Slide glass grabbing and carrying structure
Through the combined design of the clamping mechanism and the guiding mechanism, the mechanical collision and placement accuracy problems during the slide grabbing and handling process are solved, and the stable clamping, buffering and high-precision handling of the slide are achieved, adapting to the rapid switching of slides of different specifications.
Patent Information
- Application Number
- CN202421831841.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-31
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-07-31
AI Technical Summary
The existing slide grab and transport structures are mechanically impacted due to irregular operation during the pick-up and placement process, which cannot effectively buffer and stop the machine quickly, and it is difficult to adapt to the size changes of slides of different specifications, resulting in low shaking offset and placement accuracy.
The combination of clamping mechanism and guide mechanism is adopted. The clamping mechanism realizes stable clamping and buffering of the slide through clamping cylinders and buffering springs. The guide mechanism realizes high-precision sliding and fast switching through screws and telescopic cylinders, and combines with optical fiber sensors to achieve automatic emergency stop.
It effectively avoids mechanical collisions during the pick-up and placement process, improves the placement accuracy and stability of the slide, can adapt to different specifications of slides, prevent shaking and offset, and achieve efficient and accurate handling operations.
Smart Images

Figure CN223133397U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer gripping and handling, and particularly relates to a wafer gripping and handling structure. Background Art
[0002] The annular wafer is a metal sheet in the shape of a ring and is used as a component for supporting, fixing or transmitting loads. During the production process, these wafers often need to be moved from one place to another. In order to improve production efficiency and reduce labor costs, an automated handling device is used for gripping and handling. This solution specifically relates to a wafer gripping and handling structure;
[0003] When the existing wafer gripping and handling structure is in use, due to mechanical collisions caused by non-standard operations during the picking and placing of wafers, the wafers are damaged. It is not convenient to buffer them and quickly give an emergency stop command when a collision occurs. Wafers of different specifications have different sizes, and they are prone to shaking and deviation during gripping and handling, which is not convenient for quick adjustment and switching, and the accuracy of wafer placement is low. Summary of the Utility Model
[0004] The main purpose of the utility model is to provide a wafer gripping and handling structure, which can effectively solve the technical problems in the background art of "mechanical collisions caused by non-standard operations, resulting in wafer damage, it is not convenient to buffer them and quickly give an emergency stop command when a collision occurs, wafers of different specifications have different sizes, and they are prone to shaking and deviation during gripping and handling, which is not convenient for quick adjustment and switching".
[0005] To achieve the above purpose, the technical solution adopted by the utility model is as follows:
[0006] A wafer gripping and handling structure includes a support base. A sliding module is installed on the top of the support base. A first motor is installed at the front end of the sliding module. A clamping mechanism and a guiding mechanism are installed on the top of the sliding module. The clamping mechanism includes two jaw fixing parts. A clamping cylinder is installed at the bottom of the jaw fixing part. An inductor is installed at the front end of the jaw fixing part. An induction piece is installed at the top front of the clamping cylinder. Two groups of clamping pieces are installed at the bottom of the clamping cylinder. Two bearings are installed at the top front of the jaw fixing part. A buffer spring is installed at the top of the bearing.
[0007] As a further solution of the utility model, two fixed shafts are installed between the jaw fixing part and the clamping cylinder, and the fixed shafts pass through the jaw fixing part and are connected to the bearings.
[0008] As a further solution of the utility model, the number of each group of clamping pieces is two, and the two clamping pieces in each group are symmetrically arranged.
[0009] As a further solution of the present utility model, a fixed box is installed at the front end of the top of the jaw fixing member, and the top end of the buffer spring is fixed inside the fixed box at the top of the jaw fixing member.
[0010] As a further solution of the present utility model, the guiding mechanism includes a guide rail and two telescopic cylinders. The guide rail is installed at the top of the sliding module. A second motor is installed at the bottom end inside the guide rail. A lead screw is installed at the top end of the output shaft of the second motor and is located inside the guide rail. A jaw fixing block is installed on the outside of the top of the lead screw and is fixed to the top of the jaw fixing member. An optical fiber sensor is installed on the outside of the bottom support frame of the jaw fixing block. The two telescopic cylinders are used to be installed at the bottom end of the bottom support frame of the jaw fixing block, and a set of guide blocks are installed at the ends of the telescopic rods of the two telescopic cylinders.
[0011] As a further solution of the present utility model, the lead screw is fixedly connected to the output shaft of the second motor, and the slide seat on one side of the jaw fixing block is sleeved around the lead screw and is arranged in a threaded connection.
[0012] As a further solution of the present utility model, the guide block is fixedly connected to the end of the telescopic rod of the telescopic cylinder, and the guide rail is slid back and forth through the sliding module.
