Endoscope camera, endoscope imaging system, and endoscope
By using a combined heat dissipation structure of semiconductor refrigeration elements and thermal interface material layer in the endoscopic camera, the problems of insufficient space and low efficiency of the heat dissipation structure are solved, efficient chip heat dissipation is achieved, and image quality and endoscopic performance are guaranteed.
Patent Information
- Application Number
- CN202421907729.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-07
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2034-08-07
AI Technical Summary
The existing endoscope cameras have insufficient heat dissipation structure space and low heat dissipation efficiency, which leads to serious chip heating problems, affecting image quality and service life.
The heat dissipation structure of a semiconductor refrigeration element and two layers of thermal interface material layers is adopted, including a first thermal interface material layer, a semiconductor refrigeration element and a second thermal interface material layer, which respectively connects the heating element to the inner wall of the shell, and uses the semiconductor refrigeration element to absorb heat and dissipate heat through the heat dissipation surface to improve heat transfer efficiency.
Achieve efficient heat dissipation in a limited space, keeping the chip temperature within the optimal operating range, improving image quality and extending service life.
Smart Images
Figure CN223143465U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of medical equipment, in particular to an endoscope camera, an endoscope imaging system and an endoscope. Background Art
[0002] At present, the images of mainstream endoscope camera products have high resolutions, and the amount of image data that needs to be processed by the chip is extremely large, and the accompanying power consumption and heat generation problems are also very serious. In related technologies, the heat dissipation solution of the chip is to conduct heat dissipation through thermal grease or thermal silica gel attached between the chip surface and the inner wall of the cavity. This solution does not perform well in actual use.
[0003] On the one hand, the camera is small in size and has a fully enclosed structure. The chip is inside the cavity of the camera, and the distance from the chip to the inner wall of the camera cavity is usually only a few millimeters. This results in insufficient space for arranging traditional heat dissipation structures. When using thermal grease or thermal silica gel in related technologies to attach between the chip surface and the inner wall of the cavity, the distance between the chip and the inner wall of the cavity is relatively large for the thermal grease or thermal silica gel, and it is necessary to increase the coating volume, which greatly increases the thermal resistance and reduces the heat dissipation efficiency. On the other hand, for the comfort of holding, the cavity of the camera usually adopts an ergonomic design, and the inner wall of the cavity is not flat, and the thick thermal grease or thermal silica gel has a poor fit with the inner wall of the cavity, resulting in low heat dissipation efficiency. Summary of the Utility Model
[0004] The technical problem to be solved by the utility model is to overcome the defect of low heat dissipation efficiency of the heat dissipation structure of the endoscope camera in related technologies, so as to provide an endoscope camera, an endoscope imaging system and an endoscope.
[0005] In a first aspect, the utility model provides an endoscope camera, comprising: a housing; a heating element disposed inside the housing; a heat dissipation structure disposed between the inner wall of the housing and the heating element; the heat dissipation structure includes a first thermal interface material layer, a thermoelectric cooling element and a second thermal interface material layer arranged in sequence. The thermoelectric cooling element has a heat absorption surface and a heat dissipation surface. The first thermal interface material layer is respectively connected to the heating element and the heat absorption surface, and the second thermal interface material layer is respectively connected to the heat dissipation surface and the inner wall of the housing.
[0006] In some embodiments, the thermoelectric cooling element is configured as a sheet structure, and the thickness range of the thermoelectric cooling element is 3-6 mm.
[0007] In some embodiments, the thermoelectric cooling element is a thermoelectric cooling sheet with an insulating matrix or a thermoelectric cooling sheet with a metal matrix.
[0008] In some embodiments, the first thermal interface material layer is a thermal grease layer, or a thermal silica gel layer, or a phase change thermal material layer, or a thermal gel layer, or a graphite film layer; and the thickness range of the first thermal interface material layer is 0.5 - 1.5 mm. And / or, the second thermal interface material layer is a thermal grease layer, or a thermal silica gel layer, or a phase change thermal material layer, or a thermal gel layer, or a graphite film layer; and the thickness range of the second thermal interface material layer is 0.5 - 1.5 mm.
