Dispensing and attaching device for wafer reducing film

Abstract

The utility model relates to the technical field of wafer reduction film attachment, and discloses a wafer reduction film dispensing and attaching device, which comprises a processing platform and dispensing equipment, an attaching device for attaching a wafer reduction film is arranged in an attaching frame, one side of the bottom end of the inner wall of the processing platform is connected with a second motor, the output end of the second motor is connected with a gear, and the gear is connected with the processing platform. An inner gear ring is arranged at the bottom edge of the placing table. According to the dispensing and attaching device for the thin film of the wafer, after the pressing and attaching part is pressed downwards, the thin film is in an inverted cone shape, that is, the thin film makes contact with the center position of the wafer firstly, the second motor is started again, the wafer is driven to rotate, and the pressing and attaching part evenly adheres the part, making contact with the thin film, of the wafer; and a first motor is matched to drive a moving block to move outwards, so that the top frame deflects in an arc shape, it is guaranteed that bubbles generated in the whole attaching process can overflow outwards from the inverted-cone-shaped position of the film, generation of the bubbles is reduced, and the rate of finished products of subsequent machining is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer thin film attachment, in particular to a wafer thin film dispensing attachment device. Background Art

[0002] In integrated circuit packaging, it is necessary to pick up the wafer chips from the wafer for core loading. Generally, the incoming wafers need to be pre-processed, such as filming, thinning, and dicing, before being sent to the core loading process. When the wafer leaves the factory, one side of the wafer usually has a protective film. Filming is to apply a film to the other side. On the one hand, it is used to protect the wafer, and on the other hand, it is convenient to still attach the chips together after the protective film is torn off, so as to facilitate thinning and dicing after thinning.

[0003] Currently, the existing wafer thinning process generally uses a pressure roller to directly apply the film to the entire mold during film application, and then cuts it to complete the attachment. However, since the glue is generally intermittently present on the wafer surface during the dispensing process, bubbles will be generated between adjacent glues when the pressure roller is applied, which are difficult to discharge. As a result, in the subsequent thinning and dicing process, the stress on the back of the wafer is inconsistent, making it impossible to achieve fine processing. Utility Model Content

[0004] (1) Technical problems solved

[0005] In view of the shortcomings of the existing technology, the utility model provides a wafer thin film dispensing and attaching device, which has the advantages of quickly discharging bubbles and reducing the generation of bubbles, thereby solving the above technical problems.

[0006] (2) Technical solution

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a dispensing and attaching device for wafer thin film, comprising a processing platform and a dispensing device, wherein a plurality of dispensing heads are connected to the bottom end of the dispensing device, a rotatable suction cup is connected to the middle end of the top surface of the processing platform, and the end of the suction cup flush with the inner wall of the processing platform is rotatably connected to a placement table, and a first rotating cylinder and a second rotating cylinder are respectively connected to two different diagonals of the top surface of the processing platform, the top end of the first rotating cylinder is connected to the dispensing device, the top end of the second rotating cylinder is connected to a bonding frame, the end of the bonding frame is connected to a first motor, the output end of the first motor is connected to a screw, and an attaching device for bonding the wafer thin film is arranged inside the bonding frame, a second motor is connected to one side of the bottom end of the inner wall of the processing platform, the output end of the second motor is connected to a gear, and an inner gear ring is arranged on the edge of the bottom surface of the placement table.

[0008] As a preferred technical solution of the present utility model, both the dispensing device and the end of the laminating frame are above the central axis of the placement table, and the height of the first rotating cylinder is higher than that of the second rotating cylinder.

[0009] As a preferred technical solution of the present utility model, the second motor is fixedly installed on one side of the inner wall of the processing platform. An internal gear ring is fixedly installed on the bottom surface of the placement table. Relative sliding can occur between the internal gear ring and the inner wall of the processing platform. The internal gear ring meshes with the gear, and the gear is fixedly installed at the output end of the second motor.

[0010] As a preferred technical solution of the present utility model, a first motor is fixedly installed at the end of the laminating frame. The output end of the first motor is fixedly installed with a lead screw, and the other end of the lead screw is connected to another plane of the inner wall of the laminating frame.

[0011] As a preferred technical solution of the present utility model, the attaching device includes a moving block, a telescopic rod, a top frame, and a pressing part. The moving block is threadedly connected to the outer end of the lead screw. The telescopic rod is fixedly installed at the middle end of the bottom surface of the moving block. The top frame is connected to the output end of the telescopic rod. A groove is provided at the middle end of the inner wall of the top frame, and a pressing part is connected in the groove.

[0012] As a preferred technical solution of the present utility model, there is an arc-shaped deflection at the end of the top frame close to the center of the placement table. The pressing part is made of felt material and its end protrudes from the bottom surface of the top frame.

