Semiconductor packaging device

Abstract

The utility model provides a semiconductor packaging device, and relates to the technical field of semiconductor packaging, the semiconductor packaging device comprises a mounting rack, the mounting rack is internally provided with a first driving part, the first driving part is rotatably connected with a second driving part, the second driving part is connected with a hydraulic cylinder, the hydraulic cylinder is connected with a dispensing head, and the dispensing head is connected with the mounting rack. And the position of the dispensing head is adjusted under the cooperation of the first driving part, the second driving part and the hydraulic cylinder. Through the arrangement of the first driving part, the second driving part and the hydraulic cylinder, the first driving part can adjust the horizontal transverse and longitudinal direction of the dispensing head, the hydraulic cylinder can adjust the height of the dispensing head, and through automatic adjustment of the position of the dispensing head, manual intervention and debugging time are reduced, and the packaging efficiency is remarkably improved; a flexible adjusting mechanism enables the device to be suitable for various types of semiconductor chips, and extra cost caused by equipment replacement is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, and specifically, to a semiconductor packaging device. Background Art

[0002] In the rapid development of the semiconductor industry, packaging technology, as a bridge connecting chips and final products, has become increasingly important. With the continuous progress of integrated circuit (IC) technology, the size of semiconductor chips has become smaller and smaller, while their functions have become more and more powerful, which poses higher requirements for packaging technology.

[0003] Traditional semiconductor packaging devices often adopt fixed or limited adjustable mechanical structures, which are difficult to meet the current and future market demands for diversified and high-performance semiconductor packaging. Specifically, there are various types of semiconductor chips, including chips with different sizes, pin arrangements, power levels, and special functional requirements. Each type of chip requires specific packaging processes and packaging equipment to ensure the stability and reliability of its performance. For example, for miniaturized and high-density mobile device chips, fine dispensing and packaging technologies are required to reduce the volume and improve the heat dissipation performance; while for high-power electronic components, the packaging device is required to withstand extreme conditions such as high temperature and high pressure, and ensure good electrical connection and heat dissipation effects. Therefore, we make improvements and propose a semiconductor packaging device. Summary of the Invention

[0004] The purpose of the utility model is to address the problem that existing semiconductor packaging devices often adopt fixed or limited adjustable mechanical structures and are difficult to meet the current and future market demands for diversified and high-performance semiconductor packaging.

[0005] To achieve the above-mentioned invention purpose, the utility model provides a semiconductor packaging device to improve the above problems.

[0006] Specifically, this application is as follows:

[0007] A semiconductor packaging device includes a mounting frame. A first driving part is arranged inside the mounting frame. The first driving part is rotatably connected with a second driving part. The second driving part is connected with a hydraulic cylinder. The hydraulic cylinder is connected with a dispensing head. The dispensing head realizes position adjustment under the cooperation of the first driving part, the second driving part, and the hydraulic cylinder.

[0008] As a preferred technical solution of this application, the first driving part includes a threaded rod installed inside the mounting frame through a bearing. A first motor is arranged between the threaded rod and the mounting frame. Mounting holes are formed on the mounting frame.

[0009] As a preferred technical solution of the present application, a second sliding seat is threadedly connected to the outer surface of the threaded rod. One side of the second sliding seat is fixedly connected to a support seat. The inner wall of the second sliding seat is slidably connected to a second sliding rail, and both ends of the second sliding rail are fixedly connected to the mounting frame.

[0010] As a preferred technical solution of the present application, a rectangular groove is formed in the top of the support seat, and a rectangular block is inserted into the rectangular groove. The top of the rectangular block is connected to the second driving part.

[0011] As a preferred technical solution of the present application, a support rod is fixedly connected to the bottom of the rectangular block, and the bottom end of the support rod passes through the support seat.

[0012] As a preferred technical solution of the present application, a spring is sleeved on the outer surface of the support rod and is located below the support seat. Both ends of the spring are fixedly connected to the support seat and the support rod respectively.

