Automatic wiring equipment of silicon wafer wire cutting machine

Abstract

The utility model provides automatic wiring equipment of a silicon wafer wire cutting machine, and belongs to the technical field of wire cutting machines. The equipment comprises an annular support, a winding mechanism, a supporting table, an X-axis moving mechanism, a Y-axis moving mechanism, a lifting mechanism and a rotating mechanism. The annular support is provided with a notch, and the winding mechanism is wound with a diamond cutting line, is rotationally connected to the annular support and comprises a pay-off mechanism, a wiring mechanism and a visual system; during working, the winding mechanism performs circular motion along the annular bracket, so that the diamond cutting wire is wound on a grooved wheel of the wire cutting machine. According to the utility model, the automatic wiring of the diamond cutting wire on the grooved wheel is realized, the wiring process and the operation difficulty are greatly simplified, the working intensity of operators is reduced, the wiring efficiency is improved, the production cost is reduced, the efficiency is improved, the consumption is reduced, and the wiring quality is ensured.

Description

Technical Field

[0001] The utility model belongs to the technical field of wire cutting machines, and particularly relates to an automatic wire routing device for a silicon wafer wire cutting machine. Background Technique

[0002] The diamond cutting wire is abbreviated as diamond wire, diamond cutting wire or diamond line. It is to inlay tiny particles of diamond on the steel wire, so that the steel wire has diamond micro sawteeth, which can increase the cutting ability of the steel wire and greatly accelerate the cutting speed of the steel wire. When in use, the diamond cutting wire needs to be wound around the sheave of the wire cutting machine. Usually, the sheave has multiple V-shaped grooves. When routing the wire, the diamond cutting wire needs to be accurately placed in the V-shaped groove to ensure the stable operation of the diamond cutting wire and good cutting effect. At present, the diamond cutting wire routing usually adopts manual routing. The diamond cutting wire is wound around about 20 V-shaped grooves at one end of the sheave, and then the overall routing is completed by the rotation of the sheave. When manually routing, multiple processes such as pasting tape, connecting the upper wire, adjusting the wire position, dialing the wire, taking pictures, counting the grooves, and adjusting the grooves need to be completed successively. The operation is cumbersome, the difficulty is high, and the wire routing efficiency is low. Content of the Utility Model

[0003] To solve the above technical problems, the utility model provides an automatic wire routing device for a silicon wafer wire cutting machine, which simplifies the wire routing process and operation difficulty and improves the wire routing efficiency.

[0004] The technical solution adopted by the utility model is: an automatic wire routing device for a silicon wafer wire cutting machine, including an annular bracket and a wire winding mechanism; the annular bracket is provided with a notch so that the annular bracket can be circumferentially arranged around the sheave of the wire cutting machine; the wire winding mechanism is wound with a diamond cutting wire and is rotatably connected to the annular bracket. During operation, the wire winding mechanism moves in a circular motion along the annular bracket, so that the diamond cutting wire is wound around the sheave.

[0005] Further, it also includes a support table, an X-axis moving mechanism, a Y-axis moving mechanism, a lifting mechanism and a rotating mechanism; among them,

[0006] The X-axis moving mechanism is arranged on the support table; the Y-axis moving mechanism is slidably arranged on the upper part of the X-axis moving mechanism; the lifting mechanism is arranged on the upper part of the Y-axis moving mechanism; the rotating mechanism is arranged on the upper part of the lifting mechanism and has a rotating shaft extending to one side; the circumferential outer wall of the annular bracket is connected to the free end of the rotating shaft.

[0007] Further, an annular guide rail is arranged on the back of the wire winding mechanism, and the annular guide rail is coaxially arranged with the annular bracket; the annular bracket is provided with a circumferential driving component for driving the annular guide rail to perform a circular motion.

[0008] Further, the wire winding mechanism includes a wire pay-off mechanism and a wire routing mechanism. Among them,

[0009] The wire pay-off mechanism is wound with the diamond cutting wire and can rotate relative to the wire winding mechanism to pay out the diamond cutting wire;

[0010] The diamond cutting wire extends from the wire pay-off mechanism to the wire routing mechanism, and falls into the V-shaped groove of the sheave by means of the action of the wire routing mechanism.

