Evaporation device for wafer coating

Abstract

The utility model provides an evaporation device for wafer coating, and belongs to the technical field of machinery. The problem that the yield is low in the prior art is solved. The evaporation device for wafer coating comprises a rack and a mechanical arm, and further comprises a storage unit, a plurality of operation units and a correction part, the mechanical arm is connected to the center of the rack, the storage unit and the operation units are circumferentially and evenly distributed on the rack with the mechanical arm as the reference, and the correction part is arranged on the storage unit and the operation units. And the correction pieces and the operation units are arranged in a one-to-one correspondence manner. The evaporation device for wafer coating can improve the yield of products.

Description

Technical Field

[0001] The utility model belongs to the technical field of machinery and relates to an evaporation device for wafer coating. Background Art

[0002] The current process flow of OLED evaporation equipment is to place the wafers into a storage unit (which can store 15 wafers), and then the robot will transport the wafers to the "rough alignment chamber" for rough alignment. After the rough alignment is completed, the robot will then send the wafers into multiple process chambers in turn for coating process.

[0003] However, the prior art has the following defects:

[0004] 1. If the rough alignment accuracy is off or the robot movement accuracy is off, when the wafer is placed in the process chamber, the position where it lands on the wafer holder will be offset. When the offset is too large, one side of the wafer will fall on the abnormal positioning part of the wafer holder, causing the wafer to be uneven. During the operation, when the cooling system backplane is pressed down, the uneven wafer will be crushed, and there is a risk of fragmentation.

[0005] 2. After the wafer is evaporated in one process chamber, the wafer will be directly transferred to another adjacent process chamber by the robot. And so on, the wafer will move in multiple process chambers in sequence. This will test the movement accuracy of the robot. The further back the chamber is, the greater the risk of wafer deviation and fragmentation.

[0006] It can be seen that the existing wafer evaporation equipment has relatively high requirements for transmission accuracy. Once a position deviation occurs in one of the processes, the workpiece will most likely become an unqualified product and the yield rate will be relatively low. Summary of the invention

[0007] The purpose of the utility model is to provide a evaporation device for wafer coating with high yield and compact structure in view of the above problems existing in the prior art.

[0008] The purpose of the utility model can be achieved through the following technical solutions:

[0009] A evaporation device for wafer coating, comprising a frame and a robot, characterized in that it also comprises a storage unit, an operating unit and a correction piece, the robot is connected at the center of the frame, the number of the storage unit is one, the number of the operating units is several, one storage unit and the several operating units are evenly distributed on the frame in the circumferential direction with the robot as a reference, and the correction piece is arranged in a one-to-one correspondence with the operating unit.

[0010] In the above evaporation coating device for wafer coating, the correction member includes a driving member and a vacuum chuck. The above vacuum chuck is connected to the lower part of the driving member, and the driving member can drive the vacuum chuck to move left and right, back and forth, and up and down.

[0011] In the above evaporation coating device for wafer coating, the operation unit includes a support member and a cooling backplane located above the support member. The above cooling backplane can move up and down relative to the support member.

[0012] In the above evaporation coating device for wafer coating, the support member is a plurality of support blocks fixedly connected to the frame and circumferentially arranged evenly. The outer edge of the wafer can be lapped at the inner ends of each support block.

[0013] In the above evaporation coating device for wafer coating, each inner end of each support block has a recessed receiving portion for supporting the wafer.

[0014] In the above evaporation coating device for wafer coating, the above driving member is fixedly connected to the cooling backplane, and the above vacuum chuck is located directly above the support member.

[0015] In the above evaporation coating device for wafer coating, a spare unit is also fixedly connected to the edge of the frame. The above spare unit is located between the storage unit and the operation unit at the end.

[0016] In the above evaporation coating device for wafer coating, the storage unit is a storage cavity fixedly connected to the edge of the frame.

[0017] In the above evaporation coating device for wafer coating, taking the manipulator as a reference, the distance between two adjacent operation units among a plurality of operation units is the same.

[0018] In the above evaporation coating device for wafer coating, taking the manipulator as a reference, the arc distance between the storage unit and the adjacent operation unit is A, and the distance between two adjacent operation units taking the manipulator as a reference is B. The above A is equal to B.

