Soft and hard combined circuit board stable connection structure

Abstract

The utility model provides a rigid-flex circuit board stable connection structure comprising a first PCB substrate and a second PCB substrate, and the bottom of the first PCB substrate is fixedly connected with the second PCB substrate. Compared with the prior art, the circuit board has the advantages that when the circuit board is used, the first FPC substrate, the second FPC substrate, the first golden finger and the second golden finger need to be in circuit connection with other devices through the first FPC substrate, the second FPC substrate, the first golden finger and the second golden finger, and due to the fact that an FR gasket is arranged between the first golden finger and the second golden finger, the circuit board has high rigidity and can resist repeated plugging and pulling; the first FPC substrate and the second FPC substrate are used for connecting the golden fingers, and the middle parts are hollow, so that the golden fingers have good flexibility, and the middle parts are thinned, and the surfaces of the first FPC substrate and the second FPC substrate are provided with grooves, so that the golden fingers can be resistant to multiple times of bending. Therefore, the whole structure not only ensures multiple plugging of the first golden finger and the second golden finger, but also ensures electrical connection of the whole assembly, and other connection areas are not affected by plugging.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a stable connection structure of a rigid-flexible combined circuit board. Background Art

[0002] In the current rigid-flexible combined board structure, there are many FPC base ends connected to gold fingers. In this structure, some FPCs have good flexibility, but the gold fingers at the FPC base ends are too soft, which is not conducive to multiple pluggings and unplugging; some gold fingers at the FPC base ends have rigidity and are relatively easy to plug and unplug, but the connected FPCs are not flexible enough, resulting in the gold fingers at the FPC base ends not being able to be conveniently plugged and unplugged multiple times, thus affecting the plugging and unplugging effect. Summary of the Utility Model

[0003] The purpose of the utility model aims to solve at least one of the technical defects.

[0004] To this end, an object of the utility model is to provide a stable connection structure of a rigid-flexible combined circuit board to solve the problems mentioned in the background art and overcome the deficiencies in the prior art.

[0005] To achieve the above object, an embodiment of one aspect of the utility model provides a stable connection structure of a rigid-flexible combined circuit board, including a first PCB substrate and a second PCB substrate, the bottom of the first PCB substrate is fixedly connected to the second PCB substrate;

[0006] At the front ends of the first PCB substrate and the second PCB substrate, there are notches, and a first FPC substrate and a second FPC substrate are respectively fixedly connected in these notches;

[0007] A first filling member is fixedly connected between the roots of the first FPC substrate and the second FPC substrate;

[0008] The first filling member is fixedly connected in the front-end notches of the first PCB substrate and the second PCB substrate;

[0009] The front end of the first FPC substrate is fixedly connected to a first gold finger, and the front end of the second FPC substrate is fixedly connected to a second gold finger;

[0010] A second filling member is fixedly connected between the first gold finger and the second gold finger;

[0011] Grooves are formed on both the top and bottom surfaces of the first FPC substrate and the second FPC substrate, that is, the middle part of their surfaces is thinned.

[0012] Preferably, according to any of the above solutions, the first PCB substrate and the second PCB substrate are press-bonded, and the substrates of the first PCB substrate and the second PCB substrate are copper-clad laminates.

[0013] Adopting the above technical solution: The combined rigid-flex circuit board comprises, from top to bottom in sequence, a first PCB substrate, a first FPC substrate, a first gold finger, a first filler and a second filler, a second gold finger, a second FPC substrate, and a second PCB substrate.

[0014] Preferably, according to any one of the above solutions, the connection relationships between the first PCB substrate, the second PCB substrate and the first FPC substrate and the second FPC substrate are soldering and bonding.

[0015] Adopting the above technical solution: Among them, the first PCB substrate and the second PCB substrate are rigid boards, and the first FPC substrate and the second FPC substrate are flexible boards.

[0016] The basic characteristics of this combined rigid-flex circuit board are that it can achieve high-density component assembly and complex wiring design, which helps to implement more circuit designs within a limited space, improve the integration of the device and reduce its volume. By combining flexible circuit boards and rigid circuit boards, the combined rigid-flex board can provide more functions and connection points without increasing the overall size, thus saving the internal space of the product. The combined rigid-flex board has the flexibility and foldability of a flexible circuit board and can adapt to various complex space structures and special-shaped design requirements.

