of the circuit board is improved, the anti-interference ability is enhanced, and the requirements are adapted to thinner and high-density needs.
Smart Images
Figure CN223110232U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical fields of circuit boards and battery protection boards, and particularly relates to a circuit board and a battery protection board. Background Art
[0002] A circuit board is one of the important electronic components in the electronic industry. With the continuous development of electronic products towards being thinner, smaller, and more precise, the density of electronic components and wires on the circuit board has gradually increased, and the electromagnetic effect on the circuit board has become more and more obvious. In order to ensure the normal operation of the electronic components on the circuit board, generally, electromagnetic shielding treatment needs to be performed on the circuit board. The traditional method is to install a metal shielding cover on the circuit board and build a "Faraday cage" by connecting it to the ground terminal, which can achieve an effective electromagnetic shielding effect. However, due to the large volume of the metal shielding cover, it is difficult for the metal shielding cover to be applied to thin and high-density integrated circuit boards.
[0003] Therefore, an electromagnetic shielding film attached to the surface of the circuit board has been proposed in the prior art. However, when the integration degree of the circuit board is relatively high, the gap between each electronic component is very small, the process requirements are high, and since it is difficult to accurately position the shielding film, not only the process requirements are high, but also the grounding of the shielding film is likely to be unreliable, resulting in a poor shielding effect. In addition, the shielding film is likely to contact other conductive terminals on the electronic component and cause a short circuit. Summary of the Utility Model
[0004] An embodiment of the utility model provides a circuit board and a battery protection board to solve the problems in the prior art that the circuit board itself does not have anti-interference ability, the use of external shielding technology occupies a large space, and it is not suitable for the miniaturization of the circuit.
[0005] To solve the above technical problems, the embodiments of the utility model disclose the following technical solutions:
[0006] According to a first aspect of the utility model, a circuit board is provided. The circuit board includes a plurality of circuit layers, at least part of the plurality of circuit layers is provided with a grounding loop, one of the grounding loops is arranged on the edge of one of the circuit layers, the grounding loops on the plurality of circuit layers form a signal ground network structure, and the plurality of grounding loops are spaced apart in the thickness direction of the circuit board, and adjacent two grounding loops are electrically connected through a first through hole; the circuit board further includes an electrical interconnection network structure, and the electrical interconnection network structure is configured to be electrically connected to the electronic components arranged on the circuit board, and the signal ground network structure surrounds the electrical interconnection network structure.
[0007] Further, the electrical interconnection network structure includes a plurality of electrical interconnection network pattern layers, at least part of the plurality of circuit layers are provided with the electrical interconnection network pattern layers, the plurality of electrical interconnection network pattern layers are spaced in the thickness direction of the circuit board, and adjacent two electrical interconnection network pattern layers are electrically connected through second vias; for each of the electrical interconnection network pattern layers, the grounding loop arranged on the same layer as the electrical interconnection network pattern layer surrounds the electrical interconnection network pattern layer.
[0008] Further, each of the grounding loops is a closed loop.
[0009] Further, in the thickness direction of the circuit board, the projections of the plurality of grounding loops overlap.
[0010] Further, in the direction parallel to the plane where the circuit board is located, the line width of the grounding loop is greater than the cross-sectional width of the first via.
[0011] Further, the circuit board is a rigid circuit board or a flexible circuit board.
[0012] Further, in the direction parallel to the plane where the circuit board is located, the distance between the grounding loop and the edge of the circuit board is greater than or equal to a first preset threshold.
[0013] Further, the distance between adjacent two first vias is greater than or equal to a second preset threshold.
[0014] According to a second aspect of the present invention, there is provided a battery protection board, including the circuit board according to any one of the above first aspects;
[0015] In the thickness direction of the circuit board, the plurality of grounding loops include a first grounding loop closest to the electronic component and the remaining grounding loops, the first grounding loop includes a connecting portion exposed on the surface of the circuit board, and the connecting portion is electrically connected to the grounding end of the electronic component.
[0016] Further, the electronic component is a fuel gauge chip.
[0017] One of the above technical solutions has the following advantages or beneficial effects:
[0018] In the embodiment of the present invention, the signal ground network structure surrounding the electrical interconnection network structure is equivalent to forming a shielding cover between the electrical interconnection network structure and the outside world. Without setting an external shielding structure, electromagnetic isolation from the outside world is achieved by using the layout routing design of the circuit board itself, enhancing the anti-interference ability of the circuit board itself. Description of the Drawings
[0019] The present invention will be described in detail below in conjunction with the accompanying drawings, and the technical solutions and other beneficial effects of the present invention will become obvious.
[0020] Figure 1 is a schematic plan view of a circuit board provided according to the prior art;
[0021] Figure 2 is a schematic plan view of a circuit board provided according to an embodiment of the present invention.