[0009] In some embodiments, the set area of the first thermal interface material layer is not less than the set area of the heating element.
[0010] In some embodiments, the heat dissipation structure further includes a heat spreader layer, which is disposed between the second thermal interface material layer and the inner wall of the housing. The set area of the heat spreader layer is larger than the set area of the second thermal interface material layer, and the heat spreader layer covers the second thermal interface material layer.
[0011] In some embodiments, the heat spreader layer is a VC heat pipe.
[0012] In some embodiments, the camera of the endoscope further includes a power supply, which is electrically connected to the semiconductor refrigeration element, and the power supply is suitable for supplying power to the semiconductor refrigeration element.
[0013] In a second aspect, the present invention further provides an endoscope camera system, including: the endoscope camera as described above.
[0014] In a third aspect, the present invention further provides an endoscope, including: the endoscope camera as described above.
[0015] Using the technical solution of the present invention, it has at least the following advantages:
[0016] 1. The installation space occupied by the first thermal interface material layer, the semiconductor refrigeration element, and the second thermal interface material layer is small, and they can be arranged in a small space between the heating element and the inner wall of the housing to achieve heat dissipation of the heating element.
[0017] 2. The semiconductor refrigeration element is disposed between the first thermal interface material layer and the second thermal interface material layer, avoiding the first thermal interface material layer or the second thermal interface material layer from being too thick, thereby avoiding too large thermal resistance of the first thermal interface material layer or the second thermal interface material layer and ensuring the heat dissipation efficiency.
[0018] 3. The inner wall of the housing is usually not flat, and the thinner second thermal interface material layer can better fit with the inner wall of the housing, enabling the second thermal interface material layer to be in full contact with the housing to improve the heat dissipation efficiency.
[0019] 4. The heat absorption surface of the semiconductor refrigeration element can absorb heat and dissipate the heat through the heat dissipation surface, thereby enhancing the heat dissipation between the first thermal interface material layer and the second thermal interface material layer and further improving the heat dissipation efficiency. Description of the Drawings
[0020] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the related art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the related art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0021] Figure 1 It is a schematic diagram of a partial structure of an endoscope camera in the related art;
[0022] Figure 2 It is a schematic diagram of a partial structure of an endoscope camera according to an embodiment of the present invention;
[0023] Figure 3 It is a schematic diagram of a vertical cross-section of an endoscope camera according to an embodiment of the present invention;
[0024] Figure 4 For Figure 3 a partial enlarged schematic diagram of A in
[0025] Figure 5 It is a schematic diagram of a cross-section of an endoscope camera according to an embodiment of the present invention;
[0026] Figure 6 For Figure 5 a partial enlarged schematic diagram of B in
[0027] Description of the Reference Numerals:
[0028] 1. Housing; 2. Heating element; 3. Heat dissipation structure; 31. First thermal interface material layer; 32. Semiconductor refrigeration element; 33. Second thermal interface material layer; 4. Circuit board; 41. Power supply socket; 42. Power supply wire; 5. Camera module; 6. Button; 7. Thermal grease. Detailed Embodiments
[0029] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.
[0030] The camera of a rigid endoscope mainly implements the following functions in terms of hardware: collecting image signals through a CMOS (Complementary Metal Oxide Semiconductor) Sensor, transmitting them to a chip for decoding, and then transmitting them to a back-end image processing module for further processing.
[0031] Limited by the function that the endoscope camera must be held by hand for a long time, its volume will be relatively small, resulting in relatively small volumes of the internal PCB (Printed Circuit Board) and the components used. On the other hand, with the development of endoscope technology, the requirements for image quality are getting higher and higher, the image resolution is also getting larger, and the amount of data that the chip has to process has increased sharply.
