Wafer hanging basket device
By designing the wafer basket device, using vertical beams, cross beams, oblique braces and reinforcement mechanisms, the scratching problem caused by the tilt of the wafer during the cleaning process is solved, achieving higher stability and protection effects.
Patent Information
- Application Number
- CN202421656857.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-12
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-07-12
AI Technical Summary
The wafer may be tilted during vibration, causing scratches or damage to the surface of adjacent wafers, affecting product quality and performance.
A wafer hanging basket device is designed, including vertical beams, cross beams, oblique braces, reinforcement rods and reinforcement mechanisms. The lifting block is driven to resist the fixed wafer through the drive member, and combined with the liquid leakage holes and elastic member buffering to improve stability and buffering effect.
Enhances the stability of the wafer during processing, reduces the risk of accidental collisions and damage, and improves operational reliability and wafer integrity.
Smart Images

Figure CN223123877U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of storage devices, and in particular, to a wafer hanging basket device. Background Art
[0002] A wafer refers to the basic material in the semiconductor manufacturing process, usually made of silicon material. In semiconductor production, a wafer is a circular thin slice on which chips and integrated circuits can be fabricated. During the chip manufacturing process, the wafer undergoes a series of process steps such as lithography, etching, ion implantation, etc., and finally hundreds or thousands of chips are formed.
[0003] In the existing wafer wet process equipment wafer loading and unloading trough device mentioned in the Chinese public patent (authorization announcement number: CN211208409U), the hanging rack mechanism can quickly lower the washed wafer into the inner cavity of the trough to be fully connected after the cleaning process; the feeding drive mechanism enables the wafer to perform efficient reciprocating motion for loading and unloading outside the trough. After loading and unloading, the hanging basket for placing the wafer can be quickly extracted through the hanging rack mechanism.
[0004] When the existing wafers are being cleaned, most of them are placed in the chucks of the hanging basket, and then the hanging basket is moved to the cleaning tank for cleaning to remove powder. However, after cleaning, a certain amount of water droplets will adhere to the surface of the product. Therefore, it is necessary to remove the water droplets first by vibrating the hanging basket. During the vibration process, the wafers may tilt and touch the adjacent wafers, which may cause scratches or other damages on the surface of the wafers, affecting the quality and performance of the products. Summary of the Utility Model
[0005] The purpose of the present application is to provide a wafer hanging basket device to solve the problem that the wafers may tilt during the vibration process, touch the adjacent wafers, and may cause scratches or other damages on the surface of the wafers.
[0006] The present application specifically adopts the following technical solutions to achieve the above purpose:
[0007] A wafer hanging basket device includes two vertical beams. Two cross beams are fixedly connected between the two vertical beams. Diagonal braces are fixedly connected between the cross beam and the vertical beam. Reinforcing rods are fixedly connected to the inner walls on both sides of the vertical beam. Liquid leakage holes are formed in the interior of the lower cross beam. A number of first clamping plugs are fixedly connected to the top of the lower cross beam at equal intervals. A number of second clamping plugs are fixedly connected to the top of the lower cross beam at equal intervals. The top of the first clamping plug and the second clamping plug are both lapped with a wafer body. A reinforcing mechanism is arranged on one side of the two vertical beams close to each other. The reinforcing mechanism includes fixing blocks fixedly connected to the inner side walls of the two vertical beams. Driving frames are fixedly connected to the sides of the fixing blocks close to each other. A lifting plate is slidably arranged in the interior of the two driving frames. A number of lifting blocks are fixedly connected to the bottom of the lifting plate at equal intervals. A driving member is arranged in the interior of one side of the driving frame.
[0008] By adopting the above technical solution, the 8-inch wafer body is placed on the top of the first clamping plug and the second clamping plug for lapping. If it is a 12-inch wafer body, due to the Z-shaped shape of the second clamping plug, the 12-inch wafer body can be placed inside the second clamping plug, enhancing the flexibility and versatility of the hanging basket. The diagonal braces can increase the stability between the vertical beam and the cross beam. During cleaning, the cleaning liquid after cleaning can be discharged through the liquid leakage holes, thereby completing the cleaning of the wafer body. The reinforcing mechanism can reduce the risk of the wafer body tilting during use. The driving member makes the lifting plate move downward in the driving frame, and the movement of the lifting plate drives the lifting blocks to move downward, so that the lifting blocks move downward to abut and fix the wafer body placed in the hanging basket.
[0009] Further, the driving member includes a threaded rod rotatably connected to the inner bottom wall of the driving frame. The top end of the threaded rod penetrates through the lifting plate and the driving frame and is fixedly connected with a knob. The threaded rod is threadedly connected with the lifting plate. The threaded rod is rotatably connected with the driving frame. Reinforcing plates are fixedly connected to the bottoms of the two fixing blocks. The bottom of the driving frame is fixedly connected with the reinforcing plate.