[0017] Preferably, according to any one of the above solutions, the first filler and the first PCB substrate, the second PCB substrate and the first FPC substrate and the second FPC substrate are all in a bonding relationship. The base materials of the first FPC substrate and the second FPC substrate are both polyimide, and the cross-sections of the first filler and the second filler are both regular rectangles.

[0018] Adopting the above technical solution: FR4, fully known as flame-retardant copper-clad epoxy E-glass fiber cloth laminate, is a composite material widely used in the electronics industry. It is composed of epoxy resin, glass fiber cloth, and copper foil, and has excellent electrical properties, mechanical properties, thermal properties, and flame-retardant properties. The use of FR4 material makes the circuit board have higher reliability, stability, and durability.

[0019] The first filler and the second filler provide a solid structural support for the entire circuit board. It makes the circuit board not easily deformed or damaged when subjected to external forces, thus ensuring the stability and reliability of the circuit.

[0020] Preferably, according to any one of the above solutions, the materials of the first filler and the second filler are FR, and the connection between the first gold finger and the first FPC substrate is stepped.

[0021] Adopting the above technical solution: The core structure of this device is: the first FPC substrate, the second FPC substrate, the first filling member, the first gold finger, the second gold finger, the second filling member, and the groove. When using this circuit board, it is necessary to connect the first FPC substrate and the second FPC substrate to other devices through the first FPC substrate, the second FPC substrate, the first gold finger, and the second gold finger. Since there is an FR pad between the first gold finger and the second gold finger, it has strong rigidity and can withstand multiple insertions and extractions. When the first gold finger and the second gold finger are inserted and extracted, since the first FPC substrate and the second FPC substrate are connected to the gold fingers and the middle is hollow, it has good flexibility. Moreover, its middle part is thinned, and its surface has grooves, which can withstand multiple flexures. In this way, the entire structure can ensure the multiple insertions and extractions of the first gold finger and the second gold finger, and can also ensure the electrical connection of the entire component, and other connection areas are not affected by the insertions and extractions.

[0022] Preferably, according to any of the above solutions, the connection between the second gold finger and the second FPC substrate is stepped.

[0023] Compared with the prior art, the advantages and beneficial effects of the present utility model are as follows:

[0024] 1. For the stable connection structure of this rigid-flexible combination circuit board, through the cooperative setting of the first FPC substrate, the second FPC substrate, the first filling member, the first gold finger, the second gold finger, the second filling member, and the groove, when using this circuit board, it is necessary to connect the first FPC substrate and the second FPC substrate to other devices through the first FPC substrate, the second FPC substrate, the first gold finger, and the second gold finger. Since there is an FR pad between the first gold finger and the second gold finger, it has strong rigidity and can withstand multiple insertions and extractions.

[0025] 2. For the stable connection structure of this rigid-flexible combination circuit board, when the first gold finger and the second gold finger are inserted and extracted, since the first FPC substrate and the second FPC substrate are connected to the gold fingers and the middle is hollow, it has good flexibility. Moreover, its middle part is thinned, and its surface has grooves, which can withstand multiple flexures. In this way, the entire structure can ensure the multiple insertions and extractions of the first gold finger and the second gold finger, and can also ensure the electrical connection of the entire component, and other connection areas are not affected by the insertions and extractions.

[0026] The additional aspects and advantages of the present utility model will be partially given in the following description, partially will become obvious from the following description, or will be understood through the practice of the present utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and / or additional aspects and advantages of the present utility model will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, where:

[0028] Figure 1 is a schematic structural diagram of the first perspective of the present utility model;

[0029] Figure 2 is a schematic structural diagram of the second perspective of the present utility model;

[0030] Figure 3 is a schematic top view structural diagram of the present utility model.

[0031] In the figure: 1 - the first PCB substrate, 2 - the second PCB substrate, 3 - the first FPC substrate, 4 - the second FPC substrate, 5 - the first filling member, 6 - the first gold finger, 7 - the second gold finger, 8 - the second filling member, 9 - the groove. Detailed implementation manners

[0032] The following details the embodiments of the present utility model. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present utility model, and should not be construed as a limitation of the present utility model.

