Printed circuit board copper deposition treatment device

Abstract

The utility model discloses a printed circuit board copper deposition processing device, which structurally comprises a copper deposition box, a mounting box and a placing box, and is characterized in that an electric push rod upwards pushes a rotating cover plate to take out a circuit board in a placing frame from a solution through timing of a control panel; then, a motor drives a driving gear to enable a rotating cover plate to drive a placement frame to rotate to a placement box through inner wall insections in a rotating groove, then after the placement frame is placed in the placement box, the placement frame is disassembled through a connecting screw rod and a connecting nut, and then the rotating cover plate is rotated to the position of an adding box to add a placement frame for additionally placing a circuit board; according to the invention, the circuit board is dismounted and the copper deposition work is carried out at the same time, so that the working efficiency is higher, and when the circuit board is placed in the placing groove by moving the movable clamping plate, the movable clamping plate can downwards clamp the upper end and the lower end of the circuit board under stress; and the limiting sliding chute and the limiting sliding plate are fixed, so that the circuit board is more stable during copper deposition.

Description

Technical Field

[0001] The utility model relates to the technical field of printed circuit board processing, in particular to a printed circuit board copper deposition treatment device. Background Art

[0002] Copper deposition, also known as hole metallization, is used to connect the conductors on both sides. The chemical copper deposition device for PCB double-sided board production is an accessory device that uses the method of chemical deposition to deposit a thin layer of chemical copper on the hole walls of the circuit board after drilling and pretreatment, so as to improve the conductivity for subsequent electroplating to thicken the copper. It has been widely used in the field.

[0003] However, the current circuit board copper deposition device not only has low efficiency but also consumes a lot of manual labor when performing copper deposition work.

[0004] Therefore, a high-efficiency and simple circuit board copper deposition treatment device is proposed. Content of the Utility Model

[0005] (1) Technical Problems to be Solved

[0006] In order to overcome the deficiencies of the prior art, a printed circuit board copper deposition treatment device is proposed to solve the problems that the current circuit board copper deposition device not only has low efficiency but also consumes a lot of manual labor when performing copper deposition work.

[0007] (2) Technical Solutions

[0008] The utility model is realized through the following technical solutions: The utility model provides a printed circuit board copper deposition treatment device, including

[0009] A copper deposition box, a placement box and a loading box connected in a triangular arrangement, and an installation box is installed at the connection;

[0010] A control panel is installed on the outside of the installation box, an electric push rod is installed inside the installation box, the output end of the electric push rod passes through the installation box and is connected with a rotating cover plate through a bearing. A placement rack is provided at the lower end of the rotating cover plate, a connecting screw is provided at the upper end of the placement rack, a through hole is provided inside the rotating cover plate, and the upper end of the connecting screw is connected with a connecting nut to fix it. The top end of the electric push rod is connected with a mounting plate, a motor is installed on the upper end of the mounting plate, an arc-shaped rotating groove is provided on the outside of the rotating cover plate, and internal teeth are provided on the inner wall of the rotating groove. The output end of the motor passes through the mounting plate and is connected with a driving gear, and the outside of the driving gear is connected with the internal teeth.

[0011] Further, one side of the placement rack is hermetically connected up and down, and there are several through moving chutes at the sealed part. A moving slider is slidably connected inside the moving chute, and a moving clamping plate is connected to the outside through part of the moving slider. There are several groups of limiting chutes on the inner wall of the moving chute. There is a through pushing chute on the inner side of the upper end of the moving clamping plate, and a limiting sliding plate is slidably connected inside the pushing chute.

[0012] Further, placement grooves are correspondingly provided on the lower end surface of the placement rack and the lower end surface of the moving clamping plate, and a stress block is provided on the upper end of the limiting sliding plate.

[0013] Further, an extension plate is connected to the upper end of the installation box, and there is a through fixing hole inside the extension plate. A fixing column is provided at the top of the installation plate and is connected to the fixing hole.

[0014] Further, a partition is provided at the lower end inside the placement box, and there are several leakage holes inside the partition.

[0015] Further, there are several liquid immersion holes on the outside of the placement rack.

[0016] Further, liquid outlet holes are provided at the bottom end of the placement box and the copper deposition box.

