Chip testing device

Abstract

The utility model provides a chip testing device. The chip testing device comprises a first movable plate; the upper surface of the template comprises a plurality of test positions used for placing chips to be tested respectively, and each chip to be tested is placed on the test position in a manner that the surface where the solder ball is located faces upwards; the test circuit board is fixed above the first movable plate, the surface, facing the first movable plate, of the test circuit board is provided with a plurality of groups of probes corresponding to the chips to be tested respectively, and the gap of each group of probes is provided with at least one first through hole; the first driving assembly is used for driving the first movable plate to move vertically, so that the to-be-tested chip on the template moves between a feeding position and a testing position; and the plurality of ejector pins are vertically arranged above the first movable plate, penetrate through the first through holes when moving to the feeding position and push the solder balls of the to-be-tested chip to be separated from the probes. According to the utility model, the phenomenon that an adhered chip is manually taken down from the probe can be avoided, and the overall efficiency of chip testing is improved.

Description

Technical Field

[0001] The utility model relates to the field of chip testing, and more specifically, to a chip testing device. Background Art

[0002] During the packaging process, a chip is placed in a protective housing that not only provides physical protection but also ensures electrical connection between the chip and external devices. After packaging, the chip needs to undergo a series of tests to verify its functions and performance.

[0003] Currently, during the chip testing process, heat energy is generated when the solder balls of the chip to be tested come into contact with the probes. The solder balls of the chip to be tested will deform when heated. When the chip to be tested is completed, the solder balls of the chip to be tested will stick to the probes, and it is necessary to manually remove the stuck chip, which affects the testing efficiency. Summary of the Utility Model

[0004] The technical problem to be solved by the utility model is to provide a new chip testing device for the problem that the testing efficiency is affected due to the adhesion between the probes and the solder balls after the chip testing is completed.

[0005] The technical solution of the utility model to solve the above technical problem is to provide a chip testing device, including:

[0006] A first movable plate, the first movable plate is horizontally arranged;

[0007] A template, which is used to be set on the upper surface of the first movable plate. The upper surface of the template includes a plurality of test positions respectively for placing chips to be tested, and each chip to be tested is placed on the test position with the surface where the solder balls are located facing upward;

[0008] A test circuit board, which is fixed above the first movable plate in a manner parallel to the first movable plate, and the surface of the test circuit board facing the first movable plate has a plurality of groups of probes respectively corresponding to each chip to be tested. A plurality of first through holes penetrating the upper surface and the lower surface of the test circuit board are provided in the gap between each group of probes;

[0009] A first driving component, which is drivingly connected to the first movable plate and is used to drive the first movable plate to move vertically, so that the chips to be tested on the template move between the loading position and the testing position, and at the testing position, the solder balls of the chips to be tested are respectively in contact with the probes on the test circuit board;

[0010] A plurality of thimbles are vertically arranged above the first movable plate, and the vertical projection of the thimble avoids the solder balls of the chip to be tested; during the process of the chip to be tested moving from the test position to the loading position, the thimble passes through the first through hole on the test circuit board and pushes the solder balls of the chip to be tested to be separated from the probes.

[0011] As a further improvement of the present utility model, the chip testing device includes a second movable plate and a linkage rod, and the thimble is vertically connected to the lower surface of the second movable plate;

[0012] The second movable plate is arranged above the test circuit board and is parallel to the first movable plate, and the first movable plate and the second movable plate are respectively connected to the linkage rod.

[0013] As a further improvement of the present utility model, the test positions on the template are formed by grooves;

[0014] The first movable plate and the second movable plate are respectively fixedly connected to the linkage rod, and when the first driving assembly drives the first movable plate to make the chip to be tested on the template in the test position, the free end of the thimble is separated from the surface of the chip to be tested; when the chip to be tested on the template is in the loading position, the distance between the free end of the thimble and the surface of the chip to be tested is less than the depth of the groove.

[0015] As a further improvement of the present utility model, at least one of the first movable plate and the second movable plate is movably connected to the linkage rod;

[0016] The first driving assembly is drivingly connected to the second movable plate, and drives the second movable plate to move downward while driving the first movable plate to move upward, and drives the second movable plate to move upward while driving the first movable plate to move downward.