[0013] The beneficial effects of the present utility model are as follows:
[0014] By setting the clamping mechanism, the clamping cylinder drives the clamping piece to clamp the carrier sheet body, realizing the grasping of the carrier sheet. Through the connection of the fixed shaft and the expansion and contraction of the buffer spring, when the clamping cylinder moves up and down to the sensing piece to trigger the sensor, it can solve the mechanical collision problem that may be caused by non-standard operations during the loading and unloading of the carrier sheet, and can play a buffering role when the carrier sheet touches the collision. The sensor quickly makes a feedback and issues a stop instruction to prevent the parts from being damaged due to the collision;
[0015] By setting the guiding mechanism, the lead screw drives the clamping cylinder and the clamping piece to lift, and the sliding module drives the loaded carrier sheet to slide. The high-precision sliding long rail realizes long-distance and high-precision handling. By driving the guide block to slide through the telescopic cylinder, it can cope with carrier sheets of different sizes and specifications and can be quickly switched. When placing the carrier sheet, it improves the placement accuracy of the carrier sheet, making it not shake or shift, and can make an automatic emergency stop before the collision occurs to avoid economic losses. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is the overall front view of a carrier sheet grasping and handling structure of the present utility model;
[0017] Figure 2 It is the overall structural schematic diagram of a carrier sheet grasping and handling structure of the present utility model;
[0018] Figure 3Schematic diagram of the clamping mechanism in a wafer gripping and handling structure of the present utility model;
[0019] Figure 4 Schematic diagram of the top of the jaw fixing part in a wafer gripping and handling structure of the present utility model;
[0020] Figure 5 Schematic diagram of the guiding mechanism in a wafer gripping and handling structure of the present utility model;
[0021] Figure 6 Overall front view of the guiding mechanism in a wafer gripping and handling structure of the present utility model.
[0022] In the figure: 1, support base; 2, first motor; 3, sliding module; 5, clamping mechanism; 6, guiding mechanism; 7, wafer body; 8, jaw fixing part; 9, clamping cylinder; 10, sensor; 11, sensing piece; 12, clamping piece; 13, fixed shaft; 14, bearing; 15, buffer spring; 16, guide rail; 17, second motor; 18, lead screw; 19, jaw fixing block; 20, fiber optic sensor; 21, telescopic cylinder; 22, guiding block. Specific implementation mode
[0023] In order to make the technical means, creative features, achieved purposes and effects of the present utility model easy to understand, the present utility model will be further described below in conjunction with specific implementation modes.
[0024] As Figures 1-6 shown, a wafer gripping and handling structure includes a support base 1. A sliding module 3 is installed on the top of the support base 1. A first motor 2 is installed at the front end of the sliding module 3. A clamping mechanism 5 and a guiding mechanism 6 are installed on the top of the sliding module 3. The clamping mechanism 5 includes two jaw fixing parts 8. A clamping cylinder 9 is installed at the bottom of the jaw fixing part 8. A sensor 10 is installed at the front end of the jaw fixing part 8. A sensing piece 11 is installed at the front part near the top of the clamping cylinder 9. Two groups of clamping pieces 12 are installed at the bottom of the clamping cylinder 9. Two bearings 14 are installed at the front part near the top of the jaw fixing part 8. A buffer spring 15 is installed on the top of the bearing 14.
[0025] In this embodiment, two fixed shafts 13 are installed between the jaw fixing part 8 and the clamping cylinder 9. The fixed shaft 13 passes through the jaw fixing part 8 and is connected to the bearing 14. The fixed shaft 13 is connected to the bearing 14, and the bearing 14 plays a guiding role.
[0026] In this embodiment, the number of each group of clamping pieces 12 is two. The two clamping pieces 12 in each group are symmetrically arranged. The two clamping pieces 12 in the two groups are driven by the clamping cylinder 9 to close and clamp the wafer body 7. When the wafer body 7 is placed abnormally and encounters resistance, the sensing piece 11 moves upward to trigger the signal of the sensor 10.
[0027] In this embodiment, a fixed box is installed at the front end of the top of the jaw fixing member 8. The top end of the buffer spring 15 is fixed inside the fixed box at the top of the jaw fixing member 8. When the clamping cylinder 9 moves upward following the resistance, the buffer spring 15 plays a buffering role.
[0028] In this embodiment, the guiding mechanism 6 includes a guide rail 16 and two telescopic cylinders 21. The guide rail 16 is installed at the top of the sliding module 3. A second motor 17 is installed at the bottom end inside the guide rail 16. A lead screw 18 is installed at the top end of the output shaft of the second motor 17 and is located inside the guide rail 16. A jaw fixing block 19 is installed outside the top of the lead screw 18 and is fixed to the top of the jaw fixing member 8. An optical fiber sensor 20 is installed outside the bottom support frame of the jaw fixing block 19. The two telescopic cylinders 21 are used to be installed at the bottom end of the bottom support frame of the jaw fixing block 19. A set of guide blocks 22 are installed at the ends of the telescopic rods of the two telescopic cylinders 21. The telescopic cylinders 21 quickly adjust the positions of the guide blocks 22. The second motor 17 drives the lead screw 18 to rotate to move the jaw fixing block 19 up and down, so as to adjust the clamping and picking and placing of the carrier sheet body 7 of different specifications.