[0017] (III) Beneficial Effects

[0018] The utility model has the following beneficial effects compared with the prior art:

[0019] 1. In the utility model, the electric push rod is started regularly through the control panel to push the rotating cover plate to move the placement rack out of the copper deposition box, so that the circuit board is separated from the solution. Then the motor drives the rotating cover plate to rotate through the driving gear. After the placement rack is placed above the placement box, the placement rack is disassembled. Subsequently, after the rotating cover plate rotates to the upper end of the adding box, another placement rack inside it is fixed on the rotating cover plate, and then it rotates into the copper deposition box for copper deposition work. During the reaction, the installation and disassembly of other circuit boards can be carried out, so that the working efficiency is higher, and the single-person operation saves labor costs.

[0020] 2. In the utility model, circuit boards of different sizes can be placed inside the placement groove by adjusting the height of the moving clamping plate. Then, the moving clamping plate is pushed downward to clamp the circuit board, and then the limiting sliding plate is pushed into the limiting chute to fix the moving clamping plate, so that the circuit board is more stable during the copper deposition work and the copper deposition effect is better. Description of the Drawings

[0021] By reading the detailed description of the non-restrictive embodiments with reference to the following drawings, other features, purposes and advantages of the utility model will become more obvious:

[0022] Figure 1Schematic diagram of the internal structure of the present utility model;

[0023] Figure 2 Schematic top view of the internal structure of the present utility model;

[0024] Figure 3 Schematic top view of the rotating cover plate of the present utility model;

[0025] Figure 4 Schematic diagram of the internal structure of the placement box of the present utility model;

[0026] Figure 5 Schematic diagram of the internal structure of the placement rack of the present utility model;

[0027] Figure 6 Schematic side installation structure diagram of the moving clamping plate of the present utility model;

[0028] Figure 7 Schematic top view of the internal structure of the moving clamping plate of the present utility model;

[0029] In the figure: copper deposition box - 1, installation box - 2, rotating cover plate - 3, placement rack - 4, moving chute - 41, limiting chute - 42, moving clamping plate - 43, placement groove - 44, immersion hole - 45, moving slider - 46, pushing chute - 47, limiting slide plate - 48, force - receiving block - 49, electric push rod - 5, control panel - 6, through - hole - 7, connecting screw - 8, connecting nut - 9, mounting plate - 10, fixing column - 11, motor - 12, driving gear - 13, extension plate - 14, fixing hole - 15, rotating groove - 16, placement box - 17, additional box - 18, inner wall tooth pattern - 19, partition - 110, leakage hole - 111, liquid outlet hole - 112. Detailed implementation manners

[0030] In order to make the purpose, technical solutions and advantages of the present utility model clearer, the following further details the present utility model in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0031] Please refer to Figure 1 、 Figure 2 、 Figure 3 and Figure 4, the present utility model provides a printed circuit board electroless copper plating treatment device, which includes an electroless copper plating tank 1, a placement tank 17 and a charging tank 18 arranged in a triangular shape and connected to each other, and an installation box 2 is installed at the connection, so that it is convenient to rotate the cover plate 3 to the appropriate position in time, and an external protective cloth can be added at the connection to avoid the situation of solution dripping. Moreover, another placement rack 4 can be placed inside the charging tank 18, so that after the placement rack 4 after electroless copper plating is removed, the electroless copper plating work can be carried out quickly, making the work efficiency higher. A partition 110 is provided at the lower end inside the placement tank 17, and a number of leakage holes 111 are provided inside the partition 110, so that the circuit board after electroless copper plating can stand still in the placement tank 17 to drip the solution. Liquid discharge holes 112 are provided at the bottom end of the placement tank 17 and the electroless copper plating tank 1. The liquid discharge hole 112 provided at the bottom of the placement tank 17 is convenient for discharging the accumulated solution, and the liquid discharge hole 112 inside the electroless copper plating tank 1 can be used to replace the solution inside.