[0013] As a preferred technical solution of the present application, the second driving part includes a connecting seat fixedly installed on the top of the rectangular block. A support frame is fixedly installed on the top of the connecting seat. Two transmission wheels are arranged at the top of the inner cavity of the support frame, and a transmission belt is connected between the two transmission wheels. A second motor is also installed on the support frame, and the output shaft of the second motor is fixedly connected to one of the transmission wheels.

[0014] As a preferred technical solution of the present application, a first sliding rail is fixedly installed on the top of the inner cavity of the connecting seat. A first sliding seat is slidably connected to the outer surface of the first sliding rail. The first sliding seat is fixedly connected to the hydraulic cylinder and the transmission belt.

[0015] As a preferred technical solution of the present application, a second protection plate and a first protection plate located above the second protection plate are fixedly installed on one side of the mounting frame. A first groove into which the first protection plate is inserted is formed at the bottom of the support frame. A third protection plate is arranged on the other side of the mounting frame, and a second groove into which the top of the third protection plate is inserted is formed at the bottom of the support frame.

[0016] As a preferred technical solution of the present application, hooks are fixedly connected to both sides of the third protection plate, and buckles for engaging with the hooks are arranged on both sides of the mounting frame.

[0017] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0018] In the solution of the present application:

[0019] To solve the problem that semiconductor packaging devices in the prior art often adopt fixed or limited adjustable mechanical structures and are difficult to meet the current and future market demands for diverse and high-performance semiconductor packaging, in this application, through the provided first driving part, second driving part, and hydraulic cylinder, the first driving part can adjust the horizontal transverse and longitudinal directions of the dispensing head, and the hydraulic cylinder can adjust the height of the dispensing head. By automatically adjusting the position of the dispensing head, manual intervention and debugging time are reduced, and the packaging efficiency is significantly improved; the flexible adjustment mechanism enables the device to be applicable to various types of semiconductor chips, avoiding additional costs caused by replacing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic structural diagram of the semiconductor packaging device provided by this application;

[0021] Figure 2 is a schematic structural diagram of the second slide rail of the semiconductor packaging device provided by this application;

[0022] Figure 3 is a schematic structural diagram of the second motor of the semiconductor packaging device provided by this application;

[0023] Figure 4 is a schematic structural diagram of the support base of the semiconductor packaging device provided by this application;

[0024] Figure 5 is a schematic structural diagram of the rectangular block of the semiconductor packaging device provided by this application;

[0025] Figure 6 is a schematic structural diagram of the first groove of the semiconductor packaging device provided by this application;

[0026] Figure 7 is a schematic structural diagram of the second groove of the semiconductor packaging device provided by this application;

[0027] Figure 8 is a schematic structural diagram of the semiconductor packaging device provided by this application when the support frame is parallel to the second protective plate.

[0028] Labels in the figure:

[0029] 1. Mounting bracket; 101. Threaded rod; 102. Second sliding seat; 103. Support seat; 104. Rectangular block; 105. Support rod; 106. Spring; 107. Connecting seat; 108. Support frame; 109. Driving wheel; 110. Second motor; 111. First sliding rail; 112. First sliding seat; 113. Hydraulic cylinder; 114. Glue dispensing head; 115. Transmission belt; 116. First groove; 117. First protective plate; 118. Second protective plate; 119. Mounting hole; 120. Second sliding rail; 2. Third protective plate; 201. Buckle; 202. Hook; 5. Second groove. Detailed implementation manners

[0030] In order to enable those skilled in the art of the present technology to better understand the solution of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0031] As recorded in the background art, traditional semiconductor packaging devices often adopt fixed or limited adjustable mechanical structures, which are difficult to meet the current and future market demands for diversified and high-performance semiconductor packaging. Specifically, there are a wide variety of semiconductor chips, including chips with different sizes, pin arrangements, power levels, and special function requirements. Each type of chip requires specific packaging processes and packaging equipment to ensure the stability and reliability of its performance. For example, for miniaturized and high-density mobile device chips, fine glue dispensing and packaging technologies are required to reduce the volume and improve the heat dissipation performance; while for high-power electronic components, the packaging device is required to withstand extreme conditions such as high temperature and high pressure, and ensure good electrical connection and heat dissipation effects.