[0017] As a further improvement of the present utility model, the first driving assembly includes a lead screw, a first nut portion located on the first movable plate, and a second nut portion located on the second movable plate. The lead screw includes a first thread section and a second thread section arranged at intervals, and the thread rotation directions of the first thread section and the second thread section are opposite; the thread of the first nut portion is adapted to the thread of the first thread section, the thread of the second nut portion is adapted to the thread of the second thread section, and the lead screw is assembled to the first movable plate and the second movable plate in such a way that the first thread section is threadedly connected to the first nut portion and the second thread section is threadedly connected to the second nut portion.

[0018] As a further improvement of the present utility model, each thimble includes a main body portion, a telescopic portion, and an elastic member. One end of the main body portion is connected to the second movable plate, the telescopic portion is connected to the other end of the main body portion, and both ends of the elastic member are respectively abutted against the main body portion and the telescopic portion.

[0019] As a further improvement of the present utility model, at least one of the first movable plate and the second movable plate is movably connected to the linkage rod;

[0020] The chip testing device includes a second driving assembly; the second driving assembly is drivingly connected to the second movable plate, and when the first driving assembly drives the template to move upward from the loading position until the probes on the test circuit board abut against the solder balls of the chip to be tested, it drives the second movable plate to move downward until the thimble abuts against the surface of the chip to be tested, and after the first driving assembly drives the template to move downward a preset distance from the testing position, it first drives the second movable plate to move downward so that the thimble pushes the chip to be tested to separate from the probe, and then drives the second movable plate to move upward.

[0021] As a further improvement of the present utility model, the surface of the test circuit board facing away from the probes has a plurality of electrical connection interfaces, and each electrical connection interface is electrically connected to at least one group of probes via a conductive line on the test circuit board;

[0022] The second movable plate has a plurality of second through holes, the second through holes penetrate the upper surface and the lower surface of the second movable plate, and the electrical connection interfaces are connected to the upper computer through cables passing through the second through holes, or the tops of the electrical connection interfaces protrude through the second through holes to the upper surface of the second movable plate or are flush with the upper surface of the second movable plate.

[0023] As a further improvement of the present utility model, the upper surface of the first movable plate has a plurality of positioning members, the template has a plurality of positioning portions, and the template is disposed at a predetermined position of the first movable plate by a manner of cooperation between the positioning portions and the positioning members.

[0024] As a further improvement of the present utility model, a buffer spring is sleeved on the linkage rod, and both ends of the buffer spring are respectively abutted against the first movable plate and the test circuit board.

[0025] The present utility model has the following beneficial effects: The first movable plate drives the chip to be tested to move between the loading position and the testing position. At the same time, when the chip to be tested moves from the testing position to the loading position, the thimble linked with the first movable plate pushes the chip to be tested to separate from the probe, avoiding manual removal of the adhered chip from the probe and improving the overall efficiency of chip testing. Description of the Drawings

[0026] Figure 1 It is a schematic diagram of the adhesion between a chip and a probe when an existing chip testing device tests a chip.

[0027] Figure 2 It is a schematic diagram of the chip testing device provided by an embodiment of the present invention when the chip to be tested is in the loading position.

[0028] Figure 3 It is a schematic diagram of the chip testing device provided by an embodiment of the present invention when the chip to be tested is in the testing position.

[0029] Figure 4 It is a schematic diagram of the chip to be tested placed on a template in the chip testing device provided by an embodiment of the present invention.

[0030] Figure 5 It is a schematic diagram of the chip testing device provided by another embodiment of the present invention.

[0031] Figure 6 It is Figure 5 a schematic diagram of the lead screw in the chip testing device shown.

[0032] Figure 7 It is a schematic diagram of the ejector pin in the chip testing device provided by an embodiment of the present invention.

