Positioning device for laser cutting of polycrystalline diamond slices

Abstract

The utility model discloses a positioning device for cutting polycrystalline diamond slices by laser, which comprises a working platform, an index plate is arranged in the working platform, a glass slide is arranged in the index plate, and at least one polycrystalline diamond is placed on the glass slide; the working platform is further connected with a first moving part for controlling the working platform to move longitudinally and a second moving part for controlling the working platform to move transversely; the polycrystalline diamond cutting device has the advantages that the glass slide is used for loading a plurality of polycrystalline diamonds, movement of the glass slide is controlled through the first moving part and the second moving part, rotation of the glass slide can be controlled through the index plate, and cutting of the polycrystalline diamonds at any position and at any angle is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of superhard material processing, and particularly relates to a positioning device for laser cutting polycrystalline diamond slices. Background Technique

[0002] Polycrystalline diamond is directly formed by the transformation of carbon elements under ultra-high pressure and high temperature conditions. It has a series of excellent properties such as extremely high hardness, wear resistance, and excellent self-sharpening property, making it an irreplaceable tool material in ultra-precision machining. Polycrystalline diamond is generally cut by a diamond laser cutting machine. At present, most of the devices of diamond laser cutting machines on the market can only complete simple straight-line cutting and cannot meet the cutting requirements of workpieces at specific angles.

[0003] The patent with the publication number of "CN220612662U" discloses a "laser cutting device for polycrystalline diamond processing", including a bottom plate. An fixing plate is arranged above the bottom plate. An installation ring is arranged on one side of the fixing plate. An installation rod is fixedly connected to the inner wall of the installation ring. A laser is slidably connected to the installation rod. A positioning ring is arranged at the center of the installation ring. Two screw rods are threadedly connected to the outer wall of the positioning ring. One end of each screw rod is rotatably connected to a clamping plate. An arc-shaped plate is hinged to the outer wall of the positioning ring; a component that can adjust the polycrystalline diamond in multiple directions and at multiple angles during cutting is formed by the installation ring, the installation rod, the arc-shaped plate and the positioning ring, so that the laser can perform more comprehensive cutting and processing on the polycrystalline diamond after fixing the polycrystalline diamond, thereby reducing the need to continuously cool the polycrystalline diamond and adjust the fixing position multiple times during the cutting of the polycrystalline diamond, and thus improving the processing efficiency of the polycrystalline diamond during laser cutting. However, in the solution of this patent, only one polycrystalline diamond can be cut at a time, resulting in low efficiency.

[0004] Therefore, this application proposes a positioning device for laser cutting polycrystalline diamond slices. Summary of the Invention

[0005] The purpose of the utility model is to provide a positioning device for laser cutting polycrystalline diamond slices, which can cut multiple polycrystalline diamonds at one time and can also position the cutting angle of the polycrystalline diamond.

[0006] To achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A positioning device for laser cutting polycrystalline diamond slices includes a working platform. A dividing plate is arranged inside the working platform. A glass slide is arranged inside the dividing plate. At least one polycrystalline diamond is placed on the glass slide;

[0008] The working platform is also connected with a first moving part for controlling its longitudinal movement and a second moving part for controlling its transverse movement.

[0009] Preferably, a chuck is arranged inside the indexing plate, and the glass slide is installed inside the chuck.

[0010] Preferably, a groove for accommodating polycrystalline diamond is arranged on the glass slide, and a clamping post for facilitating the fixation by the chuck is arranged at the bottom of the glass slide.

[0011] Preferably, a setscrew that can abut against the outer edge of the indexing plate is arranged on the side wall of the working platform.

[0012] Preferably, an observation hole for observing the rotation angle of the indexing plate is arranged on the side wall of the working platform.

[0013] Preferably, the first moving part includes a first frame, a first lead screw is arranged inside the first frame, a movable first slider is arranged on the first lead screw, and the first slider is fixedly connected to the working platform.

[0014] Preferably, the second moving part includes a second frame, a second lead screw is arranged inside the second frame, a movable second slider is arranged on the second lead screw, and the second slider is fixedly connected to the first frame.

[0015] Preferably, the device further includes a guiding part cooperating with the first frame, one of the guiding part and the first frame has a guiding groove, and the other has a guiding protrusion cooperating with the guiding groove.

[0016] The beneficial effects of the present utility model are as follows:

[0017] 1. Use a glass slide to load multiple polycrystalline diamonds, control the movement of the glass slide through the first moving part and the second moving part, and at the same time, can also control the rotation of the glass slide through the indexing plate to realize cutting at any position and angle of the polycrystalline diamond.