[0033] In the present utility model, unless otherwise clearly defined and limited, terms such as "installed", "connected", "connected to", "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0034] As Figures 1-3 shown, the stable connection structure of the combined rigid-flexible circuit board includes the first PCB substrate 1 and the second PCB substrate 2, and the bottom of the first PCB substrate 1 is fixedly connected to the second PCB substrate 2;

[0035] At the front ends of the first PCB substrate 1 and the second PCB substrate 2, there are notches, and the first FPC substrate 3 and the second FPC substrate 4 are respectively fixedly connected in these notches;

[0036] A first filling member 5 is fixedly connected between the roots of the first FPC substrate 3 and the second FPC substrate 4;

[0037] The first filling member 5 is fixedly connected in the front-end notches of the first PCB substrate 1 and the second PCB substrate 2;

[0038] The front end of the first FPC substrate 3 is fixedly connected to a first gold finger 6, and the front end of the second FPC substrate 4 is fixedly connected to a second gold finger 7;

[0039] A second filler 8 is fixedly connected between the first gold finger 6 and the second gold finger 7;

[0040] Grooves 9 are provided on both the top and bottom surfaces of the first FPC substrate 3 and the second FPC substrate 4, that is, the middle part of their surfaces is thinned.

[0041] Embodiment 1: The first PCB substrate 1 and the second PCB substrate 2 are press-bonded. The base materials of the first PCB substrate 1 and the second PCB substrate 2 are copper-clad laminates. This rigid-flex circuit board, from top to bottom, is successively the first PCB substrate 1, the first FPC substrate 3, the first gold finger 6, the first filler 5 and the second filler 8, the second gold finger 7, the second FPC substrate 4, and the second PCB substrate 2. The connection relationships between the first PCB substrate 1, the second PCB substrate 2 and the first FPC substrate 3 and the second FPC substrate 4 are welding and bonding. Among them, the first PCB substrate 1 and the second PCB substrate 2 are rigid boards, and the first FPC substrate 3 and the second FPC substrate 4 are flexible boards. The basic feature of this rigid-flex circuit board is that it can achieve high-density component assembly and complex wiring design, which helps to implement more circuit designs within a limited space, improve the integration of the device and reduce the volume. By combining flexible circuit boards and rigid circuit boards, the rigid-flex board can provide more functions and connection points without increasing the overall size, thus saving the internal space of the product. The rigid-flex board has the flexibility and foldability of a flexible circuit board and can adapt to various complex space structures and special-shaped design requirements.

[0042] Embodiment 2: The first filler 5 has an adhesive relationship with the first PCB substrate 1, and the second PCB substrate 2 has an adhesive relationship with the first FPC substrate 3 and the second FPC substrate 4. The base materials of the first FPC substrate 3 and the second FPC substrate 4 are both polyimide. The cross-sections of the first filler 5 and the second filler 8 are both regular rectangles. FR4, full name flame-retardant copper-clad epoxy E-glass fiber cloth laminate, is a composite material widely used in the electronics industry. It consists of epoxy resin, glass fiber cloth, and copper foil, and has excellent electrical properties, mechanical properties, thermal properties, and flame-retardant properties. The use of FR4 material makes the circuit board have higher reliability, stability, and durability.

[0043] The first filler 5 and the second filler 8 provide a solid structural support for the entire circuit board. It makes the circuit board not easily deformed or damaged when subjected to external forces, thus ensuring the stability and reliability of the circuit. The materials of the first filler 5 and the second filler 8 are FR4. The connection between the first gold finger 6 and the first FPC substrate 3 is stepped. The connection between the second gold finger 7 and the second FPC substrate 4 is stepped.

[0044] The working principle of the present utility model is as follows:

[0045] The hard - and - soft combined circuit board, from top to bottom, is successively a first PCB substrate 1, a first FPC substrate 3, a first gold finger 6, a first filler 5 and a second filler 8, a second gold finger 7, a second FPC substrate 4, and a second PCB substrate 2. Among them, the first PCB substrate 1 and the second PCB substrate 2 are rigid boards, and the first FPC substrate 3 and the second FPC substrate 4 are flexible boards. The connection relationship between the first PCB substrate 1, the second PCB substrate 2 and the first FPC substrate 3 and the second FPC substrate 4 is welding or bonding. The first filler 5 has a bonding relationship with the first PCB substrate 1, and the second PCB substrate 2 has a bonding relationship with the first FPC substrate 3 and the second FPC substrate 4.

