Cooling structure of homogenizer

Abstract

The utility model relates to the technical field of cooling of homogenizers, in particular to a cooling structure of a homogenizer, which comprises a first mounting shell, a second mounting shell and a water tank, the first mounting shell and the second mounting shell are mounted on the outer wall of a diamond interaction cavity and the outer wall of a material cooling cavity of a homogenizer main body, and the water tank is placed on one side of the homogenizer main body. According to the utility model, external air enters the air holes in the rear surface of the water tank from the air holes in the front surface of the water tank and is discharged from the fan shell, so that the air cools the water on the splitter plate and the radiating surface of the semiconductor chilling plate, and the working pressure of the semiconductor chilling plate is relieved; water flows into the water tank from a gap between the splitter plate and the water tank, the contact time of the water and external air is prolonged through the splitter plate, the pre-heat-dissipation effect is optimized, and the water in the water tank is turbulent, so that the water temperature distribution is more uniform, the refrigeration of the semiconductor chilling plate is facilitated, and the cooling efficiency of the structure is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of homogenizer cooling, in particular to a homogenizer cooling structure. Background Technique

[0002] In the production process of papermaking additives, a homogenizer is needed to improve the fineness and looseness of papermaking additives and improve the appearance of papermaking additives. The outer wall of the diamond interaction cavity of the homogenizer main body and the material cooling cavity need to dissipate heat, otherwise it will affect the service life of the homogenizer. However, there are certain drawbacks in the existing cooling when in use. For example, a homogenizer cooling structure recorded in the publication number CN219129166U, belonging to the technical field of homogenizers, to solve the problem that the existing homogenizer cooling structure cannot effectively limit the operation of the homogenizer and there are potential safety hazards, including: a homogenizer main body, a pressure component, an interaction cavity jacket, a material cooling jacket, a feed pipe, a feed bucket, a refrigerator and a cooling water pump; the pressure component is fixedly connected to the right side of the homogenizer main body;

[0003] The above structure dissipates heat through water cooling. However, when in use, the water that has absorbed heat is not pre-cooled but directly enters the water tank, increasing the burden on the refrigeration mechanism and causing uneven temperature distribution of the water inside the water tank, affecting the working efficiency of the refrigeration mechanism. Content of the Utility Model

[0004] The purpose of the utility model is to provide a homogenizer cooling structure to solve the problems put forward in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solution:

[0006] A homogenizer cooling structure includes a first mounting shell and a second mounting shell installed on the outer walls of the diamond interaction cavity of the homogenizer main body and the material cooling cavity, and a water tank placed on one side of the homogenizer main body. A water outlet pipe is embedded and connected to the side surface of the water tank, and the water outlet pipe is fixedly connected to the second mounting shell. A water inlet pipe is embedded and connected to the side surface of the water tank, and the water inlet pipe is fixedly connected to the second mounting shell. The first mounting shell is snap-connected to the side surface of the second mounting shell. A heat-conducting copper plate is fixedly connected inside the water tank, and a semiconductor refrigeration sheet is fixedly connected to the lower surface of the heat-conducting copper plate. A flow dividing plate is fixedly connected to the inner wall of the water tank, and a first rotating shaft is embedded and connected to the front surface of the water tank.

[0007] Furthermore: Air holes are provided on both the front surface and the rear surface of the water tank. A connecting cover is fixedly connected to the position of the rear surface of the water tank close to the air holes. An air guide pipe is fixedly connected to the outer surface of the connecting cover. A fan housing is fixedly connected to the rear surface of the water tank, and the air guide pipe is communicated with the fan housing.

[0008] Furthermore, spiral blades are fixedly connected to the inner walls of the first mounting shell and the second mounting shell. Sealing rings are embedded and connected to the adjacent surfaces of the first mounting shell and the spiral blades near the upper and lower ends, and sealing gaskets are embedded and connected to the adjacent surfaces of the first mounting shell and the second mounting shell.

[0009] Furthermore, holes are provided on the outer surfaces of the first mounting shell and the second mounting shell, and bolt and nut assemblies are installed inside the holes.

