Wafer management chip inductor sorting equipment

Abstract

The utility model relates to the technical field of semiconductor manufacturing, and discloses wafer management chip inductor sorting equipment which comprises a base, the lower end of the base is fixedly connected with supporting legs, the upper end of the base is provided with a limiting groove, the upper end of the base is provided with a classification box, and the upper end of the base is fixedly connected with an inductor detector. According to the wafer management chip inductor sorting equipment, the detection assembly is arranged, when inductor sorting is carried out, an adjusting bolt is rotated, the adjusting bolt ascends or descends relative to a first sliding block, a sliding groove of the first sliding block slides along a sliding strip, and therefore the height of an adjusting table and the height of a containing base are adjusted, and inductor detection of wafer management chips of different heights is facilitated; during sorting, the stroke of the air cylinder is shortened to drive the second sliding block to descend along the sliding rail, the detection head is close to the wafer management chip, inductance detection is facilitated, the height can be adjusted according to the size of the wafer management chip, and chips of different sizes can be sorted conveniently.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to an inductor sorting device for wafer management chips. Background Art

[0002] With the continuous improvement of the complexity and integration of electronic products, precise management of inductor components in wafer manufacturing has become crucial. The inductor sorting device for wafer management chips is mainly used in the semiconductor manufacturing process to accurately classify and sort inductor devices, and detect the specifications and performances of each inductor, so as to ensure the high consistency and reliability of the final product.

[0003] Chinese Utility Model Patent Publication No.: CN 217830841 U, discloses: a chip sorting device. When the chips are transported on the conveyor belt, the second air pump supplies air to the air outlet head through the auxiliary blowing pipe, and the air flow in the air outlet head sprays towards the conveyor belt. The small-sized chips on the conveyor belt float upward under the vertical thrust. At the same time, the first air pump supplies air to the detection blowing pipe through the adapter pipe, and the air flow sprays through the nozzle to apply a horizontal thrust. Under the action of the air flow, the small-sized chips slide until they fall into the second collection part. The large-sized chips continue to move with the conveyor belt until they fall into the first collection part, realizing the sorting of chips, achieving automatic sorting, and reducing labor costs. However, this chip sorting device cannot detect the specifications and performances of the inductor components in the chips and classify the chips accordingly, and cannot ensure the high consistency and reliability of the final product. Summary of the Invention

[0004] The technical problem to be solved by the utility model is to provide an inductor sorting device for wafer management chips, which can effectively solve the problems in the prior art.

[0005] The technical solution adopted by the utility model is: an inductor sorting device for wafer management chips, including a base, the lower end of the base is fixedly connected with legs, a limiting groove is opened at the upper end of the base, a sorting box is arranged at the upper end of the base, an inductor detector is fixedly connected to the upper end of the base, a controller is arranged at the front end of the inductor detector, a detection component is fixedly connected to the upper end of the base, and an indicator light is arranged at the upper end of the base;

[0006] The detection component includes a mounting base, a groove, a support plate, a slide bar, a first slider, a chute, an adjusting bolt, an insulating column, an adjusting table, a placement seat, a column, a pressing seat, a cylinder, a slide rail, a second slider, a detection plate, and a detection head. A groove is provided at the upper end of the mounting base. A support plate is fixedly connected to the upper end of the groove. Slide bars are fixedly connected to the front and rear ends of the support plate. First sliders are provided at the front and rear ends of the support plate. A chute is provided inside the first slider. An adjusting bolt is provided outside the first slider. An insulating column is fixedly connected to the upper end of the support plate. A placement seat is provided at the upper end of the support plate. A column is fixedly connected to the upper end of the mounting base. A pressing seat is fixedly connected to the right side of the column. A cylinder is fixedly connected to the upper end of the mounting base. A slide rail is fixedly connected to the front end of the column. A second slider is provided at the front end of the column. A detection plate is fixedly connected to the upper end of the second slider. A detection head is provided on the right side of the detection plate.

[0007] Preferably, a classification box is provided at the upper end of the limit groove, and eight groups of the classification box and the indicator lights are correspondingly arranged.

[0008] Through the above technical solution, a classification box is provided, which can place wafer management chips of different specifications.