[0011] Further, the wire routing mechanism is arranged closer to the axis of the circular motion of the wire winding mechanism than the wire pay-off mechanism, and includes a wire routing wheel, a wire routing rotation driver, and a wire routing telescopic driver; among them,

[0012] The wire routing rotation driver is connected to the wire routing wheel to drive the wire routing wheel to rotate;

[0013] The wire routing telescopic driver is connected to the wire routing rotation driver to drive the wire routing rotation driver and the wire routing wheel to move along the length direction of the sheave;

[0014] The wire routing telescopic driver is preset with a telescopic value, and the telescopic value is the same as the spacing of the V-shaped groove on the surface of the sheave; each time the wire winding mechanism makes a circular motion, the telescopic driver extends or shortens the telescopic value.

[0015] Further, the wire winding mechanism includes a vision system for detecting the position where the diamond cutting wire is wound around the sheave.

[0016] Further, the vision system includes a camera, a light source, and a light source rotation driver; among them,

[0017] The light source is arranged in front of the camera lens;

[0018] The light source rotation driver is used to drive the light source to rotate.

[0019] Further, the wire winding mechanism includes a mounting plate, and the wire pay-off mechanism, the wire routing mechanism, and the vision system are sequentially arranged on the mounting plate along the direction of the circular motion of the wire winding mechanism.

[0020] Further, a control system is further included, and the control system is electrically connected to the X-axis moving mechanism, the Y-axis moving mechanism, the lifting mechanism, the rotating mechanism, the surrounding driving assembly, and the wire winding mechanism respectively.

[0021] Further, a moving mechanism is provided at the bottom of the support table.

[0022] The advantages and positive effects of the present utility model are:

[0023] (1) It realizes the automatic wiring of diamond cutting wire on the grooved pulley, greatly simplifies the wiring process and operation difficulty, reduces the working intensity of operators, improves the wiring efficiency, reduces the production cost, and realizes the increase of efficiency and reduction of consumption;

[0024] (2) By setting the wire pay-off mechanism and the wiring mechanism, the diamond cutting wire can accurately fall into the V-shaped groove of the grooved pulley, ensuring the wiring quality;

[0025] (3) The annular bracket and the wire winding mechanism are used in cooperation, multiple mechanisms work simultaneously, the degree of automation is high, the wiring efficiency is improved, the labor intensity is reduced, and the operation with fewer people and automation is realized. Description of the Drawings

[0026] Figure 1 is a schematic structural diagram of a specific embodiment of the present utility model;

[0027] Figure 2 is a schematic use diagram of a specific embodiment of the present utility model;

[0028] Figure 3 is a left view of a specific embodiment of the present utility model;

[0029] Figure 4 is Figure 3 a partial enlarged view of part A in

[0030] Figure 5 is a front view of a specific embodiment of the present utility model;

[0031] Figure 6 is a rear view of a specific embodiment of the present utility model;

[0032] Figure 7 is a schematic structural diagram of the wire winding mechanism of a specific embodiment of the present utility model.

[0033] In the figure:

[0034] 10. Support table 11. Roller 12. Retractable support leg

[0035] 20. X-axis moving mechanism 21. X-axis slide rail 22. First mounting seat

[0036] 30. Y-axis moving mechanism 31. Y-axis slide rail 32. Second mounting seat

[0037] 40. Lifting mechanism 41. Third mounting seat

[0038] 50. Rotating mechanism 51. Rotating shaft

[0039] 60. Annular bracket

[0040] 70. Surrounding drive assembly, 71. Transmission gear, 72. Limiting device

[0041] 80. Wire winding mechanism, 81. Mounting plate, 82. Wire pay-off mechanism

[0042] 821. Wire pay-off reel, 822. Wire pay-off driver, 83. Wire routing mechanism

[0043] 831. Wire routing wheel, 832. Wire routing rotary driver, 833. Wire routing telescopic driver

[0044] 84. Vision system, 841. Camera, 842. Light source

[0045] 843. Light source rotary driver, 85. Ring-shaped guide rail, 851. Tooth belt

[0046] 852. Guide bar

[0047] 90. Wire cutting machine, 91. Geneva wheel Detailed implementation manners

[0048] The embodiments of the present utility model will be described below with reference to the accompanying drawings.