[0033] Figure 8 It is a schematic diagram of the chip testing device provided by another embodiment of the present invention. Detailed implementation manners

[0034] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0035] As Figure 1 shown, the chip testing device 10 includes a test board 110, a template 120 and a driving device. Among them, the lower surface of the test board 110 has a plurality of probes 111, the template 120 has a plurality of chip slots 121, a plurality of chips 210 to be tested are respectively placed in the plurality of chip slots 121 of the template 120, and a plurality of solder balls are provided on the surface of each chip 210 to be tested. The driving device of the chip testing device 10 is used to make the solder balls 211 of the chip 210 to be tested contact the probes 111 on the test board 110, so as to realize the electrical connection between the chip 210 to be tested and the test board 110 and perform electrical tests. However, during the testing process, both the probes 111 and the solder balls 211 will generate heat energy. When the testing is completed, the solder balls 211 will stick to the probes 111.

[0036] As Figure 2 、3 As shown, it is a schematic diagram of a chip testing device provided by an embodiment of the present invention. This chip testing device can be used to test multiple chips with BGA packages. The chip testing device of this embodiment includes a first movable plate 31, a template 32, a test circuit board 34, a first driving component (not shown in the figure), and a plurality of ejector pins 351.

[0037] The above-mentioned first movable plate 31 is in a flat plate shape, which is horizontally arranged and serves as a placement platform for the template 32 and the chips 210 to be tested. The template 32 is arranged on the upper surface of the first movable plate 31 and moves vertically together with the first movable plate 31. The upper surface of the template 32 includes a plurality of test positions for placing the chips 210 to be tested respectively. Specifically, these test positions can be distributed in a dot matrix on the upper surface of the template 32.

[0038] Each chip 210 to be tested is a chip with BGA package. The pins of the chip 210 to be tested are composed of solder balls 211, and all the solder balls 211 of the chip 210 to be tested are arranged on the same surface. The chip 210 to be tested is placed on the test position of the template 32 with the surface where the solder balls 211 are located facing upward (i.e., away from the template 32). Moreover, the surface of the chip 210 to be tested with solder balls 211 needs to have at least one reserved area 212 without solder balls 211.

[0039] The main part of the test circuit board 34 is composed of a printed circuit board (PCB). The test circuit board 34 can include a controller for executing a test program, etc., or be connected to a host computer with a test program. The test circuit board 34 is fixed above the first movable plate 31 (i.e., above the template 32) in a manner parallel to the first movable plate 31. And the surface of the test circuit board 34 facing the first movable plate 31 has a plurality of groups of probes 341. The position and quantity of each group of probes 341 respectively correspond to the solder balls 211 of each chip 210 to be tested on the template 32. The probes 241 are made of conductive materials. By contacting the solder balls 211 of the chip 210 to be tested through the probes 341, the test circuit board 34 can be communicatively connected to the chip 210 to be tested, so as to send instructions to the chip 210 to be tested or obtain feedback signals from the chip 210 to be tested. The specific structure of the above-mentioned test circuit board 34, the structure and distribution of the probes 341, etc. can all adopt the conventional structures in the art and will not be elaborated here.

[0040] For example, as Figure 4As shown, when the template 32 includes ten test positions, ten chips 210 to be tested are respectively placed on the ten test positions. Correspondingly, there are ten groups of probes 341 on the test circuit board 34. The number of probes included in each group of probes 341 is equal to the number of solder balls 211 on the chip 210 to be tested at the corresponding test position. In particular, the above-mentioned probes are perpendicular to the test circuit board 34, and the first through holes are provided in the area of the test circuit board 34 corresponding to the reserved area 212 on the chip 210 to be tested.

[0041] The first driving component is drivingly connected to the first movable plate 31 and is used to drive the first movable plate 31 to move vertically, that is, the first movable plate 31 can move vertically under the drive of the first driving component. Correspondingly, the template 32 on the first movable plate 31 and the chips 210 to be tested on the template 32 also move vertically with the first movable plate 31 and move between the loading position and the testing position. Among them, at the testing position, the solder balls 211 of the chips 210 to be tested are respectively in contact with the probes 341 on the test circuit board 34, so that the test circuit board 34 is electrically connected to the chips 210 to be tested, and the test circuit board 34 can send test signals to the chips 210 to be tested and receive feedback signals from the chips to be tested, etc.; at the loading position, the solder balls 211 of the chips 210 to be tested are separated from the probes 341 on the test circuit board 34, so that the template 32 can be removed from the first movable plate 31 or the chips 210 to be tested can be removed from the template 32. Specifically, the travel size between the loading position and the testing position can be determined according to the thickness of the template 32, the thickness of the chips 210 to be tested, the length of the probes 341, etc., and will not be elaborated here. The above-mentioned first driving component can specifically adopt methods such as chain drive, motor drive, piston cylinder drive, etc. to drive the first movable plate 31 to move vertically, and is not limited here.

