Integrated copper substrate convenient for heat dissipation
By integrating the copper substrate and the heat dissipation fins and canceling the welding steps, the cost increase caused by the split design is solved, and the effect of efficient heat dissipation and simplified wiring is achieved.
Patent Information
- Application Number
- CN202421969503.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-14
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-08-14
AI Technical Summary
The existing copper substrate and heat dissipation fins are designed in a split form, requiring customers to spend resources on welding, resulting in increased costs.
Design an integrated copper substrate that is easy to dissipate heat, integrate the copper substrate and heat dissipation fins, cancel the welding steps, and adopt a convex copper plate structure combining No. 1 copper plate and No. 2 copper plate, combining heat dissipation fins, double-layer conductive components and thermal insulation components to improve connection tightness and thermal conductivity efficiency.
Reduces costs, reduces welding time, improves thermal conductivity, simplifies wiring difficulty, and avoids the impact of static electricity.
Smart Images
Figure CN223125053U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of copper substrate heat dissipation, and particularly relates to an integrated copper substrate facilitating heat dissipation. Background Technique
[0002] A copper substrate composed of a copper plate and an insulating layer with a copper foil as the conductive layer is widely used in high-frequency circuits, areas with large high and low temperature changes, as well as the communication equipment and building decoration industries due to its good electrical conductivity and excellent heat dissipation effect.
[0003] At present, the existing copper substrate for chip testing and the heat dissipation fins are of a split design. In order to improve the heat dissipation effect of the copper substrate, customers often need to use tools to weld between the heat dissipation fins and the copper plate by themselves, increasing the cost.
[0004] Therefore, aiming at the problem that the existing copper substrate and the heat dissipation fins are of a split design, which requires customers to consume various resources to weld the heat dissipation fins and the copper plate, resulting in an increase in cost, an integrated copper substrate facilitating heat dissipation is designed to integrate the copper substrate and the heat dissipation fins, without welding, reducing the cost. Content of the Utility Model
[0005] In order to overcome the problem that the existing copper substrate and the heat dissipation fins are of a split design, which requires customers to spend resources to increase the cost to weld the heat dissipation fins and the copper plate.
[0006] The technical solution of the utility model is: an integrated copper substrate facilitating heat dissipation, comprising a convex copper plate formed by combining a first copper plate and a second copper plate, heat dissipation fins, a double-layer conductive component, and a heat-conducting and insulating component; the top of the first copper plate is fixedly connected with the second copper plate, the bottom of the first copper plate is fixedly connected with heat dissipation fins formed by combining multiple vertical copper plates, a double-layer conductive component is arranged at the top of the first copper plate in a front-back opposite manner, and a heat-conducting and insulating component is arranged between the first copper plate and the double-layer conductive component.
[0007] Preferably, by changing the split design of the convex copper plate and the heat dissipation fins that need to be welded in the prior art into an integrated design, customers do not need to spend resources for subsequent welding, reducing the cost. The connection between the heat dissipation fins and the convex copper plate is tight, improving the heat conduction efficiency. The double-layer conductive component can install circuits in layers, reducing the difficulty of wiring. The heat-conducting and insulating component can conduct the heat in the double-layer conductive component, and at the same time, it can also prevent static electricity from being generated between the double-layer conductive components, causing adverse effects.
[0008] Preferably, the heat dissipation fins are composed of six vertical copper plates arranged at equal intervals from front to back and fixedly connected to the bottom end of the first copper plate. The heat dissipation fins can dissipate heat through convection, and its heat dissipation efficiency depends on the surface area. The combination of multiple vertical copper plates can increase the surface area of the heat dissipation fins, thereby improving the heat conduction efficiency.
[0009] Preferably, a heat dissipation solder pad composed of a square mounting base and a hemispherical heat conduction block is provided at the top end of the second copper plate. After the heat is conducted to the top end of the second copper plate, it enters the hemispherical heat conduction block along the square mounting base, and then radiates heat into the space through the hemispherical structure, which can quickly reduce the local temperature.
[0010] Preferably, the double-layer conductive component includes a first conductive copper foil and a second conductive copper foil; two first conductive copper foils are arranged opposite to each other on the upper side of the first copper plate, and a second conductive copper foil is arranged above the first conductive copper foil. The layered design of the first conductive copper foil and the second conductive copper foil can enable the two conductive copper foils to share the wiring area and reduce the wiring difficulty.
[0011] Preferably, the heat conduction and insulation component includes heat conduction glue and an insulation layer; heat conduction glue is bonded to the top end of the first copper plate in the front and back, and a plastic insulation layer is arranged above the heat conduction glue. The heat conduction glue can transfer the heat of the double-layer conductive component to the convex copper plate, and the insulation layer can prevent static electricity from being generated due to the too close distance between the first conductive copper plate and the second conductive copper plate.
[0012] Preferably, the first conductive copper foil is bonded above the heat conduction glue, and the insulation layer is arranged between the first conductive copper foil and the second conductive copper foil. The heat generated during the use of the first conductive copper foil is introduced into the first copper plate through the heat conduction glue, and then emitted through the heat dissipation fins at the bottom end of the first copper plate.