[0049] As shown in Figure 1 , the present utility model provides an automatic wire routing device for a silicon wafer wire cutting machine, including a ring-shaped bracket 60 and a wire winding mechanism 80; the ring-shaped bracket 60 is provided with a notch so that the ring-shaped bracket 60 can be circumferentially arranged around the Geneva wheel 91 of the wire cutting machine 90; the wire winding mechanism 80 is wound with a diamond cutting wire and is rotatably connected to the ring-shaped bracket 60. During operation, the wire winding mechanism 80 moves in a circular motion along the ring-shaped bracket 60, so that the diamond cutting wire is wound around the Geneva wheel 91.

[0050] Specifically, as shown in Figure 2 , the automatic wire routing device for a silicon wafer wire cutting machine is used to route the diamond cutting wire onto the Geneva wheel 91 of the wire cutting machine 90 as required. Generally, the number of Geneva wheels 91 of the wire cutting machine 90 is more than two, so that the diamond cutting wire forms a wire mesh for cutting operations; therefore, the ring-shaped bracket 60 is integrally constructed as a ring shape with a notch, and the space inside the surrounded circumference has a sufficient size to accommodate the Geneva wheel 91; in order to enable the Geneva wheel 91 to enter the inside of the ring-shaped bracket 60, the size of the notch of the ring-shaped bracket 60 is adapted to the shape and layout of the Geneva wheel 91.

[0051] During use, one end of the diamond cutting wire is connected to the Geneva wheel 91, and the other end is connected to the wire winding mechanism 80; when the wire winding mechanism 80 moves in a circular motion along the ring-shaped bracket 60, it drives the diamond cutting wire to rotate circumferentially along the Geneva wheel 91, so that the diamond cutting wire is wound around the Geneva wheel 91.

[0052] It can be understood that to prevent the wire winding mechanism 80 from detaching from the annular bracket 60 when it moves circumferentially along the annular bracket 60, the wire winding mechanism 80 should always be rotatably connected to the annular bracket 60 during the circumferential movement and be able to rotate from one side of the notch to the other side.

[0053] Preferably, the wire winding mechanism 80 is also constructed in a circular ring shape, and the center of the wire winding mechanism 80, the center of the circumferential movement of the wire winding mechanism 80, and the center of the annular bracket 60 coincide; the arc length of the wire winding mechanism 80 is greater than the circumferential length of the notch.

[0054] Specifically, as Figure 1 、 Figure 2 shown, the automatic wiring device further includes a support table 10, an X-axis moving mechanism 20, a Y-axis moving mechanism 30, a lifting mechanism 40, and a rotating mechanism 50.

[0055] Among them, the shape of the above-mentioned support table 10 can be set as required, and it is preferably provided with a rectangular plane and a support frame for supporting the X-axis moving mechanism 20, the Y-axis moving mechanism 30, the lifting mechanism 40, and the rotating mechanism 50;

[0056] The above-mentioned X-axis moving mechanism 20 is arranged on the support table 10. The X-axis moving mechanism 20 can adopt a cylinder guide rail, or a gear-rack drive, or other moving structures, which are selected according to actual needs and are not specifically required here; preferably, the X-axis moving mechanism 20 adopts a gear-rack drive, including an X-axis slide rail 21, an X-axis driving device (not shown), and a first mounting seat 22. The X-axis slide rail 21 is preferably two and is provided with a toothed belt 851; the X-axis driving device includes an X-axis driving motor and a gear, and the gear meshes with the toothed belt 851 and moves along the toothed belt 851 under the drive of the X-axis driving motor; preferably, the X-axis driving motor is a double-axis motor and can drive two gears to rotate simultaneously; the first mounting seat 22 is connected to the X-axis driving device. Preferably, the X-axis driving device is provided with a protective shell, and the first mounting seat 22 is arranged above the protective shell.

[0057] The above-mentioned Y-axis moving mechanism 30 is slidably arranged on the upper part of the X-axis moving mechanism 20, enabling the Y-axis moving mechanism 30 to reciprocate along the X-axis slide rail 21; specifically, the Y-axis moving mechanism 30 can adopt a cylinder guide rail, or a gear-rack transmission, or other moving structures, which can be selected according to actual needs and no specific requirements are made here; preferably, the Y-axis moving mechanism 30 adopts a gear-rack transmission. The Y-axis moving mechanism 30 includes a Y-axis slide rail 31, a Y-axis driving device (not shown), and a second mounting seat 32; among them, the Y-axis slide rail 31 is arranged on the first mounting seat 22, perpendicular to the X-axis slide rail 21, preferably two and provided with a toothed belt 851; the specific structures of the Y-axis slide rail 31 and the Y-axis driving device are the same as those of the X-axis slide rail 21 and the Y-axis driving device, and will not be elaborated here; preferably, the second mounting seat 32 is arranged on the upper part of the Y-axis moving mechanism 30.

