Ceramic packaging structure

Abstract

The utility model discloses a ceramic packaging structure, which comprises a lower ceramic substrate, a metal frame, an upper carrier plate, a lower carrier plate, an upper ceramic substrate and a heat dissipation cover plate, the metal frame is a rectangular frame shell with four edges provided with fillets, the metal frame is covered with the upper carrier plate, the metal frame is provided with a plurality of groove bodies and heat dissipation grooves along the outer side, and the heat dissipation grooves are communicated with the upper ceramic substrate. The heat dissipation grooves are semicircular and are positioned between two adjacent groove bodies; a lower carrier plate and lower ceramic substrates are installed in the groove body, the lower ceramic substrates are located on the lower side of the lower carrier plate and extend out of an opening in the bottom of the groove body, the lower ceramic substrates are embedded in the groove body through the lower carrier plate, and the multiple lower ceramic substrates are connected through gold wire bonding or bonding wires. According to the packaging structure, the double-layer ceramic substrates are adopted, the double-layer ceramic substrates are isolated through the carrier plate, interference of different signal circuits is avoided, and meanwhile the packaging size is further reduced through the design of the double-layer ceramic substrates.

Description

Technical Field

[0001] The utility model relates to the field of ceramic packaging, and particularly relates to a ceramic packaging structure. Background Art

[0002] With the innovation of modern microelectronic technology, electronic devices are developing towards miniaturization, integration, high efficiency, and high reliability. The overall integration degree of electronic systems has increased, and the power density has also increased synchronously. Long-term operation of electronic components in a high-temperature environment will cause deterioration of their performance and even damage to the devices. Therefore, effective electronic packaging needs to continuously improve the performance of packaging materials and rationalize the wiring of electronic circuits, so that while the electronic components are not affected by the environment, good heat dissipation can be achieved to help the electronic system maintain good stability.

[0003] Ceramic packaging has great development potential in high-hermetic packaging. Ceramic packaging belongs to airtight packaging, and the main materials are Al2O3, AIN, BeO, and mullite, which have the advantages of good moisture resistance, high mechanical strength, small thermal expansion coefficient, and high thermal conductivity.

[0004] However, the current ceramic package / body has limitations such as large volume and weight, and it overly relies on the bottom of the ceramic package body for heat dissipation, resulting in overly concentrated heat. Based on this, the utility model proposes a ceramic packaging structure. This packaging structure uses a double-layer ceramic substrate, and the double-layer ceramic substrates are isolated by a carrier plate, avoiding interference between different signal circuits. At the same time, the design of the double-layer ceramic substrate further reduces the packaging volume; moreover, the heat dissipation of the utility model relies on the heat dissipation grooves of the metal frame and the heat dissipation cover plate, that is, the upper ceramic substrate relies on the heat dissipation cover plate for heat dissipation, and the lower ceramic substrate relies on the heat dissipation grooves of the metal frame for heat dissipation, which can continuously maintain heat dissipation and avoid the situation of heat concentration. Content of the Utility Model

[0005] The purpose of the utility model is to provide a ceramic packaging structure to solve the problems raised in the above background art.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A ceramic packaging structure, including a lower ceramic substrate, a metal frame, an upper carrier plate, a lower carrier plate, an upper ceramic substrate, and a heat dissipation cover plate. The metal frame is a rectangular frame shell with rounded corners on all four sides. An upper carrier plate is covered on the metal frame. The metal frame is provided with a plurality of grooves and heat dissipation grooves along its outer side. The heat dissipation grooves are semicircular and are located between two adjacent grooves; a lower carrier plate and a lower ceramic substrate are installed in the grooves. The lower ceramic substrate is located below the lower carrier plate and extends out of the bottom opening of the groove. The lower ceramic substrate is installed in the groove through the lower carrier plate. A plurality of lower ceramic substrates are connected by gold wire bonding or wire bonding.

[0007] Preferably, the heat dissipation cover plate is integrated on the upper end surface of the upload board. The heat dissipation cover plate is in the shape of a boss, and multiple heat dissipation ring grooves are provided at the four corners of the top end of the heat dissipation cover plate.

[0008] Preferably, the upper ceramic substrate is integrated on the upper end surface of the download board, and the upper ceramic substrate and the lower ceramic substrate are connected by gold wire bonding or wire soldering.

[0009] Preferably, the lower ceramic substrate and the upper ceramic substrate are copper-clad ceramic substrates or thick-film ceramic substrates, and signal circuits or power circuits are respectively arranged on the lower ceramic substrate and the upper ceramic substrate.