[0009] Preferably, there are two sets of symmetrically identical slide bars, first sliders, chutes, and adjusting bolts, and the chute and the first slider are slidably connected.

[0010] Through the above technical solution, a detection component is provided, which can adjust the height according to the size of the wafer management chip, facilitating the sorting of chips of different sizes.

[0011] Preferably, the adjusting bolt is threadedly connected to the first slider, and both the adjusting table and the placement seat are slidably connected to the insulating column.

[0012] Through the above technical solution, an adjusting bolt is provided. When performing inductance sorting, the adjusting bolt is rotated, and the adjusting bolt rises or falls relative to the first slider, causing the chute of the first slider to slide along the slide bar, thereby adjusting the height of the adjusting table and the placement seat, facilitating the inductance detection of wafer management chips at different heights. An insulating column is provided to limit the adjusting table and the placement seat.

[0013] Preferably, the output end of the cylinder is fixedly connected to the second slider, and the second slider is slidably connected to the slide rail.

[0014] Through the above technical solution, a cylinder is provided. When performing sorting, the cylinder shortens its stroke to drive the second slider to descend along the slide rail, and the detection head approaches the wafer management chip, facilitating inductance detection.

[0015] Preferably, the pressing seat is arranged above the cylinder, and the detection head corresponds to the placement seat.

[0016] Through the above technical solution, a pressing seat is provided to tightly press the cylinder on the upper end of the mounting seat, thereby pressing the cylinder on the mounting seat and improving the detection stability.

[0017] Preferably, the inductance detector is electrically connected to the controller, the detection head, and the indicator light.

[0018] Through the above technical solution, an indicator light is provided. When the detection head detects the wafer management chip, the inductance detector is started through the control button of the controller to perform inductance detection on the wafer management chip. The detection data is displayed on the display screen of the controller. The inductance detector is pre-set with eight range data for inductance detection, corresponding to eight groups of indicator lights and sorting boxes. When the detected value is within a certain range, the corresponding indicator light lights up, and the staff puts the wafer management chip into the corresponding sorting box. The detection speed is fast, the indication effect is good, and the sorting efficiency is improved.

[0019] Compared with the prior art, the present utility model provides a wafer management chip inductance sorting device, which has the following beneficial effects:

[0020] 1. For this wafer management chip inductance sorting device, a detection component is provided. When performing inductance sorting, the adjusting bolt is rotated, and the adjusting bolt rises or falls relative to the first slider, so that the sliding groove of the first slider slides along the sliding bar, thereby adjusting the height of the adjusting table and the placing seat, facilitating the inductance detection of wafer management chips at different heights. An insulating column is provided to limit the position of the adjusting table and the placing seat. When sorting, the cylinder shortens its stroke to drive the second slider to descend along the slide rail, and the detection head approaches the wafer management chip, facilitating inductance detection. The height can be adjusted according to the size of the wafer management chip, facilitating the sorting of chips of different sizes;

[0021] 2. For this wafer management chip inductance sorting device, an indicator light is provided. When the detection head detects the wafer management chip, the inductance detector is started through the control button of the controller to perform inductance detection on the wafer management chip. The detection data is displayed on the display screen of the controller. The inductance detector is pre-set with eight range data for inductance detection, corresponding to eight groups of indicator lights and sorting boxes. When the detected value is within a certain range, the corresponding indicator light lights up, and the staff puts the wafer management chip into the corresponding sorting box. The detection speed is fast, the indication effect is good, and the sorting efficiency is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Schematic three-dimensional structure of the present utility model Figure 1 ;

[0023] Figure 2 Schematic three-dimensional structure of the present utility model Figure 2 ;

[0024] Figure 3 Schematic exploded structure diagram of the present utility model;

[0025] Figure 4 Schematic diagram of the enlarged structure of the detection component of the present utility model;

[0026] Figure 5 Schematic diagram of the disassembled structure of the detection component of the present utility model.