[0032] To solve this technical problem, the present utility model provides a semiconductor packaging device, which is applied to the packaging of semiconductors.

[0033] Specifically, please refer to Figures 1-7 , the semiconductor packaging device specifically includes:

[0034] A mounting bracket 1, a first driving part is arranged inside the mounting bracket 1, a second driving part is rotatably connected to the first driving part, the second driving part is connected to a hydraulic cylinder 113, the hydraulic cylinder 113 is connected to a glue dispensing head 114, and the glue dispensing head 114 realizes the adjustment of its position under the cooperation of the first driving part, the second driving part and the hydraulic cylinder 113.

[0035] The semiconductor packaging device provided by the utility model. In this application, through the first driving part, the second driving part and the hydraulic cylinder 113 arranged, the first driving part can adjust the horizontal transverse and longitudinal directions of the dispensing head 114, and the hydraulic cylinder 113 can adjust the height of the dispensing head 114. By automatically adjusting the position of the dispensing head 114, manual intervention and debugging time are reduced, and the packaging efficiency is significantly improved; the flexible adjustment mechanism enables the device to be applicable to various types of semiconductor chips, avoiding the additional costs caused by replacing equipment.

[0036] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings.

[0037] It should be noted that, without conflict, the embodiments in the utility model and the features and technical solutions in the embodiments can be combined with each other.

[0038] It should be noted that similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0039] Embodiment 1, please refer to Figures 1-7 , a semiconductor packaging device, including a mounting frame 1. A first driving part is arranged inside the mounting frame 1. The first driving part is rotatably connected with a second driving part. The second driving part is connected with a hydraulic cylinder 113. The hydraulic cylinder 113 is connected with a dispensing head 114. The dispensing head 114 realizes the adjustment of its position under the cooperation of the first driving part, the second driving part and the hydraulic cylinder 113. In this application, through the first driving part, the second driving part and the hydraulic cylinder 113 arranged, the first driving part can adjust the horizontal transverse and longitudinal directions of the dispensing head 114, and the hydraulic cylinder 113 can adjust the height of the dispensing head 114. By automatically adjusting the position of the dispensing head 114, manual intervention and debugging time are reduced, and the packaging efficiency is significantly improved; the flexible adjustment mechanism enables the device to be applicable to various types of semiconductor chips, avoiding the additional costs caused by replacing equipment.

[0040] Furthermore, as Figure 2 shown, the first driving part includes a threaded rod 101 installed inside the mounting frame 1 through a bearing. A first motor is arranged between the threaded rod 101 and the mounting frame 1. An installation hole 119 is opened on the mounting frame 1. The first motor is used to drive the threaded rod 101 to rotate. During the rotation of the threaded rod 101, it can drive the second slide seat 102 to move.

[0041] Furthermore, as Figure 2As shown, a second sliding seat 102 is threadedly connected to the outer surface of the threaded rod 101. One side of the second sliding seat 102 is fixedly connected to a support seat 103. The inner wall of the second sliding seat 102 is slidably connected to a second slide rail 120. Both ends of the second slide rail 120 are fixedly connected to the mounting frame 1. The second slide rail 120 can limit the second sliding seat 102, making the movement process of the second sliding seat 102 more stable and preventing the second sliding seat 102 from rotating with the threaded rod 101.

[0042] Further, as Figure 4 and Figure 5 shown, a rectangular groove is formed at the top of the support seat 103, and a rectangular block 104 is inserted into the rectangular groove. The top of the rectangular block 104 is connected to the second driving part. This setting enables the second driving part to be rotated to be parallel to the threaded rod 101. As Figure 8 shown, this setting can reduce the overall volume for convenient storage.