[0013] Preferably, the bottom end of the square mounting base is welded to the second copper plate and the second conductive copper foil that is horizontally flush with the first copper plate. The heat dissipation solder pad is fixed above the second copper plate and the second conductive copper foil by welding. During the use of the second conductive copper foil, part of the generated heat will directly radiate out from the heat dissipation solder pad along the square mounting base, achieving the heat dissipation effect.
[0014] Advantages of the present utility model:
[0015] By changing the existing convex copper plate and heat dissipation fins with a split design that requires welding into an integrated design, it is not necessary for customers to spend resources on subsequent welding, reducing costs and time. At the same time, in the integrated design of the copper substrate and heat dissipation fins, the connection between the heat dissipation fins and the convex copper plate is tight, improving the heat conduction efficiency;
[0016] In order to reduce the wiring difficulty, a copper substrate with two conductive layers is often used during chip testing. In the existing design, the conductive layers are often installed on the upper and lower surfaces of a convex copper plate, which will wrap the copper plate inside and reduce the heat conduction efficiency. Brief Description of the Drawings
[0017] Figure 1 Shown is a first three-dimensional structural schematic diagram of the integrated heat-dissipating copper substrate of the present utility model;
[0018] Figure 2 Shown is a three-dimensional structural schematic diagram of the convex copper plate and heat-dissipating fins of the integrated heat-dissipating copper substrate of the present utility model;
[0019] Figure 3 Shown is a three-dimensional structural schematic diagram of the double-layer conductive component of the integrated heat-dissipating copper substrate of the present utility model;
[0020] Figure 4 Shown is a three-dimensional structural schematic diagram of the heat-conducting and insulating component of the integrated heat-dissipating copper substrate of the present utility model;
[0021] Figure 5 Shown is a three-dimensional structural schematic diagram of the heat-dissipating pad of the integrated heat-dissipating copper substrate of the present utility model.
[0022] Description of the Reference Numerals: 1. First copper plate; 2. Second copper plate; 3. Heat-dissipating fins; 4. Square mounting seat; 5. Hemispherical heat-conducting block; 601. First conductive copper foil; 602. Second conductive copper foil; 701. Heat-conducting adhesive; 702. Insulating layer. Detailed Embodiment
[0023] The present utility model will be further described below in conjunction with the drawings and embodiments.
[0024] Please refer to Figure 1 - Figure 2 , the present utility model provides an embodiment: An integrated heat-dissipating copper substrate includes a convex copper plate composed of a combination of a first copper plate 1 and a second copper plate 2, heat-dissipating fins 3, a double-layer conductive component, and a heat-conducting and insulating component; the second copper plate 2 is fixedly connected to the top end of the first copper plate 1, the heat-dissipating fins 3 composed of multiple vertical copper plates are fixedly connected to the bottom end of the first copper plate 1, a double-layer conductive component is arranged at the front and back of the top end of the first copper plate 1, and a heat-conducting and insulating component is arranged between the first copper plate 1 and the double-layer conductive component. By changing the existing split-type design of the convex copper plate and heat-dissipating fins 3 that need to be welded into an integrated design, it is not necessary for customers to spend resources on subsequent welding, reducing the cost. The connection between the heat-dissipating fins 3 and the convex copper plate is tight, improving the heat conduction efficiency. The double-layer conductive component can install circuits in layers, reducing the wiring difficulty. The heat-conducting and insulating component can conduct the heat in the double-layer conductive component, and at the same time, it can also prevent static electricity from being generated between the double-layer conductive components and causing adverse effects.
[0025] Please refer to Figure 1 、 Figure 2 、 Figure 5 In this embodiment, the heat dissipation fins 3 are composed of six vertical copper plates arranged at equal intervals from front to back and fixedly connected to the bottom end of the first copper plate 1. The top end of the second copper plate 2 is provided with a heat dissipation solder pad composed of a square mounting seat 4 and a hemispherical heat conducting block 5. The heat dissipation fins 3 can dissipate heat through convection. Its heat dissipation efficiency depends on the surface area. By combining multiple vertical copper plates, the surface area of the heat dissipation fins 3 can be increased to improve the heat conduction efficiency. After the heat is conducted to the top end of the second copper plate 2, it enters the hemispherical heat conducting block 5 along the square mounting seat 4, and then radiates heat into the space through the hemispherical structure, which can quickly reduce the local temperature.