[0058] The above-mentioned lifting mechanism 40 is arranged on the upper part of the Y-axis moving mechanism 30. By means of the action of the Y-axis moving mechanism 30, the lifting mechanism 40 can reciprocate along the Y-axis slide rail 31; specifically, the lifting mechanism 40 is arranged on the second mounting seat 32 and can adopt cylinder lifting, hydraulic lifting, or gear-rack transmission, preferably cylinder lifting. Its lifting shaft is arranged in the vertical direction, and a third mounting seat 41 is arranged on its upper part.

[0059] The above-mentioned rotating mechanism 50 is arranged on the upper part of the lifting mechanism 40. Specifically, the rotating mechanism 50 is arranged on the third mounting seat 41; the rotating mechanism 50 includes a rotating motor and a rotating shaft 51 extending to one side, and the rotating shaft 531 is arranged along the direction of the X-axis slide rail 21. The circumferential outer wall of the above-mentioned annular bracket 60 is connected to the free end of the rotating shaft 51, and driven by the rotating motor, the annular bracket 60 rotates around the rotating shaft 51.

[0060] During use, as Figure 2 shown, move this automatic wire routing device to one side of the silicon wafer wire cutting machine, make the X-axis slide rail 21 perpendicular to the axle direction of the grooved pulley 91, and adjust the lifting mechanism 40 to make the height of the annular bracket 60 match that of the grooved pulley 91; since the grooved pulley 91 is usually arranged inside the cutting device, it is necessary to drive the X-axis moving mechanism 20 to make the annular bracket 60 close to the grooved pulley 91, so that the grooved pulley 91 enters the circumferential inner side of the annular bracket 60 through the notch; usually, the grooved pulley 91 has a certain length, and a number of V-shaped grooves are arranged in its length direction. When wiring, it is necessary to start from one end of the grooved pulley 91 and lay wire in each V-shaped groove one by one to the other end. Therefore, it is necessary to drive the Y-axis moving mechanism 30 to make the annular bracket 60 align with the wire winding starting position of the grooved pulley 91; in order to make the diamond cutting wire accurately fall into the V-shaped groove, the diamond cutting wire needs to be perpendicular to the grooved pulley 91, that is, the annular bracket 60 and the wire winding mechanism 80 should be arranged perpendicular to the grooved pulley 91. Therefore, by setting the rotating mechanism 50, it is ensured that the annular bracket 60 can be perpendicular to the grooved pulley 91, which is convenient for subsequent wire routing.

[0061] In a specific embodiment, the wire cutting machine 90 has an opening communicating with the outside world, and the height of the opening is smaller than the diameter of the annular bracket 60. When the annular bracket 60 is in a vertical state, it cannot enter the inner side of the wire cutting machine 90 through the opening. Therefore, in the initial state, the annular bracket 60 has a certain angle with the vertical direction, so that the height of the annular bracket 60 in the vertical direction is smaller than the height of the opening, and it can smoothly enter the inner side of the wire cutting machine 90 to approach the sheave 91; subsequently, the rotating mechanism 50 drives the annular bracket 60 to rotate to a vertical state and be perpendicular to the sheave 91.

[0062] The above-mentioned rotating shaft 51 has a sufficient length, so that when the annular bracket 60 moves to one end of the X-axis slide rail 21, the annular bracket 60 surrounds the outside of the sheave 91.

[0063] Furthermore, as Figure 2 、 Figure 3 shown, the present application proposes a specific structure that enables the winding mechanism 80 to perform a circular motion along the annular bracket 60: a circular guide rail 85 is provided on the back surface of the winding mechanism 80, and the circular guide rail 85 is coaxially arranged with the annular bracket 60; the annular bracket 60 is provided with a surrounding drive assembly 70 for driving the circular guide rail 85 to perform a circular motion.