[0042] On the main body part of the above-mentioned test circuit board 34, several first through holes (not shown in the figure) are provided corresponding to the gaps of each group of probes 341, and each first through hole penetrates the upper surface and the lower surface of the main body part of the test circuit board 34. Correspondingly, several thimble 351 are vertically arranged above the first movable plate 31 and avoid the solder balls 211 of the chips 210 to be tested, that is, the vertical projection of the thimble 351 on the surface of the chips 210 to be tested avoids the solder balls 211 and corresponds to the reserved area 212. And there is at least one thimble 351 above the reserved area 212 of each chip 210 to be tested.

[0043] When the first driving component drives the first movable plate 31 to move downward, so that the chip 210 to be tested moves from the test position to the loading position, the ejector pin 351 passes through the first through hole on the test circuit board 34 and pushes the solder ball 211 of the chip 210 to be tested to separate from the probe 341. In particular, the moment when the ejector pin 351 pushes the chip to be tested to separate from the probe 341 can occur at any moment when the chip 210 to be tested moves from the test position to the loading position, rather than being limited to a specific moment. In the above way, even if the solder ball 211 of the chip 210 to be tested adheres to the probe 341 after the test is completed, the chip 210 to be tested can also be separated from the probe 341 under the push of the ejector pin 351, avoiding manually removing the adhered chip from the probe and improving the overall efficiency of chip testing.

[0044] In an embodiment of the present invention, the above chip testing device further includes a second movable plate 35 and a plurality of linkage rods 36 in addition to the first movable plate 31, the template 32, the test circuit board 34, the first driving component and a plurality of ejector pins 351, wherein the ejector pin 351 is vertically connected to the lower surface of the second movable plate 35. The second movable plate 35 is disposed above the test circuit board 34 and is parallel to the first movable plate 31, that is, the first movable plate 31, the test circuit board 34, and the second movable plate 35 are parallel, and the first movable plate 31 and the second movable plate 35 are respectively connected to the linkage rod 36.

[0045] The second movable plate 35 constitutes a carrier for the ejector pins 351. By the second movable plate 35, all the ejector pins 351 can be moved up and down simultaneously. At the same time, since the first movable plate 31 and the second movable plate 35 are connected by the linkage rod 36, the ejector pins 351 are relatively fixed to the respective chips 210 to be tested on the template 32, so as to facilitate the ejector pins 351 to push the respective chips 210 to be tested to separate from the probes 341. Of course, in actual applications, the ejector pins 351 can also be independent of each other, but the overall control structure will be relatively complex.

[0046] In an embodiment of the present invention, each test position on the template 32 is formed by a groove, and the shape and size of the groove are respectively adapted to the shape and size of the respective chips 210 to be tested, so as to ensure that when the chip 210 to be tested moves from the loading position to the test position, the probe 341 on the test circuit board 34 can contact the corresponding solder ball 211, avoiding misconnection.

[0047] Accordingly, the first movable plate 31 and the second movable plate 35 are respectively fixedly connected to the linkage rod 36. For example, both ends of each linkage rod 36 are respectively perpendicularly connected to the first movable plate 31 and the second movable plate 35. When the first driving assembly drives the first movable plate 31 to move upward or downward, the second movable plate 35 moves upward or downward synchronously driven by the linkage rod 36. To ensure the stable connection between the first movable plate 31 and the second movable plate 35, the chip testing device may include four linkage rods 36.

[0048] Moreover, when the first driving assembly drives the first movable plate 31 to move upward so that the chip 210 to be tested on the template 32 is in the test position, the free end of the thimble 351 is separated from the surface of the chip 210 to be tested, as Figure 3 shown; when the first driving assembly drives the first movable plate 31 to move downward so that the chip 210 to be tested on the template 32 is in the loading position, the free end of the thimble 351 protrudes below the free end of the probe 341, as Figure 2 shown.