[0032] A control panel 6 is installed on the outside of the installation box 2 to facilitate the operation of electrical equipment in the device, and to facilitate starting the electric push rod 5 or the motor 12 for rotation work regularly. An electric push rod 5 is installed inside the installation box 2 to achieve automatic lifting work, avoiding manual operation. The output end of the electric push rod 5 passes through the installation box 2 and is connected to the rotating cover plate 3 through a bearing, so that the rotating cover plate 3 can rotate under force without causing interference to the electric push rod 5. A placement rack 4 is provided at the lower end of the rotating cover plate 3 for placing the circuit board for electroless copper plating work. A connecting screw 8 is provided at the upper end of the placement rack 4. A through hole 7 is provided through the inside of the rotating cover plate 3, and the upper end of the connecting screw 8 is connected to a connecting nut 9 to fix it. In this way, the placement rack 4 can be disassembled quickly under the rapid operation of the connecting nut 9 and the connecting screw 8, making the efficiency higher during its rapid disassembly. The top end of the electric push rod 5 is connected to a mounting plate 10, and a motor 12 is installed on the upper end of the mounting plate 10. An arc-shaped rotating groove 16 is provided on the outside of the rotating cover plate 3. The rotating groove 16 is set to be arc-shaped or semi-circular so that the rotating cover plate 3 can be rotated under force to the upper ends of the placement tank 17 and the charging tank 18 to rotate at multiple angles. Moreover, inner wall tooth patterns 19 are provided on the inner wall of the rotating groove 16. The output end of the motor 12 passes through the mounting plate 10 and is connected to a driving gear 13, and the outside of the driving gear 13 is connected to the inner wall tooth patterns 19. In this way, when the motor 12 drives the driving gear 13, the rotating cover plate 3 is driven by the inner wall tooth patterns 19 to adjust its position left and right for use. In addition, an extension plate 14 is connected to the upper end of the installation box 2. The height of the extension plate 14 is higher than the distance that the placement rack 4 is pushed upward. A through fixing hole 15 is provided inside the extension plate 14. A fixing column 11 is provided at the top end of the mounting plate 10 and is connected to the fixing hole 15. Moreover, both the fixing column 11 and the fixing hole 15 are set to be rectangular, so that the fixing column 11 and the fixing hole 15 are stressed to avoid the situation that the rotating cover plate 3 drives the electric push rod 5 to rotate together when rotating.

[0033] Please refer to Figure 5 , Figure 6 andFigure 7 One side of the placement rack 4 is hermetically connected up and down, so that one side is connected to the upper and lower ends, facilitating the entry of the solution and the placement of the circuit board. A number of immersion holes 45 are provided on the outer side of the placement rack 4 to facilitate the entry of the solution, making the copper deposition more comprehensive. And a number of through moving sliding grooves 41 are provided at the closed part. A moving slider 46 is slidably connected inside the moving sliding groove 41, and a moving clamping plate 43 is connected to the penetrated part on the outer side of the moving slider 46. In this way, the moving clamping plate 43 can move up and down, enabling the clamping of circuit boards of different sizes, resulting in a better stable effect. A number of sets of limiting sliding grooves 42 are provided on the inner wall of the moving sliding groove 41. A penetrated pushing sliding groove 47 is provided on the inner side of the upper end of the moving clamping plate 43, and a limiting sliding plate 48 is slidably connected inside the pushing sliding groove 47. In this way, the limiting sliding plate 48 can be pushed into the limiting sliding groove 42, thereby fixing the moving clamping plate 43, making the moving clamping plate 43 more stable when the placement rack 4 moves, and facilitating operation and disassembly. Corresponding placement grooves 44 are provided on the lower end surface of the placement rack 4 and the lower end surface of the moving clamping plate 43, and the placement grooves 44 can be set to be larger, enabling the placement of most circuit boards and facilitating the immersion of the solution inside. A force-receiving block 49 is provided on the upper end of the limiting sliding plate 48, facilitating the user to apply force to push the limiting sliding plate 48 to move.