[0022] The meanings of the reference numerals are as follows: grounding loop - 10; first via - 11; electrically interconnected network pattern layer - 20; second via - 21. Detailed Embodiment
[0023] In order to make the objectives, technical solutions and beneficial effects of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described in this specification are only for explaining the present invention and not for limiting the present invention.
[0024] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless otherwise specifically defined.
[0025] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected" and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0026] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include direct contact between the first and second features, or may include the first and second features not being in direct contact but being in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "below", "beneath" and "underneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.
[0027] As Figure 1 shown, an electro-interconnection network pattern layer 20' is provided on a circuit board, and adjacent electro-interconnection network pattern layers 20' are connected through vias 21' to form an electro-interconnection network structure. The conductive lines and electronic components in the electro-interconnection network structure are vulnerable to external electromagnetic interference, resulting in poor anti-interference performance of the circuit board.
[0028] Aiming at the problem that the circuit board in the prior art does not have anti-interference performance by itself, the present utility model provides a circuit board. The circuit board includes a plurality of circuit layers, and at least part of the plurality of circuit layers are provided with ground loops. For example, when the circuit board includes four circuit layers, ground loops can be provided on three of the circuit layers. Figure 2 is a plan view of the circuit layer provided with a ground loop. As Figure 2 shown, a ground loop 10 is provided on the edge of a circuit layer, and the ground loops 10 on the plurality of circuit layers form a signal ground network structure, and the plurality of ground loops 10 are spaced apart in the thickness direction of the circuit board, and adjacent two ground loops 10 are electrically connected through a first via 11.
[0029] The circuit board further includes an electro-interconnection network structure, and the electro-interconnection network structure is configured to be electrically connected to electronic components provided on the circuit board, and the signal ground network structure surrounds the electro-interconnection network structure.
[0030] In some embodiments, the electro-interconnection network structure includes a plurality of electro-interconnection network pattern layers 20. Specifically, the electro-interconnection network pattern layer 20 may include connection lines, pads, ends of second vias 21, and copper-clad areas.
[0031] At least some of the multiple circuit layers are provided with an electrically interconnected network pattern layer 20. The multiple electrically interconnected network pattern layers 20 are spaced apart in the thickness direction of the circuit board, and adjacent two electrically interconnected network pattern layers 20 are electrically connected through a second via 21. For the multiple circuit layers on the same circuit board, the ground loop and the electrically interconnected network pattern layer can be provided on different circuit layers. For example, for a certain circuit layer, a ground loop can be provided alone, or an electrically interconnected network layer can be provided alone; an electrically interconnected network layer and a ground loop can also be provided simultaneously, or neither of them is included.
[0032] For each electrically interconnected network pattern layer 20, a ground loop 10 provided on the same layer as the electrically interconnected network pattern layer 20 surrounds the electrically interconnected network pattern layer 20. A shielding ring for the electrically interconnected network pattern layer 20 is formed on this layer. At the same time, the ground loops 10 on the multiple circuit layers of the circuit board are connected through a first via 11 to form a signal ground network structure that acts as a shielding cover for the electrically interconnected network structure, realizing electromagnetic isolation between the electrically interconnected network structure and the outside world, and enabling the circuit board itself to have anti-interference ability.
[0033] In some embodiments, the multiple electrically interconnected network pattern layers 20 are electrically connected through a second via 21. According to the functions that the circuit board needs to achieve, different electrically interconnected network pattern layers 20 are provided on different layers of the circuit board, and the electrically interconnected network pattern layers 20 on different layers are electrically connected through a second via 21.
[0034] In some embodiments, in the thickness direction of the circuit board, the projections of the multiple ground loops 10 completely overlap. The positions and line widths of the ground loops 10 on each layer are the same.
[0035] In some embodiments, in the direction parallel to the plane where the circuit board is located, the line width of the ground loop 10 is greater than the cross-sectional width of the first via 11. When the line width of the ground loop 10 is not greater than the cross-sectional width of the first via 11, the first via 11 can disconnect the ground loop 10, so that the segments of the ground loop 10 on the same layer are connected to each other through the first via 11. Exemplarily, the diameter of the first via 11 can be 0.3 - 0.5 mm.
[0036] In some embodiments, each ground loop 10 is a closed loop. When the ground loop 10 is a closed loop, it has stronger anti-interference performance compared to a non-closed loop.
[0037] In some embodiments, the circuit board can be a rigid circuit board or a flexible circuit board.
[0038] In some embodiments, in a direction parallel to the plane of the circuit board, the distance between the grounding loop 10 and the edge of the circuit board is greater than or equal to a first preset threshold. Exemplarily, the first preset threshold can be 0.25 mm. For the grounding loop 10 that encloses the electrical interconnection network pattern layer 20, due to the limitation of the original wiring position relationship on the electrical interconnection network pattern layer 20, the grounding loop 10 needs to be arranged as close as possible to the edge of the circuit board. However, due to the process limitation in the manufacturing process, the distance between the grounding loop 10 and the edge of the circuit board is greater than or equal to the first preset threshold.