[0026] Please refer to Figure 3 - Figure 5 In this embodiment, the double-layer conductive component includes a first conductive copper foil 601 and a second conductive copper foil 602; there are two first conductive copper foils 601 arranged opposite to each other front and back on the upper side of the first copper plate 1, and a second conductive copper foil 602 is arranged above the first conductive copper foil 601. The heat conducting and insulating component includes a heat conducting adhesive 701 and an insulating layer 702; the top end of the first copper plate 1 is adhesively bonded with heat conducting adhesives 701 arranged opposite to each other front and back, and a plastic insulating layer 702 is arranged above the heat conducting adhesive 701. The first conductive copper foil 601 is adhesively bonded above the heat conducting adhesive 701, and the insulating layer 702 is arranged between the first conductive copper foil 601 and the second conductive copper foil 602. The bottom end of the square mounting seat 4 is welded to the second copper plate 2 and the second conductive copper foil 602 that is horizontally flush with the first copper plate 1. The layered design of the first conductive copper foil 601 and the second conductive copper foil 602 can enable the two conductive copper foils to share the wiring area and reduce the wiring difficulty. The heat conducting adhesive 701 can transfer the heat of the double-layer conductive component to the convex copper plate, while the insulating layer 702 can prevent static electricity from being generated due to the first conductive copper plate and the second conductive copper plate being too close. The heat generated during the use of the first conductive copper foil 601 is introduced into the first copper plate 1 through the heat conducting adhesive 701, and then emitted through the heat dissipation fins 3 at the bottom end of the first copper plate 1. The heat dissipation solder pad is fixed above the second copper plate 2 and the second conductive copper foil 602 by welding. During the use of the second conductive copper foil 602, part of the generated heat will directly radiate out from the heat dissipation solder pad along the square mounting base to achieve the heat dissipation effect.
[0027] When working, first, the staff bonds the thermal conductive adhesive 701 cut according to the size of the first copper plate 1 onto the first copper plate 1. Then, the first conductive copper foil 601 is bonded above the thermal conductive adhesive 701. Next, the insulating layer 702 is fixed above the first conductive copper foil 601 by an anchor such as a screw. Then, the second conductive copper foil 602 is installed above the plastic insulating layer 702, and the heat dissipation pad is welded to the second conductive copper foil 602 and the second copper plate 2.
[0028] There are circuits connected to the first conductive copper foil 601 and the second conductive copper foil 602. During use, a large amount of heat is generated. The heat enters the second copper plate 2 and then flows in two directions, up and down. The heat flowing upward enters the heat dissipation pad along the second copper plate 2 and the second conductive copper foil 602, and the heat flowing downward enters the heat dissipation fins 3 along the first copper plate 1, achieving heat dissipation for the first conductive copper foil 601 and the second conductive copper foil 602.
[0029] Through the above steps, the existing split - type convex copper plate and heat dissipation fins 3 that need to be welded are changed to an integrated design, eliminating the need for customers to spend resources on subsequent welding, reducing costs and time. At the same time, in the integrated design of the copper substrate and the heat dissipation fins 3, the connection between the heat dissipation fins 3 and the convex copper plate is tight, improving the heat conduction efficiency, so as to solve the problem that the existing copper substrate and heat dissipation fins 3 are in a split - type design and customers need to spend resources to increase costs for welding the heat dissipation fins 3 and the copper plate.
[0030] The above has described the embodiments of the present invention in detail with reference to the accompanying drawings. However, the present invention is not limited to the above - described embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the gist of the present invention.
Claims
1. An integrated copper substrate facilitating heat dissipation, comprising a convex copper plate formed by combining a first copper plate (1) and a second copper plate (2); characterized in that, It also includes a heat dissipation fin (3), a double-layer conductive component, and a heat-conducting and insulating component; the top end of the first copper plate (1) is fixedly connected to the second copper plate (2), the bottom end of the first copper plate (1) is fixedly connected to the heat dissipation fin (3) composed of multiple vertical copper plates, the top end of the first copper plate (1) is provided with a double-layer conductive component opposite to each other in the front and back, and a heat-conducting and insulating component is arranged between the first copper plate (1) and the double-layer conductive component.
2. The integrated copper substrate facilitating heat dissipation according to claim 1, wherein The heat dissipation fin (3) is composed of six vertical copper plates arranged at equal intervals from front to back and fixedly connected to the bottom end of the first copper plate (1).
3. The integrated copper substrate facilitating heat dissipation according to claim 2, wherein The top end of the second copper plate (2) is provided with a heat dissipation solder pad composed of a square mounting seat (4) and a hemispherical heat-conducting block (5).
4. The integrated copper substrate facilitating heat dissipation according to claim 3, wherein, The double-layer conductive component includes a first conductive copper foil (601) and a second conductive copper foil (602); two first conductive copper foils (601) opposite to each other in the front and back are arranged on the upper side of the first copper plate (1), and a second conductive copper foil (602) is arranged above the first conductive copper foil (601).
5. The integrated copper substrate facilitating heat dissipation according to claim 4, wherein The heat-conducting and insulating component includes a heat-conducting adhesive (701) and an insulating layer (702); heat-conducting adhesives (701) opposite to each other in the front and back are bonded to the top end of the first copper plate (1), and a plastic insulating layer (702) is arranged above the heat-conducting adhesive (701).
6. The integrated copper substrate facilitating heat dissipation according to claim 5, wherein, The first conductive copper foil (601) is bonded above the heat-conducting adhesive (701), and the insulating layer (702) is arranged between the first conductive copper foil (601) and the second conductive copper foil (602).
7. The integrated copper substrate facilitating heat dissipation according to claim 6, characterized in that, The bottom end of the square mounting seat (4) is welded to the second copper plate (2) and the second conductive copper foil (602) horizontally flush with the first copper plate (1).