Loop heat pipe device

Abstract

The utility model discloses a loop heat pipe device which comprises an annular pipeline, a plurality of grooves distributed in the circumferential direction are formed in the inner side wall of the annular pipeline, and the grooves extend along the center line of the annular pipeline. Groove teeth are formed between any two adjacent grooves. The grooves are formed in the inner side wall of the annular pipeline, when the loop heat pipe operates at low power, gas of the evaporator is cooled into liquid in the condenser, the grooves can damage the surface tension of the liquid and reduce the flowing resistance of the liquid, and the liquid in the annular pipeline cannot be accumulated and only flows to the lower position under the influence of gravity, so that the heat pipe is not prone to falling off. Circulation can be formed only through pushing of a small amount of evaporation gas, the problem that liquid blocking is easily formed at the position of a condenser through a loop heat pipe device is effectively solved, the heat dissipation area of an annular pipeline can be increased through the groove teeth, the heat dissipation capacity is improved, and the heat dissipation effect is improved. And the loop heat pipe device can adapt to a standby low-power operation scene of the high-power chip, and the number of operation scenes which can be adapted to the loop heat pipe device is increased.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation devices, and particularly relates to a loop heat pipe device. Background Art

[0002] With the booming development of the electronic heat dissipation industry and the iterative update of electronic products, the power and heat flux density of chips are constantly increasing. It is difficult to improve the heat dissipation power of a single heat pipe. To improve it means that more heat pipes must be added for heat dissipation, resulting in an increase in the weight of the radiator, an increase in cost, and difficulty in layout. Moreover, more heat pipes will also make the internal layout of the radiator more complex, increasing the distance between the chip and the fan, resulting in long-distance heat transfer of the heat pipe and poor heat transfer efficiency. As an efficient two-phase heat transfer device, the loop heat pipe drives the flow of the working fluid through the capillary force generated by the wick in the evaporator, and uses the phase change process of the working fluid to efficiently transfer heat in the heat pipe. Compared with the traditional heat pipe module, its greatest advantages are higher heat transfer performance, excellent isothermal property, larger heat transfer distance, etc., and it is widely used in scenarios with high power and a long distance between the chip layout and the fan.

[0003] The existing loop heat pipe generally consists of an evaporation chamber, a liquid storage chamber, a condensation chamber and a circular pipeline. Its working principle is: when heated by a heat source, the liquid medium evaporates in the evaporation chamber, enters the condensation chamber through the circular pipeline, the vapor cools and condenses into a liquid, and the liquid flows back to the liquid storage chamber along the loop heat pipe, and the liquid in the liquid storage chamber flows back to the evaporation chamber through the gas-liquid isolation wall, thus completing a complete heat exchange cycle of liquid-gas-liquid.

[0004] The current loop heat pipe radiator is only suitable for medium and high power heat dissipation. When the loop heat pipe is heated by a low-power heat source, due to low power and slow heat exchange, a small amount of evaporation gas will be generated in the liquid in the evaporation chamber during the heating process. The amount of vapor is small, and the driving force of the vapor is small, and the gas cannot push the liquid to flow towards the liquid storage chamber, resulting in liquid accumulation at the condenser position of the loop heat pipe, which will hinder the flow of high-temperature gas generated by the evaporator, and the condenser cannot complete heat dissipation, making the loop heat pipe unable to complete a complete cycle from the evaporation chamber to the condenser and then to the liquid storage chamber. The liquid in the evaporation chamber cannot be replenished in time, resulting in an increase in the chip temperature and poor heat dissipation effect, so that the loop heat pipe cannot adapt to the low-power operation scenario of high-power chips during standby, cannot adapt to various operation scenarios of the chip, and the applicable scenarios are limited. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a loop heat pipe device, which solves the technical problems of poor heat dissipation effect and limited applicable scenarios of the loop heat pipe.

[0006] To achieve the above object, the present utility model provides a loop heat pipe device, which includes an annular pipeline. The inner side wall of the annular pipeline is provided with a plurality of grooves distributed circumferentially. The grooves are used to reduce the flow resistance of the fluid in the annular pipeline; the grooves extend along the center line of the annular pipeline; a groove tooth is formed between any two adjacent grooves, and the groove tooth is used to increase the heat dissipation area of the annular pipeline.

