Carrier heating device, carrier and heating system

Abstract

The utility model discloses a carrier heating device, a carrier and a heating system, relates to the technical field of vacuum coating, and aims to improve the heating effect on the carrier. The carrier heating device comprises a base, a carrier frame heating plate and a carrier plate heating plate, the carrier frame heating plate is connected to one side of the base, the carrier frame heating plate is provided with a carrier frame heating face deviating from the base, and the carrier frame heating face is used for making contact with the bottom face of a carrier frame. The carrier plate heating plate is connected to the side, away from the base, of the carrier frame heating plate, the carrier plate heating plate is provided with a carrier plate heating face deviating from the base, and the carrier plate heating face is used for making contact with the bottom face of the carrier plate. And the vertical projection of the carrier plate heating plate on the carrier frame heating plate is not overlapped with the carrier frame heating surface. The carrier heating device is used for heating the carrier.

Description

Technical Field

[0001] The present application relates to the field of vacuum coating technology, and in particular to a carrier heating device, a carrier and a heating system. Background Art

[0002] In the process of producing battery cells, the coating process of the substrate is involved. In the coating process, the carrier with the substrate will pass through the heating chamber and the coating chamber in sequence. In the heating chamber, the substrate will be heated to facilitate the coating of the substrate after entering the coating chamber.

[0003] In the related art, a heating device is provided in the heating chamber, and the heating device is arranged opposite to the carrier and at a distance, so as to ensure the normal transportation of the carrier on the basis of heating the carrier by non-contact heating. However, the heating effect of the non-contact heating method is poor. Utility Model Content

[0004] The embodiments of the present application provide a carrier heating device, a carrier, and a heating system for improving the heating effect of a carrier.

[0005] A first aspect of an embodiment of the present application provides a carrier heating device, comprising a base, a carrier frame heating plate, and a carrier plate heating plate, wherein the carrier frame heating plate is connected to one side of the base, the carrier frame heating plate has a carrier frame heating surface facing away from the base, and the carrier frame heating surface is used to contact the bottom surface of the carrier frame. The carrier plate heating plate is connected to a side of the carrier frame heating plate away from the base, the carrier plate heating plate has a carrier plate heating surface facing away from the base, and the carrier plate heating surface is used to contact the bottom surface of the carrier. The vertical projection of the carrier plate heating plate on the carrier frame heating plate does not overlap with the carrier frame heating surface.

[0006] In the carrier heating device provided in the embodiment of the present application, the base provides support for the carrier frame heating plate and the carrier plate heating plate. Since the vertical projection of the carrier plate heating plate on the carrier frame heating plate does not overlap with the carrier frame heating surface, the carrier frame heating surface and the carrier plate heating surface can provide mutual avoidance, so that after the carrier is placed on the carrier heating device, the carrier frame heating surface can contact the bottom surface of the carrier frame, and the carrier plate heating surface can contact the bottom surface of the carrier plate.

[0007] In this way, the carrier frame heating surface can heat the bottom surface of the carrier frame. Since the carrier board is set on the carrier frame, the heat will be transferred to the carrier board, and then transferred to the substrate on the carrier board. At the same time, the carrier board heating surface will also heat the bottom surface of the carrier board, and the heat will be directly transferred to the substrate through the carrier board. In this way, the entire carrier can be contact heated, and the heating effect is better.

[0008] In a possible implementation of the present application, the frame heating plate has an ineffective area opposite to the carrier heating plate, the vertical projection of the carrier heating plate on the frame heating plate is located in the ineffective area, and the frame heating surface surrounds the ineffective area.

[0009] With such a setting, since the vertical projection of the carrier plate heating plate on the carrier frame heating plate is located within the invalid area, and the carrier frame heating surface surrounds the invalid area, the carrier plate heating plate can avoid the carrier frame heating surface. Since the carrier frame heating surface surrounds the invalid area, the carrier frame heating surface is also in a frame shape, similar to the bottom surface of the carrier frame. In this way, the carrier frame heating surface can fit better with the bottom surface of the carrier frame, facilitating the heating of the bottom surface of the carrier frame.

[0010] In a possible implementation manner of the present application, the invalid area includes a plurality of sub-areas that are spaced apart and opposite to the carrier plate heating plate. The carrier plate heating plate includes a plurality of heating sub-plates, and the plurality of heating sub-plates are correspondingly arranged with the plurality of sub-areas. The vertical projection of the heating sub-plates on the carrier frame heating plate is located within the corresponding sub-areas. The side surfaces of the plurality of heating sub-plates facing away from the base form the carrier plate heating surface.

[0011] In this way, it can be applicable to different types of carrier frame forms, facilitating the carrier frame heating plate to heat the bottom surface of the carrier frame.

[0012] In a possible implementation manner of the present application, strip-shaped holes are formed on the side surfaces of the heating sub-plates, and the openings of the strip-shaped holes extend in the direction in which the plurality of heating sub-plates are away from each other.

[0013] With such a setting, when the heating sub-plates are deformed due to heat, the strip-shaped holes can have a guiding effect on the deformation direction of the heating sub-plates, so that the heating sub-plates are deformed in the direction away from each other, avoiding the narrowing of the gaps between the heating sub-plates, and ensuring that part of the carrier frame can smoothly pass through the gaps between the heating sub-plates and contact the carrier frame heating surface.

[0014] In a possible implementation manner of the present application, an opening penetrating the carrier frame heating plate is provided within the sub-area.

[0015] By providing an opening in the sub-area, on the basis of not affecting the heating of the bottom surface of the carrier frame by the carrier frame heating plate, the production material of the carrier frame heating plate can be reduced, and the material cost can be lowered.

[0016] In a possible implementation manner of the present application, the carrier frame heating plate includes a plurality of first slats and at least one second slat. The plurality of first slats are sequentially connected end to end to form a closed first frame structure. At least one second slat is disposed within the first frame structure and is connected to the first slats; the side surfaces of the first slats and the second slats facing away from the base include the carrier frame heating surface; the first slats and the second slats enclose a plurality of openings.

[0017] By setting the carrier plate heating plate in the form of the first slats and the second slats, it is applicable to the carrier frame with a frame bar structure, facilitating the heating of the bottom surface of the carrier frame.

[0018] In a possible implementation of the present application, it further includes a leveling component. At least one leveling component is connected between the base and at least one of the carrier frame heating plate and the carrier plate heating plate; in a direction perpendicular to the plane where the vehicle is located, the leveling component is used to drive at least one of the carrier frame heating plate and the carrier plate heating plate to move relative to the base.

[0019] By setting the leveling component, the flatness of the carrier frame heating plate can be adjusted to facilitate the fitting contact between the carrier frame heating surface and the bottom surface of the carrier frame; and / or, the flatness of the carrier plate heating plate can be adjusted to facilitate the fitting contact between the carrier plate heating surface and the bottom surface of the carrier plate.

[0020] In a possible implementation of the present application, the leveling component includes a connecting portion and an adjusting portion. The connecting portion is connected to the base, and the connecting portion can move along the arrangement direction of the base and the carrier frame heating plate. The adjusting portion is disposed on the side of the connecting portion away from the base and is threadedly connected to the connecting portion;

[0021] One side of the connecting portion facing away from the base abuts against the carrier frame heating plate. A first through hole is formed in the carrier frame heating surface. A part of the adjusting portion is disposed in the first through hole. One end of the adjusting portion away from the connecting portion has an abutting portion, and the abutting portion abuts against the side where the carrier frame heating surface is located; and / or,

[0022] One side of the connecting portion facing away from the base abuts against the carrier plate heating plate. A second through hole is formed in the carrier plate heating surface. A part of the adjusting portion is disposed in the second through hole. One end of the adjusting portion away from the connecting portion has an abutting portion, and the abutting portion abuts against the side where the carrier plate heating surface is located.

[0023] Through the above settings, at least one of the carrier frame heating surface and the carrier plate heating surface can be raised or lowered by adjusting the connecting portion and the adjusting portion, thereby adjusting the flatness of the carrier frame heating surface and the carrier plate heating surface. At the same time, the relative distance between the carrier frame heating surface and the carrier plate heating surface can also be adjusted to adapt to different types of vehicles.

[0024] In a possible implementation of the present application, the vehicle heating device further includes a carrier frame heat reflector and / or a carrier plate heat reflector. The carrier frame heat reflector is disposed between the carrier frame heating plate and the base and is opposite to the carrier frame heating plate; and / or, the carrier plate heat reflector is disposed between the carrier plate heating plate and the base and is opposite to the carrier plate heating plate.

[0025] Through the above settings, the heat radiated from the carrier frame heating plate to the carrier frame heat reflector will be reflected back to the carrier frame heating plate, and / or, the heat radiated from the carrier plate heating plate to the carrier plate heat reflector will be reflected back to the carrier plate heating plate, which can improve the utilization rate of heat.