[0049] After the chip 210 to be tested is tested, the first driving assembly drives the first movable plate 31 to move downward, and the template 32 and the second movable plate 35 follow the first movable plate 31 to move downward synchronously. If the probe 341 is not adhered to the solder ball 211 of the chip 210 to be tested, the chip 210 to be tested will move downward following the template 32; if the probe 341 is adhered to the solder ball 211 of the chip 210 to be tested, the chip 210 to be tested will remain in its original position. Instead, the thimble 351 moving downward following the second movable plate 35 will move downward and insert into the first through hole on the test circuit board 34. And as the first movable plate 31 continues to move downward, the free end of the thimble 351 will contact the reserved area 212 on the surface of the chip 210 to be tested. Since the solder ball 211 on the surface of the chip 210 to be tested has not fully hardened just after the test, the chip 210 to be tested will be separated from the probe 341 under the push of the thimble 351, thus avoiding manually removing the chip 210 to be tested from the probe 341.

[0050] Specifically, to prevent the free end of the ejector pin 351 from contacting the surface of the chip 210 to be tested and causing the chip 210 to be damaged due to dropping onto the template 32 under the push of the ejector pin 351 after the contact, the distance between the first movable plate 31, the test circuit board 34 and the second movable plate 35, and the lengths of the ejector pin 351 and the probe 341 should meet the following conditions: when the chip 210 to be tested on the template 32 is in the loading position, the distance between the free end of the ejector pin 351 and the surface of the chip 210 to be tested is less than the depth of the groove. In this way, when the solder balls 211 of the chip 210 to be tested adhere to the probes 341, during the downward movement of the first movable plate 31 and the second movable plate 35 driven by the first driving component, when the free end of the ejector pin 351 contacts the surface of the chip 210 to be tested, the bottom of the chip 210 to be tested still does not exceed the upper surface of the template 32. Thus, even if the chip 210 to be tested is separated from the probe 341 under the push of the ejector pin 351, the chip 210 to be tested will move downward along the groove wall, and due to the frictional force between its outer edge and the groove wall, the chip 210 to be tested will not fall, avoiding its collision damage.

[0051] In an embodiment of the present invention, one of the first movable plate 31 and the second movable plate 35 is movably connected to the linkage rod 36, or one of the first movable plate 31 and the second movable plate 35 and the linkage rod 36 are both movably connected to the linkage rod 36, that is, the first movable plate 31 and / or the second movable plate 35 can move up and down relative to the linkage rod 36. For example, the second movable plate 35 can be movably connected to the linkage rod 36 in the following way: a number of through holes penetrating its upper and lower surfaces are provided on the second movable plate 35, and the size of the through hole is adapted to the cross-sectional size of the linkage rod 36, and the linkage rod 36 passes through the through hole to be movably connected to the second movable plate 35.

[0052] In addition to being drivingly connected to the first movable plate 31, the first driving component is also drivingly connected to the second movable plate 35, and when the first driving component drives the first movable plate 31 to move upward, it drives the second movable plate 35 to move downward at the same time, and when it drives the first movable plate 31 to move downward, it drives the second movable plate 35 to move upward at the same time. That is, when the first driving component drives the first movable plate 31 and the second movable plate 35 to move vertically, the moving directions of the first movable plate 31 and the second movable plate 35 are opposite, so that when the first movable plate 31 is driven to run to the position where the chip 210 to be tested is in the test position, the second movable plate 35 is driven to run to the position where the free end of the ejector pin 351 abuts against the surface of the chip 210 to be tested.

[0053] Specifically, in combination with Figure 5 、 6As shown in the figure, the above-mentioned first driving component includes a lead screw 37, a first nut portion 311 located on the first movable plate 31, and a second nut portion 353 located on the second movable plate 35. The lead screw 37 includes a first thread segment 3711 and a second thread segment 3721 arranged at intervals, and the thread rotation directions of the first thread segment 3711 and the second thread segment 3721 are opposite; the first nut portion 311 and the second nut portion 353 include threaded holes with the center lines on the same straight line, and the thread of the threaded hole of the first nut portion 311 is adapted to the thread of the first thread segment 3711, and the thread of the threaded hole of the second nut portion 353 is adapted to the thread of the second thread segment 3721. The lead screw 37 is assembled to the first movable plate 31 and the second movable plate 35 in such a way that the first thread segment 3711 is threadedly connected to the first nut portion 311 and the second thread segment 3721 is threadedly connected to the second nut portion 353.