[0064] Specifically, the circular guide rail 85 protrudes from the middle of the back surface of the winding mechanism 80 and has a certain length and width; its length is greater than the arc length corresponding to the notch part; it can cross the notch and be connected to the surrounding drive assembly 70; one end or both ends in the width direction of the circular guide rail 85 are provided with a toothed belt 851, and a guide strip 852 is provided on the end surface away from the winding mechanism 80, and the guide strip 852 is an annular plate; the surrounding drive assembly 70 includes a surrounding driver, a transmission gear 71 and a limiting device 72, and the limiting device 72 is a plurality of limiting wheels; the transmission gear 71 and the limiting wheels are circumferentially dispersed with the center of the annular bracket 60 as the center, the transmission gear 71 meshes with the toothed belt 851, and the limiting wheels have limiting grooves, and both ends in the width direction of the guide strip 852 are clamped into the limiting grooves; when the surrounding driver drives the transmission gear 71 to rotate, the circular guide rail 85 drives the winding mechanism 80 to perform a circular operation.

[0065] Preferably, the surrounding drive assembly 70 includes a bearing with a notch and a surrounding driver. Both ends of the bearing are respectively connected to the winding mechanism 80 and the annular bracket 60, and at the same time the surrounding driver can drive the bearing to rotate; the bearing is a commercially available product, and its specific structure will not be elaborated here.

[0066] Furthermore, as Figure 4 、 Figure 5 and Figure 6As shown, the wire winding mechanism 80 includes a wire pay-off mechanism 82 and a wire routing mechanism 83. Among them, the wire pay-off mechanism 82 is wound with a diamond cutting wire and can rotate relative to the wire winding mechanism 80 to pay off the diamond cutting wire; the diamond cutting wire extends from the wire pay-off mechanism 82 to the wire routing mechanism 83, and by the action of the wire routing mechanism 83, it falls into the V-shaped groove of the sheave 91.

[0067] Specifically, the wire pay-off mechanism 82 includes a wire pay-off reel 821 and a wire pay-off driver 822. The wire pay-off reel 821 is connected to one end of the rotating shaft of the wire pay-off driver 822, and the diamond cutting wire is wound around the wire pay-off reel 821. When the wire pay-off driver 822 operates, it drives the wire pay-off reel 821 to rotate to pay off the diamond cutting wire; preferably, the rotating shaft of the wire pay-off driver 822 is arranged along the direction of the Y-axis slide rail 31, so that the wire pay-off reel 821 is parallel to the X-axis slide rail 21. When the annular bracket 60 is perpendicular to the sheave 91, the wire pay-off reel 821 is also perpendicular to the sheave 91. When the wire winding mechanism 80 makes a circular motion, the diamond cutting wire is perpendicular to the sheave 91, which is convenient for the diamond cutting wire to fall into the V-shaped groove of the sheave 91.

[0068] The above-mentioned wire routing mechanism 83 is arranged closer to the axis of the circular motion of the wire winding mechanism 80 relative to the wire pay-off mechanism 82. That is to say, in use, the wire routing mechanism 83 is closer to the sheave 91, so that the diamond cutting wire can fall into the V-shaped groove of the sheave 91 through the wire routing mechanism 83.

[0069] Specifically, the wire routing mechanism 83 includes a wire routing wheel 831, a wire routing rotation driver 832 and a wire routing telescopic driver 833; among them, the wire routing rotation driver 832 is connected to the wire routing wheel 831 to drive the wire routing wheel 831 to rotate. The rotating shaft of the wire routing rotation driver 832 is arranged along the direction of the Y-axis slide rail 31, so that the wire routing reel is parallel to the X-axis slide rail 21, and further makes the diamond cutting wire on the wire routing wheel 831 perpendicular to the sheave 91; the wire routing telescopic driver 833 is connected to the wire routing rotation driver 832, and the telescopic shaft of the wire routing telescopic driver 833 is arranged along the direction of the Y-axis slide rail 31 to drive the wire routing rotation driver 832 and the wire routing wheel 831 to move along the length direction of the sheave 91 to control the landing point of the diamond cutting wire on the wire routing reel; it can be understood that the telescopic movement of the wire routing telescopic driver 833 cooperates with the rotation of the wire winding mechanism 80. Every time the wire winding mechanism 80 rotates one week, the wire routing telescopic driver 833 completes one telescopic movement, so that the diamond cutting wire can accurately fall into the V-shaped groove. At this time, the path of the diamond cutting wire is spiral.