[0026] A second aspect of the embodiments of the present application provides a carrier, including a carrier frame and a carrier plate, wherein the carrier frame has a carrier frame bottom surface, the carrier frame bottom surface has an avoidance area penetrating the carrier frame, and the carrier frame bottom surface is used to be arranged opposite to and in contact with the carrier frame heating surface of the carrier heating device. The carrier plate is connected to the side of the carrier frame that is away from the carrier frame bottom surface, the carrier plate has a carrier plate bottom surface, and the portion of the vertical projection of the carrier plate bottom surface on the carrier frame is located in the avoidance area, and the carrier plate bottom surface is used to be arranged opposite to and in contact with the carrier plate heating surface of the carrier heating device through the avoidance area.

[0027] In the carrier provided in the embodiment of the present application, the carrier frame provides support for the carrier plate, and the substrate can be placed on the carrier plate. Since the carrier frame heating surface heats the bottom surface of the carrier frame, and the carrier plate is arranged on the carrier frame, the heat will be transferred to the carrier plate, and then transferred to the substrate on the carrier plate. At the same time, the carrier plate heating surface will also heat the bottom surface of the carrier plate, and the heat will be directly transferred to the substrate through the carrier plate. By adopting the contact heating method, the heating effect can be improved.

[0028] In a possible implementation of the present application, the carrier also includes a pressing piece, which includes a main body and a pressing part. The main body passes through the carrier plate and is connected to the carrier frame. The pressing part is connected to an end of the main body away from the carrier frame and abuts against the side of the carrier plate away from the carrier frame.

[0029] By providing a pressing piece, the carrier is pressed against the carrier frame, so that during the transportation of the carrier, the vibration frequency of the carrier on the carrier frame can be reduced, or the carrier is prevented from vibrating on the carrier frame, thereby ensuring stable transportation of the carrier.

[0030] In a possible implementation of the present application, the carrier further includes a first connecting member and a second connecting member, wherein the first connecting member is disposed in the avoidance area and connected to the carrier frame. The second connecting member is disposed on a side of the carrier frame away from the first connecting member and connected to the carrier frame; the main body passes through the carrier plate and is respectively connected to the first connecting member and the second connecting member.

[0031] In this way, the pressing member can be connected to the carrier frame through the first connecting member and the second connecting member. Since the first connecting member and the second connecting member are respectively located inside and outside the carrier frame, the stability of the pressing member connection can be improved and the vibration reduction effect of the carrier can be improved.

[0032] In a possible implementation of the present application, the carrier frame includes a plurality of frame bars, the plurality of frame bars include a plurality of first frame bars and at least one second frame bar, and the plurality of first frame bars are sequentially connected end to end to form a closed second frame structure. At least one second frame bar is disposed in the second frame structure and connected to the first frame bar, and the first frame bar and the second frame bar form a plurality of avoidance areas; the bottom surfaces of the first frame bar, the second frame bar and the carrier frame heating surface constitute the carrier frame bottom surface.

[0033] By setting the carrier frame as the structure of the first border structure and the second frame bar, the overall stability of the carrier frame can be improved, and better support can be provided for the carrier board.

[0034] In a possible implementation manner of the present application, adjacent frame bars are connected by a mortise and tenon structure.

[0035] Connecting adjacent frame bars through a mortise and tenon structure can improve the connection stability.

[0036] In a possible implementation manner of the present application, within the plane perpendicular to the extension direction of the frame bar, the dimension of the frame bar in the direction perpendicular to the plane where the vehicle is located is greater than the dimension of the frame bar in the direction parallel to the plane where the vehicle is located.

[0037] In this way, the probability of deformation of at least one of the first frame bar and the second frame bar can be reduced, and the stability of the overall structure of the carrier frame can be ensured.

[0038] In a possible implementation manner of the present application, the frame bar includes multiple stacked frame plates, and the stacking direction is perpendicular to the extension direction of the frame bar and parallel to the plane where the vehicle is located.

[0039] In this way, it is convenient for the production and manufacturing of the frame bar.

[0040] In a possible implementation manner of the present application, the vehicle further includes a third connecting member. The third connecting member is arranged in the avoidance area, and the third connecting member is arranged at the intersection of adjacent frame bars, and the third connecting member is respectively connected to the adjacent frame bars.

[0041] By arranging a third connecting member at the intersection of at least one of adjacent first frame bars, adjacent second frame bars, and adjacent first and second frame bars, the connection stability between the frame bars can be improved.

[0042] The third aspect of the embodiments of the present application further provides a heating system, including a vehicle heating device and a vehicle. The vehicle heating device is the vehicle heating device mentioned in any of the above embodiments. The vehicle is the vehicle mentioned in any of the above embodiments; the vehicle is arranged on the vehicle heating device, and the carrier frame heating surface of the vehicle heating device is in contact with the bottom surface of the carrier frame of the vehicle, and the carrier board heating surface of the vehicle heating device is in contact with the bottom surface of the carrier board of the vehicle.

[0043] In the heating system provided by the embodiments of the present application, the carrier frame heating surface can heat the bottom surface of the carrier frame, and the carrier board heating surface can heat the bottom surface of the carrier board, so as to heat the entire vehicle by using the vehicle heating device and achieve a better heating effect on the carrier board.

[0044] In a possible implementation manner of the present application, the carrier frame heating surface is adapted to the bottom surface of the carrier frame; and / or, the carrier board heating surface is adapted to the bottom surface of the carrier board.

[0045] In this way, the heating surface of the carrier frame can better fit and heat with the bottom surface of the carrier frame, achieving a better heating effect. And / or, the heating surface of the carrier plate can better fit and heat with the bottom surface of the carrier plate, achieving a better heating effect. Description of the Drawings

[0046] Figure 1 Partial cross-sectional schematic diagram of the heating system provided by the embodiment of the present application;

[0047] Figure 2 Explosion schematic diagram of a vehicle heating device provided by the embodiment of the present application;

[0048] Figure 3 Top view schematic diagram of the vehicle heating device provided by the embodiment of the present application;

[0049] Figure 4 Partial cross-sectional schematic diagram of the leveling component cooperating with the carrier plate, carrier frame, and base provided by the embodiment of the present application;

[0050] Figure 5 Another partial cross-sectional schematic diagram of the leveling component cooperating with the carrier plate, carrier frame, and base provided by the embodiment of the present application;

[0051] Figure 6 External structure schematic diagram of the vehicle provided by the embodiment of the present application;

[0052] Figure 7 External structure schematic diagram of the carrier frame provided by the embodiment of the present application;

[0053] Figure 8 Partial enlarged schematic diagram of the pressing member cooperating with the carrier frame and carrier plate provided by the embodiment of the present application;

[0054] Figure 9 Another partial enlarged schematic diagram of the pressing member cooperating with the carrier frame and carrier plate provided by the embodiment of the present application;

[0055] Figure 10 Partial enlarged schematic diagram of the inclined surface provided on the second connecting member provided by the embodiment of the present application;

[0056] Figure 11 Partial enlarged schematic diagram of the first frame bar and the second frame bar connected by a mortise and tenon structure provided by the embodiment of the present application;

[0057] Figure 12 Another partial enlarged schematic diagram of the first frame bar and the second frame bar connected by a mortise and tenon structure provided by the embodiment of the present application;

[0058] Figure 13 Partial enlarged schematic diagram of the frame plates on the frame bar connected to each other provided by the embodiment of the present application;

[0059] Figure 14 Another partial enlarged schematic diagram of the connection between the frame plates on the frame bar provided by the embodiment of the present application;

[0060] Figure 15 A cross-sectional schematic diagram of the connection between the frame plates on the frame bar provided by the embodiment of the present application;

[0061] Figure 16 A partial enlarged schematic diagram of the connection between the third connecting member and the frame bar provided by the embodiment of the present application;

[0062] Figure 17 Another partial enlarged schematic diagram of the connection between the third connecting member and the frame bar provided by the embodiment of the present application;

[0063] Figure 18 Another partial enlarged schematic diagram of the connection between the third connecting member and the frame bar provided by the embodiment of the present application.

[0064] Reference numerals:

[0065] 01 - Heating system;

[0066] 1 - Vehicle heating device; 11 - Base; 111 - Carrier plate; 1111 - Body plate; 1112 - Carrier block; 112 - Lifting seat; 12 - Carrier frame heating plate; 121 - Carrier frame heating surface; b - Opening; d - First through hole; 122 - First strip; 123 - Second strip; 13 - Carrier plate heating plate; 131 - Carrier plate heating surface; e - Second through hole; 132 - Heating sub - plate; c - Slot; a - Invalid area; a1 - Sub - area; 14 - Leveling component; 141 - Connection part; 1411 - Connection column; 1412 - Adjusting column; 142 - Adjusting part; 1421 - Abutting part; 15 - Carrier frame heat - reflecting plate; 16 - Carrier plate heat - reflecting plate;

[0067] 2 - Vehicle; 21 - Carrier frame; f - Avoidance area; 211 - Carrier frame bottom surface; W - Frame bar; W1 - Frame plate; 212 - First frame bar; 213 - Second frame bar; 22 - Carrier plate; 221 - Carrier plate bottom surface; 222 - Sub - plate; 23 - Pressing member; 231 - Body part; B1 - First body column; B2 - Second body column; 232 - Pressing part; 24 - First connecting member; 25 - Second connecting member; 251 - Inclined surface; C1 - First screw; C2 - First anti - loosening top screw; C3 - Second screw; C4 - Second anti - loosening top screw; C5 - Third screw; D1 - Anti - collision block; F - Mortise - and - tenon structure; F1 - Protruding part; F2 - Recessed part; 26 - Third connecting member; 261 - First connecting plate; 262 - Second connecting plate. Detailed implementation manners

[0068] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the following will further describe the specific technical solutions of this application in detail with reference to the accompanying drawings in the embodiments of this application. The following embodiments are used to illustrate this application but are not used to limit the scope of this application.