[0010] Furthermore, a second rotating shaft is rotatably embedded and connected to the front surface of the water tank. One end of the first rotating shaft is fixedly connected to a first gear, one end of the second rotating shaft is fixedly connected to a second gear, and the first gear and the second gear are meshed and connected.

[0011] Furthermore, stirring blades are fixedly connected to the outer surfaces of the first rotating shaft and the second rotating shaft. A servo motor is fixedly connected to the rear surface of the water tank. The output end of the servo motor is fixedly connected to the first rotating shaft, and a fan blade is fixedly connected to the outer surface of the second rotating shaft.

[0012] Furthermore, a water pump is fixedly connected to the end of the water inlet pipe. A tank cover is fixedly connected to the upper surface of the water tank, and a water injection port is provided on the upper surface of the tank cover.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] The connection cover cooperates with the air duct to extract air, enabling the outside air to enter the water tank from the air holes on the front surface of the water tank and exit from the air holes on the rear surface of the water tank at the position of the fan housing. This allows the air to cool the water on the shunt plate and the heat dissipation surface of the semiconductor refrigeration sheet through air cooling, relieving the working pressure of the semiconductor refrigeration sheet. Moreover, the water in the water outlet pipe flows down along the shunt plate and enters the interior of the water tank through the gap between the shunt plate and the water tank, extending the contact time between the water and the outside air through the shunt plate and optimizing the pre-cooling effect.

[0015] Start the servo motor. The output end of the servo motor drives the first rotating shaft to rotate. When the first rotating shaft rotates, it drives the second rotating shaft to rotate in the opposite direction through the cooperation of the first gear and the second gear, causing the stirring blades on the first rotating shaft and the stirring blades on the second rotating shaft to rotate in opposite directions, making the water in the water tank turbulent, thereby making the temperature distribution of the water more uniform, facilitating the refrigeration of the semiconductor refrigeration sheet, and improving the cooling efficiency of this structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is the overall schematic diagram of the present utility model;

[0017] Figure 2 is the structural schematic diagram of another angle of the present utility model;

[0018] Figure 3 It is a schematic diagram of the split structure of the first installation shell of the present utility model;

[0019] Figure 4 It is a schematic sectional structure diagram of the water tank of the present utility model.

[0020] In the figure: 1, the main body of the homogenizer; 2, the water tank; 201, the connecting cover; 202, the air duct; 203, the fan housing; 204, the air hole; 3, the first installation shell; 301, the spiral blade; 302, the sealing ring; 303, the gasket; 304, the second installation shell; 305, the water outlet pipe; 306, the water inlet pipe; 4, the first rotating shaft; 401, the second rotating shaft; 402, the first gear; 403, the second gear; 404, the stirring blade; 405, the heat-conducting copper plate; 406, the fan blade; 5, the servo motor; 6, the water pump; 7, the tank cover; 701, the flow dividing plate; 8, the semiconductor refrigeration sheet. Specific embodiments

[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0022] Please refer to Figures 1 to 4 , in the embodiment of the present utility model, a cooling structure of a homogenizer includes a first installation shell 3 and a second installation shell 304 installed on the outer wall of the diamond interaction cavity and the outer wall of the material cooling cavity of the main body 1 of the homogenizer, and a water tank 2 placed on one side of the main body 1 of the homogenizer. The side surface of the water tank 2 is embedded and connected with a water outlet pipe 305, and the water outlet pipe 305 is fixedly connected with the second installation shell 304. The side surface of the water tank 2 is embedded and connected with a water inlet pipe 306, and the water inlet pipe 306 is fixedly connected with the second installation shell 304. The side surface of the second installation shell 304 is snap-connected with the first installation shell 3. A heat-conducting copper plate 405 is fixedly connected inside the water tank 2. A semiconductor refrigeration sheet 8 is fixedly connected to the lower surface of the heat-conducting copper plate 405. A flow dividing plate 701 is fixedly connected to the inner wall of the water tank 2. A first rotating shaft 4 is embedded and connected to the front surface of the water tank 2. The end of the water inlet pipe 306 is fixedly connected with a water pump 6. A tank cover 7 is fixedly connected to the upper surface of the water tank 2, and a water injection port is opened on the upper surface of the tank cover 7.