[0010] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0011] The packaging structure of the present utility model adopts a double-layer ceramic substrate, and the double-layer ceramic substrates are isolated by a carrier board, avoiding interference between different signal circuits. At the same time, the design of the double-layer ceramic substrate further reduces the packaging volume; moreover, the heat dissipation of the present utility model relies on the heat dissipation grooves of the metal frame and the heat dissipation cover plate, that is, the upper ceramic substrate relies on the heat dissipation cover plate for heat dissipation, and the lower ceramic substrate relies on the heat dissipation grooves of the metal frame for heat dissipation, which can continuously maintain heat dissipation and avoid heat concentration. Description of the Drawings

[0012] Figure 1 is a structural schematic diagram of the present utility model Figure 1 ;

[0013] Figure 2 is a structural schematic diagram of the present utility model Figure 2 。

[0014] In the figure: 1, lower ceramic substrate; 2, metal frame; 3, upload board; 4, download board; 5, heat dissipation cover plate; 6, heat dissipation groove; 7, heat dissipation ring groove. Detailed Embodiments

[0015] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0016] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "vertical", "upper", "lower", "horizontal", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model.

[0017] In the description of the present utility model, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", and "linked" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0018] Please refer to Figure 1-2 , the present utility model provides a technical solution: a ceramic packaging structure, including a lower ceramic substrate 1, a metal frame 2, an upper carrier plate 3, a lower carrier plate 4, an upper ceramic substrate (not shown in the figure) and a heat dissipation cover plate 5. The metal frame 2 is a rectangular frame shell with rounded corners on its four sides. An upper carrier plate 3 is covered on the metal frame 2. A plurality of grooves and heat dissipation grooves 6 are provided along the outer side of the metal frame 2. The heat dissipation grooves 6 are semicircular and are located between two adjacent grooves. A lower carrier plate 4 and a lower ceramic substrate 1 are installed in the grooves. The lower ceramic substrate 1 is located below the lower carrier plate 4 and extends out of the bottom opening of the groove. The lower ceramic substrate 1 is embedded in the groove through the lower carrier plate 4. A plurality of lower ceramic substrates 1 are connected by gold wire bonding or wire bonding.

[0019] In this embodiment, the heat dissipation cover plate 5 is integrated on the upper end surface of the upper carrier plate 3. The heat dissipation cover plate 5 is in a boss shape, and multiple heat dissipation ring grooves 7 are provided at the four corners of the top end of the heat dissipation cover plate 5.

[0020] In this embodiment, the upper ceramic substrate (not shown in the figure) is integrated on the upper end surface of the lower carrier plate 4. The upper ceramic substrate and the lower ceramic substrate 1 are connected by gold wire bonding or wire bonding.

[0021] In this embodiment, the lower ceramic substrate 1 and the upper ceramic substrate are copper-clad ceramic substrates or thick film ceramic substrates, and signal circuits or power circuits are respectively arranged on the lower ceramic substrate 1 and the upper ceramic substrate.

[0022] The above packaging structure adopts a double-layer ceramic substrate. The double-layer ceramic substrates are isolated by the carrier plate, avoiding the interference of different signal circuits. At the same time, the design of the double-layer ceramic substrate further reduces the packaging volume. Moreover, the heat dissipation of the present utility model relies on the heat dissipation grooves 6 of the metal frame 2 and the heat dissipation cover plate 5, that is, the upper ceramic substrate relies on the heat dissipation cover plate 5 for heat dissipation, and the lower ceramic substrate 1 relies on the heat dissipation grooves 6 of the metal frame 2 for heat dissipation, which can continuously maintain heat dissipation and avoid the situation of heat concentration.

[0023] Although embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A ceramic packaging structure, characterized in that, It includes a lower ceramic substrate (1), a metal frame (2), an upper carrier plate (3), a lower carrier plate (4), an upper ceramic substrate and a heat dissipation cover plate (5). The metal frame (2) is a rectangular frame shell with rounded corners on its four sides. An upper carrier plate (3) is covered on the metal frame (2). A plurality of grooves and heat dissipation grooves (6) are provided along the outer side of the metal frame (2). The heat dissipation grooves (6) are semicircular and are located between two adjacent grooves. A lower carrier plate (4) and a lower ceramic substrate (1) are installed in the grooves. Among them, the lower ceramic substrate (1) is located on the lower side of the lower carrier plate (4) and extends out of the bottom opening of the groove. The lower ceramic substrate (1) is installed in the groove through the lower carrier plate (4). A plurality of lower ceramic substrates (1) are connected by gold wire bonding or wire bonding.

2. The ceramic package structure according to claim 1, characterized in that: The heat dissipation cover plate (5) is integrated on the upper end face of the upper carrier plate (3). The heat dissipation cover plate (5) is in the shape of a convex platform, and multiple heat dissipation ring grooves (7) are provided at the four corners of the top end of the heat dissipation cover plate (5).

3. A ceramic package structure according to claim 1, wherein: The upper ceramic substrate is integrated on the upper end face of the lower carrier plate (4). The upper ceramic substrate and the lower ceramic substrate (1) are connected by gold wire bonding or wire bonding.

4. A ceramic package structure according to claim 1, characterized in that: The lower ceramic substrate (1) and the upper ceramic substrate are copper-clad ceramic substrates or thick-film ceramic substrates. Signal circuits or power circuits are respectively arranged on the lower ceramic substrate (1) and the upper ceramic substrate.

Images