[0054] The above-mentioned lead screw 37 is vertically fixed by bearings, connecting sleeves, etc., that is, the lead screw 37 can only rotate and cannot move axially. Since the rotation directions of the first thread segment 3711 and the second thread segment 3721 are opposite, during the rotation of the lead screw 37, the first movable plate 31 and the second movable plate 35 move in opposite directions.

[0055] Particularly, the above-mentioned lead screw 37 can be formed by axially connecting a first rod portion 371 and a second rod portion 372. The first thread segment is located on the first rod portion 371, the second thread segment 3721 is located on the second rod portion 372, and the first rod portion 371 and the second rod portion 372 are axially connected together. For example, a third thread segment 3722 can be provided at the bottom of the second rod portion 372, and the diameter of the second thread segment 3722 is smaller than the diameter of the main body portion of the second rod portion 372; one end face of the first rod portion 371 has a threaded hole (for example, the threaded hole can be located at the end face where the first thread segment 3711 is located), and the diameter of the threaded hole is adapted to the diameter of the third thread segment 3722 of the second rod portion 372. When the lead screw 37 is assembled to the first movable plate 31 and the second movable plate 35, the second rod portion 372 can be first threadedly connected to the second nut portion 353, and then the first rod portion 371 is threadedly connected to the first nut portion 311, and the first rod portion is continuously rotated so that the threaded hole of the first rod portion is threadedly connected to the third thread segment 372 of the second rod portion 372.

[0056] It can be understood that in addition to the lead screw 37, the first driving component may also include transmission parts such as a motor and gears to drive the lead screw 37 to rotate. In practical applications, the first driving component can also adopt other structures as long as it can drive the first movable plate 31 and the second movable plate 35 to move in opposite directions.

[0057] Such as Figure 7As shown in the above embodiment, each thimble 351 includes a main body portion 3511, a telescopic portion 3513, and an elastic member 3512. One end of the main body portion 3511 is vertically connected to the lower surface of the second movable plate 35. The telescopic portion 3513 is movably connected to the other end of the main body portion 3511, and both ends of the elastic member 3512 are respectively abutted against the main body portion 3511 and the telescopic portion 3513. That is, the telescopic portion 3513 can axially move relative to the main body portion 3511.

[0058] When the first movable plate 31 is driven by the first driving component to move upward until the solder ball 211 of the chip 210 to be tested contacts the free end of the probe 341, the second movable plate 35 is driven by the first driving component to move downward. The telescopic portion 3513 of the thimble 351 contacts the surface of the chip 210 to be tested and the elastic member 3512 is compressed. After the chip 210 to be tested is completed, the first driving component drives the first movable plate 31 to move downward, and at the same time drives the second movable plate 35 to move upward. At this time, the elastic member 3512 pushes the telescopic portion 3513 to axially move relative to the main body portion 3511 through its own elastic force, so that the telescopic portion 3513 pushes the chip 210 to be tested to separate from the probe 341. As the second movable plate 35 continues to move upward, the telescopic portion 3513 separates from the surface of the chip 210 to be tested and continues to retract above the free end of the probe 341 (or flush with the free end of the probe 341), so as to facilitate removing the template 32 from the first movable plate 31.

[0059] In addition, when at least one of the first movable plate 31 and the second movable plate 35 is movably connected to the linkage rod 36, the above chip testing device may further include a second driving component. The second driving component is drivingly connected to the second movable plate 35. That is, the first movable plate 31 and the second movable plate 35 are respectively driven by different driving components. And when the first driving component drives the first movable plate 31 and the template 32 to move upward from the loading position until the probe 341 on the test circuit board 34 contacts the solder ball 211 of the chip 210 to be tested, the second movable plate 35 is driven to move downward until the thimble 351 contacts the surface of the chip 210 to be tested. And after the first driving component drives the first movable plate 31 and the template 32 to move downward a preset distance (the preset distance can be set as needed) from the test position, the second movable plate 35 is first driven to move downward to push the solder ball 211 of the chip 210 to be tested to separate from the probe 341, and then the second movable plate 35 is driven to move upward until the free end of the thimble 35 is higher than the free end of the probe 341.