[0023] Specifically, when in use, the water inside the water tank 2 is cooled by the thermoelectric cooler 8. In cooperation with the water pump 6, the cold water enters the first mounting shell 3 and the second mounting shell 304 to cool the outer wall of the diamond interaction cavity and the outer wall of the material cooling cavity. Subsequently, the water enters the water tank 2 to complete the cycle. Before that, the water flows through the flow dividing plate 701 and is pre-cooled on the flow dividing plate 701 to share the cooling pressure of the circulating water and further improve the cooling effect of the cooling structure.

[0024] Embodiment 1

[0025] As Figures 1 - 3 shown, air holes 204 are formed on both the front surface and the rear surface of the water tank 2. A connection cover 201 is fixedly connected to the position of the rear surface of the water tank 2 near the air hole 204. An air duct 202 is fixedly connected to the outer surface of the connection cover 201. A fan housing 203 is fixedly connected to the rear surface of the water tank 2, and the air duct 202 communicates with the fan housing 203.

[0026] In this embodiment, the connection cover 201 cooperates with the air duct 202 to extract air, so that the outside air enters the air hole 204 on the rear surface of the water tank 2 from the air hole 204 on the front surface of the water tank 2 and is discharged from the position of the fan housing 203.

[0027] As Figures 1 - 3 shown, spiral blades 301 are fixedly connected to the inner walls of both the first mounting shell 3 and the second mounting shell 304. Sealing rings 302 are embedded at the positions near the upper end and the lower end of the adjacent surfaces of the first mounting shell 3 and the spiral blades 301. Sealing gaskets 303 are embedded at the adjacent surfaces of the first mounting shell 3 and the second mounting shell 304. The outer surfaces of the first mounting shell 3 and the second mounting shell 304 are provided with holes, and bolt and nut assemblies are installed inside the holes.

[0028] In this embodiment, the water in the water tank 2 enters the first mounting shell 3 and the second mounting shell 304 in cooperation with the water inlet pipe 306 and the water pump 6, and the spiral blades 301 make the water rotate along the spiral direction, so that the water evenly absorbs the heat generated by the outer wall of the diamond interaction cavity and the outer wall of the material cooling cavity.

[0029] Embodiment 2

[0030] On the basis of Embodiment 1, in order to make up for the problem that it is inconvenient to pre-cool the cooling water in Embodiment 1.

[0031] As Figures 1 - 4As shown in the figure, the front surface of the water tank 2 is embedded and rotatably connected with a second rotating shaft 401. One end of the first rotating shaft 4 is fixedly connected with a first gear 402. One end of the second rotating shaft 401 is fixedly connected with a second gear 403. The first gear 402 and the second gear 403 are meshed and connected. The rear surface of the water tank 2 is fixedly connected with a servo motor 5. The output end of the servo motor 5 is fixedly connected with the first rotating shaft 4. Stirring blades 404 are fixedly connected to the outer surfaces of the first rotating shaft 4 and the second rotating shaft 401.

[0032] In this embodiment, when the servo motor 5 is started, the output end of the servo motor 5 drives the first rotating shaft 4 to rotate. When the first rotating shaft 4 rotates, the second rotating shaft 401 is driven to rotate in the opposite direction through the cooperation of the first gear 402 and the second gear 403, so that the stirring blades 404 on the first rotating shaft 4 and the stirring blades 404 on the second rotating shaft 401 rotate in opposite directions, causing the water in the water tank 2 to be turbulent, thereby making the temperature distribution of the water more uniform, facilitating the refrigeration of the semiconductor refrigeration sheet 8, and improving the cooling efficiency of this structure.

[0033] As Figures 1 - 4 shown, a fan blade 406 is fixedly connected to the outer surface of the second rotating shaft 401.