[0018] 2. Realize the movement of the working platform and the indexing plate and the glass slide installed on the working platform in the form of a lead screw and a slider, making the movement process stable and reliable.

[0019] 3. An observation hole is arranged on the working platform, which is convenient for observing the angle of the indexing plate, and at the same time, position it through the setscrew to prevent rotation during the cutting process. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a top view of the present utility model;

[0021] Figure 2 is Figure 1 the top view with the chuck removed in

[0022] Figure 3 is Figure 2 the top view with the working platform removed in

[0023] Figure 4 is Figure 2 the A-A sectional view;

[0024] Figure 5 are the three-dimensional views of the chuck at two different angles;

[0025] Figure 6 is the top view of the glass slide;

[0026] Figure 7 is the bottom view of the glass slide;

[0027] Figure 8 is the schematic diagram of the first cut of the polycrystalline diamond;

[0028] Figure 9 is the schematic diagram of the second cut of the polycrystalline diamond.

[0029] The accompanying drawings are only for illustrative purposes and should not be construed as a limitation to this patent; for better illustration of this embodiment, some components in the drawings may be omitted, enlarged or reduced, which do not represent the dimensions of the actual product; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted. Detailed implementation manners

[0030] The following further describes the present utility model in conjunction with the accompanying drawings. Embodiment

[0031] As Figure 1 , Figure 2 and Figure 6 shown, a positioning device for laser cutting polycrystalline diamond slices in this embodiment includes a working platform 300. A dividing plate 301 is arranged inside the working platform 300. A glass slide 100 is arranged inside the dividing plate 301. At least one polycrystalline diamond 101 is placed on the glass slide 100;

[0032] The working platform 300 is further connected with a first moving part 400 for controlling its longitudinal movement and a second moving part 500 for controlling its transverse movement. During use, the rotation of the glass slide 100 is controlled by the dividing plate 301 to achieve cutting at any angle of the polycrystalline diamond 101, and the movement of the working platform 300 and the glass slide 100 is controlled by the first moving part 400 and the second moving part 500 to achieve cutting at any position thereof.

[0033] As Figure 1 and Figure 5As shown, a chuck 200 is provided inside the indexing plate 301, and the glass slide 100 is installed inside the chuck 200. The chuck 200 is a three-jaw chuck, which is an existing conventional machining device. It has three jaws 201, and a clamping space 202 is formed between the three jaws 201. A fixing part 203 installed inside the indexing plate 301 is provided at the bottom of the chuck 200.

[0034] As Figure 6 and Figure 7 shown, a groove for accommodating polycrystalline diamond 101 is provided on the glass slide 100, and a clamping post 102 convenient for the chuck 200 to fix is provided at the bottom of the glass slide 100. The clamping post 102 can extend into the clamping space 202 and be clamped by the three jaws 201.

[0035] As Figure 2 and Figure 4 shown, a setscrew 302 that can abut against the outer edge of the indexing plate 301 is provided on the side wall of the working platform 300. When the setscrew 302 is screwed out from the working platform 300 (not necessarily completely screwed out), the indexing plate 301, the chuck 200, and the glass slide 100 can be freely rotated to realize the rotation of the polycrystalline diamond 101. When the setscrew 302 is screwed into the working platform 300 and its end abuts against the indexing plate 301, the indexing plate 301 cannot rotate, realizing the positioning of the glass slide 100 and the polycrystalline diamond 101 at this angle, and the polycrystalline diamond 101 can be stably cut at this angle.

[0036] An observation hole 303 for observing the rotation angle of the indexing plate 301 is provided on the side wall of the working platform 300. A fixed scale is provided inside the observation hole 303, which is convenient for observing the rotation angle of the indexing plate 301 and real-time positioning.

[0037] As Figure 3 and Figure 4 shown, the first moving part 400 includes a first frame 401. A first lead screw 402 is provided inside the first frame 401. A movable first slider 403 is provided on the first lead screw 402. The first slider 403 is fixedly connected to the working platform 300.

[0038] The second moving part 500 includes a second frame 501. A second lead screw 502 is arranged inside the second frame 501. A movable second slider 503 is arranged on the second lead screw 502. The second slider 503 is fixedly connected to the first frame 401. In this embodiment, both the first lead screw 402 and the second lead screw 502 are connected to motors (not shown in the figure) that drive their rotation. When the first lead screw 402 rotates, the first slider 403 drives the working platform 300, the chuck 200, and the glass slide 100 to move up and down. When the second lead screw 502 rotates, the second slider 503 drives the first frame 401, the working platform 300, the chuck 200, and the glass slide 100 to move left and right, ensuring that the glass slide 100 and any polycrystalline diamond 101 can be moved directly below the laser cutting instrument for laser cutting.