[0060] As Figure 8As shown, in an embodiment of the present utility model, the surface of the above-mentioned test circuit board 34 facing away from the probe 341 has a plurality of electrical connection interfaces 342, and each electrical connection interface 342 is electrically connected to at least one group of probes 341 via a conductive line (the conductive line can be composed of copper foil on the test circuit board 34, etc.). Correspondingly, the second movable plate 35 has a plurality of second through holes 352, which penetrate the upper surface and the lower surface of the second movable plate 35, and the electrical connection interfaces 342 are connected to the host computer through cables passing through the second through holes 352, or the tops of the electrical connection interfaces 342 protrude through the second through holes 352 to the upper surface of the second movable plate 35 or are flush with the upper surface of the second movable plate 35, so as to facilitate the connection between the electrical connection interfaces 342 and the host computer.

[0061] To ensure that the relative positions of the test circuit board 34 are maintained during the movement of the first movable plate 31 and the second movable plate 35, the above-mentioned chip testing device further includes a fixing frame, which is located outside the orthographic projection area of the first movable plate 31. The test circuit board 34 is fixed to the fixing frame and extends above the orthographic projection area of the first movable plate 31. In this way, non-contact fixation between the test circuit board 34 and the first movable plate 31 can be achieved.

[0062] Particularly, the test circuit board 34 can also be movably connected to the linkage rod 36. For example, a third through hole is provided on the test circuit board 34, the diameter of the third through hole is adapted to the diameter of the linkage rod 36, and the linkage rod 36 passes through the third through hole. Through the linkage rod 36, the horizontal positions of the first movable plate 31, the second movable plate 35 and the test circuit board 34 can be kept relatively unchanged, so as to ensure that after the first movable plate 31 moves upward, the solder balls 211 of the chip 210 to be tested can contact the corresponding probes 241, and at the same time ensure that after the second movable plate 35 moves downward, the free end of the ejector pin 351 can abut against the reserved area 212 of the chip 210 to be tested.

[0063] In addition, in an embodiment of the present utility model, the upper surface of the first movable plate 31 has a plurality of positioning members. Correspondingly, the template 32 has a plurality of positioning portions, and the template 32 is arranged at a predetermined position of the first movable plate 31 by means of the cooperation between the positioning portions and the positioning members. Through this structure, it can be ensured that after the first movable plate 31 moves upward, the solder balls 211 of the chip 210 to be tested can contact the corresponding probes 241.

[0064] Specifically, the positioning members can be composed of a plurality of bumps on the upper surface of the first movable plate 31, and the positioning portions can be composed of the side surfaces of the template 32.

[0065] In an embodiment of the present utility model, a buffer spring may be sleeved on the linkage rod 36, and two ends of the buffer spring respectively abut against the first movable plate 31 and the test circuit board 34. Through the buffer spring, the resistance of the first movable plate 31 moving upward can be increased, so as to avoid the impact on the probe 341 caused by the too-fast rising of the chip 210 to be tested and prevent the probe 341 from being knocked crooked.

[0066] The above are only the preferred specific embodiments of the present utility model, but the protection scope of the present utility model is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present utility model should be covered within the protection scope of the present utility model. Therefore, the protection scope of the present utility model should be subject to the protection scope of the claims.

Claims

1. A chip testing device, characterized in that, include: A first movable plate, wherein the first movable plate is arranged horizontally; A template, used to be set on the upper surface of the first movable plate, the upper surface of the template includes a plurality of test positions for placing the chips to be tested, and each of the chips to be tested is placed on the test position in a manner that the surface where the solder balls are located faces upward; A test circuit board is fixed above the first movable plate in a manner parallel to the first movable plate, and a surface of the test circuit board facing the first movable plate has a plurality of groups of probes corresponding to the chips to be tested, and a gap between each group of probes is provided with at least one first through hole penetrating the upper and lower surfaces of the test circuit board; A first driving assembly is connected to the first movable plate and is used to drive the first movable plate to move vertically, so that the chip to be tested on the template moves between a loading position and a testing position, and at the testing position, the solder balls of the chip to be tested are respectively in contact with the probes on the testing circuit board; A plurality of ejector pins are vertically arranged above the first movable plate, and the vertical projections of the ejector pins avoid the solder balls of the chip to be tested; when the chip to be tested moves from the testing position to the loading position, the ejector pins pass through the first through holes on the test circuit board and push the solder balls of the chip to be tested to separate from the probes.