[0046] When using this circuit board, it is necessary to connect the first FPC substrate 3 and the second FPC substrate 4 to other devices through the first FPC substrate 3, the second FPC substrate 4, the first gold finger 6 and the second gold finger 7. Since there is an FR4 gasket between the first gold finger 6 and the second gold finger 7, it has strong rigidity and can withstand multiple insertions and extractions. When the first gold finger 6 and the second gold finger 7 are inserted and extracted, because the first FPC substrate 3 and the second FPC substrate 4 are connected to the gold fingers and are hollow in the middle, they have good flexibility. And the middle part is thinned, and there are grooves 9 on its surface, which can withstand multiple flexures.

[0047] Compared with the prior art, the present utility model has the following beneficial effects over the prior art:

[0048] 1. The hard - and - soft combined circuit board has a stable connection structure. Through the cooperation of the first FPC substrate 3, the second FPC substrate 4, the first filler 5, the first gold finger 6, the second gold finger 7, the second filler 8 and the groove 9, when using this circuit board, it is necessary to connect the first FPC substrate 3 and the second FPC substrate 4 to other devices through the first FPC substrate 3, the second FPC substrate 4, the first gold finger 6 and the second gold finger 7. Since there is an FR4 gasket between the first gold finger 6 and the second gold finger 7, it has strong rigidity and can withstand multiple insertions and extractions.

[0049] 2. The hard - and - soft combined circuit board has a stable connection structure. When the first gold finger 6 and the second gold finger 7 are inserted and extracted, because the first FPC substrate 3 and the second FPC substrate 4 are connected to the gold fingers and are hollow in the middle, they have good flexibility. And the middle part is thinned, and there are grooves 9 on its surface, which can withstand multiple flexures. In this way, the entire structure can not only ensure the multiple insertions and extractions of the first gold finger 6 and the second gold finger 7, but also ensure the electrical connection of the entire component, and other connection areas are not affected by the insertions and extractions.

Claims

1. A stable connection structure for a circuit board combining rigid and flexible components, characterized in that, It includes a first PCB substrate (1) and a second PCB substrate (2), and the bottom of the first PCB substrate (1) is fixedly connected to the second PCB substrate (2); At the front ends of the first PCB substrate (1) and the second PCB substrate (2), there are notches, and a first FPC substrate (3) and a second FPC substrate (4) are fixedly connected in these notches respectively; A first filling member (5) is fixedly connected between the roots of the first FPC substrate (3) and the second FPC substrate (4); The first filling member (5) is fixedly connected in the front notches of the first PCB substrate (1) and the second PCB substrate (2); The front end of the first FPC substrate (3) is fixedly connected to a first gold finger (6), and the front end of the second FPC substrate (4) is fixedly connected to a second gold finger (7); A second filling member (8) is fixedly connected between the first gold finger (6) and the second gold finger (7); Grooves (9) are formed on both the top and bottom surfaces of the first FPC substrate (3) and the second FPC substrate (4), that is, the middle part of their surfaces is thinned.

2. The stable connection structure of a rigid-flex circuit board as described in claim 1, characterized in that: The first PCB substrate (1) and the second PCB substrate (2) are press-bonded, and the substrates of the first PCB substrate (1) and the second PCB substrate (2) are copper-clad laminates.

3. The stable connection structure of a rigid-flex circuit board according to claim 2, wherein: The connection relationships between the first PCB substrate (1), the second PCB substrate (2) and the first FPC substrate (3) and the second FPC substrate (4) are welding and bonding.

4. The stable connection structure of a rigid-flex circuit board as described in claim 3, characterized in that: The connection relationships between the first filling member (5), the first PCB substrate (1), the second PCB substrate (2), the first FPC substrate (3) and the second FPC substrate (4) are all bonding. The substrates of the first FPC substrate (3) and the second FPC substrate (4) are both polyimide. The cross-sections of the first filling member (5) and the second filling member (8) are both regular rectangles.

5. The stable connection structure of a rigid-flex circuit board according to claim 4, characterized in that: The materials of the first filling member (5) and the second filling member (8) are FR4, and the connection part between the first gold finger (6) and the first FPC substrate (3) is stepped.

6. The stable connection structure of a rigid-flex printed circuit board according to claim 5, characterized in that: The connection part between the second gold finger (7) and the second FPC substrate (4) is stepped.

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