Ultrathin mobile phone camera module

Abstract

The utility model discloses an ultrathin mobile phone camera module, which comprises a camera, a lamp, an optical chip and a substrate, a camera mounting hole, a lamp mounting hole and a light hole arranged on the periphery of the lamp mounting hole are arranged on the substrate, the camera is arranged in the camera mounting hole, the lamp is arranged in the lamp mounting hole, and the optical chip is arranged in the lamp mounting hole. The optical chip is installed below the substrate through the first welding balls in a welding mode, a circuit on the optical chip is connected with a circuit on the substrate through the first welding balls, and a light sensing area of the optical chip is located at an orifice of a chip light-transmitting hole below the substrate. And transparent bodies are filled in the light holes. The mobile phone camera module has the advantages that the optical chip is reversely mounted, wire lapping and packaging on the surface of the chip are avoided, and the total thickness of the packaged optical chip is reduced, so that the thickness of the mobile phone camera module is reduced, and a camera area at the rear part of a mobile phone is prevented from having an over-thick bulge; it is guaranteed that the transparent body is regular and free of warping, the surface is smooth and traceless, incident light is uniform, scattered refraction is avoided, and the intensity of mobile phone shooting environment light can be accurately sensed.

Description

Technical Field

[0001] The utility model relates to an ultra-thin mobile phone camera module, belonging to the technical field of mobile phone chip applications. Background Art

[0002] Multiple optical chips are used on mobile phones to sense the intensity of ambient light. When the ambient light is sufficient, the mobile phone flash or light can be not started for mobile phone shooting. When it senses that the ambient light is weak, the flash or light will be started for mobile phone shooting. The optical chips are often arranged near the mobile phone flash (flashlight) to form a mobile phone camera module. There are also cases where they are arranged at other positions according to space requirements. Arranging the optical chips near the flash can save space at other positions, which is a relatively ideal setting method.

[0003] Conventional optical chips are soldered to the surface of the substrate through solder balls. Electric wires are soldered between the upper surface of the chip and the substrate, and then the electric wires and the substrate are encapsulated with sealant. Since the electric wires have an upward-arching curvature and the encapsulation needs to encapsulate all the electric wires into the sealant layer, this will result in a relatively large thickness of the encapsulation layer, making the thickness of the chip including the substrate very large. When making a module with the flash and the camera, it also makes the thickness of the module increase accordingly, resulting in a relatively high protrusion backward in this area (generally, the thicknesses of the camera and the light can be made smaller than the thickness of the conventional optical chip). Summary of the Utility Model

[0004] The technical problem to be solved by the utility model is: how to reduce the thickness of the mobile phone camera module and avoid an overly thick protrusion in the rear camera area of the mobile phone.

[0005] In view of the above problems, the technical solution proposed by the utility model is:

[0006] An ultra-thin mobile phone camera module includes a camera, a light, an optical chip, and a substrate. A camera mounting hole, a light mounting hole, and a light-transmitting hole opened on the outer periphery of the light mounting hole are formed on the substrate. The camera is mounted in the camera mounting hole, the light is mounted in the light mounting hole, the optical chip is mounted on the lower surface of the substrate in a soldering manner through a solder ball one, the circuit on the optical chip is connected to the circuit on the substrate through the solder ball one, and the photosensitive area of the optical chip is located at the orifice of the chip light-transmitting hole on the lower surface of the substrate.

[0007] Furthermore, a transparent body is filled in the light-transmitting hole.

[0008] The transparent body is a solidified glue solution, and its bottom is bonded to the photosensitive area of the optical chip.

[0009] Furthermore, below the substrate, there is a sealant layer for encapsulating the optical chip and the solder ball one between it and the substrate with sealant.

[0010] The upper end surface of the transparent body is a plane parallel to the upper surface of the photosensitive area of the optical chip.

[0011] The upper end surface of the transparent body is lower than the upper surface of the substrate.

[0012] The height difference between the upper end surface of the transparent body and the upper surface of the substrate is 0.05-0.15 mm.

[0013] The welding ball 2 arranged under the substrate is located outside the sealing glue layer. Beneficial Effects

[0014] 1. The optical chip is reverse mounted to avoid wiring packaging on the chip surface, which reduces the total thickness of the optical chip after packaging, thereby reducing the thickness of the mobile phone camera module and avoiding excessive protrusion in the camera area on the rear of the mobile phone;

[0015] 2. Ensure that the transparent body is regular without warping, the surface is smooth and without marks, the light enters evenly without scattered refraction, and can accurately sense the intensity of the ambient light when shooting with a mobile phone;

[0016] 3. Simple structure and strong practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a three-dimensional schematic diagram of the substrate;

[0018] Figure 2 is a three-dimensional schematic diagram of the mobile phone camera module;

[0019] Figure 3 A three-dimensional schematic diagram of the location of some optical chips in the mobile phone camera module;

[0020] Figure 4 for Figure 3 A partial schematic diagram of .