[0039] In some embodiments, the distance between two adjacent first vias 11 is greater than or equal to a second preset value. Exemplarily, the second preset threshold can be 1 mm. The distance between the first via 11 and the adjacent first via 11 can be a fixed value, and all the first vias 11 are evenly distributed on the grounding loop 10.
[0040] The present utility model further provides a battery protection board, including the above-mentioned circuit board. Electronic components are arranged on the circuit board. In the thickness direction of the circuit board, the plurality of grounding loops 10 include the first grounding loop 10 closest to the electronic component and the remaining grounding loops 10. The first grounding loop 10 includes a connection portion exposed on the surface of the circuit board, and the connection portion is electrically connected to the grounding end of the electronic component.
[0041] The battery protection board is an integrated circuit board that protects rechargeable batteries. It can monitor the voltage of the battery cell and the current in the charge and discharge circuit, and instantaneously control the on and off of the current circuit. The battery protection board is usually composed of a circuit board and electronic components packaged on the circuit board. These electronic components include a control IC, a MOS switch, a precision resistor, a fuel gauge, etc. They are vulnerable to external interference, and at the same time, the magnetic field emitted by their own conductive circuits will also form electromagnetic interference to the outside. Electromagnetic isolation of the circuit protection board can be achieved by externally installing a shielding cover, but it will occupy a large volume and is difficult to adapt to thin and high-density battery protection boards. The shielding film is commonly used in the electromagnetic shielding design of flexible circuit boards, and its process is difficult and the manufacturing cost is high. It is also not applicable to the shielding setting of rigid circuit boards with uneven surfaces.
[0042] The battery protection board using the above-mentioned circuit board to enhance the electromagnetic shielding performance can meet the thinness requirements of the battery protection board and reduce the occupied volume. It can achieve excellent electromagnetic shielding effects while reducing production costs.
[0043] In some embodiments, the electronic component can be a fuel gauge chip, and the grounding end of the fuel gauge chip is electrically connected to the grounding loop 10.
[0044] The introduction provided by the above embodiments is only used to help understand the structure and core idea of the present utility model. For those of ordinary skill in the art, without departing from the principle of the present utility model, several improvements and modifications can be made to the present utility model, and these improvements and modifications also fall within the scope of protection of the claims of the present utility model.
Claims
1. A circuit board, characterized in that, The circuit board includes a plurality of circuit layers, at least some of the plurality of circuit layers are provided with ground loops, one of the ground loops is disposed on the edge of one of the circuit layers, and the ground loops on the plurality of circuit layers form a signal ground network structure, and the plurality of ground loops are spaced apart in the thickness direction of the circuit board, and adjacent two ground loops are electrically connected through a first via hole; The circuit board further includes an electrical interconnection network structure configured to be electrically connected to electronic components disposed on the circuit board, and the signal ground network structure surrounds the electrical interconnection network structure.
2. The circuit board according to claim 1, wherein, The electrical interconnection network structure includes a plurality of electrical interconnection network pattern layers, at least some of the plurality of circuit layers are provided with the electrical interconnection network pattern layers, and the plurality of electrical interconnection network pattern layers are spaced apart in the thickness direction of the circuit board, and adjacent two electrical interconnection network pattern layers are electrically connected through a second via hole; For each of the electrical interconnection network pattern layers, the ground loop disposed on the same layer as the electrical interconnection network pattern layer surrounds the electrical interconnection network pattern layer.
3. The circuit board according to claim 1, wherein Each of the ground loops is a closed loop.
4. The circuit board according to claim 1, wherein In the thickness direction of the circuit board, the projections of the plurality of ground loops overlap.
5. The circuit board according to claim 1, characterized in that, In a direction parallel to the plane where the circuit board is located, the line width of the ground loop is greater than the cross-sectional width of the first via hole.
6. The circuit board according to claim 1, characterized in that, The circuit board is a rigid circuit board or a flexible circuit board.
7. The circuit board according to claim 1, characterized in that In a direction parallel to the plane where the circuit board is located, the distance between the ground loop and the edge of the circuit board is greater than or equal to a first preset threshold.
8. The circuit board according to claim 1, wherein, The distance between adjacent two of the first via holes is greater than or equal to a second preset threshold.
9. A battery protection board, characterized in that, Comprising the circuit board according to any one of claims 1 to 8; In the thickness direction of the circuit board, the plurality of ground loops include a first ground loop closest to the electronic component and the remaining ground loops, and the first ground loop includes a connection portion exposed on the surface of the circuit board, and the connection portion is electrically connected to the ground terminal of the electronic component.
10. The battery protection board according to claim 9, characterized in that, The electronic component is a fuel gauge chip.