[0010] By adopting the above technical solution, rotating the knob drives the threaded rod to rotate inside the driving frame. Due to the threaded connection between the threaded rod and the lifting plate, the lifting plate moves.
[0011] Further, a guide rod is arranged in the interior of the other driving frame. The top end of the guide rod penetrates through the lifting plate. The guide rod is slidably connected with the lifting plate. The two ends of the guide rod are fixedly connected with the inner wall of the driving frame.
[0012] By adopting the above technical solution, the movement stability of the lifting plate is improved.
[0013] Further, a number of through holes are formed in the interior of the lifting plate at equal intervals.
[0014] By adopting the above technical solution, it is convenient for the cleaning liquid to flow to the surface of the wafer body.
[0015] Furthermore, a hollow groove is opened inside the lifting block, and an elastic member is fixedly connected to the inner top wall of the hollow groove, and the elastic member is composed of a telescopic rod and a spring. A resistance block is fixedly connected to the bottom of the elastic member, and the resistance block is slidably arranged with the hollow groove. A resistance plate is fixedly connected to the bottom of the resistance block, and the resistance plate is arranged to be concave, and the resistance plate resists against the wafer body when moving.
[0016] By adopting the above technical solution, the abutment plate can have a certain buffer space while abutting and fixing the wafer body.
[0017] Furthermore, a buffer pad is fixedly connected to the bottom of the abutment plate, and the shape of the buffer pad is adapted to the shape of the abutment plate.
[0018] By adopting the above technical solution, the stress impact on the wafer body can be further reduced.
[0019] Furthermore, sliding grooves are provided on both sides of the empty groove, and sliding blocks are fixedly connected to both sides of the abutment block. The shapes of the sliding blocks are adapted to the sliding grooves, and the sliding blocks are slidably connected to the sliding grooves.
[0020] By adopting the above technical solution, the interference block can maintain a correct moving trajectory when moving.
[0021] In summary, the present application includes at least one of the following beneficial effects:
[0022] 1. In the present application, when reinforcing the wafer body, the knob is first turned to drive the lifting block downward to resist and fix the wafer body placed in the hanging basket, which improves the stability of the wafer during the processing process, reduces the risk of damage caused by accidental collision or movement, and thus improves the reliability during operation.
[0023] 2. In the present application, when the lifting block moves downward, the elastic member can ensure that the resistance plate has a certain buffer space while resisting and fixing the wafer body, thereby reducing the impact or damage to the wafer body caused by sudden force application, making the wafer body more stable and controllable during the fixing process, thereby protecting the integrity of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 It is a schematic diagram of the first three-dimensional structure of the hanging basket in this application;
[0025] Figure 2 It is a schematic diagram of the second three-dimensional structure of the hanging basket in this application;
[0026] Figure 3It is a schematic diagram of the third three-dimensional structure of the hanging basket in this application;
[0027] Figure 4 This application Figure 3 The enlarged structural diagram at A in the middle;
[0028] Figure 5 This application Figure 2 The enlarged structural diagram at B in the middle;
[0029] Figure 6 It is a schematic diagram of the three-dimensional structure of the lifting plate in this application;
[0030] Figure 7 It is a schematic diagram of the cross-sectional structure of the lifting block in this application.
[0031] Description of reference numerals:
[0032] 1. Vertical beam; 2. Horizontal beam; 3. Diagonal brace; 4. Reinforcement rod; 5. Leakage hole; 6. Plug one; 7. Plug two; 8. Wafer body; 9. Fixed block; 10. Drive frame; 11. Lifting plate; 12. Lifting block; 13. Threaded rod; 14. Knob; 15. Guide rod; 16. Through hole; 17. Empty slot; 18. Elastic part; 19. Resistance block; 20. Resistance plate; 21. Buffer pad; 22. Slide groove; 23. Reinforcement plate. DETAILED DESCRIPTION
[0033] The following is combined with Figure 1-7 This application is described in further detail.
[0034] The embodiment of the present application discloses a wafer hanging basket device.
[0035] Reference Figures 1 to 4 A wafer hanging basket device comprises two vertical beams 1, two horizontal beams 2 are fixedly connected between the two vertical beams 1, diagonal braces 3 are fixedly connected between the horizontal beams 2 and the vertical beams 1, reinforcing rods 4 are fixedly connected to the inner walls of both sides of the vertical beams 1, leakage holes 5 are opened inside the lower horizontal beam 2, a plurality of plugs 1 6 are fixedly connected to the top of the lower horizontal beam 2 at an equal distance, a plurality of plugs 2 7 are fixedly connected to the top of the lower horizontal beam 2 at an equal distance, a wafer body 8 is overlapped on the top of the plugs 1 6 and the plugs 2 7, a reinforcing mechanism is arranged on the side of the two vertical beams 1 close to each other, the reinforcing mechanism comprises a fixed block 9 fixedly connected to the inner side walls of the two vertical beams 1, a driving frame 10 is fixedly connected to the side of the fixed blocks 9 on both sides close to each other, a lifting plate 11 is slidingly arranged inside the driving frames 10 on both sides, a plurality of lifting blocks 12 are fixedly connected to the bottom of the lifting plate 11 at an equal distance, and a driving member is arranged inside the driving frame 10 on one side.
