Cutting and chipping equipment applied to straw bundling
By designing the structure of the clamp and cutting table, the problem of loose stranding straw during the cutting process is solved, and efficient straw cutting into chips is achieved.
Patent Information
- Application Number
- CN202422423625.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-09
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-10-09
AI Technical Summary
Traditional cutting devices can easily lead to loosening of straw when cutting bundled into rolls, reducing cutting and processing efficiency.
A device including a clamp, a cutting table and a cutting knife is designed to fix the straw through the clamp and cut it using the positioning holes and cutting knife on the cutting table to avoid loosening of the straw.
It effectively avoids the strands tied into rolls to be loose during the cutting process, which improves the cutting efficiency.
Smart Images

Figure CN223110571U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of straw processing, and more specifically, to a cutting and chipping device for bundling straw. Background Art
[0002] Straw is the general term for the stems and leaves of mature crops. It usually refers to the remaining parts of wheat, rice, corn, potatoes, rapeseed, cotton, sugarcane and other crops after harvesting the seeds. Straw is a renewable biological resource with multiple uses and is also a roughage; therefore, straw is an environmentally friendly material with no pollution, low cost and high durability.
[0003] In related technologies, straw can be applied to tableware production. Tableware made of straw has the characteristics of environmental protection, health and durability, and is thus deeply favored by consumers.
[0004] In actual use, straw is bundled into rolls for easy transportation and placement. However, when traditional cutting devices cut the bundled straw, it is very easy for the straw to become loose, which will undoubtedly greatly reduce the cutting efficiency of the straw. Utility Model Content
[0005] In view of this, the embodiments of this application provide a cutting and chipping device for bundling straw to solve the problem that the cutting device in related technologies is prone to making the bundled straw loose during the cutting process.
[0006] In order to achieve the above purpose, the embodiments of this application provide the following technical solutions:
[0007] A cutting and chipping device for bundling straw, comprising:
[0008] A frame, the frame includes a chassis;
[0009] A driving screw, the driving screw is arranged on the frame and inside the chassis, the driving screw is connected to the driving end of a driving motor, and the driving motor is fixedly arranged on the frame;
[0010] A gripper, the gripper includes an upper clamping plate and a lower clamping plate, the upper clamping plate is connected to the lower clamping plate through a fastening screw, an arc surface is arranged at the adjacent wall surfaces of the upper clamping plate and the lower clamping plate, the bottom end of the lower clamping plate is threadedly connected to the driving screw, and the wall surface in the length direction of the lower clamping plate is slidably connected to the inner wall surface of the chassis;
[0011] A cutting table, the cutting table is arranged beside the chassis and at the output end of the driving screw, the cutting table is provided with a positioning hole along the thickness direction, and the positioning hole is adapted to the height of the gripper;
[0012] A cutting knife, the cutting knife is arranged above the cutting table and above the positioning hole, the cutting knife is fixedly connected to the driving end of a servo motor, and the servo motor is fixedly arranged above the cutting table.
[0013] In some possible implementation manners, two driving screws are symmetrically arranged in the chassis, and the lower clamping plate is in threaded connection with the two driving screws.
[0014] In some possible implementation manners, the cutting table is further provided with a material receiving hopper, and the material receiving hopper is located on the opposite side of the gripper.
[0015] In some possible implementation manners, the cutting knife is located on the opposite side of the gripper and above the positioning hole.
[0016] In some possible implementation manners, a chamfered surface that is recessed inward is arranged at the edge of the positioning hole facing the gripper.
[0017] In some possible implementation manners, the cutting table is further provided with a motor support plate, and the servo motor is fixedly arranged at the motor support plate.
[0018] The cutting and chipping device for bundling straw provided by the embodiment of the present application at least has the following beneficial effects:
[0019] In the cutting and chipping device for bundling straw provided by the embodiment of the present application, the bundled straw roll is placed between the upper clamping plate and the lower clamping plate of the gripper, and the fastening screw is rotated to fix the straw. Subsequently, the driving motor is started to control the rotation of the driving screw, and the gripper moves towards the positioning hole of the cutting table until the bundled straw roll can pass through the positioning hole and enter the other side of the cutting table. After that, the straw will become the straw chips required for processing tableware under the rotary cutting action of the cutting knife. With the above structural design, the bundled straw roll can be chipped. At the same time, both ends of the bundled straw roll are fixed by the gripper and the positioning hole respectively, which can effectively avoid the situation of loosening during the chipping process. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0021] Figure 1 It is a schematic structural diagram of the cutting and chipping device for bundling straw provided by the embodiment of the present application;
[0022] Figure 2 A side schematic diagram of a straw cutting and chipping device for bundling provided in an embodiment of the present application;
[0023] Figure 3 A front structural schematic diagram of a straw cutting and chipping device for bundling provided in an embodiment of the present application.