[0069] In the embodiments of this application, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of this application, unless otherwise stated, the meaning of "a plurality" is two or more.

[0070] In addition, in the embodiments of this application, orientation terms such as "upper", "lower", "left", and "right" are defined relative to the orientation in which the components in the drawings are schematically placed. It should be understood that these directional terms are relative concepts, and they are used for relative description and clarification, and they can change accordingly with the change of the orientation in which the components in the drawings are placed.

[0071] In the embodiments of this application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or integrated; it can be directly connected or indirectly connected through an intermediate medium.

[0072] In the embodiments of this application, the terms "include", "comprise", or any other variant thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device that includes a series of elements includes not only those elements but also other elements not expressly listed, or elements that are inherent to such process, method, article, or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, article, or device that includes the element.

[0073] In the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or explanations. Any embodiment or design solution described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of words such as "exemplary" or "for example" is intended to present relevant concepts in a specific manner.

[0074] The production process of solar cells mainly involves processes such as heating and coating of the substrate. Specifically, the substrate is placed on a carrier, and the carrier can be transported on a conveyor line. During the transportation process, the carrier will pass through a heating space, and in the heating space, the substrate will be heated to facilitate the subsequent coating process of the substrate.

[0075] In the related art, a heating device is provided in a heating space. The heating device is opposite to and spaced from the carrier, so as to heat the carrier and the substrate in a non-contact heating manner, and facilitate the subsequent conveyance of the carrier. However, the heating effect of the non-contact heating method is poor.

[0076] Based on this, as Figure 1 , Figure 2 shown, the present application provides a heating system 01. The heating system 01 includes a carrier 2 and a carrier heating device 1. The carrier 2 is used to carry a substrate. The carrier heating device 1 has a carrier frame heating surface 121 and a carrier plate heating surface 131. The carrier frame heating surface 121 is in contact with the bottom surface 211 of the carrier frame of the carrier 2, and the carrier plate heating surface 131 is in contact with the bottom surface 221 of the carrier plate of the carrier 2.

[0077] Among them, the substrate may include a silicon wafer. For example, the silicon wafer may be a single-crystal silicon wafer or a polycrystalline silicon wafer, etc. Of course, the substrate may also be any other suitable thin-film structure.

[0078] In this way, the carrier frame heating surface 121 can heat the bottom surface 211 of the carrier frame, and the heat will be conducted to the carrier plate 22 through the part where the carrier frame 21 contacts the carrier plate 22 (a part of the bottom surface of the carrier plate 22), and then conducted to the substrate on the carrier plate 22. And the carrier plate heating surface 131 can heat the bottom surface 221 of the carrier plate, and the heat will be directly conducted to the substrate through the bottom surface 221 of the carrier plate. In this way, the carrier heating device 1 is used to heat the entire carrier 2, achieving a better heating effect on the carrier plate 22. Compared with the non-contact heating method, the contact heating method adopted in the present application can achieve a better heating effect.

[0079] In some embodiments, as Figure 1 shown, the carrier frame heating surface 121 is adapted to the bottom surface 211 of the carrier frame. In this way, the carrier frame heating surface 121 can heat the carrier frame 21 better, thereby ensuring the heating efficiency of the substrate.

[0080] It can be understood that the carrier frame heating surface 121 being adapted to the bottom surface 211 of the carrier frame means that the shape of the carrier frame heating surface 121 is the same as the shape of the bottom surface 211 of the carrier frame, and the carrier frame heating surface 121 can exactly fit and heat the entire bottom surface 211 of the carrier frame.

[0081] In some embodiments, as Figure 1 shown, the carrier plate heating surface 131 is adapted to the bottom surface 221 of the carrier plate. In this way, the carrier plate heating surface 131 can heat the carrier plate 22 better, thereby ensuring the heating efficiency of the substrate.

[0082] It should be noted that the fact that the heating surface 131 of the carrier plate is adapted to the bottom surface 221 of the carrier plate means that the shape of the heating surface 131 of the carrier plate is the same as that of the part of the bottom surface 221 of the carrier plate not blocked by the carrier frame 21, and the heating surface 131 of the carrier plate is in complete contact with the part of the bottom surface 221 of the carrier plate not blocked by the carrier frame 21 for heating.

[0083] In some embodiments, as Figure 1 shown, the heating surface 121 of the carrier frame is adapted to the bottom surface 211 of the carrier frame, and the heating surface 131 of the carrier plate is adapted to the bottom surface 221 of the carrier plate. In this way, the heating surface 121 of the carrier frame can heat the carrier frame 21 better, so as to ensure the heating efficiency of the substrate. At the same time, the heating surface 131 of the carrier plate can heat the carrier plate 22 better, so as to ensure the heating efficiency of the substrate.

[0084] Based on the above design concept, the present application also provides a carrier heating device 1 and a carrier 2 respectively. The following is a detailed introduction.

[0085] For the carrier heating device 1, as Figure 1 、 Figure 2 shown, the carrier heating device 1 in some embodiments of the present application includes a base 11, a carrier frame heating plate 12 and a carrier plate heating plate 13. The carrier frame heating plate 12 is connected to one side of the base 11. The carrier frame heating plate 12 has a carrier frame heating surface 121 facing away from the base 11, and the carrier frame heating surface 121 is used to contact the bottom surface 211 of the carrier frame. The carrier plate heating plate 13 is connected to the side of the carrier frame heating plate 12 away from the base 11. The carrier plate heating plate 13 has a carrier plate heating surface 131 facing away from the base 11, and the carrier plate heating surface 131 is used to contact the bottom surface 221 of the carrier plate. The vertical projection of the carrier plate heating plate 13 on the carrier frame heating plate 12 does not overlap with the carrier frame heating surface 121.

[0086] It can be understood that the fact that the carrier plate heating plate 13 is connected to the side of the carrier frame heating plate 12 away from the base 11 means that the carrier plate heating plate 13 is connected to the carrier frame heating plate 12, or the carrier plate heating plate 13 is connected to the base 11.

[0087] In some examples, as Figure 2As shown, the base 11 includes a carrier plate 111 and a lifting seat 112. The carrier plate 111 is arranged on the lifting seat 112. The lifting seat 112 can drive the carrier plate 111 to rise and fall. The frame heating plate 12 and the carrier heating plate 13 are connected to the side of the carrier plate 111 away from the lifting seat 112. With such a configuration, the carrier plate 111 can be more convenient for connecting the frame heating plate 12 and the carrier heating plate 13. The lifting seat 112 can drive the frame heating plate 12 and the carrier heating plate 13 to rise and fall. When the carrier 2 passes through the carrier heating device 1, the carrier plate 111 drives the frame heating plate 12 and the carrier heating plate 13 to rise, so that the frame heating surface 121 contacts the frame bottom surface 211, and the carrier heating surface 131 contacts the carrier bottom surface 221. After heating is completed, the frame heating plate 12 and the carrier heating plate 13 are lowered to allow the carrier 2 to continue to be transported.

[0088] In some examples, such as Figure 1 As shown, the carrier plate 111 includes a main body plate 1111 and a plurality of carrier blocks 1112 arranged around the main body plate 1111, the main body plate 1111 is connected to the lifting seat 112, the carrier blocks 1112 are connected to the bottom edge of the main body plate 1111, the carrier frame heating plate 12 is connected to the carrier blocks 1112, and the carrier plate heating plate 13 is connected to the main body plate 1111. In this arrangement, the carrier frame heating plate 12 can be arranged on the periphery of the carrier plate heating plate 13, which is convenient for the connection between the two and the carrier plate 111.

[0089] Through the above arrangement, the base 11 provides support for the frame heating plate 12 and the carrier heating plate 13. Since the vertical projection of the carrier heating plate 13 on the frame heating plate 12 does not overlap with the frame heating surface 121, the frame heating surface 121 and the carrier heating surface 131 can provide mutual avoidance, so that after the carrier 2 is placed on the carrier heating device 1, the frame heating surface 121 can contact the frame bottom surface 211, and the carrier heating surface 131 can contact the carrier bottom surface 221.

[0090] In this way, the frame heating surface 121 can heat the frame bottom surface 211. Since the carrier 22 is disposed on the frame 21, the heat will be transferred to the carrier 22, and then to the substrate on the carrier 22. At the same time, the carrier heating surface 131 will also heat the carrier bottom surface 221, and the heat will be directly transferred to the substrate through the carrier 22. In this way, the entire carrier 2 can be contact-heated, and the heating effect is better.