[0013] [[ID=!15]]Compared with the prior art, the present utility model provides a dispensing and attaching device for a wafer thinning film, having the following beneficial effects:

[0014] After the pressing part presses down in the present utility model, the film becomes an inverted cone shape, that is, it first contacts the center position of the wafer, and then the second motor is started again to drive the wafer to rotate, so that the pressing part uniformly adheres to the part where the wafer contacts the film. Cooperating with the first motor driving the moving block to move outward and the arc-shaped deflection of the top frame, it ensures that the bubbles generated during the entire laminating process will overflow from the inverted cone of the film, thereby reducing the generation of bubbles and ensuring the yield of subsequent processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a three-dimensional schematic diagram of the structure of the present utility model;

[0016] Figure 2 is a top view schematic diagram of the structure of the present utility model;

[0017] Figure 3 is a full cross-sectional schematic diagram of the structure of the present utility model;

[0018] Figure 4 is a top view schematic diagram of the attaching device of the structure of the present utility model;

[0019] Figure 5 The structure of the present utility model Figure 4 The partial enlarged schematic view at position A in it.

[0020] Wherein: 1. Processing platform; 2. First rotating cylinder; 3. Second rotating cylinder; 4. Glue dispensing device; 5. Glue dispensing head; 6. Suction cup; 7. Laminating frame; 8. First motor; 9. Placing table; 10. Second motor; 11. Gear; 12. Internal gear ring; 13. Moving block; 14. Telescopic rod; 15. Top frame; 16. Pressing part. Specific embodiments

[0021] The following further describes the embodiments of the present utility model in detail in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the present utility model, but cannot be used to limit the scope of the present utility model.

[0022] In the description of the present utility model, unless otherwise specified, "a plurality of" means two or more; the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present utility model. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0023] In the description of the present utility model, it should be noted that unless otherwise clearly defined and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood in specific situations.

[0024] Please refer to Figures 1-5, A dispensing and attaching device for a wafer thinning film, comprising a processing platform 1 and a dispensing device 4. The bottom end of the dispensing device 4 is connected with a plurality of dispensing heads 5. The middle end of the top surface of the processing platform 1 is connected with a rotatable suction cup 6. The inner wall of the processing platform 1 is flush with the end of the suction cup 6 and rotatably connected with a placing table 9. On two different diagonals of the top surface of the processing platform 1, a first rotary cylinder 2 and a second rotary cylinder 3 are respectively connected. The top end of the first rotary cylinder 2 is connected to the dispensing device 4. The top end of the second rotary cylinder 3 is connected with a fitting frame 7. The end of the fitting frame 7 is connected with a first motor 8. The output end of the first motor 8 is connected with a lead screw. Inside the fitting frame 7, there is an attaching device for attaching the wafer thinning film. The attaching device includes a moving block 13, a telescopic rod 14, a top frame 15 and a pressing part 16. One side of the bottom end of the inner wall of the processing platform 1 is connected with a second motor 10. The output end of the second motor 10 is connected with a gear 11. An internal gear ring 12 is arranged at the bottom edge of the bottom surface of the placing table 9.

[0025] Further, both the end of the dispensing device 4 and the end of the fitting frame 7 are above the central axis of the placing table 9. The height of the first rotary cylinder 2 is higher than that of the second rotary cylinder 3. When working, after an external gripper places the wafer on the top end of the placing table 9 at the center of the processing platform 1, the suction cup 6 is then started to fix the wafer. At the same time, the dispensing device 4 is rotated by the first rotary cylinder 2 to make its end at the central axis directly above the placing table 9. Then, the wafer is dispensed through the dispensing head 5, and the placing table 9 is driven to rotate by the internal gear ring 12 at the bottom, so as to perform the dispensing operation on the wafer on the placing table 9. After the dispensing is completed, the first rotary cylinder 2 rotates and resets, so that the dispensing device 4 leaves above the placing table 9. Then, the second rotary cylinder 3 is started to drive the fitting frame 7 to move to directly above the placing table 9.

[0026] Further, the rotation of the placing table 9 is driven by the internal gear ring 12 fixedly installed on the bottom surface. Driven by the second motor 10, the gear 11 fixedly installed at its output end will be driven to rotate, thereby driving the internal gear ring 12 to rotate, so that the placing table 9 rotates on the inner wall of the processing platform 1. At the same time, due to the connection between the suction cup 6 and the placing table 9, it can be ensured that when the placing table 9 rotates, the suction cup 6 and its driving components will rotate together, thus ensuring the synchronous rotation of the wafer and the placing table 9.

[0027] Further, the moving block 13 is threadedly connected to the outer end of the lead screw. The telescopic rod 14 is fixedly installed at the middle end of the bottom surface of the moving block 13. The top frame 15 is connected to the output end of the telescopic rod 14. A groove is provided at the middle end of the inner wall of the top frame 15, and a pressing part 16 is connected in the groove. Before pressing, the film laminating device provided externally transports the wafer reducing film to directly above the placing table 9 and has a small gap with the top surface of the processing platform 1. Then, the telescopic rod 14 is started to drive downward, so that the top frame 15 moves downward until the pressing part 16 contacts the surface of the film and presses downward until the film adheres to the glue at the center of the wafer. The pressing part 16 is made of felt material and will not damage the wafer after contacting the film. Since the film becomes inverted cone-shaped after the pressing part 16 presses down, that is, it first contacts the center position of the wafer, and then the second motor 10 is started again to drive the wafer to rotate, so that the pressing part 16 evenly adheres to the part where the wafer contacts the film. At this time, the first motor 8 is started to drive the lead screw to rotate, so that the moving block 13 moves outward, making the pressing part 16 move outward, and then adhering to the part where the wafer and the film are not adhered, thus ensuring the adhesion of the entire wafer. Since there is an arc deflection at the position of the top frame 15 close to the axis of the placing table 9, the deflected part will push out the possible bubbles outward during the outward movement process, thereby reducing the accumulation of bubbles inside.