[0034] In this embodiment, the second rotating shaft 401 drives the fan blade 406 to rotate. The fan blade 406 cooperates with the fan housing 203 to pump air from the connecting cover 201, so that the air cools the water on the flow dividing plate 701 and the heat dissipation surface of the semiconductor refrigeration sheet 8, relieving the working pressure of the semiconductor refrigeration sheet 8. Moreover, the water in the water outlet pipe 305 flows down along the flow dividing plate 701 and flows into the interior of the water tank 2 through the gap between the flow dividing plate 701 and the water tank 2, prolonging the contact time between the water and the outside air through the flow dividing plate 701 and optimizing the pre-cooling effect.

[0035] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference numerals in the claims should not be regarded as limiting the claims involved.

[0036] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A homogenizer cooling structure, comprising a first mounting shell (3) and a second mounting shell (304) installed on the outer wall of the diamond interaction cavity and the outer wall of the material cooling cavity of the homogenizer main body (1), and a water tank (2) placed on one side of the homogenizer main body (1), characterized in that, A water outlet pipe (305) is embedded and connected to the side surface of the water tank (2), and the water outlet pipe (305) is fixedly connected to the second mounting shell (304). A water inlet pipe (306) is embedded and connected to the side surface of the water tank (2), and the water inlet pipe (306) is fixedly connected to the second mounting shell (304). A first mounting shell (3) is snap-connected to the side surface of the second mounting shell (304). A heat-conducting copper plate (405) is fixedly connected inside the water tank (2), and a semiconductor refrigeration sheet (8) is fixedly connected to the lower surface of the heat-conducting copper plate (405). A flow dividing plate (701) is fixedly connected to the inner wall of the water tank (2), and a first rotating shaft (4) is embedded and connected to the front surface of the water tank (2).

2. The cooling structure of a homogenizer according to claim 1, characterized in that, Air holes (204) are provided on both the front surface and the rear surface of the water tank (2). A connecting cover (201) is fixedly connected to the position of the rear surface of the water tank (2) near the air holes (204). An air guide pipe (202) is fixedly connected to the outer surface of the connecting cover (201). A fan housing (203) is fixedly connected to the rear surface of the water tank (2), and the air guide pipe (202) is in communication with the fan housing (203).

3. The cooling structure of a homogenizer according to claim 1, characterized in that, Spiral blades (301) are fixedly connected to the inner walls of both the first mounting shell (3) and the second mounting shell (304). Sealing rings (302) are embedded and connected to the positions near the upper end and the lower end of the adjacent surfaces of the first mounting shell (3) and the spiral blades (301). Sealing gaskets (303) are embedded and connected to the adjacent surfaces of the first mounting shell (3) and the second mounting shell (304).

4. A homogenizer cooling structure according to claim 1, characterized in that, Holes are provided on the outer surfaces of the first mounting shell (3) and the second mounting shell (304), and bolt and nut assemblies are installed inside the holes.

5. A homogenizer cooling structure according to claim 1, characterized in that, A second rotating shaft (401) is embedded and rotatably connected to the front surface of the water tank (2). One end of the first rotating shaft (4) is fixedly connected to a first gear (402), and one end of the second rotating shaft (401) is fixedly connected to a second gear (403). The first gear (402) and the second gear (403) are meshed and connected.

6. The cooling structure of a homogenizer according to claim 5, characterized in that, Stirring blades (404) are fixedly connected to the outer surfaces of both the first rotating shaft (4) and the second rotating shaft (401). A servo motor (5) is fixedly connected to the rear surface of the water tank (2), the output end of the servo motor (5) is fixedly connected to the first rotating shaft (4), and a fan blade (406) is fixedly connected to the outer surface of the second rotating shaft (401).

7. The cooling structure of a homogenizer according to claim 1, characterized in that, A water pump (6) is fixedly connected to the end of the water inlet pipe (306). A tank cover (7) is fixedly connected to the upper surface of the water tank (2), and a water injection port is provided on the upper surface of the tank cover (7).

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