[0034] Working principle: When in use, first connect the electric push rod 5, the control panel 6 and the motor 12 to an external power supply. Then move the moving clamping plate 43 up and down. After placing the circuit board inside the placement groove 44, the moving clamping plate 43 moves downward to clamp the circuit board. After that, push the limiting sliding plate 48 to fix it. Then fix the placement rack 4 through the connecting screw 8 and the connecting nut 9 and place it inside the copper deposition tank 1 for copper deposition work. After copper deposition, the electric push rod 5 pushes the rotating cover plate 3 upward, so that the fixing column 11 is inserted into the fixing hole 15. Then the motor 12 drives the driving gear 13, and under the action of the inner wall tooth pattern 19, the rotating cover plate 3 drives the placement rack 4 to rotate by an angle. When the lower placement rack 4 is located at the placement box 17, the electric push rod 5 can be pulled downward to place the placement rack 4 inside the placement box 17 for disassembly. Then when the rotating cover plate 3 rotates to the addition box 18, during the downward movement, the connecting screw 8 on the placement rack 4 inside the addition box 18 penetrates through the through hole 7 for fixation. Then move the addition box 18 upward and then rotate it into the copper deposition tank 1 for copper deposition work, thus completing the work.

[0035] The basic principles, main features and advantages of the present utility model have been shown and described above. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. The above embodiments and the descriptions in the specification are only preferred examples of the present utility model and are not used to limit the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.

Claims

1. A printed circuit board electroless copper plating treatment device, characterized in that, including a copper deposition box (1), a placement box (17) and a charging box (18) which are connected in a triangular arrangement, and an installation box (2) is installed at the connection; a control panel (6) is installed on the outer side of the installation box (2), an electric push rod (5) is installed inside the installation box (2), a rotating cover plate (3) is connected to the output end of the electric push rod (5) through a bearing at the position where it penetrates the installation box (2), a placement rack (4) is arranged at the lower end of the rotating cover plate (3), a connecting screw rod (8) is arranged at the upper end of the placement rack (4), a through port (7) is arranged inside the rotating cover plate (3), and the upper end of the connecting screw rod (8) is connected with a connecting nut (9) to fix it. The top end of the electric push rod (5) is connected with a mounting plate (10), a motor (12) is installed on the upper end of the mounting plate (10), an arc-shaped rotating groove (16) is arranged on the outer side of the rotating cover plate (3), and inner wall tooth patterns (19) are arranged on the inner wall of the rotating groove (16). The output end of the motor (12) penetrates the mounting plate (10) and is connected with a driving gear (13), and the outer side of the driving gear (13) is connected with the inner wall tooth patterns (19).

2. The copper deposition treatment device for printed circuit boards according to claim 1, characterized in that: One side of the placement rack (4) is hermetically connected up and down, and a plurality of through moving sliding grooves (41) are arranged at the sealed position. A moving slider (46) is slidably connected inside the moving sliding grooves (41), and a moving clamping plate (43) is connected to the outer side of the moving slider (46) at the penetrating position. A plurality of groups of limiting sliding grooves (42) are arranged on the inner wall of the moving sliding grooves (41), a through pushing sliding groove (47) is arranged on the inner side of the upper end of the moving clamping plate (43), and a limiting sliding plate (48) is slidably connected inside the pushing sliding groove (47).

3. The copper deposition treatment device for printed circuit boards according to claim 2, characterized in that: Placement grooves (44) are correspondingly arranged on the lower end surface of the placement rack (4) and the lower end surface of the moving clamping plate (43), and a stress block (49) is arranged on the upper end of the limiting sliding plate (48).

4. A copper deposition treatment device for a printed circuit board according to claim 1, characterized in that: An extension plate (14) is connected to the upper end of the installation box (2), and a through fixing hole (15) is arranged inside the extension plate (14). A fixing column (11) is arranged at the top end of the mounting plate (10) and is connected with the fixing hole (15).

5. A copper deposition treatment device for a printed circuit board according to claim 1, characterized in that: A partition plate (110) is arranged at the lower end inside the placement box (17), and a plurality of leakage holes (111) are arranged inside the partition plate (110).

6. The copper deposition treatment device for printed circuit boards according to claim 1, wherein: A plurality of liquid immersion holes (45) are arranged on the outer side of the placement rack (4).

7. A copper deposition treatment device for a printed circuit board according to claim 1, characterized in that: Liquid outlet holes (112) are arranged at the bottom ends of the placement box (17) and the copper deposition box (1).

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