[0019] Compared with the prior art, in the evaporation coating device for wafer coating of the present invention, since each operation unit has a corresponding correction member one by one, after the manipulator loads the wafers into each operation unit in sequence, the corresponding correction member in each operation unit corrects the wafers, and finally ensures that the wafers are in a set proper position during the evaporation coating operation process, effectively improving the yield of the wafers.

[0020] Meanwhile, taking the manipulator as a reference, the storage units and working units that are circumferentially and evenly distributed on the frame effectively improve the structural compactness of the entire device. Moreover, since the distances between the storage unit and the working units and between adjacent two working units are the same, the manipulator can stably place the wafers at each working unit after moving with the same stroke displacement, further improving its stability and structural compactness, and having high practical value. Brief Description of the Drawings

[0021] Figure 1 is a top view structural schematic diagram of an evaporation coating device for wafer coating.

[0022] Figure 2 is a structural schematic diagram of a calibration part in an evaporation coating device for wafer coating.

[0023] In the figures, 1, frame; 2, manipulator; 3, storage unit; 4, working unit; 4a, support block; 4a1, receiving part; 4b, cooling backplane; 5, calibration part; 5a, driving part; 5b, vacuum chuck; 6, spare unit. Detailed Embodiments

[0024] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0025] It should be noted that when a component is referred to as being "installed on" another component, it can be directly installed on the other component or there may also be an intermediate component. When a component is considered to be "set on" another component, it can be directly set on the other component or there may be an intermediate component at the same time. When a component is considered to be "fixed to" another component, it can be directly fixed to the other component or there may be an intermediate component at the same time.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The term "or / and" used herein includes any and all combinations of one or more of the related listed items.

[0027] Such as Figure 1 and Figure 2As shown in the figure, the evaporation coating device for wafers includes a frame 1 and a manipulator 2, and also includes a storage unit 3, an operation unit 4 and a correction member 5. The above-mentioned manipulator 2 is connected to the center of the frame 1. The number of the above-mentioned storage units 3 is one, and the number of the operation units 4 is several. One storage unit 3 and several operation units 4 are circumferentially distributed on the frame 1 with the manipulator 2 as the reference. The above-mentioned correction members 5 are arranged in one-to-one correspondence with the operation units 4.

[0028] The correction member 5 includes a driving member 5a and a vacuum chuck 5b. The above-mentioned vacuum chuck 5b is connected to the lower part of the driving member 5a, and the driving member 5a can drive the vacuum chuck 5b to move left and right, back and forth, and up and down.

[0029] The driving member 5a is a driving mechanism that can drive the vacuum chuck to move in the X, Y, and Z directions. Since it is a prior art, the specific technical solution of the driving member 5a will not be described in detail in the specification. That is to say, the driving member 5a is similar to a robotic arm that can translate left and right, back and forth, and up and down.

[0030] The operation unit 4 includes a support member and a cooling backplane 4b located at the upper part of the support member. The above-mentioned cooling backplane 4b can move up and down relative to the support member.

[0031] The support member is several support blocks 4a fixedly connected to the frame 1 and circumferentially distributed. The outer edge of the wafer can be lapped at the inner end of each support block 4a.

[0032] At the inner end of each support block 4a, there is a recessed receiving portion 4a1 for supporting the wafer.

[0033] The setting of the receiving portion 4a1 has an appropriate correction effect on the wafer, avoiding excessive offset of the wafer.

[0034] The above-mentioned driving member 5a is fixedly connected to the cooling backplane 4b, and the above-mentioned vacuum chuck 5b is located directly above the support member.

[0035] A spare unit 6 is also fixedly connected to the edge of the frame 1. The above-mentioned spare unit 6 is located between the storage unit 3 and the operation unit 4 at the end.

[0036] The spare unit 6 is reserved for backup. Once the operation unit 4 or the storage unit 3 is damaged, the spare unit 6 can be used as the operation unit 4 or the storage unit 3.

[0037] The storage unit 3 is a storage cavity fixedly connected to the edge of the frame 1.