[0032] The large amount of data also makes the power consumption of the chip increase, and the resulting heat problem has become serious. When the chip exceeds the optimal operating temperature range, the chip performance will decline, and the subsequent image quality will also be affected accordingly; when the temperature exceeds the chip operating temperature range, a protection mechanism will be triggered, the chip will stop working, the image will disappear, and it is necessary to wait until the temperature returns to normal and restart to make the endoscope produce images normally. Due to the particularity of the actual application of the endoscope, this situation is not allowed to occur, which requires a good heat dissipation solution to ensure that the chip temperature is within the optimal operating temperature range.
[0033] As Figure 1 shown, in the related art, the heat dissipation solution for the chip (i.e., the heating element 2) is to apply thermal grease 7 on the surface of the chip and connect the thermal grease 7 to a sheet metal part (usually the housing 1 of the endoscope camera), and dissipate heat through the thermal grease 7 and the sheet metal part. It is found in actual use that the heat dissipation effect of this solution is not completely ideal and the heat dissipation efficiency is low.
[0034] Based on this, the present utility model provides an endoscope camera, an endoscope imaging system, and an endoscope.
[0035] Next, in combination with Figures 2 to 6 , the embodiments of the present utility model will be described.
[0036] According to an embodiment of the present utility model, on the one hand, an endoscope camera is provided, which includes a housing 1, a heating element 2 disposed in the housing 1, and a heat dissipation structure 3. Among them, the heat dissipation structure 3 is disposed between the inner wall of the housing 1 and the heating element 2 to achieve heat dissipation of the heating element 2.
[0037] Specifically, the heat dissipation structure 3 includes a first thermal interface material layer 31, a semiconductor refrigeration element 32, and a second thermal interface material layer 33 arranged in sequence. Among them, the semiconductor refrigeration element 32 has a heat absorption surface adapted to absorb heat and a heat dissipation surface adapted to dissipate heat. The first thermal interface material layer 31 is respectively connected between the heating element 2 and the heat absorption surface, and the second thermal interface material layer 33 is respectively connected between the heat dissipation surface and the inner wall of the housing 1.
[0038] Specifically, the connection between the first thermal interface material layer 31 and the heating element 2 can be a fitting arrangement or an adhesive arrangement, and the connection between the first thermal interface material layer 31 and the heat absorption surface of the semiconductor refrigeration element 32 can also be a fitting arrangement or an adhesive arrangement, so as to facilitate efficient heat transfer between the first thermal interface material layer 31 and the heating element 2 and between the first thermal interface material layer 31 and the heat absorption surface.
[0039] Specifically, the connection between the second thermal interface material layer 33 and the heat dissipation surface of the semiconductor refrigeration element 32 can be a fitting arrangement or an adhesive arrangement, and the connection between the second thermal interface material layer 33 and the inner wall of the housing 1 can be a fitting arrangement or an adhesive arrangement, so as to facilitate efficient heat transfer between the second thermal interface material layer 33 and the heat dissipation surface and between the second thermal interface material layer 33 and the inner wall of the housing 1.
[0040] By using the technical solution of the present invention, the semiconductor refrigeration element 32 is arranged between the first thermal interface material layer 31 and the second thermal interface material layer 33, avoiding the excessive thickness of the first thermal interface material layer 31 or the second thermal interface material layer 33, thereby avoiding excessive thermal resistance of the first thermal interface material layer 31 or the second thermal interface material layer 33 and ensuring the heat dissipation efficiency. Moreover, the inner wall of the housing 1 is usually not flat, and the thinner second thermal interface material layer 33 can better fit the inner wall of the housing 1, enabling the second thermal interface material layer 33 to be in full contact with the housing 1 to improve the heat dissipation efficiency.
