Jig and printing platform for thin substrate solder paste printing

Abstract

The utility model provides a jig and a printing platform for thin substrate solder paste printing, the jig comprises a jig top plate and a jig bottom plate, the lower surface of the jig top plate covers and is fixed on the upper surface of the jig bottom plate, and the upper surface of the jig top plate is used for bearing a substrate; a first groove is formed in the upper surface of the jig top plate, a plurality of protrusions are arranged on the groove, the height of the portion, placed on the protrusions, of the base plate is the same as the height of the edge of the groove, and first through holes penetrating through the upper surface and the lower surface of the protrusions are formed in the protrusions. A second groove is formed in the upper surface of the jig bottom plate; a second through hole communicated with the second groove is downwards formed in the second groove of the jig bottom plate; the first through hole, the second groove and the second through hole can be vacuumized to adsorb the substrate. The solder paste printing device has the advantages that the substrate is prevented from loosening in the solder paste printing process, fixation of the substrate through a high-temperature adhesive tape is omitted, the risk that the adhesive tape is left on the substrate is eliminated, the solder paste printing quality is improved, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of substrate printing, in particular to a fixture and a printing platform for solder paste printing on a thin substrate. Background Art

[0002] The process of substrate solder paste printing: Since the substrate is thin (≤0.3mm), it is easy to warp and deform. Before printing, the substrate needs to be attached to a carrier and then placed in a printing machine for solder paste printing. During the solder paste printing process, a vacuum fixture is required on the printing platform to support and fix the carrier and the substrate to achieve the accuracy and stability of printing. Currently, in the industry of solder paste printing process, the general method is: vacuum fixture + side clamp (clamping plate) for positioning. Currently, a vacuum fixture suitable for a printing machine is designed based on optimizing the substrate in the solder paste printing process. Summary of the Utility Model

[0003] The technical problem to be solved by the utility model is: to provide a fixture for solder paste printing on a thin substrate, aiming to improve production efficiency.

[0004] To solve the above technical problem, the technical solution adopted by the utility model is: a fixture for solder paste printing on a thin substrate, which is characterized by including: a fixture top plate and a fixture bottom plate. The lower surface of the fixture top plate is covered and fixed on the upper surface of the fixture bottom plate. The upper surface of the fixture top plate is used to carry the substrate. A first groove is opened on the upper surface of the fixture top plate, and a plurality of protrusions are arranged on the groove. The height of the substrate placed on the protrusions is the same as the height of the groove edge. A first through hole penetrating its upper and lower surfaces is opened on the protrusion. A second groove is opened on the upper surface of the fixture bottom plate. A second through hole communicating with the second groove is opened downward from the second groove of the fixture bottom plate. The first through hole, the second groove and the second through hole can be evacuated to adsorb the substrate.

[0005] Further, positioning pins are provided on the lower surface of the fixture bottom plate.

[0006] Further, magnets are embedded on the lower surface of the fixture bottom plate.

[0007] Further, first screw holes are opened on the fixture top plate and the fixture bottom plate, and the fixture top plate and the fixture bottom plate are fixed by screws.

[0008] Further, a plurality of protrusions are arranged in an array.

[0009] Further, each protrusion is a rectangular column.

[0010] Further, among the plurality of protrusions, the first through holes are uniformly arranged in three rows and six columns.

[0011] The present utility model further provides a printing platform, comprising: a platform and a jig as described in any one of the above; the bottom plate of the jig is fixed on the platform; above the top plate of the jig, there is a stencil, a squeegee and solder paste are arranged on the stencil.

[0012] Furthermore, air extraction holes are provided on the platform, and the air extraction holes communicate with the second through holes on the bottom plate of the jig.

[0013] Furthermore, second screw holes are provided on the platform and the bottom plate of the jig, and the platform and the bottom plate of the jig are fixed by screws.

[0014] The beneficial effects of the present utility model are as follows: the substrate is carried by the protrusions on the upper surface of the top plate of the jig, and the substrate is adsorbed by evacuating the first through holes, the second grooves and the second through holes into a vacuum, preventing the substrate from loosening during the solder paste printing process, eliminating the need to fix the substrate with high-temperature tape, eliminating the risk of tape residue remaining on the substrate, improving the solder paste printing quality and production efficiency. Description of the Drawings

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on the mechanisms shown in these drawings.