[0091] On this basis, in some embodiments, such as Figure 1 , Figure 3 As shown, the frame heating plate 12 has an ineffective area a opposite to the carrier heating plate 13 , the vertical projection of the carrier heating plate 13 on the frame heating plate 12 is located in the ineffective area a, and the frame heating surface 121 surrounds the ineffective area a.

[0092] Among them, the vertical projection of the carrier plate heating plate 13 on the carrier frame heating plate 12 is located within the invalid area a, and it can coincide with the invalid area a, or it can only occupy a part of the invalid area a.

[0093] In some examples, the outer contour of the invalid area a can be a regular shape such as a square or a circle, or the outer contour of the invalid area a can also be an irregular shape.

[0094] In some examples, as Figure 1 shown, there is an opening b penetrating the carrier frame heating plate 12 within the invalid area a. In this way, on the basis of not affecting the heating of the carrier frame 21 by the carrier frame heating plate 12, the material cost of the carrier frame heating plate 12 can be reduced.

[0095] Exemplarily, the outer contour of the opening b coincides with the outer contour of the invalid area a. In this way, the material cost of the carrier frame heating plate 12 can be reduced to the greatest extent.

[0096] Through the above settings, since the vertical projection of the carrier plate heating plate 13 on the carrier frame heating plate 12 is located within the invalid area a, and the carrier frame heating surface 121 surrounds the invalid area a, the carrier plate heating plate 13 can avoid the carrier frame heating surface 121 so that the carrier frame heating surface 121 can contact the bottom surface 211 of the carrier frame. And because the carrier frame heating surface 121 surrounds the invalid area a, the carrier frame heating surface 121 surrounds the carrier plate heating plate 13. In this way, the carrier frame heating surface 121 is in a frame shape and can be similar to the frame-shaped bottom surface 211 of the carrier frame, which can make the carrier frame heating surface 121 more fitting with the bottom surface 211 of the carrier frame and facilitate the heating of the bottom surface 211 of the carrier frame.

[0097] On this basis, as Figure 2 、 Figure 3 shown, the invalid area a includes a plurality of sub-areas a1 that are spaced apart and opposite to the carrier plate heating plate 13. The carrier plate heating plate 13 includes a plurality of heating sub-plates 132. The plurality of heating sub-plates 132 are correspondingly arranged with the plurality of sub-areas a1. The vertical projection of the heating sub-plate 132 on the carrier frame heating plate 12 is located within the corresponding sub-area a1. The side surfaces of the plurality of heating sub-plates 132 facing away from the base 11 constitute the carrier plate heating surface 131.

[0098] It can be understood that in this case, the carrier frame heating surface 121 includes the side surfaces of the carrier frame heating plate 12 within the area between the sub-areas a1 and the side surfaces of the carrier frame heating plate 12 within the area surrounding the plurality of sub-areas a1 at the same time.

[0099] In some examples, the number of the sub-areas a1 can be two, three, four, five, etc.

[0100] Exemplarily, both the number of the heating sub-boards 132 and the number of the sub-regions a1 are four. The four sub-regions a1 are arranged at intervals in a two-row and two-column manner. In this way, the region between the four sub-regions a1 is in a shape similar to a "plus" sign, and then the overall shape of the carrier frame heating surface 121 is in a shape similar to a "field" character. Thus, it is suitable for contact heating of the bottom surface 211 of the carrier frame in the shape of a "field" character.

[0101] Exemplarily, both the number of the heating sub-boards 132 and the number of the sub-regions a1 are two. In this way, the region between the four sub-regions a1 is in a shape similar to a "one" character, and then the overall shape of the carrier frame heating surface 121 is in a shape similar to a "sun" character. Thus, it is suitable for contact heating of the bottom surface 211 of the carrier frame in the shape of a "sun" character.

[0102] Through the above settings, the carrier frame heating surface 121 can be suitable for heating the carrier frame 21 with reinforcing frame bars inside, such as the carrier frame 21 in the shape of a "sun" character or a "field" character. Since such a carrier frame 21 has high structural strength, it is widely used. Therefore, this design of the carrier frame heating plate 12 has a wider range of use.

[0103] On this basis. In some embodiments, as Figure 2 、 Figure 3 shown, strip-shaped holes c are formed on the side surfaces of the heating sub-boards 132. The openings of the strip-shaped holes c extend in the direction away from each other of the multiple heating sub-boards 132.

[0104] It should be explained that the side surfaces of the heating sub-boards 132 refer to the two opposite side surfaces of the heating sub-boards 132 in the arrangement direction of the carrier frame heating plate 12 and the carrier plate heating plate 13.

[0105] Among them, the strip-shaped holes c can be through holes penetrating the heating sub-boards 132, or can also be blind holes.

[0106] In some examples, strip-shaped holes c are formed on each heating sub-board 132. In this way, the strip-shaped holes c can play a guiding role in the thermal expansion of each heating sub-board 132.

[0107] In some examples, as Figure 3 shown, the number of the heating sub-boards 132 is four. The four heating sub-boards 132 are arranged in a two-row and two-column manner. The strip-shaped holes c on the two diagonally arranged heating sub-boards 132 extend in the diagonal directions respectively. In this way, when the heating sub-boards 132 are deformed due to heat, the deformation directions of the heating sub-boards 132 will simultaneously move away from the other three heating sub-boards 132. Thus, it can be avoided that the heating sub-boards 132 are pressed inward, ensuring that the middle frame bar part of the carrier frame 21 can smoothly pass through the gap between the adjacent heating sub-boards 132 and contact with the carrier frame heating surface 121.

[0108] With the above settings, when the heating sub-board 132 deforms due to heat, the strip-shaped hole c can guide the deformation direction of the heating sub-board 132, so that the heating sub-board 132 deforms in a direction away from each other, avoiding the narrowing of the gap between adjacent heating sub-boards 132, ensuring that the middle frame part of the carrier frame 21 can smoothly pass through the gap between the heating sub-boards 132 and contact the carrier frame heating surface 121, and improving the overall reliability of the carrier heating device 1.

[0109] In some embodiments, as Figure 2 shown, the sub-region a1 has an opening b penetrating through the carrier frame heating plate 12. With this setting, since the opening b is located in the sub-region a1, the setting of the opening b will not affect the carrier frame heating surface 121, nor will it affect the heating of the carrier frame 21 by the carrier frame heating plate 12. At the same time, the material cost of the carrier frame heating plate 12 can be reduced.

[0110] In some examples, the outer contour of the opening b coincides with the outer contour of the sub-region a1, so that the material cost of the carrier frame heating plate 12 can be reduced to the greatest extent.

[0111] On this basis, as Figure 2 shown, the carrier frame heating plate 12 includes a plurality of first slats 122 and at least one second slat 123. The plurality of first slats 122 are connected end to end in sequence to form a closed first frame structure. At least one second slat 123 is disposed within the first frame structure and is connected to the first slats 122. The surfaces of the first slats 122 and the second slats 123 facing away from the base 11 include the carrier frame heating surface 121. The first slats 122 and the second slats 123 enclose a plurality of openings b.

[0112] It can be understood that the plurality of first slats 122 and the second slats 123 should be in a plane parallel to the plane where the carrier 2 is located, so as to facilitate the assembly of the first slats 122 and the second slats 123.

[0113] Among them, the number of the first slats 122 can be two, three, four, or five, etc.

[0114] Exemplarily, the number of the first slats 122 is four. The four first slats 122 are connected end to end in sequence, and two adjacent first slats 122 are perpendicular to each other, thereby enclosing a square frame structure.

[0115] In addition, the number of the second slats 123 can be one, two, three, or four, etc.

[0116] Exemplarily, the number of the second slats 123 is two, and the two second slats 123 are arranged crosswise and perpendicularly.

[0117] In some examples, two adjacent first slats 122 can be connected by a mortise and tenon structure F, or can also be fastened by screws.

[0118] In some examples, the first slat 122 and the second slat 123 can be connected by a mortise and tenon structure F, or can also be fastened by screws.

[0119] With the above arrangement, the carrier frame heating plate 12 is composed of the first slat 122 and the second slat 123. Since the opening b is surrounded by the first slat 122 and the second slat 123, the formation of the opening b is relatively convenient. In addition, the forms of the first slat 122 and the second slat 123 can also facilitate the transportation and assembly of the carrier frame heating plate 12.

[0120] Of course, in some other embodiments, the opening b can also be directly formed on the carrier frame 21.

[0121] After the carrier frame heating plate 12 and the carrier plate heating plate 13 are heated, they may deform, resulting in the deformation of the carrier frame heating surface 121 and the carrier plate heating surface 131. Therefore, in order to ensure that the carrier frame heating surface 121 can better contact the bottom surface 211 of the carrier frame, and the carrier plate heating surface 131 can better contact the bottom surface 221 of the carrier plate, it is necessary to ensure the flatness of the carrier frame heating surface 121 and the carrier plate heating surface 131.