[0041] Furthermore, both the first thermal interface material layer 31 and the second thermal interface material layer 33 are obtained by using thermal interface materials. The present application does not specifically limit the materials of the first thermal interface material layer 31 and the second thermal interface material layer 33, as long as they can achieve efficient heat conduction functions. Exemplarily, the materials of the first thermal interface material layer 31 and the second thermal interface material layer 33 are respectively one of thermal conductive silicone grease, thermal conductive silicone rubber, thermal conductive silicone rubber sheet, phase change thermal interface material, thermal conductive gel (GEL), or graphite film.
[0042] Accordingly, the obtained first thermal interface material layer 31 is a thermal grease layer, or a thermal silica gel layer, or a phase change thermal conductive material layer, or a thermal gel layer, or a graphite film layer. The obtained second thermal interface material layer 33 is a thermal grease layer, or a thermal silica gel layer, or a phase change thermal conductive material layer, or a thermal gel layer, or a graphite film layer. Among them, the materials of the first thermal interface material layer 31 and the second thermal interface material layer 33 can be the same or different. Preferably, both the first thermal interface material layer 31 and the second thermal interface material layer 33 adopt thermal grease 7. The thermal grease 7 is in paste form, easy to coat, and easy to fully fill the gap between the semiconductor refrigeration element 32 or the inner wall of the housing 1, so as to achieve complete adhesion to the semiconductor refrigeration element 32 or the inner wall of the housing 1, and the heat conduction efficiency is higher.
[0043] Exemplarily, in order to improve the adhesion stability between the heat dissipation structure 3, the heating element 2, and the inner wall of the housing 1, both sides of the first thermal interface material layer 31 can be bonded to the heating element 2 and the heat absorption surface respectively, and both sides of the second thermal interface material layer 33 can be bonded to the heat dissipation surface and the inner wall of the housing 1 respectively. Exemplarily, both the first thermal interface material layer 31 and the second thermal interface material layer 33 can be obtained by using thermal silica gel. The thermal silica gel has its own adhesive property, which simplifies the production process.
[0044] Exemplarily, the thickness range of the first thermal interface material layer 31 is 0.5 - 1.5 mm, and / or the thickness range of the second thermal interface material layer 33 is 0.5 - 1.5 mm. Preferably, the thicknesses of the first thermal interface material layer 31 and the second thermal interface material layer 33 are 1 mm.
[0045] Furthermore, the semiconductor refrigeration element 32 is configured as a sheet structure, and the thickness range of the semiconductor refrigeration element 32 is 3 - 6 mm. Preferably, the thickness of the semiconductor refrigeration element 32 is 4 mm.
[0046] Specifically, the thicknesses of the first thermal interface material layer 31, the second thermal interface material layer 33, and the semiconductor refrigeration element 32 refer to the set dimensions in the direction of the interval between the heating element 2 and the inner wall of the housing 1.
[0047] In the actual application scenario, in the direction of the interval between the heating element 2 and the inner wall of the housing 1, the distance between the heating element 2 and the inner wall of the housing is usually about 7 mm, the thickness of the semiconductor refrigeration element 32 is about 4 mm, and the thicknesses of the first thermal interface material layer 31 and the second thermal interface material layer 33 are about 1 mm, so as to meet the requirements in terms of space, and it will not cause the first thermal interface material layer 31 and the second thermal interface material layer 33 to be too thick and increase their thermal resistance, thus ensuring the heat transfer efficiency.
[0048] In addition, the present application does not specifically limit the set areas of the first thermal interface material layer 31, the second thermal interface material layer 33, and the semiconductor refrigeration element 32, as long as the heat dissipation requirements of the heating element 2 can be met. Specifically, the set area refers to the area in the direction perpendicular to the interval between the heating element 2 and the inner wall of the housing 1. Exemplarily, the set area of the first thermal interface material layer 31 is not less than the set area of the heating element 2, so as to fully dissipate the heat of the heating element 2. The set areas of the second thermal interface material layer 33 and the semiconductor refrigeration element 32 are not less than the set area of the first thermal interface material layer 31, so as to enable efficient heat conduction between the first thermal interface material layer 31, the second thermal interface material layer 33, and the semiconductor refrigeration element 32.