[0043] Further, as Figure 5 shown, a support rod 105 is fixedly connected to the bottom of the rectangular block 104. The bottom end of the support rod 105 passes through the support seat 103. After the rectangular block 104 is inserted into the rectangular groove, it will not rotate.

[0044] Further, as Figure 5 shown, a spring 106 is sleeved on the outer surface of the support rod 105 and is located below the support seat 103. Both ends of the spring 106 are fixedly connected to the support seat 103 and the support rod 105 respectively. The acting force of the spring 106 can limit the rectangular block 104 through the support rod 105 to improve the stability of the insertion of the rectangular block 104 into the rectangular groove.

[0045] Example 2 further optimizes the semiconductor packaging device provided in Example 1. Specifically, as Figure 1 、 Figure 2 、 Figure 3 、 Figure 6 and Figure 7 shown, the second driving part includes a connecting seat 107 fixedly installed on the top of the rectangular block 104. A support frame 108 is fixedly installed on the top of the connecting seat 107. Two transmission wheels 109 are arranged at the top of the inner cavity of the support frame 108, and a transmission belt 115 is connected between the two transmission wheels 109. A second motor 110 is also installed on the support frame 108. The output shaft of the second motor 110 is fixedly connected to one of the transmission wheels 109. The second motor 110 can drive the transmission wheel 109 and the transmission belt 115 to rotate.

[0046] Further, as [[ID= and ​As shown in the figure, a first slide rail 111 is fixedly installed at the top of the inner cavity of the connecting seat 107. A first slide block 112 is slidably connected to the outer surface of the first slide rail 111. The first slide block 112 is fixedly connected to the hydraulic cylinder 113 and the transmission belt 115. During the rotation of the transmission belt 115, the hydraulic cylinder 113 can be driven to move by the first slide block 112.

[0047] Embodiment 3 further optimizes the semiconductor packaging device provided in Embodiment 1 or 2. Specifically, as ​ and ​ shown in the figure, a second protective plate 118 and a first protective plate 117 located above the second protective plate 118 are fixedly installed on one side of the mounting frame 1. A first groove 116 into which the first protective plate 117 is inserted is provided at the bottom of the support frame 108. The first groove 116 can enable the support frame 108 to avoid the first protective plate 117. A third protective plate 2 is provided on the other side of the mounting frame 1. A second groove 5 into which the top of the third protective plate 2 is inserted is provided at the bottom of the support frame 108. The second groove 5 can enable the support frame 108 to avoid the third protective plate 2.

[0048] Furthermore, as ​ shown in the figure, hooks 202 are fixedly connected to both sides of the third protective plate 2. Buckles 201 that are buckled with the hooks 202 are provided on both sides of the mounting frame 1. The mutual buckling of the hooks 202 and the buckles 201 can limit the third protective plate 2.

[0049] The usage process of the semiconductor packaging device provided by the present utility model is as follows:

[0050] Referring to ​ , the first motor is used to drive the threaded rod 101 to rotate. During the rotation of the threaded rod 101, the second slide block 102 is driven to move. The second slide block 102 drives the support frame 108 to move through the support base 103, the rectangular block 104, and the connecting seat 107. The second motor 110 drives the first slide block 112 to move through the transmission wheel 109 and the transmission belt 115. During the movement of the first slide block 112, the hydraulic cylinder 113 is driven to move. The hydraulic cylinder 113 can drive the dispensing head 114 to move up and down, so that the horizontal, longitudinal, and vertical adjustment of the dispensing head 114 can be realized;

[0051] After use, the buckling between the buckle 201 and the hook 202 is released, and then the third protective plate 2 is removed. The support frame 108 is pulled upward so that the rectangular block 104 is separated from the rectangular groove. The support frame 108 is rotated around the support rod 105 so that the support frame 108 is parallel to the mounting frame 1. Then the rectangular block 104 is inserted into the rectangular groove again, and the third protective plate 2 is installed, that is, as ​As shown, at this time, the mounting bracket 1, the second protective plate 118, the first protective plate 117, and the third protective plate 2 cooperate to protect components such as the hydraulic cylinder 113 and the dispensing head 114, and the overall volume of D is reduced for easy carrying.