[0122] Based on this, as Figure 1 shown, in some embodiments of the present application, the carrier heating device 1 further includes a leveling assembly 14. At least one leveling assembly 14 is connected between the base 11 and at least one of the carrier frame heating plate 12 and the carrier plate heating plate 13. In the direction perpendicular to the plane where the carrier 2 is located ( Figure 1 the vertical direction in

[0123] ), the leveling assembly 14 is used to drive at least one of the carrier frame heating plate 12 and the carrier plate heating plate 13 to move relative to the base 11.

[0124] In some examples, a plurality of leveling assemblies 14 are provided between the carrier frame heating plate 12 and the base 11. The plurality of leveling assemblies 14 are arranged at intervals, and different leveling assemblies 14 correspond to different positions of the carrier frame heating plate 12. In this way, by adjusting different leveling assemblies, the different positions of the carrier frame heating plate 12 can be driven to rise or fall relative to the base 11, so as to adjust the flatness of the carrier frame heating surface 121, so that the carrier frame heating surface 121 can better contact the bottom surface 211 of the carrier frame. In addition, by adjusting a plurality of leveling assemblies 14 simultaneously, the overall height of the carrier frame heating plate 12 can also be adjusted.

[0125] Of course, a leveling component 14 can also be provided between the carrier frame heating plate 12 and the base 11. In this case, the carrier frame heating plate 12 needs to be fixed to the base 11 through other fasteners, so that the distance between the carrier frame heating plate 12 and the base 11 at the corresponding position can be adjusted by adjusting the leveling component 14.

[0126] In some examples, a plurality of leveling components 14 are provided between the carrier plate heating plate 13 and the base 11. The plurality of leveling components 14 are arranged at intervals, and different leveling components 14 correspond to different positions of the carrier plate heating plate 13. In this way, by adjusting different leveling components 14, the carrier plate heating plate 13 at different positions can be driven to rise or fall relative to the base 11, so as to adjust the flatness of the carrier plate heating surface 131, so that the carrier plate heating surface 131 can better contact the bottom surface 221 of the carrier plate. In addition, by adjusting a plurality of leveling components 14 simultaneously, the overall height of the carrier plate heating plate 13 can also be adjusted.

[0127] Exemplarily, the plurality of leveling components 14 between the carrier plate heating plate 13 and the base 11 are arranged in the shape of the carrier plate heating surface 131.

[0128] Of course, a leveling component 14 can also be provided between the carrier plate heating plate 13 and the base 11. In this case, the carrier plate heating plate 13 needs to be fixed to the base 11 through other fasteners, so that the distance between the carrier plate heating plate 13 and the base 11 at the corresponding position can be adjusted by adjusting the leveling component 14.

[0129] Exemplarily, an opening b is provided in the invalid area a, and the leveling component 14 is connected to the base 11 and the carrier plate heating plate 13 through the opening b.

[0130] Through the above settings, by adjusting the leveling component 14, the carrier frame heating plate 12 at different positions can be driven to move up and down relative to the base 11, so as to adjust the distance between different positions of the carrier frame heating surface 121 and the base 11, thereby adjusting the flatness of the carrier frame heating surface 121 and facilitating the fitting contact between the carrier frame heating surface 121 and the bottom surface 211 of the carrier frame. And / or, by adjusting the leveling component 14, the carrier plate heating plate 13 at different positions can be driven to move up and down relative to the base 11, so as to adjust the distance between different positions of the carrier plate heating surface 131 and the base 11, thereby adjusting the flatness of the carrier plate heating surface 131 and facilitating the fitting contact between the carrier plate heating surface 131 and the bottom surface 221 of the carrier plate. In this way, the heating effect of the carrier heating device 1 on the carrier 2 is ensured.

[0131] On this basis, in some embodiments, such as Figure 4As shown, the leveling component 14 includes a connecting portion 141 and an adjusting portion 142. The connecting portion 141 is connected to the base 11, and the connecting portion 141 can move along the arrangement direction of the base 11 and the carrier frame heating plate 12. The adjusting portion 142 is disposed on the side of the connecting portion 141 away from the base 11 and is threadedly connected to the connecting portion 141.

[0132] As Figure 4 shown, the side of the connecting portion 141 facing away from the base 11 abuts against the carrier frame heating plate 12. A first through hole d is formed in the carrier frame heating surface 121. A part of the adjusting portion 142 is disposed in the first through hole d. The end of the adjusting portion 142 away from the connecting portion 141 has an abutting portion 1421, and the abutting portion 1421 abuts against the side where the carrier frame heating surface 121 is located; and / or,

[0133] As Figure 4 shown, the side of the connecting portion 141 facing away from the base 11 abuts against the carrier plate heating plate 13. A second through hole e is formed in the carrier plate heating surface 131. A part of the adjusting portion 142 is disposed in the second through hole e. The end of the adjusting portion 142 away from the connecting portion 141 has an abutting portion 1421, and the abutting portion 1421 abuts against the side where the carrier plate heating surface 131 is located.

[0134] In some examples, the connecting portion 141 is threadedly connected to the base 11. In this way, the connecting portion 141 can be rotated to drive the connecting portion 141 to move up and down relative to the base 11.

[0135] In some examples, the first through hole d is a countersunk hole. The abutting portion 1421 abutting against the side where the carrier frame heating surface 121 is located is located in the first through hole d and abuts against the stepped surface of the countersunk hole. In this way, the countersunk hole can provide a receiving space for the abutting portion 1421. When the carrier frame heating surface 121 contacts the bottom surface 211 of the carrier frame, the abutting portion 1421 can be prevented from interfering with the contact, so as to better utilize the carrier frame heating surface 121 to heat the carrier frame 21.

[0136] In some examples, the second through hole e is a countersunk hole. The abutting portion 1421 abutting against the side where the carrier plate heating surface 131 is located is located in the second through hole e and abuts against the stepped surface of the countersunk hole. In this way, the countersunk hole can provide a receiving space for the abutting portion 1421. When the carrier plate heating surface 131 contacts the bottom surface 221 of the carrier plate, the abutting portion 1421 can be prevented from interfering with the contact, so as to better utilize the carrier plate heating surface 131 to heat the carrier plate 22.

[0137] In this case, exemplarily, the second through hole e is a strip-shaped hole c. In this way, the second through hole e can not only guide the thermal deformation of the heating sub-plate 132, but also realize the setting of the adjusting portion 142.

[0138] Through the above settings, the partial positions of at least one of the carrier frame heating surface 121 and the carrier plate heating surface 131 can be raised or lowered by adjusting the connecting portion 141 and the adjusting portion 142, so as to adjust the flatness of at least one of the carrier frame heating surface 121 and the carrier plate heating surface 131, so that the carrier frame heating surface 121 can better contact and heat the bottom surface 211 of the carrier frame, and / or the carrier plate heating surface 131 can better contact and heat the bottom surface 221 of the carrier plate. At the same time, the relative distance between the carrier frame heating surface 121 and the carrier plate heating surface 131 can also be adjusted to adapt to different types of carriers 2.

[0139] On this basis, as Figure 5 shown, the connecting portion 141 includes a connecting column 1411 and an adjusting column 1412. The connecting column 1411 is connected to the base 11. The adjusting column 1412 is disposed on the side of the connecting column 1411 away from the base 11 and is threadedly connected to the connecting column 1411. One end of the adjusting portion 142 close to the connecting portion 141 passes through the adjusting column 1412 and is threadedly connected to the connecting column 1411;

[0140] The side of the adjusting column 1412 away from the connecting column 1411 abuts against the carrier frame heating plate 12; and / or the side of the adjusting column 1412 away from the connecting column 1411 abuts against the carrier plate heating plate 13.

[0141] Through the above settings, the partial positions of at least one of the carrier frame heating surface 121 and the carrier plate heating surface 131 can be raised or lowered by adjusting the adjusting column 1412 and the adjusting portion 142, so as to adjust the flatness of at least one of the carrier frame heating surface 121 and the carrier plate heating surface 131, so that the carrier frame heating surface 121 can better contact and heat the bottom surface 211 of the carrier frame, and / or the carrier plate heating surface 131 can better contact and heat the bottom surface 221 of the carrier plate. At the same time, the relative distance between the carrier frame heating surface 121 and the carrier plate heating surface 131 can also be adjusted to adapt to different types of carriers 2. In addition, since the leveling assembly 14 is connected to the base 11 through the connecting column 1411, the setting stability of the leveling assembly 14 can be improved.

[0142] In some embodiments, as Figure 1 shown, the carrier heating device 1 further includes a carrier frame heat reflector 15 and / or a carrier plate heat reflector 16. The carrier frame heat reflector 15 is disposed between the carrier frame heating plate 12 and the base 11 and is opposite to the carrier frame heating plate 12. And / or the carrier plate heat reflector 16 is disposed between the carrier plate heating plate 13 and the base 11 and is opposite to the carrier plate heating plate 13.

[0143] In some examples, the carrier frame heat reflector 15 can be made to have heat reflection ability by coating a heat reflection material on the surface of the carrier frame heat reflector 15.

[0144] In some examples, the carrier heat reflective plate 16 may have heat reflective capability by coating a heat reflective material on the surface of the carrier heat reflective plate 16 .