[0049] Specifically, the set area of the first thermal interface material layer 31 is close to the set area of the heating element 2 to fully dissipate the heat of the heating element 2. The set area of the heat absorption surface of the semiconductor refrigeration element 32 is close to or slightly larger than the set area of the first thermal interface material, and the set area of the second thermal interface material layer 33 is close to the set area of the heat dissipation surface of the semiconductor refrigeration element 32. Preferably, the set areas of the heat absorption surface and the heat dissipation surface of the first thermal interface material layer 31, the second thermal interface material layer 33, and the semiconductor refrigeration element 32 are all the same as the set area of the heating element 2.
[0050] Furthermore, in some embodiments, the heat dissipation structure 3 further includes a heat spreader (not shown in the figure), the heat spreader is disposed between the second thermal interface material layer 33 and the inner wall of the housing 1, the set area of the heat spreader is larger than the set area of the second thermal interface material layer 33, and the heat spreader covers the second thermal interface material layer 33. The provision of the heat spreader facilitates the expansion of the heat dissipation area and further improves the heat dissipation rate. Exemplarily, the inner wall of the housing 1 is configured as an arc surface, and the heat spreader is configured as an arc surface adapted to the shape of the inner wall of the housing 1. Exemplarily, the heat spreader can be a VC heat pipe, and its thickness is relatively thin, which is convenient for arranging in a narrow space.
[0051] Furthermore, in some embodiments, the camera of the endoscope further includes a power source (not shown in the figure), the power source is electrically connected to the semiconductor refrigeration element 32, and the power source is adapted to supply power to the semiconductor refrigeration element 32, so that the heat absorption surface of the semiconductor refrigeration element 32 can absorb the heat of the first thermal interface material layer 31 and dissipate the heat through the heat dissipation surface.
[0052] Specifically, the semiconductor refrigeration element 32 generally includes a refrigeration structure and a substrate structure. The refrigeration structure realizes heat absorption or heat dissipation through external power supply (such as the above-mentioned power supply). The substrate structure includes a first substrate and a second substrate disposed on the upper and lower sides of the refrigeration structure. The heat absorption surface is formed on the first substrate, and the heat dissipation surface is formed on the second substrate. Among them, the semiconductor refrigeration element 32 can be a semiconductor refrigeration chip with an insulating substrate. Exemplarily, both the first substrate and the second substrate are provided as ceramic layers to form a semiconductor refrigeration chip with an insulating substrate. Or, the semiconductor refrigeration element 32 can be a semiconductor refrigeration chip with a metal substrate. Exemplarily, the first substrate is a ceramic layer and the second substrate is a copper layer to form a semiconductor refrigeration chip with a metal substrate. Preferably, the semiconductor refrigeration element 32 is a semiconductor refrigeration chip with a metal substrate, so that the thickness of the semiconductor refrigeration element 32 is thinner and the heat conduction and heat dissipation efficiency is higher.
[0053] It can be understood that the semiconductor refrigeration element 32 has various specifications (different powers, thicknesses, etc.). The specifications of the semiconductor can be adaptively selected according to the actual layout space or heat dissipation requirements to achieve the best heat dissipation effect of the heating element 2, so that the heating element 2 is at the best working temperature, thereby improving the use performance of the endoscope camera.
[0054] Specifically, the heating element 2 of the present invention can be a chip or other components that need heat dissipation. In this embodiment, the heating element 2 is taken as an example of a chip. Refer to Figures 3 - 6 , the camera of the endoscope includes a camera module 5 and a circuit board 4 disposed on the camera module 5. Both the camera module 5 and the circuit board 4 are located in the housing 1. The chip is disposed on the circuit board 4 and is electrically connected to the camera module 5 for transmitting image information. The above-mentioned heat dissipation structure 3 is disposed between the chip and the inner wall of the housing 1. Among them, the first thermal interface material layer 31 is adhesively disposed between the side of the chip facing away from the circuit board 4 and the heat absorption surface, and the second thermal interface material layer 33 is adhesively disposed between the heat dissipation surface and the inner wall of the housing 1. The setting of the heat dissipation structure 3 can effectively improve the heat dissipation efficiency of the chip, ensure that the working temperature of the chip is in the best range, thereby optimizing the chip performance, improving the image quality, extending the chip life, and further ensuring the imaging effect and service life of the endoscope camera.