[0038] Taking the manipulator 2 as the reference, the distance between two adjacent operation units 4 among several operation units 4 is the same.

[0039] Taking the manipulator 2 as a reference, the arc distance between the above storage unit 3 and the adjacent operation unit 4 is A, and the distance between two adjacent operation units 4 with the manipulator 2 as a reference is B. The above A is equal to B.

[0040] The wafer to be processed is placed at the storage unit. After starting the operation, the manipulator clamps the wafer at the storage unit and sends it to the operation unit adjacent to the storage unit. The wafer is subjected to corresponding processing at this operation unit.

[0041] After the processing is completed, the manipulator takes out the wafer at the above operation unit, and the taken-out wafer is placed at another operation unit adjacent to the next one, and so on. The wafer is subjected to corresponding processing at each operation unit.

[0042] During the above processing operation, since there is a calibration part at each operation unit, this can ensure that the wafer is stably processed in the operation unit at a suitable set position.

[0043] It can be seen that even if there are minor errors in the previous operation unit, after the wafer enters the next adjacent operation unit, under the action of the corresponding calibration part, the position of the wafer can be adjusted in time to ensure that the wafer is stably processed in this device.

[0044] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0045] Those of ordinary skill in the art of this technology should recognize that the above embodiments are only used to illustrate the present invention, rather than to limit the present invention. As long as it is within the scope of the spirit of the present invention, appropriate changes and variations made to the above embodiments fall within the scope of protection required by the present invention.

Claims

1. An evaporation coating device for wafer coating, comprising a frame (1) and a manipulator (2), characterized in that, It further includes a storage unit (3), an operation unit (4) and a correction member (5). The above-mentioned manipulator (2) is connected to the center of the frame (1). The number of the above-mentioned storage units (3) is one, and the number of the operation units (4) is several. One storage unit (3) and several operation units (4) are circumferentially and evenly distributed on the frame (1) with the manipulator (2) as the reference. The above-mentioned correction members (5) are arranged in one-to-one correspondence with the operation units (4).

2. The evaporation coating device for wafer coating according to claim 1, wherein, The above-mentioned correction member (5) includes a driving member (5a) and a vacuum chuck (5b). The above-mentioned vacuum chuck (5b) is connected to the lower part of the driving member (5a), and the driving member (5a) can drive the vacuum chuck (5b) to move left and right, back and forth, and up and down.

3. The evaporation coating device for wafer coating according to claim 2, wherein, The above-mentioned operation unit (4) includes a support member and a cooling backplane (4b) located at the upper part of the support member. The above-mentioned cooling backplane (4b) can move up and down relative to the support member.

4. The evaporation coating device for wafer coating according to claim 3, characterized in that, The above-mentioned support member is several support blocks (4a) fixedly connected to the frame (1) and circumferentially and evenly distributed. The outer edge of the wafer can be lapped at the inner ends of each support block (4a).

5. The evaporation coating device for wafer coating according to claim 4, characterized in that, At the inner end of each support block (4a), there is a recessed receiving portion (4a1) for supporting the wafer.

6. The evaporation coating device for wafer coating according to claim 5, characterized in that, The above-mentioned driving member (5a) is fixedly connected to the cooling backplane (4b), and the above-mentioned vacuum chuck (5b) is located directly above the support member.

7. The evaporation coating device for wafer coating according to claim 6, wherein, A spare unit (6) is also fixedly connected to the edge of the above-mentioned frame (1). The above-mentioned spare unit (6) is located between the storage unit (3) and the operation unit (4) at the end.

8. The evaporation coating device for wafer coating according to claim 7, characterized in that, The above-mentioned storage unit is a storage cavity fixedly connected to the edge of the frame.

9. The evaporation coating device for wafer coating according to claim 8, characterized in that, Taking the manipulator as the reference, the distance between two adjacent operation units among several operation units is the same.

10. The evaporation coating device for wafer coating according to claim 9, characterized in that, Taking the manipulator as the reference, the arc distance between the above-mentioned storage unit and the adjacent operation unit is A, and the distance between two adjacent operation units is B. The above-mentioned A is equal to B.

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