[0036] When cleaning the wafer body 8, first place the 8-inch wafer body 8 on the top lap of the chuck one 6 and the chuck two 7. If it is a 12-inch wafer body 8, the shape of the chuck two 7 is Z-shaped, so that the 12-inch wafer body 8 can be placed inside the chuck two 7, enhancing the flexibility and versatility of the hanging basket. The stability between the vertical beam 1 and the cross beam 2 can be increased by the diagonal brace 3. When cleaning, the cleaning liquid after cleaning can be discharged through the liquid leakage hole 5, thus completing the cleaning of the wafer body 8. The stability of the wafer body 8 can be increased by the reinforcement mechanism, reducing the risk of the wafer body 8 tilting during use. The lifting block 12 is driven downward by the driving part to resist and fix the wafer body 8 placed in the hanging basket.
[0037] Refer to Figure 2 and Figure 5 , the driving part includes a threaded rod 13 rotatably connected to the inner bottom wall of the driving frame 10. The top end of the threaded rod 13 penetrates through the lifting plate 11 and the driving frame 10 and is fixedly connected with a knob 14. The threaded rod 13 is threadedly connected with the lifting plate 11, and the threaded rod 13 is rotatably connected with the driving frame 10. The bottom of the two fixed blocks 9 is fixedly connected with a reinforcement plate 23, and the bottom of the driving frame 10 is fixedly connected with the reinforcement plate 23.
[0038] In addition, a guide rod 15 is arranged inside the other driving frame 10. The top end of the guide rod 15 penetrates through the lifting plate 11, and the guide rod 15 is slidably connected with the lifting plate 11. Both ends of the guide rod 15 are fixedly connected with the inner wall of the driving frame 10.
[0039] Moreover, a number of through holes 16 are equidistantly arranged inside the lifting plate 11.
[0040] When strengthening the wafer body 8, first rotate the knob 14 to drive the threaded rod 13 to rotate inside the driving frame 10. Due to the threaded connection between the threaded rod 13 and the lifting plate 11, the lifting plate 11 moves downward inside the driving frame 10, and the movement of the lifting plate 11 will drive the lifting block 12 to move downward, so that the lifting block 12 moves downward to resist and fix the wafer body 8 placed in the hanging basket, improving the stability of the wafer during processing. When the lifting plate 11 moves downward, the guide rod 15 provides an additional support point for the lifting plate 11, so that the lifting plate 11 can remain stable when moving. During cleaning, the cleaning liquid on the lifting plate 11 can flow to the surface of the wafer body 8 through the through holes 16.
[0041] Refer to Figure 6 and Figure 7A hollow groove 17 is provided inside the lowering block, and an elastic member 18 is fixedly connected to the inner top wall of the hollow groove 17. The elastic member 18 is composed of a telescopic rod and a spring. A resistance block 19 is fixedly connected to the bottom of the elastic member 18. The resistance block 19 is slidably arranged with the hollow groove 17. A resistance plate 20 is fixedly connected to the bottom of the resistance block 19. The resistance plate 20 is arranged to be concave, and the resistance plate 20 resists against the wafer body 8 when moving.
[0042] A buffer pad 21 is fixedly connected to the bottom of the abutment plate 20 , and the shape of the buffer pad 21 matches the shape of the abutment plate 20 .
[0043] In addition, sliding grooves 22 are provided on both sides of the empty groove 17 , and sliding blocks are fixedly connected to both sides of the abutment block 19 . The shapes of the sliding blocks match those of the sliding grooves 22 , and the sliding blocks are slidably connected to the sliding grooves 22 .
[0044] When the lifting block 12 moves downward, it will drive the resistance block 19 to move downward. The downward movement of the resistance block 19 will drive the resistance plate 20 to move downward. The downward movement of the resistance plate 20 will resist the wafer body 8. At this time, the resistance plate 20 will move upward and squeeze the elastic member 18, causing the spring to contract and generate elastic potential energy, thereby resisting and clamping the wafer body 8. The elastic member 18 can make the resistance plate 20 have a certain buffer space while resisting and fixing the wafer body 8. When the resistance plate 20 clamps the wafer body 8, the buffer pad 21 is made of rubber, which can provide additional buffering and protection, thereby helping to further reduce the stress impact on the wafer body 8. When the resistance block 19 is moving, the slider and the slide groove 22 provide a guiding effect for the resistance block 19, so that the resistance block 19 can maintain the correct moving trajectory when moving.