[0016] Figure 1 It is a schematic structural diagram of the top plate of the jig according to an embodiment of the present utility model;

[0017] Figure 2 It is a schematic structural diagram of the bottom plate of the jig according to an embodiment of the present utility model;

[0018] Figure 3 It is a schematic overall structural diagram of the jig for solder paste printing of thin substrates according to an embodiment of the present utility model;

[0019] Figure 4 It is a schematic structural diagram of the printing platform according to an embodiment of the present utility model;

[0020] Wherein, 10, top plate of the jig; 11, protrusion; 12, first through hole; 13, first groove; 14, first screw hole; 15, carrier; 16, substrate; 20, bottom plate of the jig; 21, second groove; 22, second through hole; 23, positioning pin; 24, magnet; 25, second screw hole; 30, platform; 31, air extraction hole; 40, stencil; 41, squeegee; 42, solder paste. Detailed Embodiments

[0021] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0022] It should be noted that the descriptions involving "first", "second", etc. in the present invention are only for descriptive purposes, and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present invention.

[0023] As Figures 1 - 4 shown, an embodiment of the present invention is: a jig for solder paste printing on a thin substrate, including: a jig top plate 10 and a jig bottom plate 20. The lower surface of the jig top plate 10 is covered and fixed on the upper surface of the jig bottom plate 20. The upper surface of the jig top plate 10 is used to carry the substrate 16. A first groove 13 is formed on the upper surface of the jig top plate 10, and a plurality of protrusions 11 are provided on the groove. The height of the substrate 16 placed on the protrusions 11 is the same as the height of the groove edge. A first through hole 12 penetrating through its upper and lower surfaces is formed on the protrusion 11. A second groove 21 is formed on the upper surface of the jig bottom plate 20. A second through hole 22 communicating with the second groove 21 is formed downward from the second groove 21 of the jig bottom plate 20. The first through hole 12, the second groove 21, and the second through hole 22 can be evacuated to adsorb the substrate 16.

[0024] In this embodiment, the substrate 16 is carried by the protrusions 11 on the upper surface of the jig top plate 10, and the substrate 16 is adsorbed by evacuating the first through hole 12, the second groove 21, and the second through hole 22, preventing the substrate 16 from loosening during the solder paste 42 printing process, eliminating the need to fix the substrate 16 with high-temperature tape, eliminating the risk of tape remaining on the substrate 16, improving the solder paste 42 printing quality, and improving production efficiency.

[0025] In a specific embodiment, a positioning pin 23 is provided on the lower surface of the jig bottom plate 20.

[0026] Among them, a magnet 24 is embedded in the lower surface of the jig bottom plate 20.

[0027] In this embodiment, the positioning pin 23 is used to limit the fixture bottom plate 20 on the printing platform 30, and the magnet 24 functions to adsorb on the printing platform 30.

[0028] In a specific embodiment, the fixture top plate 10 and the fixture bottom plate 20 are provided with first screw holes 14, and the fixture top plate 10 and the fixture bottom plate 20 are fixed by screws.

[0029] In this embodiment, the fixture top plate 10 and the fixture bottom plate 20 are fixed by screws, so that a communication channel is formed between the first through hole 12, the second groove 21 and the second through hole 22. By extracting the air in this channel, a vacuum environment can be formed, thereby adsorbing and fixing the substrate 16; it can simplify the operation process, improve production efficiency and quality when printing products, avoid using high-temperature tapes, and reduce production costs.

[0030] In a specific embodiment, a plurality of protrusions 11 are arranged in an array.

[0031] Among them, each protrusion 11 is a rectangular column.

[0032] Among them, in the plurality of protrusions 11, the first through holes 12 are uniformly arranged in three rows and six columns.

[0033] In this embodiment, the plurality of protrusions 11 are arranged in an array, which can provide uniform support points for the substrate 16. Among the plurality of protrusions 11, the first through holes 12 are selectively opened at intervals in the protrusions 11 to provide uniform adsorption force for the substrate 16.

[0034] As Figure 4 shown, an embodiment of the present invention further provides a printing platform, including: a platform 30 and the fixture as described in any one of the above; the fixture bottom plate 20 is fixed on the platform 30; a stencil 40 is provided above the fixture top plate 10, and a squeegee 41 and solder paste 42 are provided on the stencil 40.

[0035] Among them, an air extraction hole 31 is provided on the platform 30, and the air extraction hole 31 communicates with the second through hole 22 on the fixture bottom plate 20.

[0036] Among them, second screw holes 25 are provided on the platform 30 and the fixture bottom plate 20, and the platform 30 and the fixture bottom plate 20 are fixed by screws.