2. The chip testing device according to claim 1, wherein, The chip testing device comprises a second movable plate and a linkage rod, and the ejector pin is vertically connected to the lower surface of the second movable plate; The second movable plate is disposed above the test circuit board and is parallel to the first movable plate. The first movable plate and the second movable plate are respectively connected to the linkage rod.

3. The chip testing device according to claim 2, wherein The test position on the template is formed by a groove; The first movable plate and the second movable plate are fixedly connected to the linkage rod respectively, and when the first driving assembly drives the first movable plate to make the chip to be tested on the template in the testing position, the free end of the ejector pin is separated from the surface of the chip to be tested; when the chip to be tested on the template is in the loading position, the distance between the free end of the ejector pin and the surface of the chip to be tested is less than the depth of the groove.

4. The chip testing device according to claim 2, wherein At least one of the first movable plate and the second movable plate is movably connected to the linkage rod; The first driving assembly is drivingly connected to the second movable plate, and drives the second movable plate downward while driving the first movable plate upward, and drives the second movable plate upward while driving the first movable plate downward.

5. The chip testing device according to claim 4, characterized in that, The first driving assembly includes a lead screw, a first nut portion located on the first movable plate, and a second nut portion located on the second movable plate, the lead screw includes a first thread segment and a second thread segment that are spaced apart, and the thread rotation directions of the first thread segment and the second thread segment are opposite; the thread of the first nut portion is adapted to the thread of the first thread segment, the thread of the second nut portion is adapted to the thread of the second thread segment, and the lead screw is assembled to the first movable plate and the second movable plate in a manner that the first thread segment is threadedly connected to the first nut portion, and the second thread segment is threadedly connected to the second nut portion.

6. The chip testing device according to claim 4 or 5, characterized in that, Each of the thimbles includes a main body portion, a telescopic portion and an elastic member. One end of the main body portion is connected to the second movable plate, the telescopic portion is connected to the other end of the main body portion, and both ends of the elastic member are respectively abutted against the main body portion and the telescopic portion.

7. The chip testing device according to claim 2, wherein At least one of the first movable plate and the second movable plate is movably connected to the linkage rod; The chip testing device includes a second driving assembly; the second driving assembly is drivingly connected to the second movable plate, and when the first driving assembly drives the template to move upward from the loading position until the probes on the test circuit board abut against the solder balls of the chip to be tested, it drives the second movable plate to move downward until the thimble abuts against the surface of the chip to be tested, and after the first driving assembly drives the template to move downward a preset distance from the test position, it first drives the second movable plate to move downward so that the thimble pushes the chip to be tested to separate from the probe, and then drives the second movable plate to move upward.

8. The chip testing device according to claim 2, wherein, The surface of the test circuit board facing away from the probes has a plurality of electrical connection interfaces, and each of the electrical connection interfaces is electrically connected to at least one group of probes via conductive lines on the test circuit board; The second movable plate has a plurality of second through holes that penetrate the upper surface and the lower surface of the second movable plate, and the electrical connection interfaces are connected to the host computer through cables passing through the second through holes, or the tops of the electrical connection interfaces protrude to the upper surface of the second movable plate or are flush with the upper surface of the second movable plate through the second through holes.

9. The chip testing device according to claim 1, wherein, The upper surface of the first movable plate has a plurality of positioning members, the template has a plurality of positioning portions, and the template is disposed at a predetermined position of the first movable plate by a manner of cooperation between the positioning portions and the positioning members.

10. The chip testing device according to claim 2, wherein A buffer spring is sleeved on the linkage rod, and both ends of the buffer spring are respectively abutted against the first movable plate and the test circuit board.

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