[0027] Wherein: 1. Base; 2. Leg; 3. Limit groove; 4. Classification box; 5. Inductance detector; 6. Controller; 7. Detection component; 701. Mounting seat; 702. Groove; 703. Support plate; 704. Slide bar; 705. First slider; 706. Slide groove; 707. Adjusting bolt; 708. Insulating column; 709. Adjusting table; 710. Placing seat; 711. Column; 712. Pressing seat; 713. Cylinder; 714. Slide rail; 715. Second slider; 716. Detection plate; 717. Detection head; 8. Indicator light. Specific implementation mode

[0028] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0029] Embodiment 1: As Figures 1-5 shown, a wafer management chip inductance sorting device provided by the present utility model includes a base 1, legs 2 are fixedly connected to the lower end of the base 1, a limit groove 3 is opened at the upper end of the base 1, a classification box 4 is arranged at the upper end of the base 1, an inductance detector 5 is fixedly connected to the upper end of the base 1, a controller 6 is arranged at the front end of the inductance detector 5, a detection component 7 is fixedly connected to the upper end of the base 1, and an indicator light 8 is arranged at the upper end of the base 1;

[0030] The detection component 7 includes a mounting base 701, a groove 702, a support plate 703, a slide bar 704, a first slider 705, a chute 706, an adjusting bolt 707, an insulating column 708, an adjusting table 709, a placement seat 710, a column 711, a pressing seat 712, a cylinder 713, a slide rail 714, a second slider 715, a detection plate 716, and a detection head 717. A groove 702 is formed at the upper end of the mounting base 701. A support plate 703 is fixedly connected to the upper end of the groove 702. Slide bars 704 are fixedly connected to the front and rear ends of the support plate 703. First sliders 705 are arranged at the front and rear ends of the support plate 703. A chute 706 is formed inside the first slider 705. An adjusting bolt 707 is arranged outside the first slider 705. An insulating column 708 is fixedly connected to the upper end of the support plate 703. A placement seat 710 is arranged at the upper end of the support plate 703. A column 711 is fixedly connected to the upper end of the mounting base 701. A pressing seat 712 is fixedly connected to the right side of the column 711. A cylinder 713 is fixedly connected to the upper end of the mounting base 701. A slide rail 714 is fixedly connected to the front end of the column 711. A second slider 715 is arranged at the front end of the column 711. A detection plate 716 is fixedly connected to the upper end of the second slider 715. A detection head 717 is arranged on the right side of the detection plate 716.

[0031] Specifically, a classification box 4 is arranged at the upper end of the limit groove 3, and there are eight groups of the classification box 4 corresponding to the indicator lights 8. The advantage is that the classification box 4 is provided, and wafer management chips of different specifications can be placed.

[0032] Specifically, there are two sets of symmetrically identical slide bars 704, first sliders 705, chutes 706, and adjusting bolts 707, and the chute 706 is slidably connected to the first slider 705. The advantage is that the detection component 7 is provided, and the height can be adjusted according to the size of the wafer management chip, which is convenient for sorting chips of different sizes.

[0033] Embodiment 2: As Figures 2-5 shown, as an improvement to the previous embodiment.

[0034] Specifically, the adjusting bolt 707 is threadedly connected to the first slider 705, and both the adjusting table 709 and the placement seat 710 are slidably connected to the insulating column 708. The advantage is that the adjusting bolt 707 is provided. When performing inductance sorting, the adjusting bolt 707 is rotated, and the adjusting bolt 707 rises or falls relative to the first slider 705, so that the chute 706 of the first slider 705 slides along the slide bar 704, thereby adjusting the height of the adjusting table 709 and the placement seat 710, which is convenient for inductance detection of wafer management chips at different heights. The insulating column 708 is provided to limit the adjusting table 709 and the placement seat 710.

[0035] Specifically, the output end of the air cylinder 713 is fixedly connected to the second slider 715, and the second slider 715 is slidably connected to the slide rail 714. The advantage is that the air cylinder 713 is provided. When sorting, the air cylinder 713 shortens its stroke to drive the second slider 715 to descend along the slide rail 714, and the detection head 717 approaches the wafer management chip, facilitating inductance detection.

[0036] Specifically, the pressing seat 712 is arranged at the upper end of the air cylinder 713, and the detection head 717 corresponds to the placement seat 710. The advantage is that the pressing seat 712 is provided, which tightly presses the air cylinder 713 on the upper end of the mounting seat 701, pressing the air cylinder 713 on the mounting seat 701 to improve the detection stability.