[0055] Since the thermal interface material not only has high thermal conductivity but also has high flexibility, the specific shapes of the first thermal interface material layer 31 and the second thermal interface material layer 33 can adapt to the shapes of the contacting components to fully fit the contacting components. Exemplarily, such as Figure 2 、 4As shown in Figure 6, the side of the chip facing away from the circuit board 4, the heat absorption surface and the heat dissipation surface of the semiconductor refrigeration element 32 are all constructed as horizontal planes, and the inner wall of the shell 1 is constructed as an arc surface or a curved surface. Correspondingly, the surfaces of the first thermal interface material layer 31 that are in contact with the chip and the heat absorption surface are respectively set as horizontal planes, and the surface of the second thermal interface material layer 33 that is in contact with the heat dissipation surface is set as a horizontal plane, and the surface of the second thermal interface material layer 33 that is in contact with the inner wall of the shell 1 is set as an arc surface or a curved surface.
[0056] Furthermore, if Figure 3 and 4 As shown, a power supply socket 41 is provided on the circuit board 4, and the power supply of the camera module 5 can also be provided on the circuit board 4. The power supply socket 41 and the circuit board 4 can be electrically connected through the conductive line on the circuit board 4. Preferably, the power supply socket 41 and the chip and the heat dissipation structure 3 are located on the same side of the camera module 5. Exemplarily, a power supply line 42 is connected to the power supply socket 41, and the power supply line 42 is connected to the semiconductor refrigeration element 32 to realize power supply to the semiconductor refrigeration element 32 through the power supply. Alternatively, a terminal is provided on the power supply socket 41, and the semiconductor refrigeration element 32 is provided with the power supply line 42, and the power supply line 42 is plugged into the terminal of the power supply socket 41 to realize power supply to the semiconductor refrigeration element 32 through the power supply.
[0057] Exemplarily, the endoscope camera head is also provided with a button 6, a lens group, a mirror body snap-on structure, etc., so as to realize the functions of the endoscope camera head such as collecting image information, which will not be described in detail here.
[0058] In some embodiments not shown in the figures, a plurality of heating elements 2 may be provided, and correspondingly, a plurality of groups of the heat dissipation structures 3 may be provided.
[0059] In some embodiments not shown in the figures, the arrangement space between some heating elements 2 and the inner wall of the housing 1 is relatively large, and the heat dissipation structure 3 may also include one or two of a heat dissipation member or a heat conduction member. For example, the heat dissipation member may be a fan, etc.; the heat conduction member may be a heat-conducting copper tube or a heat-conducting bracket, etc.
[0060] According to an embodiment of the present invention, on the other hand, an endoscopic camera system is provided, comprising an endoscopic camera head as described in any of the above embodiments. Since the endoscopic camera system of the present invention comprises the above endoscopic camera head, it has the same technical effect as the endoscopic camera head of the present invention, and will not be described in detail here.
[0061] According to an embodiment of the present invention, in another aspect, an endoscope is provided, comprising the endoscope camera described in any of the above embodiments. Since the endoscope of the present invention comprises the above endoscope camera, it has the same technical effect as the endoscope camera of the present invention, and will not be described in detail here.
[0062] In summary, the technical solution of the present utility model has at least the following advantages:
[0063] 1. The first thermal interface material layer 31, the semiconductor refrigeration element 32, and the second thermal interface material layer 33 occupy a relatively small installation space and can be arranged in a relatively small space between the heating element 2 and the inner wall of the housing to achieve heat dissipation of the heating element 2.