[0070] Furthermore, the wire routing telescopic driver 833 is preset with a telescopic value, and this telescopic value is the same as the spacing of the V-shaped grooves on the surface of the sheave 91; every time the wire winding mechanism 80 makes a circular motion, the wire routing telescopic driver 833 elongates or shortens the telescopic value, so that the diamond cutting wire can continuously fall into the V-shaped groove with the movement of the wire winding mechanism 80 to complete the wire routing.

[0071] Further, the wire winding mechanism 80 further includes a vision system 84 for detecting the position where the diamond cutting wire is wound around the sheave 91; by providing the vision system 84 to detect whether the diamond cutting wire falls into the V-shaped groove, the wiring effect can be ensured.

[0072] Specifically, the vision system 84 includes a camera 841, a light source 842, and a light source rotation driver 843; wherein, the light source 842 is disposed in front of the lens of the camera 841; the light source rotation driver 843 is used to drive the light source 842 to rotate. The shooting range of the camera 841 can cover multiple V-shaped grooves, and the light source rotation driver 843 adjusts the irradiation angle of the light source 842 along with the circumferential movement of the wire winding mechanism 80 to ensure that the camera 841 can capture a clear image of the diamond cutting wire wound around the sheave 91.

[0073] In a specific embodiment, the spacing between the V-shaped grooves is 0.172 mm, the photographing range of the camera 841 is 4 mm, and the camera 841 can clearly capture more than twenty V-shaped grooves each time; in this embodiment, the wire cutting machine 90 is provided with three sheaves 91, and the camera 841 is set to take a picture when its shooting angle is perpendicular to any one of the sheaves 91, and at the same time the light source rotation driver 843 drives the light source 842 to rotate so that the light source 842 can irradiate the corresponding position of the sheave 91 aligned with the camera 841.

[0074] Further, as Figure 6 、 Figure 7 shown, the wire winding mechanism 80 includes a mounting plate 81, and the wire pay-off mechanism 82, the wire routing mechanism 83, and the vision system 84 are sequentially arranged on the mounting plate 81 along the circumferential movement direction of the wire winding mechanism 80; specifically, the wire pay-off driver 822, the wire routing telescopic driver 833, and the vision system 84 are sequentially arranged on the mounting plate 81.

[0075] Wherein, the camera 841 and the light source rotation driver 843 of the vision system 84 can be separately and independently arranged on the mounting plate 81, or the light source rotation driver 843 can be connected to the camera 841, as long as the light source rotation driver 843 can drive the light source 842 to rotate and is located in front of the lens of the camera 841.

[0076] In the present application, the annular bracket 60 has a circumferential inner wall, a circumferential outer wall, and two opposite axial side surfaces. Preferably, as Figure 6 、 Figure 7As shown, the shape of the mounting plate 81 matches the axial side surface, and it is rotationally connected to the axial side surface through the surrounding drive assembly 70 to achieve circular motion along the axial side surface; the wire pay-off mechanism 82, the wire routing mechanism 83, and the vision system 84 are arranged in a ring in sequence along the direction of circular motion of the wire winding mechanism 80, and are disposed on the side of the mounting plate 81 away from the annular bracket 60.

[0077] In another specific embodiment of the present application, the shape of the mounting plate 81 matches the inner circumferential wall of the annular bracket 60, and it is rotationally connected to the inner circumferential wall through the surrounding drive assembly 70 to perform circular motion along the inner circumferential wall. The wire pay-off mechanism 82, the wire routing mechanism 83, and the vision system 84 are arranged in sequence along the direction of circular motion of the wire winding mechanism 80, and are disposed on the inner circumference of the mounting plate 81.

[0078] Furthermore, the present application further includes a control system, and the control system is electrically connected to the X-axis moving mechanism 20, the Y-axis moving mechanism 30, the lifting mechanism 40, the rotating mechanism 50, the surrounding drive assembly 70, and the wire winding mechanism 80 respectively. Specifically, the control system includes a number of sensors, and the actions of the X-axis moving mechanism 20, the Y-axis moving mechanism 30, the lifting mechanism 40, the rotating mechanism 50, the surrounding drive assembly 70, the wire pay-off mechanism 82, the wire routing mechanism 83, and the vision system 84 are controlled through the assistance of the sensors; the control system further includes a programmable controller, and a pre-edited program is provided inside, so that the X-axis moving mechanism 20, the Y-axis moving mechanism 30, the lifting mechanism 40, the rotating mechanism 50, the surrounding drive assembly 70, the wire pay-off mechanism 82, the wire routing mechanism 83, and the vision system 84 act according to the pre-edited program, automatically completing the winding of the diamond cutting wire around the sheave 91, detecting the wire routing effect, realizing integrated control, improving the wire routing efficiency, and reducing the labor intensity and production cost.