[0039] To ensure the smooth and reliable left - right movement of the first frame 401, the device is also provided with a guiding part 600 that cooperates with the first frame 401. Guide protrusions are arranged on the guiding part 600, and guiding grooves that cooperate with the guide protrusions are arranged at the bottom of the first frame. It plays a certain guiding role in the left - right movement of the first frame 401 to avoid deflection.

[0040] When the present utility model is in use, through the first moving part 400 and the second moving part 500, any polycrystalline diamond 101 can be moved to the cutting position of the laser cutting instrument. Then, through the rotation of the dividing plate 301, cutting at any angle of the polycrystalline diamond 101 can be achieved.

[0041] During the actual cutting process, the laser cutting instrument only moves up and down for a short distance. As Figure 8 shown, the reference numerals 1 - 9 are the 9 polycrystalline diamonds placed on the glass slide 100 in this embodiment. The vertical lines in the polycrystalline diamonds are the first cuts made on them. For example, the first cut on polycrystalline diamond 1 is 11, and the first cut on polycrystalline diamond 4 is 41. After the first cut is completed on all 9 polycrystalline diamonds, as Figure 9 shown, it is a schematic diagram of the second cut on the polycrystalline diamond after the glass slide 100 rotates counterclockwise by 60°. By moving the position of the glass slide 100, first align polycrystalline diamond 1 with the starting point of the laser cutting instrument, and then the laser cutting instrument starts to cut the second cut 12. Then the glass slide 100 continues to move, enabling the laser cutting instrument to cut the second cut 42 of polycrystalline diamond 4, thus completing the second cut of all 9 polycrystalline diamonds; subsequently, the glass slide can continue to rotate to complete the third cut (not detailed in this embodiment).

[0042] In this embodiment, the angular rotation of the indexing plate 301 and the specific moving distance of the glass slide 100 are both manually operated. In some embodiments, the rotation angle of the indexing plate 301 can also be preset in advance, and then the control system automatically records the cutting point and cutting length set when cutting the first knife. According to the rotation angle of the glass slide 100, the cutting point and cutting length when cutting the second knife are automatically calculated for automated operation, which can greatly simplify the work of the operator.

[0043] This embodiment does not impose any formal restrictions on the shape, material, structure, etc. of the present invention. Any simple modification, equivalent change, and modification made to the above embodiments based on the technical essence of the present invention all belong to the protection scope of the technical solution of the present invention.

[0044] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the protected content of the present invention.

[0045] If terms such as "first" and "second" are used in this article to limit components, those skilled in the art should be aware that the use of "first" and "second" is only for the convenience of describing the present invention and simplifying the description. Without additional declaration, the above terms have no special meaning.

[0046] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features, but these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A positioning device for laser cutting polycrystalline diamond slices, comprising a working platform, characterized in that, A dividing plate is arranged inside the working platform, a glass slide is arranged inside the dividing plate, and at least one polycrystalline diamond is placed on the glass slide. The working platform is further connected with a first moving part for controlling its longitudinal movement and a second moving part for controlling its transverse movement.

2. The positioning device for laser cutting polycrystalline diamond slices according to claim 1, wherein A chuck is arranged inside the dividing plate, and the glass slide is installed inside the chuck.

3. The positioning device for laser cutting polycrystalline diamond slices according to claim 2, wherein, A groove for accommodating the polycrystalline diamond is arranged on the glass slide, and a clamping column for facilitating the fixation by the chuck is arranged at the bottom of the glass slide.

4. A positioning device for laser cutting polycrystalline diamond slices according to claim 1, characterized in that, A setscrew capable of abutting against the outer edge of the dividing plate is arranged on the side wall of the working platform.

5. A positioning device for laser cutting polycrystalline diamond slices according to claim 1, characterized in that, An observation hole for observing the rotation angle of the dividing plate is arranged on the side wall of the working platform.

6. The positioning device for laser cutting polycrystalline diamond slices according to claim 1, characterized in that, The first moving part includes a first frame, a first lead screw is arranged inside the first frame, a movable first slider is arranged on the first lead screw, and the first slider is fixedly connected with the working platform.

7. The positioning device for laser cutting polycrystalline diamond slices according to claim 6, characterized in that, The second moving part includes a second frame, a second lead screw is arranged inside the second frame, a movable second slider is arranged on the second lead screw, and the second slider is fixedly connected with the first frame.

8. The positioning device for laser cutting polycrystalline diamond slices according to claim 6, wherein, A guiding part cooperating with the first frame is further included, and one of the guiding part and the first frame has a guiding groove, and the other has a guiding protrusion cooperating with the guiding groove.

Images