[0029] In this embodiment, the lead screw 18 is fixedly connected to the output shaft of the second motor 17. The slide seat on one side of the jaw fixing block 19 is sleeved around the lead screw 18 and is arranged in a threaded connection. The lead screw 18 drives the jaw fixing block 19 and the clamping mechanism 5 to move up and down, which is convenient for the picking and placing of the carrier sheet body 7.
[0030] In this embodiment, the guide block 22 is fixedly connected to the end of the telescopic rod of the telescopic cylinder 21. The guide rail 16 is slidably arranged back and forth through the sliding module 3. The telescopic cylinder 21 is used to adjust the position of the guide block 22 to quickly switch to the carrier sheet body 7 of the required specification.
[0031] It should be noted that the present utility model is a carrier sheet grasping and transporting structure. When in use, first, the first motor 2 drives the sliding module 3 to move to a specified position. The second motor 17 drives the lead screw 18 to rotate and drives the slide seat of the jaw fixing block 19 to move up and down under the action of the thread, so that the jaw fixing member 8 and the clamping piece 12 in the clamping mechanism 5 follow up and down to the desired height. The clamping cylinder 9 drives the clamping piece 12 to clamp the carrier sheet body 7. After clamping the carrier sheet body 7, the lead screw 18 drives the clamped carrier sheet body 7 to rise. The corresponding guide block 22 is driven by the telescopic cylinder 21 to slide to guide the carrier sheet body 7 so that it does not shake and deviate. After rising in place, the optical fiber sensor 20 is triggered to confirm the picking of the sheet. After moving to the placement position through the sliding module 3, the clamping piece 12 moves downward, and the guide block 22 guides the carrier sheet body 7 to be accurately and stably placed at a specific position, and the jaws are retracted to complete the entire process of picking, transporting, and placing the material.
[0032] The foregoing has shown and described the basic principles, main features, and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed. The scope of protection claimed for the present utility model is defined by the appended claims and their equivalents.
Claims
1. A slide grasping and transporting structure, including a support base (1), a sliding module (3) is installed on the top of the support base (1), a first motor (2) is installed at the front end of the sliding module (3), a clamping mechanism (5) and a guiding mechanism (6) are installed on the top of the sliding module (3), and it is characterized in that: The clamping mechanism (5) includes two jaw fixing members (8). A clamping cylinder (9) is installed at the bottom of the jaw fixing member (8). An inductor (10) is installed at the front end of the jaw fixing member (8). An induction piece (11) is installed at the top near the front of the clamping cylinder (9). Two sets of clamping pieces (12) are installed at the bottom of the clamping cylinder (9). Two bearings (14) are installed at the top near the front end of the jaw fixing member (8). A buffer spring (15) is installed at the top of the bearing (14).
2. The wafer gripping and handling structure according to claim 1, characterized in that: Two fixed shafts (13) are installed between the jaw fixing member (8) and the clamping cylinder (9). The fixed shaft (13) passes through the jaw fixing member (8) and is connected to the bearing (14).
3. The wafer gripping and handling structure according to claim 1, characterized in that: The number of each set of the clamping pieces (12) is two, and the two clamping pieces (12) in each set are symmetrically arranged.
4. A wafer gripping and handling structure according to claim 1, characterized in that: A fixed box is installed at the top near the front end of the jaw fixing member (8). The top end of the buffer spring (15) is fixed inside the fixed box at the top of the jaw fixing member (8).
5. A wafer gripping and handling structure according to claim 1, characterized in that: The guiding mechanism (6) includes a guide rail (16) and two telescopic cylinders (21). The guide rail (16) is installed at the top of the sliding module (3). A second motor (17) is installed at the bottom inside the guide rail (16). A lead screw (18) is installed at the top of the output shaft of the second motor (17) and is located inside the guide rail (16). A jaw fixing block (19) is installed on the outside of the bottom support frame of the lead screw (18) and is fixed to the top of the jaw fixing member (8). An optical fiber sensor (20) is installed on the outside of the bottom support frame of the jaw fixing block (19). The two telescopic cylinders (21) are used to be installed at the bottom end of the bottom support frame of the jaw fixing block (19). A set of guiding blocks (22) are installed at the ends of the telescopic rods of the two telescopic cylinders (21).
6. The carrier sheet grasping and transporting structure according to claim 5, characterized in that: The lead screw (18) is fixedly connected to the output shaft of the second motor (17). The slide seat on one side of the jaw fixing block (19) is sleeved around the lead screw (18) and is arranged in a threaded connection.
7. A wafer gripping and handling structure according to claim 5, characterized in that: The guiding block (22) is fixedly connected to the end of the telescopic rod of the telescopic cylinder (21). The guide rail (16) is slidably arranged back and forth through the sliding module (3).