[0064] 2. The semiconductor refrigeration element 32 is arranged between the first thermal interface material layer 31 and the second thermal interface material layer 33, avoiding the first thermal interface material layer 31 or the second thermal interface material layer 33 from being too thick, thereby avoiding too large thermal resistance of the first thermal interface material layer 31 or the second thermal interface material layer 33 and ensuring the heat dissipation efficiency.
[0065] 3. The inner wall of the housing 1 is usually not flat, and the relatively thin second thermal interface material layer 33 can better fit with the inner wall of the housing 1, enabling the second thermal interface material layer 33 to be in full contact with the housing 1 to improve the heat dissipation efficiency.
[0066] 4. The heat absorption surface of the semiconductor refrigeration element 32 can absorb heat and dissipate the heat through the heat dissipation surface, thereby strengthening the heat dissipation between the first thermal interface material layer 31 and the second thermal interface material layer 33 and further improving the heat dissipation efficiency.
[0067] Although the embodiments of the present utility model have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present utility model, and such modifications and variations all fall within the scope defined by the appended claims.
Claims
1. An endoscope camera, characterized in that, Comprising: A housing (1); A heating element (2) disposed within the housing (1); A heat dissipation structure (3) disposed between the inner wall of the housing (1) and the heating element (2); the heat dissipation structure (3) includes a first thermal interface material layer (31), a semiconductor refrigeration element (32), and a second thermal interface material layer (33) arranged in sequence. The semiconductor refrigeration element (32) has a heat absorption surface and a heat dissipation surface. The first thermal interface material layer (31) is respectively connected to the heating element (2) and the heat absorption surface, and the second thermal interface material layer (33) is respectively connected to the heat dissipation surface and the inner wall of the housing (1).
2. The endoscopic camera according to claim 1, wherein, The semiconductor refrigeration element (32) is configured as a sheet, and the thickness range of the semiconductor refrigeration element (32) is 3 - 6 mm.
3. The endoscopic camera according to claim 1, wherein, The semiconductor refrigeration element (32) is a semiconductor refrigeration sheet with an insulating substrate or a semiconductor refrigeration sheet with a metal substrate.
4. The endoscopic camera according to claim 1, wherein, The first thermal interface material layer (31) is a thermal conductive silicone grease layer, or a thermal conductive silica gel layer, or a phase change thermal conductive material layer, or a thermal conductive gel layer, or a graphite film layer; and the thickness range of the first thermal interface material layer (31) is 0.5 - 1.5 mm; And / or, the second thermal interface material layer (33) is a thermal conductive silicone grease layer, or a thermal conductive silica gel layer, or a phase change thermal conductive material layer, or a thermal conductive gel layer, or a graphite film layer; and the thickness range of the second thermal interface material layer (33) is 0.5 - 1.5 mm.
5. The endoscope camera according to any one of claims 1-4, characterized in that, The set area of the first thermal interface material layer (31) is not less than the set area of the heating element (2).
6. The endoscopic camera according to any one of claims 1-4, characterized in that, The heat dissipation structure (3) further includes a heat spreader layer disposed between the second thermal interface material layer (33) and the inner wall of the housing (1). The set area of the heat spreader layer is larger than the set area of the second thermal interface material layer (33), and the heat spreader layer covers the second thermal interface material layer (33).
7. The endoscope camera according to claim 6, characterized in that, The heat spreader layer is a VC heat pipe.
8. The endoscope camera according to any one of claims 1-4, characterized in that, The endoscope camera further includes a power source electrically connected to the semiconductor refrigeration element (32), and the power source is adapted to supply power to the semiconductor refrigeration element (32).
9. An endoscope camera system, characterized in that, Comprising: The endoscope camera according to any one of claims 1 - 8.
10. An endoscope, characterized in that, Comprising: The endoscope camera according to any one of claims 1 - 8.