[0028] During use, after an external gripper places the wafer on the top of the placing table 9 at the center of the processing platform 1, then the suction cup 6 is started to fix the wafer. At the same time, the dispensing device 4 rotates under the first rotary cylinder 2 to make the end of it at the middle of the axis directly above the placing table 9. Then, the wafer is dispensed through the dispensing head 5, and the placing table 9 is driven by the internal gear ring 12 at the bottom to rotate, so as to perform the dispensing operation on the wafer on the placing table 9. After the dispensing is completed, the first rotary cylinder 2 rotates and resets to move the dispensing device 4 away from above the placing table 9. Then, the second rotary cylinder 3 is started to drive the fitting frame 7 to move to directly above the placing table 9. The film laminating device provided externally transports the wafer reducing film to directly above the placing table 9 and has a small gap with the top surface of the processing platform 1. Then, by starting the telescopic rod 14 to drive downward, the top frame 15 moves downward until the pressing part 16 contacts the surface of the film and presses downward until the film adheres to the glue at the center of the wafer. The second motor 10 is started to drive the wafer to rotate, and the first motor 8 is started to drive the lead screw to rotate, so that the moving block 13 moves outward, making the pressing part 16 move outward, and then adhering to the part where the wafer and the film are not adhered, thus ensuring the adhesion of the entire wafer, and thus completing the attachment of the wafer. Then, the corresponding part is cut by an external device to complete the processing.

[0029] Although embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A dispensing and attaching device for a wafer thinning film, comprising a processing platform (1) and a dispensing device (4). A plurality of dispensing heads (5) are connected to the bottom end of the dispensing device (4). A rotatable suction cup (6) is connected to the middle end of the top surface of the processing platform (1). A placement table (9) is rotatably connected to the inner wall of the processing platform (1) flush with the end of the suction cup (6). It is characterized in that: On the top surface of the processing platform (1), a first rotary cylinder (2) and a second rotary cylinder (3) are respectively connected on two different diagonals. Between the top end of the first rotary cylinder (2) and the dispensing device (4) is connected. The top end of the second rotary cylinder (3) is connected with a laminating frame (7). The end of the laminating frame (7) is connected with a first motor (8). The output end of the first motor (8) is connected with a lead screw. Inside the laminating frame (7) is provided with an attaching device for laminating the wafer thinning film. On one side at the bottom end of the inner wall of the processing platform (1) is connected with a second motor (10). The output end of the second motor (10) is connected with a gear (11). An internal gear ring (12) is provided at the edge of the bottom surface of the placement table (9).

2. The dispensing and attaching device for a wafer thinning film according to claim 1, characterized in that: Both the dispensing device (4) and the end of the laminating frame (7) are above the central axis of the placement table (9). The height of the first rotary cylinder (2) is higher than that of the second rotary cylinder (3).

3. The dispensing and attaching device for wafer thinning film according to claim 1, wherein: The second motor (10) is fixedly installed on one side of the inner wall of the processing platform (1). The internal gear ring (12) is fixedly installed on the bottom surface of the placement table (9). Relative sliding can occur between the internal gear ring (12) and the inner wall of the processing platform (1). The internal gear ring (12) meshes with the gear (11). The gear (11) is fixedly installed on the output end of the second motor (10).

4. The dispensing and attaching device for a wafer thinning film according to claim 1, wherein: The end of the laminating frame (7) is fixedly installed with a first motor (8). The output end of the first motor (8) is fixedly installed with a lead screw, and the other end of the lead screw is connected to another plane of the inner wall of the laminating frame (7).

5. The dispensing and attaching device for a wafer thinning film according to claim 4, characterized in that: The attaching device includes a moving block (13), a telescopic rod (14), a top frame (15) and a pressing part (16). The moving block (13) is threadedly connected to the outer end of the lead screw. The telescopic rod (14) is fixedly installed at the middle end of the bottom surface of the moving block (13). The top frame (15) is connected to the output end of the telescopic rod (14). In the middle end of the inner wall of the top frame (15) is provided with a groove, and a pressing part (16) is connected in the groove.

6. The dispensing and attaching device for a wafer thinning film according to claim 5, characterized in that: The top frame (15) has an arc-shaped deflection near the axis of the placement table (9). The pressing part (16) is made of felt material and its end protrudes from the bottom surface of the top frame (15).

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