[0024] In the figure:
[0025] 100, frame; 110, motor support plate; 200, chassis; 300, drive screw; 400, drive motor; 500, clamp; 510, upper clamp; 520, lower clamp; 530, fastening screw; 600, cutting table; 610, positioning hole; 620, chamfered surface; 700, cutting knife; 800, servo motor; 900, hopper. DETAILED DESCRIPTION
[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0027] like Figures 1-3 As shown, the straw cutting and chipping device for bundling provided in the embodiment of the present application includes a frame 100, a driving screw 300, a clamp 500, a cutting table 600 and a cutting knife 700, wherein a chassis 200 is arranged on the frame 100, and a driving screw 300 is rotatably connected in the chassis 200, and the driving screw 300 is arranged along the length direction of the chassis 200. Preferably, two driving screws 300 can be symmetrically arranged side by side in the width direction in the chassis 200. The end of the driving screw 300 is fixedly connected to the driving end of the driving motor 400, and the driving motor 400 is arranged on the wall outside the chassis 200.
[0028] The clamp 500 is a mechanism for clamping and fixing the bundled straw, and the clamp 500 includes an upper clamping plate 510 and a lower clamping plate 520. The bottom end of the lower clamping plate 520 is connected to the driving screw 300 by threaded connection, and the width of the lower clamping plate 520 is adapted to the interior of the chassis 200, that is, the two walls of the lower clamping plate 520 in the width direction are in contact with the inner wall of the chassis 200. Therefore, when the driving screw 300 rotates, the lower clamping plate 520 can move back and forth along the length direction of the chassis 200.
[0029] In this embodiment, the top surface of the lower clamping plate 520 is connected to the bottom surface of the upper clamping plate 510 through a fastening screw 530. Arc surfaces are provided at the opposite walls of the upper clamping plate 510 and the lower clamping plate 520, and the two arc surfaces can be spliced into a circle. During actual use, the fastening screw 530 can be rotated to change the position between the upper clamping plate 510 and the lower clamping plate 520, and then the bundled straw is clamped between the upper clamping plate 510 and the lower clamping plate 520 through the arc surface.
[0030] The cutting table 600 is arranged beside the chassis 200. The cutting table 600 is provided with a positioning hole 610 along the thickness direction. The height of the positioning hole 610 is adapted to the height of the arc surface between the upper clamping plate 510 and the lower clamping plate 520, which enables the bundled straw transported by the gripper 500 to pass through the positioning hole 610 and be transported to the other side of the cutting table 600. A cutting knife 700 is also arranged on the cutting table 600. The cutting knife 700 is located above the positioning hole 610 and on the opposite side of the chassis 200. The cutting knife 700 is connected to the driving end of a servo motor 800, and the servo motor 800 is fixedly arranged on the motor support plate 110 of the cutting table 600. Preferably, a material receiving hopper 900 can be arranged below the cutting knife 700. The material receiving hopper 900 is connected to the bottom end of the side surface of the cutting table 600, and the material receiving hopper 900 is used to collect straw chips.
[0031] In the cutting and chipping device for bundled straw provided in the embodiment of the present application, the bundled straw is placed between the upper clamping plate 510 and the lower clamping plate 520 of the gripper 500, and the fastening screw 530 is rotated to fix the straw. Subsequently, the driving motor 400 is started to control the driving screw 300 to rotate, and the gripper 500 moves towards the positioning hole 610 of the cutting table 600 until the bundled straw can penetrate through the positioning hole 610 and enter the other side of the cutting table 600. Then the straw will become the straw chips required for processing tableware under the rotary cutting action of the cutting knife 700. With the above structural design, the bundled straw can be chipped. At the same time, both ends of the bundled straw are fixed by the gripper 500 and the positioning hole 610 respectively, which can effectively prevent the straw from becoming loose during the chipping process.
[0032] In some embodiments, a chamfered surface 620 that is recessed inward is provided at the positioning hole 610 of the cutting table 600, which enables the bundled straw transported by the gripper 500 towards the cutting table 600 to gather towards the middle under the action of the chamfered surface 620, thereby preventing the straw from becoming loose during transportation and chipping.
[0033] The embodiments or implementation manners in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts among the embodiments can be referred to each other.
[0034] It should be noted that phrases such as "an embodiment", "embodiments", "exemplary embodiments", "some embodiments", etc. mentioned in the specification indicate that the described embodiments may include specific features, structures, or characteristics, but not necessarily every embodiment includes such specific features, structures, or characteristics. Moreover, such phrases do not necessarily refer to the same embodiment. In addition, when combining a specific feature, structure, or characteristic with an embodiment, it is within the knowledge scope of those skilled in the art to implement such a feature, structure, or characteristic in combination with other embodiments, whether explicitly or implicitly described.