[0007] Preferably, the groove is a V-shaped groove.

[0008] Preferably, the groove tooth is a V-shaped groove tooth formed between two adjacent V-shaped grooves.

[0009] Preferably, the groove is a trapezoidal groove.

[0010] Preferably, the groove tooth is a trapezoidal groove tooth formed between two adjacent trapezoidal grooves.

[0011] Preferably, it further includes an evaporation chamber, a liquid storage chamber and a condensation chamber. The annular pipeline includes an evaporation pipe and a liquid return pipe. The evaporation chamber is communicated with the condensation chamber through the evaporation pipe, and the liquid storage chamber is communicated with the condensation chamber through the liquid return pipe; a gas-liquid isolation wall is formed between the evaporation chamber and the liquid storage chamber.

[0012] Preferably, the annular pipeline is of a segmented structure. The annular pipeline includes a plurality of hollow pipes connected in sequence; all the hollow pipes are cylindrical and have the same outer diameter; any two adjacent hollow pipes are detachably connected.

[0013] Preferably, the widths of all the grooves of any two adjacent hollow pipes are equal, and all the grooves of any two adjacent hollow pipes are correspondingly communicated.

[0014] Preferably, the inner side wall of some of the hollow pipes is provided with grooves.

[0015] Preferably, a seal is sleeved at the connection between any two adjacent hollow pipes.

[0016] Compared with the background technology, the present utility model optimizes the annular pipeline of the loop heat pipe device, adds grooves to the inner wall of the annular pipeline. When the loop heat pipe operates at low power, the gas in the evaporator is cooled into liquid in the condenser. The grooves can break the surface tension of the liquid, reduce the flow resistance of the liquid, prevent the liquid in the annular pipeline from accumulating, and the liquid can flow downward only under the action of gravity. Only a small amount of evaporation gas is needed to push to form a cycle, effectively solving the problem that the loop heat pipe device is prone to liquid blockage at the condenser position. In addition, the groove teeth can increase the heat dissipation area of the annular pipeline and enhance the heat dissipation capacity, achieving the improvement of the heat dissipation effect; and enabling the loop heat pipe device to adapt to the scenario of high-power chips operating at low power in standby, increasing the applicable operating scenarios. Description of the Drawings

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on the provided drawings.

[0018] Figure 1 Structural diagram of the loop heat pipe device provided by the embodiment of the present invention;

[0019] Figure 2 is Figure 1 Cross-sectional schematic view of the annular pipeline in

[0020] Figure 3 is Figure 1 Another cross-sectional schematic view of the annular pipeline in

[0021] The reference numerals are as follows:

[0022] Annular pipeline 1, groove 2, groove tooth 3, evaporation chamber 4, liquid storage chamber 5, condensation chamber 6, gas-liquid isolation wall 7, bottom plate 8 and cover plate 9;

[0023] Evaporation pipe 11 and return liquid pipe 12. Specific embodiments

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.

[0025] To enable those skilled in the art of this technology to better understand the solution of the present invention, the following will further elaborate on the present invention in conjunction with the drawings and specific embodiments.

[0026] The embodiment of the present invention discloses a loop heat pipe device, as shown in the attached Figure 1 figure, which includes an annular pipeline 1. A plurality of grooves 2 are provided on the inner side wall of the annular pipeline 1, and all the grooves 2 are circumferentially distributed, so that a plurality of grooves 2 are parallelly distributed on the inner side wall of the annular pipeline 1. The circumferential direction mentioned in the text refers to the circumferential direction along the annular pipeline 1.

[0027] The annular pipeline 1 is a ring-shaped structure, but not a closed ring-shaped structure. The annular pipeline 1 is provided with multiple sections of gaps, and each gap is communicated with functional components such as an evaporation chamber 4, a liquid storage chamber 5, and a condensation chamber 6.

[0028] The included angles between adjacent grooves 2 are equal, so that all the grooves 2 in the annular pipeline 1 are evenly distributed at equal intervals. The depths of all the grooves 2 are equal, and the depth of each groove 2 is less than the thickness of the inner side wall of the annular pipeline 1.