[0145] In some examples, there can be multiple frame heat reflection plates 15, and multiple frame heat reflection plates 15 are arranged in sequence and spaced apart along the arrangement direction of the base 11 and the frame 21. At the same time, multiple frame heat reflection plates 15 are used to reflect the heat on the frame heating plate 12, thereby improving the utilization rate of heat.

[0146] Exemplarily, the number of the frame heat reflection plates 15 may be two, three, four or five.

[0147] Of course, the number of the frame heat reflection plate 15 can also be one.

[0148] In some examples, there can be multiple carrier heat reflecting plates 16, and multiple carrier heat reflecting plates 16 are arranged in sequence and spaced apart along the arrangement direction of the base 11 and the carrier 22. At the same time, multiple carrier heat reflecting plates 16 are used to reflect the heat on the carrier heating plate 13, thereby improving the utilization rate of heat.

[0149] Exemplarily, the number of the carrier heat reflection plates 16 may be two, three, four or five.

[0150] Of course, the number of the carrier heat reflection plate 16 can also be one.

[0151] Through the above configuration, the heat radiated from the frame heating plate 12 to the frame heat reflecting plate 15 will be reflected to the frame heating plate 12. And / or, the heat radiated from the carrier heating plate 13 to the carrier heat reflecting plate 16 will be reflected to the carrier heating plate 13, thereby improving the utilization rate of heat.

[0152] For vehicle 2, if Figure 1 , Figure 6 , Figure 7 As shown, the carrier 2 provided in some embodiments of the present application includes a carrier frame 21 and a carrier plate 22. The carrier frame 21 has a carrier frame bottom surface 211. The carrier frame bottom surface 211 has an avoidance area f that penetrates the carrier frame 21. The carrier frame bottom surface 211 is used to be arranged opposite to and in contact with the carrier frame heating surface 121 of the carrier heating device 1. The carrier plate 22 is connected to the side of the carrier frame 21 that is away from the carrier frame bottom surface 211. The carrier plate 22 has a carrier plate bottom surface 221. The part of the vertical projection of the carrier plate bottom surface 221 on the carrier frame 21 is located in the avoidance area f. The carrier plate bottom surface 221 is used to be arranged opposite to and in contact with the carrier plate heating surface 131 of the carrier heating device 1 through the avoidance area f.

[0153] It can be understood that the carrier heating surface 131 is only in contact with the portion of the carrier bottom surface 221 that is not blocked by the carrier frame 21 .

[0154] In some examples, such as Figure 6 shown, the carrier plate 22 includes a plurality of sub-plates 222, and the plurality of sub-plates 222 are located in a plane parallel to the plane where the carrier 2 is located. The plurality of sub-plates 222 are spliced into an integral carrier plate 22, and the bottom surfaces of the plurality of sub-plates 222 facing the heating surface 131 of the carrier plate form the bottom surface 221 of the carrier plate.

[0155] Exemplarily, the number of the sub-plates 222 is four, and the four sub-plates 222 are in contact with the heating surface 131 of the carrier plate through the avoidance areas f.

[0156] In some examples, such as Figure 7 shown, a plurality of avoidance areas f are provided, and the plurality of avoidance areas f are arranged at intervals. In this way, the entire carrier frame 21 is a frame-shaped structure with a reinforcing frame bar in the middle, which can ensure the structural strength of the entire carrier frame 21.

[0157] In some examples, the number of the avoidance areas f is four, and the number of the sub-plates 222 is four. Each sub-plate 222 corresponds to one avoidance area f, and a part of the bottom surface of each sub-plate 222 is in contact with the heating surface 131 of the carrier plate through the corresponding avoidance area f for heating.

[0158] In some examples, the vertical projection of the carrier plate 22 on the carrier frame 21 coincides with the outer contour of the carrier frame 21. In this way, the carrier frame 21 can exactly provide support for the entire carrier plate 22.

[0159] In some examples, the carrier plate 22 further has a top surface of the carrier plate opposite to the bottom surface 221 of the carrier plate, and a plurality of grooves are provided on the top surface of the carrier plate. The grooves are used for loading substrates, so as to ensure the stability during the transportation of the substrates.

[0160] Through the above settings, the carrier frame 21 provides support for the carrier plate 22, and substrates can be placed on the carrier plate 22. Since the heating surface 121 of the carrier frame heats the bottom surface 211 of the carrier frame, and the carrier plate 22 is arranged on the carrier frame 21, the heat will be conducted to the carrier plate 22 and then to the substrates on the carrier plate 22. At the same time, the heating surface 131 of the carrier plate will also heat the bottom surface 221 of the carrier plate, and the heat will be directly conducted to the substrates through the carrier plate 22. By adopting the contact heating method, the heating effect can be improved.

[0161] In some embodiments, such as Figure 8 、 Figure 9 shown, the carrier 2 further includes a pressing member 23. The pressing member 23 includes a body portion 231 and a pressing portion 232. The body portion 231 passes through the carrier plate 22 and is connected to the carrier frame 21. The pressing portion 232 is connected to one end of the body portion 231 away from the carrier frame 21 and abuts against the side surface of the carrier plate 22 facing away from the carrier frame 21.

[0162] It can be understood that communication holes are provided on the side surface of the carrier plate 22, and the pressing member 23 passes through the carrier plate 22 through the communication holes.

[0163] In some examples, a plurality of pressing members 23 are provided. The plurality of pressing members 23 are arranged at intervals along the edge area of the side surface of the carrier plate 22 facing away from the carrier frame 21. In this way, each pressing member 23 can apply a pressure to the carrier plate 22 in a direction approaching the carrier frame 21, so that the carrier plate 22 can be better pressed on the carrier frame 21. In this way, during the transportation of the carrier 2, the vibration frequency of the carrier plate 22 can be reduced, ensuring the stability of the substrate transportation.

[0164] In some examples, the pressing portion 232 is a plate-like structure, and the side surface of the plate-like structure is in fitting contact with the side surface of the carrier plate 22 facing away from the carrier frame 21. In this way, the contact area can be increased, improving the vibration damping effect.

[0165] Through the above settings, the body portion 231 connects the pressing portion 232 to the carrier frame 21, and the pressing portion 232 can press the carrier plate 22 on the carrier frame 21. In this way, during the transportation of the carrier 2, the vibration frequency of the carrier plate 22 on the carrier frame 21 can be reduced, or the vibration of the carrier plate 22 on the carrier frame 21 can be avoided, thereby ensuring the stable transportation of the carrier plate 22 and the stable transportation of the substrate.

[0166] After passing through the carrier plate 22, the pressing member 23 can be directly connected to the carrier frame 21, or can also be connected to the carrier frame 21 through the first connecting member 24 and the second connecting member 25.

[0167] In some embodiments, as Figure 8 、 Figure 9 shown, the carrier 2 further includes a first connecting member 24 and a second connecting member 25. The first connecting member 24 is arranged in the avoidance area f and is connected to the carrier frame 21. The second connecting member 25 is arranged on the side of the carrier frame 21 away from the first connecting member 24 and is connected to the carrier frame 21. The body portion 231 passes through the carrier plate 22 and is respectively connected to the first connecting member 24 and the second connecting member 25.

[0168] Among them, the first connecting member 24 and the second connecting member 25 can both be block-like structures.

[0169] In some examples, both the first connecting member 24 and the second connecting member 25 are fixed to the carrier frame 21 by means of screw fastening.

[0170] In some examples, the number of both the first connecting member 24 and the second connecting member 25 is multiple, and they are arranged corresponding to the pressing member 23.

[0171] Exemplarily, as Figure 8 、 Figure 10 shown, the conveying direction of the carrier frame 21 ( Figure 8On both sides of the X direction (in the figure), second connectors 25 are provided. The bottom of the second connector 25 is an inclined surface 251. Along the conveying direction of the carrier frame 21, the inclined surface 251 extends in the direction approaching the carrier plate 22. In this way, the inclined surface 251 on the second connector 25 can play a guiding role for the conveying wheels used to carry the carrier frame 21, facilitating the stable transportation of the carrier frame 21 on the conveying line.

[0172] In some examples, such as Figure 8 shown, along the conveying direction of the carrier frame 21, a collision prevention block D1 is connected to the front end of the carrier frame 21. In this way, when the carrier frame 21 moves to the end of the conveying line, the collision prevention block D1 can prevent the carrier frame 21 from directly colliding with the end of the conveying line, thereby protecting the carrier frame 21 from damage.

[0173] In some examples, such as Figure 8 、 Figure 9 shown, the body part 231 includes a first body column B1 and a second body column B2. The first body column B1 is arranged in the avoidance area f and is connected to the first connector 24 located in the avoidance area f. The second body column B2 is arranged on the side of the carrier frame 21 away from the first body column B1 and is connected to the second connector 25. One ends of the first body column B1 and the second body column B2 away from the carrier frame 21 are both connected to the pressing part 232. In this way, it is convenient to arrange the pressing part 232.

[0174] In some examples, such as Figure 8 、 Figure 9 shown, the carrier 2 further includes a first screw C1. The first screw C1 passes through the first connector 24 from the side of the first connector 24 away from the pressing part 232 and is threadedly connected to the first body column B1. This ensures the stability of the connection.