[0079] Furthermore, a moving mechanism is provided at the bottom of the support table 10. The moving mechanism includes rollers 11 and retractable feet 12. By providing the rollers 11, it is convenient to move the automatic wire routing device to the required position; after the automatic wire routing device moves into place, the retractable feet 12 are lowered, and the automatic wire routing device is firmly fixed to the ground through the retractable feet 12, and it is not likely to move during the working process.

[0080] When the automatic wire routing device of the silicon wafer wire cutting machine is in use, the operator first moves the device close to the wire cutting machine 90. By operating the X-axis moving mechanism 20, the annular bracket 60 enters the inner side of the wire cutting machine 90 near the sheave 91. Subsequently, the lifting mechanism 40 is operated to align the notch of the annular bracket 60 with the sheave 91. The X-axis moving mechanism 20 is operated again to surround the annular bracket 60 around the outer periphery of the sheave 91. The rotating mechanism 50 is operated to make the annular bracket 60 perpendicular to the axis direction of the sheave 91. The Y-axis moving mechanism 30 is operated to align the wire routing mechanism 83 with the initial wire routing position on the sheave 91. The sequence of operations of the above X-axis moving mechanism 20, Y-axis moving mechanism 30, lifting mechanism 40, and rotating mechanism 50 can be adjusted as needed and is not limited here. Subsequently, the operator first winds the diamond cutting wire around the wire pay-off mechanism 82. The length of the diamond cutting wire can be set according to requirements. Preferably, its length satisfies winding around the sheave 91 for more than twenty turns. Subsequently, the diamond cutting wire is extended to the wire routing mechanism 83, and after passing through the wire routing mechanism 83, its free end is wound into the V-shaped groove of the sheave 91. Subsequently, the circumferential drive assembly 70, wire pay-off mechanism 82, wire routing mechanism 83, and vision system 84 are operated to make the wire winding mechanism 80 perform a circular motion along the annular bracket 60. At this time, the wire routing mechanism 83 drags the diamond cutting wire to travel along the length direction of the sheave 91 in a spiral trajectory, so that the diamond cutting wire accurately enters the V-shaped groove. The camera 841 of the vision system 84 is set to take photos of the diamond cutting wire and the sheave 91 at several set positions during the circular motion, and perform comparative analysis to determine whether the diamond cutting wire falls into the V-shaped groove, and send a signal to the control system. The control system issues instructions to the circumferential drive assembly 70, wire pay-off mechanism 82, wire routing mechanism 83, and vision system 84 to control the circumferential drive assembly 70, wire pay-off mechanism 82, wire routing mechanism 83, and vision system 84 to continue running or stop running. When all the diamond cutting wire wound on the wire pay-off mechanism 82 is released, the control system controls the circumferential drive assembly 70, wire pay-off mechanism 82, wire routing mechanism 83, and vision system 84 to stop running. Subsequently, one end of the diamond cutting wire wound on the sheave 91 is connected to the diamond cutting wire on the wire pay-off mechanism of the wire cutting machine 90. The sheave 91 is operated, and the wire routing of the remaining length of the sheave 91 is automatically completed through the rotation of the sheave 91. During this process, the diamond cutting wire continuously advances and elongates, and its other end is connected to the wire take-up mechanism of the wire cutting machine 90, thus completing the wire routing work.

[0081] Through the above actions, the automatic wire routing of the diamond cutting wire on the sheave is realized, greatly simplifying the wire routing process flow and operation difficulty, reducing the working intensity of the operator, improving the wire routing efficiency, reducing the production cost, and achieving efficiency increase and consumption reduction.

[0082] By adopting the above technical solution, the diamond cutting wire can accurately fall into the V-shaped groove of the sheave, ensuring the wire routing quality;

[0083] By using a combination of a ring-shaped bracket and a wire winding mechanism, multiple mechanisms work simultaneously, with a high degree of automation, improving the wiring efficiency, reducing the labor intensity, and realizing less-man and automated operations.