[0029] The utility model optimizes the annular pipeline 1 of the loop heat pipe device, and grooves 2 are added to the inner wall of the annular pipeline 1. When the loop heat pipe operates at low power, the gas in the evaporator is cooled into liquid in the condenser. The grooves 2 can break the surface tension of the liquid, reduce the resistance of liquid flow, prevent the liquid in the annular pipeline 1 from accumulating, and enable the liquid to flow downward only under the action of gravity. Only a small amount of evaporation gas is needed to push to form a cycle, effectively solving the problem that the loop heat pipe device is prone to liquid blockage at the condenser position, increasing the heat dissipation capacity, and improving the heat dissipation effect. And it enables the loop heat pipe device to adapt to the scenario of high-power chips operating at low power in standby, and enables the loop heat pipe device to adapt to various operating scenarios of high-power chips at low, medium, and high power, increasing the number of applicable operating scenarios.

[0030] The grooves 2 extend along the center line of the annular pipeline 1, so that the grooves 2 play a role in guiding the flow, guiding the liquid flow pushed by the evaporation gas, and ensuring the smooth flow of the fluid in the annular pipeline 1.

[0031] There are serrations 3 formed between any adjacent two grooves 2. The serrations 3 are used to increase the heat dissipation area of the annular pipeline 1, improve the heat exchange efficiency, and improve the heat exchange effect.

[0032] As shown in the Figure 2 accompanying drawings, as a preferred embodiment, the grooves 2 are V-shaped grooves. Correspondingly, the serrations 3 are V-shaped serrations formed between adjacent two V-shaped grooves. The width of the V-shaped serrations is relatively narrow, so that the number of grooves 2 that can be arranged on the inner side wall of the annular pipeline 1 increases, and the resistance of liquid flow can be reduced to a greater extent. Of course, the serrations 3 can also be trapezoidal serrations formed between adjacent two V-shaped grooves. The width of the trapezoidal serrations is greater than the width of the V-shaped serrations, and the heat dissipation area of the trapezoidal serrations is larger, and the heat exchange effect is better.

[0033] As shown in the Figure 3 accompanying drawings, as another preferred embodiment, the grooves 2 are trapezoidal grooves. Compared with the V-shaped grooves, the cross-sectional area of the trapezoidal grooves is larger than that of the V-shaped grooves, and the trapezoidal grooves can hold more liquid. Correspondingly, the serrations 3 are trapezoidal serrations formed between adjacent two trapezoidal grooves. The heat dissipation area of the trapezoidal serrations is larger than that of the V-shaped serrations, and the heat exchange effect is better. Of course, the structures of the grooves 2 and the serrations 3 are not limited to this.

[0034] The loop heat pipe device further includes an evaporation chamber 4, a liquid storage chamber 5, and a condensation chamber 6. The annular pipeline 1 includes an evaporation pipe 11 and a liquid return pipe 12. The evaporation chamber 4 is connected to the condensation chamber 6 through the evaporation pipe 11, and the liquid storage chamber 5 is connected to the condensation chamber 6 through the liquid return pipe 12. An air-liquid isolation wall 7 is formed between the evaporation chamber 4 and the liquid storage chamber 5, and the air-liquid isolation wall 7 can only allow the liquid in the liquid storage chamber 5 to flow back into the evaporation chamber 4 unidirectionally. The evaporation chamber 4 and the liquid storage chamber 5 are integrally formed on the bottom plate 8, and a cover plate 9 is detachably installed at the open end of the bottom plate 8. The cross-sectional width of the evaporation chamber 4 is greater than the cross-sectional width of the liquid storage chamber 5. The bottom plate 8 is a porous copper powder structure. The air-liquid isolation wall 7 is a porous medium copper powder wall.

[0035] When heated by a heat source, the liquid medium evaporates in the porous copper powder structure of the evaporation chamber 4, enters the condensation chamber 6 through the annular pipeline 1, the vapor cools and condenses into a liquid, and the liquid flows back to the liquid storage chamber 5 along the loop heat pipe. The liquid in the liquid storage chamber 5 flows back into the evaporation chamber 4 through the air-liquid isolation wall 7, thus completing a complete heat exchange cycle of liquid-vapor-liquid.

[0036] The loop heat pipe device is in an L shape and is applicable to scenarios with a small installation space. Considering that the inlet and outlet width of the condensation chamber 6 is smaller than the width between the evaporation chamber 4 and the liquid storage chamber 5, and the evaporation pipe 11 is bent in an L shape, the liquid return pipe 12 is smoothly connected by an L-shaped structure and an arc structure, making the layout of the loop heat pipe device more compact and able to avoid other functional components to a certain extent.