[0035] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part according to the context, the term "one or more" used in the text can be used to describe any feature, structure, or characteristic in the sense of singularity, or can be used to describe a combination of features, structures, or characteristics in the sense of plurality. Similarly, at least in part according to the context, terms such as "a" or "the" can also be understood to convey singular usage or plural usage.
[0036] It should be easily understood that the terms "on", "above", and "over" in this disclosure should be interpreted in the broadest manner, so that "on" not only means "directly on something", but also includes the meaning of "on something" with intermediate features or layers therebetween, and "above" or "over" not only includes the meaning of "above" or "over something", but can also include the meaning of "above" or "over something" with no intermediate features or layers therebetween (i.e., directly on something).
[0037] In addition, in order to facilitate the description, spatial relative terms such as "below", "beneath", "under", "above", "over", etc. may be used in the text to describe the relationship of one element or feature to other elements or features as shown in the figure. Spatial relative terms are intended to include different orientations of the device in use or operation other than the orientation shown in the drawings. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used in the text can be interpreted accordingly.
[0038] The term "substrate" used in the text refers to the material on which subsequent material layers are added. The substrate itself can be patterned. The material added on top of the substrate can be patterned or can remain unpatterned. In addition, the substrate can include a wide range of materials, such as silicon, germanium, gallium arsenide, indium phosphide, etc. Alternatively, the substrate can be made of non-conductive materials (such as glass, plastic, or sapphire wafers, etc.).
[0039] As used herein, the term "layer" may refer to a portion of a material that includes a region having a certain thickness. The layer may extend over the entire underlying or overlying structure, or may have a smaller extent than the underlying or overlying structure. Additionally, the layer may be a region of a homogeneous or non-homogeneous continuous structure, the thickness of which is less than the thickness of the continuous structure. For example, the layer may be located between the top and bottom surfaces of the continuous structure or between any pair of lateral planes at the top and bottom surfaces. The layer may extend laterally, vertically, and / or along a tapered surface. The substrate may be a layer, may include one or more layers therein, and / or may have one or more layers located thereon, above it, and / or below it. A layer may include multiple layers. For example, an interconnect layer may include one or more conductors and contact layers (in which contacts, interconnect lines, and / or vias are formed) and one or more dielectric layers.
[0040] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. A cutting and chipping device applied to straw bundling, characterized in that, Including: A frame (100), the frame (100) including a chassis (200); A driving screw (300), the driving screw (300) being disposed on the frame (100) and within the chassis (200), the driving screw (300) being connected to the driving end of a driving motor (400), the driving motor (400) being fixedly disposed on the frame (100); A gripper (500), the gripper (500) including an upper clamping plate (510) and a lower clamping plate (520), the upper clamping plate (510) being connected to the lower clamping plate (520) by a fastening screw (530), arc-shaped surfaces being provided at the adjacent wall surfaces of the upper clamping plate (510) and the lower clamping plate (520), the bottom end of the lower clamping plate (520) being threadedly connected to the driving screw (300), and the wall surface in the length direction of the lower clamping plate (520) being slidably connected to the inner wall surface of the chassis (200); A cutting table (600), the cutting table (600) being disposed beside the chassis (200) and at the output end of the driving screw (300), the cutting table (600) being provided with a positioning hole (610) in the thickness direction, the positioning hole (610) being adapted to the height of the gripper (500); A cutting knife (700), the cutting knife (700) being disposed on the cutting table (600) and above the positioning hole (610), the cutting knife (700) being fixedly connected to the driving end of a servo motor (800), the servo motor (800) being fixedly disposed on the cutting table (600).
2. The shredding equipment for cutting and shredding straw according to claim 1, wherein: Two of the driving screws (300) are symmetrically disposed within the chassis (200), and the lower clamping plate (520) is threadedly connected to the two driving screws (300).
3. The cutting and chipping device for bundling straw according to claim 1, characterized in that: The cutting table (600) is further provided with a material receiving hopper (900), the material receiving hopper (900) being located on the opposite side of the gripper (500).
4. The chipping equipment for cutting and applying to straw bales according to claim 1, characterized in that: The cutting knife (700) is located on the opposite side of the gripper (500), and the cutting knife (700) is located above the positioning hole (610).
5. The chipping device for cutting and chipping straw according to claim 1, characterized in that: The positioning hole (610) is provided with an inwardly concave chamfered surface (620) at the edge facing the gripper (500).
6. The chipping equipment for cutting and chipping straw according to claim 1, characterized in that: The cutting table (600) is further provided with a motor support plate (110), the servo motor (800) being fixedly disposed at the motor support plate (110).