[0084] The above has described the embodiments of the present invention in detail, but the content described is only the preferred embodiments of the present invention and cannot be considered as used to limit the scope of implementation of the present invention. All equivalent changes and improvements made according to the scope of the present invention application should still fall within the scope covered by the patent of the present invention.

Claims

1. An automatic wire routing device for a silicon wafer wire cutting machine, characterized in that: It includes an annular bracket and a wire winding mechanism; the annular bracket is provided with a notch so that the annular bracket can be circumferentially arranged around the sheave of the wire cutting machine; the wire winding mechanism is wound with a diamond cutting wire and is rotatably connected to the annular bracket. During operation, the wire winding mechanism performs a circular motion along the annular bracket, so that the diamond cutting wire is wound around the sheave.

2. The automatic wiring device for a silicon wafer wire cutting machine according to claim 1, characterized in that: It further includes a support table, an X-axis moving mechanism, a Y-axis moving mechanism, a lifting mechanism and a rotating mechanism; wherein, the X-axis moving mechanism is arranged on the support table; the Y-axis moving mechanism is slidably arranged on the upper part of the X-axis moving mechanism; the lifting mechanism is arranged on the upper part of the Y-axis moving mechanism; the rotating mechanism is arranged on the upper part of the lifting mechanism and has a rotating shaft extending to one side; the circumferential outer wall of the annular bracket is connected to the free end of the rotating shaft.

3. The automatic wiring device for a silicon wafer wire cutting machine according to claim 2, characterized in that: An annular guide rail is arranged on the back of the wire winding mechanism, and the annular guide rail is coaxially arranged with the annular bracket; the annular bracket is provided with a circumferential driving component for driving the annular guide rail to perform a circular motion.

4. The automatic wiring device for a silicon wafer wire cutting machine according to claim 3, characterized in that: The wire winding mechanism includes a wire paying-off mechanism and a wire routing mechanism, wherein, the wire paying-off mechanism is wound with the diamond cutting wire and can rotate relative to the wire winding mechanism to pay off the diamond cutting wire; the diamond cutting wire extends from the wire paying-off mechanism to the wire routing mechanism and falls into the V-shaped groove of the sheave by means of the action of the wire routing mechanism.

5. The automatic wire routing device for a silicon wafer wire cutting machine according to claim 4, characterized in that: The wire routing mechanism is arranged closer to the axis of the circular motion of the wire winding mechanism than the wire paying-off mechanism, and includes a wire routing wheel, a wire routing rotation driver and a wire routing telescopic driver; wherein, the wire routing rotation driver is connected to the wire routing wheel to drive the wire routing wheel to rotate; the wire routing telescopic driver is connected to the wire routing rotation driver to drive the wire routing rotation driver and the wire routing wheel to move along the length direction of the sheave; the wire routing telescopic driver is preset with a telescopic value, and the telescopic value is the same as the distance between the V-shaped grooves on the surface of the sheave; every time the wire winding mechanism performs a circular motion, the telescopic driver elongates or shortens the telescopic value.

6. The automatic wiring device for a silicon wafer wire cutting machine according to claim 5, characterized in that: The wire winding mechanism includes a vision system for detecting the position where the diamond cutting wire is wound around the sheave.

7. The automatic wire routing device for a silicon wafer wire cutting machine according to claim 6, characterized in that: The vision system includes a camera, a light source and a light source rotation driver; wherein, the light source is arranged in front of the camera lens; the light source rotation driver is used to drive the light source to rotate.

8. The automatic wiring device for a silicon wafer wire cutting machine according to claim 6 or 7, characterized in that: The wire winding mechanism includes a mounting plate, and the wire paying-off mechanism, the wire routing mechanism and the vision system are sequentially arranged on the mounting plate along the direction of the circular motion of the wire winding mechanism.

9. The automatic wire routing device for a silicon wafer wire sawing machine according to claim 8, wherein: It further includes a control system, and the control system is electrically connected to the X-axis moving mechanism, the Y-axis moving mechanism, the lifting mechanism, the rotating mechanism, the circumferential driving component and the wire winding mechanism respectively.

10. The automatic wiring device for a silicon wafer wire cutting machine according to any one of claims 2 and 4-7, 9, characterized in that: A moving mechanism is arranged at the bottom of the support table.

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