[0037] The annular pipeline 1 is a segmented structure. The annular pipeline 1 includes several hollow pipes connected in sequence, and any two adjacent hollow pipes are detachably connected, which is convenient for processing grooves 2 on the inner side wall of each hollow pipe.

[0038] As a preferred embodiment, all the hollow pipes are cylindrical and have the same outer diameter. The widths of all the grooves 2 of any two adjacent hollow pipes are equal, and all the grooves 2 of any two adjacent hollow pipes are in one-to-one correspondence and communicate with each other, ensuring that the liquid flows between the connected hollow pipes along the grooves 2.

[0039] As another preferred embodiment, grooves 2 are provided on the inner side walls of some of the hollow pipes, that is, grooves 2 are not provided on the inner side walls of all the hollow pipes. For example, grooves 2 are only provided on the bent hollow pipes or the hollow pipes that are prone to liquid blockage, and it is not necessary to provide grooves 2 on all the hollow pipes, which can reduce the production cost.

[0040] A seal is sleeved at the connection between any two adjacent hollow pipes to prevent the fluid in the annular pipeline 1 from leaking. The seal can specifically be an O-ring, but is not limited thereto.

[0041] It should be noted that in this specification, relational terms such as first and second are only used to distinguish one entity from several other entities, and do not necessarily require or imply any actual relationship or order between these entities.

[0042] In this article, specific examples are used to elaborate on the principles and implementation manners of the present utility model. The description of the above embodiments is only used to help understand the method and its core idea of the present utility model. It should be pointed out that for those of ordinary skill in the art in this technical field, without departing from the principle of the present utility model, several improvements and modifications can be made to the present utility model, and these improvements and modifications also fall within the protection scope of the claims of the present utility model.

Claims

1. A loop heat pipe device, characterized in that, It includes an annular pipeline (1), and a number of circumferentially distributed grooves (2) are provided on the inner side wall of the annular pipeline (1). The grooves (2) are used to reduce the flow resistance of the fluid in the annular pipeline (1); the grooves (2) extend along the center line of the annular pipeline (1); a groove tooth (3) is formed between any two adjacent grooves (2), and the groove tooth (3) is used to increase the heat dissipation area of the annular pipeline (1).

2. The loop heat pipe device according to claim 1, wherein The groove (2) is a V-shaped groove.

3. The loop heat pipe device according to claim 2, wherein The groove tooth (3) is a V-shaped groove tooth formed between two adjacent V-shaped grooves.

4. The loop heat pipe device according to claim 1, characterized in that, The groove (2) is a trapezoidal groove.

5. The loop heat pipe device according to claim 4, wherein The groove tooth (3) is a trapezoidal groove tooth formed between two adjacent trapezoidal grooves.

6. The loop heat pipe device according to any one of claims 1 to 5, characterized in that, It further includes an evaporation chamber (4), a liquid storage chamber (5) and a condensation chamber (6). The annular pipeline (1) includes an evaporation pipe (11) and a liquid return pipe (12). The evaporation chamber (4) is communicated with the condensation chamber (6) through the evaporation pipe (11), and the liquid storage chamber (5) is communicated with the condensation chamber (6) through the liquid return pipe (12); a gas-liquid isolation wall (7) is formed between the evaporation chamber (4) and the liquid storage chamber (5).

7. The loop heat pipe device according to any one of claims 1 to 5, characterized in that The annular pipeline (1) is of a segmented structure. The annular pipeline (1) includes a number of hollow pipes connected in sequence; all the hollow pipes are cylindrical and have the same outer diameter; any two adjacent hollow pipes are detachably connected.

8. The loop heat pipe device according to claim 7, characterized in that, The widths of all the grooves (2) of any two adjacent hollow pipes are equal, and all the grooves (2) of any two adjacent hollow pipes are in one-to-one correspondence and penetrate through.

9. The loop heat pipe device according to claim 7, characterized in that, The grooves (2) are provided on the inner side walls of some of the hollow pipes.

10. The loop heat pipe device according to claim 7, wherein A sealing member is sleeved at the connection between any two adjacent hollow pipes.

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