[0052] When using it again, after removing the third protective plate 2, pull up the support frame 108, then rotate the support frame 108 to be perpendicular to the mounting bracket 1, and then insert the rectangular block 104 into the rectangular groove again.

[0053] In the present invention, unless otherwise clearly defined and limited, terms such as "mounted", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection, or communicable with each other; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0054] Obviously, the above-described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. The drawings show the preferred embodiments of the present invention, but do not limit the patent scope of the present invention. The present invention can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosed content of the present invention more thorough and comprehensive. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing specific embodiments, or perform equivalent replacements for some of the technical features. Any equivalent structure directly or indirectly using the content of the specification and drawings of the present invention in other related technical fields is equally within the scope of the patent protection of the present invention.

Claims

1. A semiconductor packaging device, characterized in that, It includes a mounting bracket (1), a first driving part is arranged inside the mounting bracket (1), the first driving part is rotatably connected with a second driving part, the second driving part is connected with a hydraulic cylinder (113), the hydraulic cylinder (113) is connected with a dispensing head (114), and the dispensing head (114) realizes the adjustment of position under the cooperation of the first driving part, the second driving part and the hydraulic cylinder (113); The first driving part includes a threaded rod (101) installed inside the mounting bracket (1) through a bearing, a first motor is arranged between the threaded rod (101) and the mounting bracket (1), and a mounting hole (119) is formed on the mounting bracket (1); A second sliding seat (102) is threadedly connected to the outer surface of the threaded rod (101), a support seat (103) is fixedly connected to one side of the second sliding seat (102), a second sliding rail (120) is slidably connected to the inner wall of the second sliding seat (102), and both ends of the second sliding rail (120) are fixedly connected to the mounting bracket (1); A rectangular groove is formed at the top of the support seat (103), and a rectangular block (104) is inserted into the rectangular groove, and the top of the rectangular block (104) is connected with the second driving part; The second driving part includes a connecting seat (107) fixedly installed at the top of the rectangular block (104), a support frame (108) is fixedly installed at the top of the connecting seat (107), two transmission wheels (109) are arranged at the top of the inner cavity of the support frame (108), and a transmission belt (115) is drivingly connected between the two transmission wheels (109), and a second motor (110) is further installed on the support frame (108), and an output shaft of the second motor (110) is fixedly connected with one of the transmission wheels (109); A first sliding rail (111) is fixedly installed at the top of the inner cavity of the connecting seat (107), a first sliding seat (112) is slidably connected to the outer surface of the first sliding rail (111), and the first sliding seat (112) is fixedly connected with the hydraulic cylinder (113) and the transmission belt (115).

2. The semiconductor packaging device according to claim 1, characterized in that, The bottom of the rectangular block (104) is fixedly connected with a support rod (105), and the bottom end of the support rod (105) passes through the support seat (103).

3. The semiconductor packaging device according to claim 2, wherein A spring (106) is sleeved on the outer surface of the support rod (105) and is located below the support seat (103), and both ends of the spring (106) are fixedly connected with the support seat (103) and the support rod (105) respectively.

4. A semiconductor packaging device according to claim 3, wherein, A second protection plate (118) and a first protection plate (117) located above the second protection plate (118) are fixedly installed on one side of the mounting bracket (1), a first groove (116) inserted with the first protection plate (117) is formed at the bottom of the support frame (108), a third protection plate (2) is arranged on the other side of the mounting bracket (1), and a second groove (5) inserted with the top of the third protection plate (2) is formed at the bottom of the support frame (108).

5. A semiconductor packaging device according to claim 4, wherein, Hook (202) are fixedly connected to both sides of the third protection plate (2), and buckles (201) engaged with the hook (202) are arranged on both sides of the mounting bracket (1).

Images