[0175] Exemplarily, the carrier 2 further includes a first anti-loosening set screw C2. The first anti-loosening set screw C2 abuts against the top of the first screw C1 and is connected to the first connector 24. The setting of the first anti-loosening set screw C2 can prevent the first screw C1 from falling off, thereby ensuring the connection stability between the first connector 24 and the pressing part 23.

[0176] In some examples, such as Figure 8 、 Figure 9 shown, the carrier 2 further includes a second screw C3. The second screw C3 passes through the second connector 25 from the side of the second connector 25 away from the pressing part 232 and is threadedly connected to the second body column B2. This ensures the stability of the connection.

[0177] Exemplarily, the carrier 2 further includes a second anti-loosening set screw C4. The second anti-loosening set screw C4 abuts against the top of the second screw C3 and is connected to the second connector 25. The setting of the second anti-loosening set screw C4 can prevent the second screw C3 from falling off, thereby ensuring the connection stability between the second connector 25 and the pressing part 23.

[0178] In this way, the pressing member 23 can be connected to the carrier frame 21 through the first connecting member 24 and the second connecting member 25. Since the first connecting member 24 and the second connecting member 25 are respectively located inside and outside the carrier frame 21, the connection stability of the pressing member 23 can be improved, the pressing stability of the pressing member 23 can be improved, and the vibration damping effect can be improved.

[0179] In some embodiments, as Figure 7 shown, the carrier frame 21 includes a plurality of frame bars W. The plurality of frame bars W include a first frame bar 212 and at least one second frame bar 213. The plurality of first frame bars 212 are sequentially connected end to end to form a closed second border structure. At least one second frame bar 213 is disposed inside the second border structure and is connected to the first frame bar 212. The first frame bar 212 and the second frame bar 213 enclose a plurality of avoidance areas f; the bottom surfaces of the first frame bar 212, the second frame bar 213 opposite to the carrier frame heating surface 121 constitute the carrier frame bottom surface 211.

[0180] It can be understood that the plurality of first frame bars 212 and the second frame bars 213 are located in a plane parallel to the carrier frame heating surface 121, so that the assembly of the carrier frame 21 can be facilitated.

[0181] Among them, the number of the first frame bars 212 can be two, three, four, five, etc.

[0182] Exemplarily, the number of the first frame bars 212 is four. The four first frame bars 212 are sequentially connected end to end, and two adjacent first frame bars 212 are perpendicular to each other, thereby enclosing a square structure.

[0183] In addition, the number of the second frame bars 213 can be one, two, three, four, etc.

[0184] Exemplarily, the number of the second frame bars 213 is two, and the two second frame bars 213 are arranged crosswise and perpendicularly.

[0185] In some examples, the material of the frame bar W can include carbon fiber. Carbon fiber has good thermal conductivity, and the frame bar W made of carbon fiber is light in weight and high in structural strength.

[0186] By setting the carrier frame 21 as a structure combined with the first border structure and the second frame bar 213, the overall stability of the carrier frame 21 can be improved, and better support can be provided for the carrier board 22.

[0187] In some embodiments, as Figure 11 、 Figure 12 shown, adjacent frame bars W are connected by a mortise and tenon structure F. In this way, the overall appearance of the carrier frame 21 can be made more concise, and the connection stability is relatively high.

[0188] It can be understood that the adjacent frame bars W are connected by the mortise and tenon structure F, that is, at least one of the adjacent first frame bars 212 and / or second frame bars 213 is connected by the mortise and tenon structure F.

[0189] In some examples, such as Figure 11 , Figure 12 As shown, the mortise and tenon structure F includes a protruding portion F1 and a recessed portion F2. One of the protruding portion F1 and the recessed portion F2 is provided on one of the adjacent frame bars W, and the other of the protruding portion F1 and the recessed portion F2 is provided on the other of the adjacent frame bars W, and the protruding portion F1 extends into the recessed portion F2 to achieve the connection.

[0190] In some embodiments, such as Figure 11 As shown, in the plane perpendicular to the extension direction of the frame bar W, the dimension Y of the frame bar W in the direction perpendicular to the plane where the vehicle 2 is located is greater than the dimension Z of the frame bar W in the direction parallel to the plane where the vehicle 2 is located.

[0191] With such a setting, during the transportation of the vehicle 2, the probability of at least one of the first frame bar 212 and the second frame bar 213 deforming downward can be reduced, ensuring the stability of the overall structure of the load frame 21, and thus ensuring the support stability of the load frame 21 for the load plate 22.

[0192] In some embodiments, such as Figure 11 As shown, the frame bar W includes a plurality of stacked frame plates W1, and the stacking direction is perpendicular to the extension direction of the frame bar W and parallel to the plane where the vehicle 2 is located. In this way, the frame bar W can be formed by producing a plurality of frame plates W1 and then stacking the plurality of frame plates W1, which is convenient for the production and manufacturing of the frame bar W.

[0193] In some examples, the ratio between the dimension of the frame plate W1 in the Y direction and the dimension of the frame plate W1 in the Z direction is greater than or equal to four and less than or equal to ten. In this way, the deformation of the back frame bar W downward can be better prevented.

[0194] Exemplarily, the ratio between the dimension of the frame plate W1 in the Y direction and the dimension of the frame plate W1 in the Z direction can be four, five, six, eight or ten.

[0195] In some examples, such as Figure 7As shown, the number of the first frame bars 212 is four, and the number of the second frame bars 213 is two. The adjacent first frame bars 212 are perpendicular to each other, the two second frame bars 213 intersect perpendicularly, and the second frame bars 213 are perpendicular to the first frame bars 212. Each of the two first frame bars 212 located on both sides of the conveying direction of the vehicle 2 includes three stacked frame plates W1, each of the two first frame bars 212 arranged along the conveying direction of the vehicle 2 includes two stacked frame plates W1, the second frame bar 213 extending along the conveying direction of the vehicle 2 includes one frame plate W1, and the second frame bar 213 perpendicular to the conveying direction of the vehicle 2 includes two stacked frame plates W1. In this way, on the basis of ensuring the overall structural strength of the carrier frame 21, the material cost of the carrier frame 21 can be reduced as much as possible.

[0196] In some examples, as Figures 13 - 15 shown, multiple frame plates W1 can be connected by the cooperation of the second connecting member 25 and the third screw C5. Specifically, the third screw C5 passes through multiple frame plates W1 in sequence from the side of the frame bar W away from the second connecting member 25 and is threadedly connected to the second connecting member 25.

[0197] Among them, a nut can be arranged at the tail of the third screw C5 to improve the fixing stability.

[0198] In addition, the number of the third screws C5 can be one or multiple, for example, it can be two, three, four, etc.

[0199] In some embodiments, as Figure 16 、 Figure 17 shown, the vehicle 2 further includes a third connecting member 26. The third connecting member 26 is arranged in the avoidance area f. The third connecting member 26 is arranged at the intersection of adjacent frame bars W, and the third connecting member 26 is respectively connected to the adjacent frame bars W.

[0200] In some examples, as Figure 17 shown, the first connecting member 24 can replace the third connecting member 26, that is, the first connecting member 24 is arranged at the intersection of adjacent frame bars W and is respectively connected to the adjacent frame bars W, and the first connecting member 24 is also connected to the pressing member 23.

[0201] In some examples, as Figure 18 shown, the number of the second frame bars 213 is two. The two second frame bars 213 are vertically and crosswise arranged to form a shape similar to a "plus" sign, thus forming four avoidance areas f. Four third connecting members 26 are arranged at the central intersection of the "plus" sign. The four third connecting members 26 are respectively arranged in the four avoidance areas f, and the third connecting members 26 are respectively connected to the adjacent second frame bars 213.

[0202] Exemplarily, by setting fasteners such as screws to pass through the second frame bar 213 and the two third connectors 26 on both sides thereof, the two third connectors 26 on both sides of the second frame bar 213 can be fixed to the second frame bar 213 at one time. In this case, nuts can also be provided at the tails of the fasteners such as screws to improve the connection stability.

[0203] Exemplarily, the carrier plate 22 includes four sub - plates 222, and the four sub - plates 222 respectively correspond to four avoidance areas f. The pressing member 23 can also be arranged at the junction of adjacent sub - plates 222, and the pressing parts 232 are respectively in contact with the adjacent sub - plates 22, and the body parts 231 are respectively connected to the third connectors 26 in the avoidance areas f corresponding to the adjacent two sub - plates 22. In this way, multiple sub - plates 222 can be better pressed on the carrier frame 21.

[0204] In some examples, as Figure 18 shown, the third connector 26 includes a first connecting plate 261 and a second connecting plate 262 which are connected to each other. The first connecting plate 261 and the second connecting plate 262 are arranged at a certain angle, so that the corner of the first connecting plate 261 and the second connecting plate 262 is adapted to the intersection corner of the adjacent frame bar W. Then, the first connecting plate 261 is respectively connected to the frame bar W it fits, and the second connecting plate 262 is respectively connected to the other frame bar W it fits, so as to achieve the setting.