[0021] In the figure: 1. substrate; 101. camera mounting hole; 102. lamp mounting hole; 103. light-transmitting hole; 104. welding ball two; 2. camera; 3. lamp; 4. optical chip; 401. photosensitive area; 402. transparent body; 403. sealing layer; 404. welding ball one. DETAILED DESCRIPTION

[0022] The utility model is further described below in conjunction with the accompanying drawings:

[0023] like Figure 1As shown in Figure 4, a ultra-thin mobile phone camera module includes a camera 2, a lamp 3, and an optical chip 4, and further includes a substrate 1. A camera mounting hole 101, a lamp mounting hole 102, and a light-transmitting hole 103 are formed on the substrate 1 around the lamp mounting hole 102. The camera 2 is mounted in the camera mounting hole 101, the lamp 3 is mounted in the lamp mounting hole 102, and the optical chip 4 is mounted under the substrate 1 by soldering balls 404 in a soldering manner. The circuit on the optical chip 4 is connected to the circuit on the substrate 1 through the soldering balls 404. The photosensitive area of the optical chip 4 is located at the orifice of the chip light-transmitting hole 103 under the substrate 1. During application, the optical chip 4 senses the intensity of external ambient light through the light-transmitting hole 103, thereby controlling the switch of the lamp 3 to provide reliable light for the camera 2. Since the optical chip 4 is mounted under the substrate 1, the circuit between the optical chip 4 and the substrate 1 is connected through the soldering balls 404, so there is no need to wire and seal on the surface of the optical chip 4, which can reduce the total packaging thickness of the optical chip 4 and the substrate 1 by 0.5 - 2 mm, thus significantly reducing the total thickness of the mobile phone camera module.

[0024] As Figure 3 , 4 shown, further, a transparent body 402 is filled in the light-transmitting hole 103. The transparent body 402 is a solidified glue solution, and its bottom is bonded to the photosensitive area 401 of the optical chip 4. In this way, while ensuring the light transmission of the photosensitive area 401 of the optical chip 4, the photosensitive area 401 of the optical chip 4 can be fixed at the orifice of the chip light-transmitting hole 103 under the substrate 1, and the photosensitive body of the photosensitive area 401 can be protected.

[0025] Under the substrate 1, there is a sealing layer 403 that seals the optical chip 4 and the soldering balls 404 between it and the substrate 1, and the soldering balls 104 provided under the substrate 1 are located outside the sealing layer 403. In this way, the encapsulation of the optical chip 4 is completed, and the encapsulation does not affect the connection with the relevant electronic components of the mobile phone through the soldering balls 104.

[0026] The upper end surface of the transparent body 402 is a plane parallel to the upper surface of the photosensitive area 401 of the optical chip 4. In this way, it can ensure that the light can pass through the transparent body 5 evenly and parallelly, avoiding astigmatism and refraction.

[0027] The upper end surface of the transparent body 402 is lower than the upper surface of the substrate 1, and the height difference between the upper end surface of the transparent body 402 and the upper surface of the substrate 1 is 0.05 - 0.15 mm, so as to avoid the transparent body 402 being rubbed when cleaning the upper surface of the substrate.

[0028] The above embodiments are only used to describe the present utility model more clearly, and should not be regarded as limiting the protection scope covered by the present utility model. Any modification in an equivalent form should be regarded as falling within the protection scope covered by the present utility model.

Claims

1. An ultra-thin mobile phone camera module, comprising a camera (2), a lamp (3), and an optical chip (4), characterized in that: It further includes a substrate (1), on which a camera mounting hole (101), a lamp mounting hole (102) and a light-transmitting hole (103) formed on the outer periphery of the lamp mounting hole (102) are provided. The camera (2) is mounted in the camera mounting hole (101), the lamp (3) is mounted in the lamp mounting hole (102), the optical chip (4) is mounted on the lower surface of the substrate (1) by soldering with solder balls one (404), the circuit on the optical chip (4) is connected to the circuit on the substrate (1) through the solder balls one (404), and the photosensitive area of the optical chip (4) is located at the orifice of the chip light-transmitting hole (103) on the lower surface of the substrate (1).

2. The ultra-thin mobile phone camera module according to claim 1, wherein: A transparent body (402) is filled in the light-transmitting hole (103).

3. The ultra-thin mobile phone camera module according to claim 2, wherein: The transparent body (402) is a solidified glue solution, and its bottom is bonded to the photosensitive area (401) of the optical chip (4).

4. The ultra-thin mobile phone camera module according to claim 2, wherein: Under the substrate (1), there is a sealing glue layer (403) that seals the optical chip (4) and the solder balls one (404) between it and the substrate (1).

5. The ultra-thin mobile phone camera module according to claim 2, characterized in that: The upper end surface of the transparent body (402) is a plane parallel to the upper surface of the photosensitive area (401) of the optical chip (4).

6. The ultra-thin mobile phone camera module according to claim 2, characterized in that: The upper end surface of the transparent body (402) is lower than the upper surface of the substrate (1).

7. The ultra-thin mobile phone camera module according to claim 6, wherein: The height difference between the upper end surface of the transparent body (402) and the upper surface of the substrate (1) is 0.05 - 0.15 mm.

8. The ultra-thin mobile phone camera module according to claim 4, wherein: The solder balls two (104) provided under the substrate (1) are located outside the sealing glue layer (403).

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