[0037] Working principle: During use, rotate the adjusting bolt 707. The adjusting bolt 707 rises or falls relative to the first slider 705, causing the sliding groove 706 of the first slider 705 to slide along the slide bar 704, thereby adjusting the height of the adjusting table 709 and the placement seat 710, facilitating the inductance detection of wafer management chips at different heights. The insulating column 708 limits the adjusting table 709 and the placement seat 710. When sorting, the air cylinder 713 shortens its stroke to drive the second slider 715 to descend along the slide rail 714, and the detection head 717 approaches the wafer management chip. Start the inductance detector 5 through the control button of the controller 6 to perform inductance detection on the wafer management chip. The detection data is displayed on the display screen of the controller 6. The inductance detector 5 is pre-set with eight range data for inductance detection, corresponding to eight groups of indicator lights 8 and sorting boxes 4. When the detected value is within a certain range, the corresponding indicator light 8 lights up, and the staff puts the wafer management chip into the corresponding sorting box 4. The detection speed is fast, the indication effect is good, and the sorting efficiency is improved.

[0038] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer management chip inductor sorting device, comprising a base (1), characterized in that: The lower end of the base (1) is fixedly connected with legs (2). A limiting groove (3) is formed in the upper end of the base (1). A sorting box (4) is arranged on the upper end of the base (1). An inductance detector (5) is fixedly connected to the upper end of the base (1). A controller (6) is arranged at the front end of the inductance detector (5). A detection component (7) is fixedly connected to the upper end of the base (1). An indicator light (8) is arranged on the upper end of the base (1). The detection component (7) includes a mounting seat (701), a groove (702), a support plate (703), a sliding strip (704), a first slider (705), a sliding groove (706), an adjusting bolt (707), an insulating column (708), an adjusting table (709), a placing seat (710), a column (711), a pressing seat (712), a cylinder (713), a slide rail (714), a second slider (715), a detection plate (716) and a detection head (717). A groove (702) is formed in the upper end of the mounting seat (701). A support plate (703) is fixedly connected to the upper end of the groove (702). Sliding strips (704) are fixedly connected to the front and rear ends of the support plate (703). First sliders (705) are arranged at the front and rear ends of the support plate (703). A sliding groove (706) is formed inside the first slider (705). An adjusting bolt (707) is arranged outside the first slider (705). An insulating column (708) is fixedly connected to the upper end of the support plate (703). A placing seat (710) is arranged on the upper end of the support plate (703). A column (711) is fixedly connected to the upper end of the mounting seat (701). A pressing seat (712) is fixedly connected to the right side of the column (711). A cylinder (713) is fixedly connected to the upper end of the mounting seat (701). A slide rail (714) is fixedly connected to the front end of the column (711). A second slider (715) is arranged at the front end of the column (711). A detection plate (716) is fixedly connected to the upper end of the second slider (715). A detection head (717) is arranged on the right side of the detection plate (716).

2. The inductance sorting device for a wafer management chip according to claim 1, wherein: The sorting box (4) is arranged at the upper end of the limiting groove (3). There are eight groups of the sorting box (4) corresponding to the indicator light (8).

3. The inductance sorting device for a wafer management chip according to claim 1, characterized in that: There are two groups of the sliding strip (704), the first slider (705), the sliding groove (706) and the adjusting bolt (707) which are symmetrically the same. The sliding groove (706) is slidably connected with the first slider (705).

4. A wafer management chip inductor sorting device according to claim 1, characterized in that: The adjusting bolt (707) is threadedly connected with the first slider (705). Both the adjusting table (709) and the placing seat (710) are slidably connected with the insulating column (708).

5. The inductance sorting device for a wafer management chip according to claim 1, characterized in that: The output end of the cylinder (713) is fixedly connected with the second slider (715). The second slider (715) is slidably connected with the slide rail (714).

6. The inductance sorting device for a wafer management chip according to claim 1, characterized in that: The pressing seat (712) is arranged above the cylinder (713). The detection head (717) corresponds to the placing seat (710).

7. An inductor sorting device for a wafer management chip according to claim 1, characterized in that: The inductance detector (5) is electrically connected with the controller (6), the detection head (717) and the indicator light (8).

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