[0045] Working principle: Place the 8-inch wafer body 8 on the top of the plug 1 6 and the plug 2 7 to overlap. If it is a 12-inch wafer body 8, the shape of the plug 2 7 is Z-shaped, so that the 12-inch wafer body 8 can be placed inside the plug 2 7, thereby enhancing the flexibility and versatility of the hanging basket. The diagonal support 3 can increase the stability between the vertical beam 1 and the horizontal beam 2. During cleaning, the cleaning liquid can be discharged through the leakage hole 5 after cleaning, thereby completing the cleaning of the wafer body 8. Turning the knob 14 drives the threaded rod 13 to rotate inside the drive frame 10. The threaded rod 13 is threadedly connected to the lifting plate 11, so that the lifting plate 11 moves downward inside the drive frame 10, and the movement of the lifting plate 11 drives the lifting block 12 to move downward, so that the lifting block 12 downwardly contacts and fixes the wafer body 8 placed in the hanging basket, thereby improving the stability of the wafer during the processing.
Claims
1. A wafer hanging basket device, comprising two vertical beams (1), characterized in that: Two cross beams (2) are fixedly connected between the two vertical beams (1), diagonal braces (3) are fixedly connected between the cross beams (2) and the vertical beams (1), reinforcing rods (4) are fixedly connected to the inner walls of both sides of the vertical beams (1), a leakage hole (5) is provided inside the cross beam (2) located below, a plurality of first plugs (6) are fixedly connected at equal intervals to the top of the cross beam (2) located below, a plurality of second plugs (7) are fixedly connected at equal intervals to the top of the cross beam (2) located below, and the first plugs (6) and the second plugs (7) are fixedly connected at equal intervals to the top of the cross beam (2) located below. The tops are overlapped with wafer bodies (8); a reinforcement mechanism is provided on the sides of the two vertical beams (1) close to each other, and the reinforcement mechanism comprises a fixed block (9) fixedly connected to the inner side walls of the two vertical beams (1); the sides of the fixed blocks (9) close to each other are fixedly connected to a drive frame (10); the driving frames (10) on both sides are slidably provided with lifting plates (11); the bottoms of the lifting plates (11) are fixedly connected with a plurality of lifting blocks (12) at equal intervals; and a driving member is provided inside the driving frame (10) on one side.
2. The wafer hanging basket device according to claim 1, characterized in that: The driving member comprises a threaded rod (13) rotatably connected to the inner bottom wall of the driving frame (10); the top end of the threaded rod (13) penetrates the lifting plate (11) and the driving frame (10) and is fixedly connected to a knob (14); the threaded rod (13) is threadedly connected to the lifting plate (11); the threaded rod (13) is rotatably connected to the driving frame (10); the bottoms of the fixed blocks (9) on both sides are fixedly connected to reinforcing plates (23); and the bottom of the driving frame (10) is fixedly connected to the reinforcing plates (23).
3. The wafer hanging basket device according to claim 2, characterized in that: A guide rod (15) is arranged inside the driving frame (10) on the other side, the top end of the guide rod (15) passes through the lifting plate (11), the guide rod (15) is slidably connected to the lifting plate (11), and the two ends of the guide rod (15) are fixedly connected to the inner wall of the driving frame (10).
4. A wafer hanging basket device according to claim 2, characterized in that: The interior of the lifting plate (11) is provided with a plurality of through holes (16) at equal intervals.
5. The wafer hanging basket device according to claim 2, characterized in that: The lifting block (12) is provided with an empty slot (17) inside, and an elastic member (18) is fixedly connected to the inner top wall of the empty slot (17), and the elastic member (18) is composed of a telescopic rod and a spring. The bottom of the elastic member (18) is fixedly connected to a resistance block (19), and the resistance block (19) is slidably arranged with the empty slot (17). The bottom of the resistance block (19) is fixedly connected to a resistance plate (20), and the resistance plate (20) is arranged to be concave, and when the resistance plate (20) moves, it resists the wafer body (8).
6. The wafer hanging basket device according to claim 5, characterized in that: A buffer pad (21) is fixedly connected to the bottom of the abutment plate (20), and the shape of the buffer pad (21) is compatible with the shape of the abutment plate (20).
7. The wafer hanging basket device according to claim 6, characterized in that: Slide grooves (22) are provided on both sides of the empty groove (17), and sliding blocks are fixedly connected to both sides of the abutment block (19). The shapes of the sliding blocks are adapted to the shapes of the slide grooves (22), and the sliding blocks are slidably connected to the slide grooves (22).
Citation Information
Patent Citations
Wafer loading and unloading groove device for wafer wet processing equipment
CN211208409U