[0037] In this embodiment, positioning holes are provided on the platform 30. The fixture is fixed to the platform 30 by inserting the positioning pins 23 of the fixture bottom plate 20 into the positioning holes of the platform 30, then adsorbing the fixture to the platform 30 through the magnets 24, and then fixing the fixture bottom plate 20 to the platform 30 by screws.

[0038] The working principle of the fixture for thin substrate solder paste printing:

[0039] In the first step, the jig is installed on the printing machine platform 30, and the carrier 15 and the substrate 16 are transferred to the designated positions on the printing platform 30.

[0040] In the second step, the jig slowly jacks up to fit with the carrier 15 and the substrate 16, so that the carrier 15 and the substrate 16 are completely embedded in the jig and kept flat; then the vacuum is turned on to adsorb the substrate 16; after the camera identifies the fiducial points of the substrate 16 and the stencil 40, it automatically adjusts the offset and angle, and the jig together with the platform 30 rises to the bottom of the stencil 40; the squeegee 41 scrapes the solder paste 42 on the front side of the stencil 40, and the solder paste 42 is screen-printed onto the pads of the substrate 16 through the specific mesh holes on the stencil 40; after printing is completed, the platform 30 together with the jig descends to the track height, and finally the jig slowly descends to disengage from the carrier 15 and the substrate 16; the design of this jig better ensures that the substrate 16 remains fixed and flat during the printing process, guaranteeing the printing quality.

[0041] In the third step, the carrier 15 and the substrate 16 are transferred out of the platform 30 together to complete the printing process of one substrate 16.

[0042] The beneficial effects of this embodiment are as follows: The substrate 16 is carried by the protrusion 11 on the upper surface of the jig top plate 10, and the substrate 16 is adsorbed by evacuating the first through hole 12, the second groove 21 and the second through hole 22 to a vacuum, preventing the substrate 16 from loosening during the printing of the solder paste 42, eliminating the need to fix the substrate 16 with high-temperature tape, eliminating the risk of tape remaining on the substrate 16, improving the printing quality of the solder paste 42, and improving production efficiency. The height of the substrate 16 placed on the protrusion 11 is the same as the height of the groove edge, which can extend the service life of the stencil 40 and the printing quality of the product.

[0043] The above are only the embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structure or equivalent process transformation made by using the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, shall be similarly included in the patent protection scope of the present invention.

Claims

1. A fixture for solder paste printing on a thin substrate, which is applied to a printing platform, and is characterized in that Comprising: A fixture top plate and a fixture bottom plate, the lower surface of the fixture top plate is covered and fixed on the upper surface of the fixture bottom plate, and the upper surface of the fixture top plate is used to carry the substrate; a first groove is provided on the upper surface of the fixture top plate, and a plurality of protrusions are provided on the groove. The height of the substrate placed on the protrusions is the same as the height of the groove edge, and a first through hole penetrating through its upper and lower surfaces is provided on the protrusion; a second groove is provided on the upper surface of the fixture bottom plate; a second through hole communicating with the second groove is provided downward in the second groove of the fixture bottom plate; the first through hole, the second groove and the second through hole can be evacuated to adsorb the substrate; positioning pins are provided on the lower surface of the fixture bottom plate, and the positioning pins limit the fixture bottom plate on the printing platform; magnets are embedded on the lower surface of the fixture bottom plate, and the magnets are used to adsorb on the printing platform.

2. The jig for solder paste printing on a thin substrate according to claim 1, wherein: The fixture top plate and the fixture bottom plate are provided with first screw holes, and the fixture top plate and the fixture bottom plate are fixed by screws.

3. The jig for solder paste printing on a thin substrate according to claim 1, wherein: The plurality of protrusions are arranged in an array.

4. The jig for solder paste printing on a thin substrate according to claim 3, characterized in that: Each protrusion is a rectangular column.

5. The jig for solder paste printing on a thin substrate according to claim 3, characterized in that: Among the plurality of protrusions, the first through holes are evenly provided with three rows and six columns.

6. A printing platform, characterized in that, Comprising: A platform and the fixture according to any one of claims 1-5; the fixture bottom plate is fixed on the platform; a stencil is provided above the fixture top plate, and a squeegee and solder paste are provided on the stencil.

7. The printing platform according to claim 6, wherein: An air extraction hole is provided on the platform, and the air extraction hole communicates with the second through hole on the fixture bottom plate.

8. The printing platform according to claim 6, characterized in that: Second screw holes are provided on the platform and the fixture bottom plate, and the platform and the fixture bottom plate are fixed by screws.

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