[0205] Exemplarily, the angle between the first connecting plate 261 and the second connecting plate 262 can be 80°, 85°, 90°, 95° or 100°, etc. Specifically, it should be set according to the angle at the intersection of the adjacent first frame bar 212 and / or the second frame bar 213.

[0206] In this way, the setting of the third connector 26 can improve the connection strength between at least one of the adjacent first frame bars 212, the adjacent second frame bars 213, and the adjacent first frame bars 212 and second frame bars 213, thereby ensuring the overall structural strength of the carrier frame 21, improving the transportation stability of the carrier frame 21, avoiding the shaking of the carrier plate 22, and at the same time, it can also extend the service life of the carrier 2.

[0207] The above are only the preferred embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied to other related technical fields, shall be included in the patent protection scope of the present application by the same token.

Claims

1. A vehicle heating device, characterized in that, Comprising: A base (11); A carrier frame heating plate (12), connected to one side of the base (11), the carrier frame heating plate (12) having a carrier frame heating surface (121) facing away from the base (11), the carrier frame heating surface (121) being adapted to contact the bottom surface (211) of the carrier frame of the carrier (2); A carrier plate heating plate (13), connected to the side of the carrier frame heating plate (12) away from the base (11), the carrier plate heating plate (13) having a carrier plate heating surface (131) facing away from the base (11), the carrier plate heating surface (131) being adapted to contact the bottom surface (221) of the carrier plate of the carrier (2); The vertical projection of the carrier plate heating plate (13) on the carrier frame heating plate (12) does not overlap with the carrier frame heating surface (121).

2. The vehicle heating device according to claim 1, characterized in that The carrier frame heating plate (12) has an invalid area (a) opposite to the carrier plate heating plate (13), the vertical projection of the carrier plate heating plate (13) on the carrier frame heating plate (12) is located within the invalid area (a), and the carrier frame heating surface (121) surrounds the invalid area (a).

3. The vehicle heating device according to claim 2, wherein The invalid area (a) includes a plurality of sub-areas (a1) arranged at intervals and opposite to the carrier plate heating plate (13); the carrier plate heating plate (13) includes a plurality of heating sub-plates (132), the plurality of heating sub-plates (132) are arranged corresponding to the plurality of sub-areas (a1), and the vertical projection of the heating sub-plate (132) on the carrier frame heating plate (12) is located within the corresponding sub-area (a1); the side surfaces of the plurality of heating sub-plates (132) facing away from the base (11) constitute the carrier plate heating surface (131).

4. The vehicle heating device according to claim 3, wherein Strip-shaped holes (c) are formed on the side surfaces of the heating sub-plates (132), and the openings of the strip-shaped holes (c) extend in the direction in which the plurality of heating sub-plates (132) are away from each other.

5. The vehicle heating device according to claim 3, wherein Openings (b) penetrating the carrier frame heating plate (12) are provided within the sub-areas (a1).

6. The vehicle heating device according to claim 5, characterized in that The carrier frame heating plate (12) includes: A plurality of first slats (122), connected end to end in sequence to form a closed first frame structure; At least one second slat (123), disposed within the first frame structure and connected to the first slat (122); the side surfaces of the first slat (122) and the second slat (123) facing away from the base (11) include the carrier frame heating surface (121); the first slat (122) and the second slat (123) enclose the plurality of openings (b).

7. The vehicle heating device according to any one of claims 1 to 6, characterized in that, It further includes a leveling assembly (14), and at least one of the leveling assemblies (14) is connected between the base (11) and at least one of the carrier frame heating plate (12) and the carrier plate heating plate (13); in the direction perpendicular to the plane where the carrier (2) is located, the leveling assembly (14) is adapted to drive at least one of the carrier frame heating plate (12) and the carrier plate heating plate (13) to move relative to the base (11).

8. The vehicle heating device according to claim 7, characterized in that, The leveling component includes a connecting part (141) and an adjusting part (142). The connecting part (141) is connected to the base (11), and the connecting part (141) can move along the arrangement direction of the base (11) and the carrier frame heating plate (12). The adjusting part (142) is arranged on the side of the connecting part (141) away from the base (11) and is threadedly connected to the connecting part (141). One side of the connecting part (141) facing away from the base (11) abuts against the carrier frame heating plate (12). A first through hole (d) is formed in the carrier frame heating surface (121). A part of the adjusting part (142) is arranged in the first through hole (d). One end of the adjusting part (142) away from the connecting part (141) has an abutting part (1421), and the abutting part (1421) abuts against the side where the carrier frame heating surface (121) is located. and / or, One side of the connecting part (141) facing away from the base (11) abuts against the carrier plate heating plate (13). A second through hole (e) is formed in the carrier plate heating surface (131). A part of the adjusting part (142) is arranged in the second through hole (e). One end of the adjusting part (142) away from the connecting part (141) has an abutting part (1421), and the abutting part (1421) abuts against the side where the carrier plate heating surface (131) is located.

9. The vehicle heating device according to any one of claims 1 to 6, characterized in that, It further includes: A carrier frame heat reflecting plate (15), which is arranged between the carrier frame heating plate (12) and the base (11) and is opposite to the carrier frame heating plate (12); and / or, A carrier plate heat reflecting plate (16), which is arranged between the carrier plate heating plate (13) and the base (11) and is opposite to the carrier plate heating plate (13).

10. A vehicle, characterized in that, It includes: A carrier frame (21), which has a carrier frame bottom surface (211). An avoidance area (f) penetrating the carrier frame (21) is formed on the carrier frame bottom surface (211). The carrier frame bottom surface (211) is used to be oppositely arranged and in contact with the carrier frame heating surface (121) of the carrier heating device (1). A carrier plate (22), which is connected to the side surface of the carrier frame (21) facing away from the carrier frame bottom surface (211). The carrier plate (22) has a carrier plate bottom surface (221). A part of the vertical projection of the carrier plate bottom surface (221) on the carrier frame (21) is located in the avoidance area (f). The carrier plate bottom surface (221) is used to be oppositely arranged and in contact with the carrier plate heating surface (131) of the carrier heating device (1) through the avoidance area (f).

11. The vehicle according to claim 10, characterized in that, It further includes a pressing member (23). The pressing member (23) includes a main body part (231) and a pressing part (232). The main body part (231) passes through the carrier plate (22) and is connected to the carrier frame (21). The pressing part (232) is connected to one end of the main body part (231) away from the carrier frame (21) and abuts against the side surface of the carrier plate (22) facing away from the carrier frame (21).

12. The vehicle according to claim 11, characterized in that, It further includes: The first connecting member (24) is disposed within the avoidance area (f) and is connected to the carrier frame (21). The second connecting member (25) is disposed on a side of the carrier frame (21) away from the first connecting member (24) and is connected to the carrier frame (21); the body portion (231) passes through the carrier plate (22) and is respectively connected to the first connecting member (24) and the second connecting member (25).

13. The vehicle according to any one of claims 10 to 12, characterized in that, The carrier frame (21) includes a plurality of frame bars (W), and the plurality of frame bars (W) include: A plurality of first frame bars (212) are sequentially connected end to end to form a closed second frame structure. At least one second frame bar (213) is disposed within the second frame structure and is connected to the first frame bar (212). The first frame bar (212) and the second frame bar (213) enclose a plurality of the avoidance areas (f); the bottom surfaces of the first frame bar (212) and the second frame bar (213) opposite to the carrier frame heating surface (121) constitute the carrier frame bottom surface (211).

14. The vehicle according to claim 13, wherein, Adjacent frame bars (W) are connected by a mortise and tenon structure (F).

15. The vehicle according to claim 13, characterized in that, In a plane perpendicular to the extending direction of the frame bar (W), the dimension of the frame bar (W) in the direction perpendicular to the plane where the carrier (2) is located is greater than the dimension of the frame bar (W) in the direction parallel to the plane where the carrier (2) is located.

16. The vehicle according to claim 15, characterized in that, The frame bar (W) includes a plurality of stacked frame plates (W1), and the stacking direction is perpendicular to the extending direction of the frame bar (W) and parallel to the plane where the carrier (2) is located.

17. The vehicle according to claim 13, wherein, The carrier (2) further includes a third connecting member (26). The third connecting member (26) is disposed within the avoidance area (f), and the third connecting member (26) is disposed at the intersection of adjacent frame bars (W). The third connecting member (26) is respectively connected to adjacent frame bars (W).

18. A heating system, characterized in that, Comprising: A carrier heating device (1), which is the carrier heating device (1) according to any one of claims 1 to 9. A carrier (2), which is the carrier (2) according to any one of claims 10 to 17; the carrier (2) is disposed on the carrier heating device (1), and the carrier frame heating surface (121) of the carrier heating device (1) is in contact with the carrier frame bottom surface (211) of the carrier (2), and the carrier plate heating surface (131) of the carrier heating device (1) is in contact with the carrier plate bottom surface (221) of the carrier (2).

19. The heating system according to claim 18, characterized in that, The carrier frame heating surface (121) is adapted to the carrier frame bottom surface (211); and / or, the carrier plate heating surface (131) is adapted to the carrier plate bottom surface (221).

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