Charging module and charging pile

Abstract

The embodiment of the utility model relates to the technical field of electronic equipment, in particular to a charging module and a charging pile. The utility model aims to solve the problem that the normal use of the circuit board is affected due to over-high temperature of the circuit board. The embodiment of the utility model provides a charging module. The charging module comprises a circuit board and an electronic device. The electronic device is arranged on one side of the circuit board. The charging module further comprises a cooling structure which is arranged on the side, away from the circuit board, of the electronic device. The charging module further comprises a first metal strip and a second metal strip. The first metal strip is electrically connected with the electronic device and the circuit board. One end of the second metal strip is connected with the first metal strip or the circuit board, and the other end of the second metal strip is in heat conduction contact with the cooling structure, so that heat of the circuit board or the electronic device can be transmitted to the second metal strip, and then the second metal strip transmits the heat to the cooling structure, so that the temperature of the circuit board is reduced; and normal use of the circuit board is ensured.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of electronic devices, and particularly to a charging module and a charging pile. Background Art

[0002] The charging module includes electronic components and a circuit board. The electronic components are arranged on the circuit board and electrically connected to the circuit board. Since the charging module has a large power, a cooling structure is generally provided to cool the charging module. However, the electronic components are small and do not directly contact the cooling structure, resulting in poor cooling effect and easily causing the temperature of the circuit board to be too high, affecting the normal use of the circuit board. Summary of the Utility Model

[0003] The embodiments of the present application provide a charging module and a charging pile, which can reduce the temperature of the circuit board and ensure the normal use of the circuit board.

[0004] In a first aspect, the embodiments of the present application provide a charging module, including a circuit board and electronic components. The electronic components are arranged on one side of the circuit board. The charging module further includes a cooling structure, which is arranged on the side of the electronic components away from the circuit board. The charging module further includes a first metal strip and a second metal strip. The first metal strip electrically connects the electronic components and the circuit board. One end of the second metal strip is connected to the first metal strip or the circuit board, and the other end of the second metal strip is in thermal contact with the cooling structure, and the second metal strip is electrically isolated from the cooling structure.

[0005] One end of the second metal strip is connected to the first metal strip or the circuit board, and the other end of the second metal strip is in thermal contact with the cooling structure, which can transfer the heat of the circuit board or the electronic components to the second metal strip, and then transfer the heat to the cooling structure by the second metal strip, so as to reduce the temperature of the circuit board and ensure the normal use of the circuit board. At the same time, the second metal strip is electrically isolated from the cooling structure, which can prevent the cooling structure from being charged and prevent electric shock.

[0006] In some embodiments that may include the above embodiments, the charging module further includes a third metal strip, and the third metal strip and the second metal strip are arranged at intervals. One end of the third metal strip is connected to the first metal strip, and the other end of the third metal strip is in thermal contact with the cooling structure, and the third metal strip is electrically isolated from the cooling structure.

[0007] The third metal strip and the second metal strip can transfer the heat of the electronic components or the circuit board to the cooling structure, strengthening the heat transfer efficiency and further improving the heat dissipation capacity of the second electronic components and the circuit board. The third metal strip is electrically isolated from the cooling structure, which can prevent the third metal strip from transferring current to the cooling structure, prevent the cooling structure from being charged, and prevent electric shock.

[0008] In some embodiments that may include the above embodiments, the second metal strip extends in a direction perpendicular to the circuit board, and a portion of the second metal strip near the cooling structure is bent in a direction parallel to the surface of the cooling structure.

[0009] A portion of the second metal strip near the cooling structure extends in a direction parallel to the surface of the cooling structure, which can increase the contact area between the second metal strip and the cooling structure, improve the heat conduction rate of the second metal strip, thereby accelerating the cooling rate of the electronic device and the circuit board, further enhancing the heat dissipation capacity of the electronic device and the circuit board, and ensuring the normal use of the electronic device and the circuit board.

[0010] In some embodiments that may include the above embodiments, the second metal strip surrounds the outer periphery of the electronic device. The second metal strip includes a first metal strip, a second metal strip, and a third metal strip, and the first metal strip, the second metal strip, and the third metal strip are connected in sequence. The first metal strip and the third metal strip extend in a direction perpendicular to the plane of the circuit board, the second metal strip extends in a direction parallel to the surface of the cooling structure, and the second metal strip is in thermal contact with the cooling structure.

[0011] The second metal strip increases the contact area between the second metal strip and the cooling structure, improves the heat conduction rate of the second metal strip, thereby accelerating the cooling rate of the electronic device and the circuit board, and further enhancing the heat dissipation capacity of the electronic device and the circuit board.

[0012] At the same time, the first metal strip, the second metal strip, and the third metal strip are connected in sequence, which improves the stability of the second metal strip and can prevent the second metal strip from toppling. The second metal strip surrounds the outer periphery of the second electronic device, which can save space on the circuit board and improve the space utilization rate of the circuit board.

[0013] In some embodiments that may include the above embodiments, along a direction perpendicular to the extending direction of the first metal strip and perpendicular to the direction from the first metal strip pointing to the third metal strip, the width of the first metal strip is greater than the widths of the second metal strip and the third metal strip.

[0014] The widths of the second metal strip and the third metal strip are smaller, which can reduce the volume of the second metal strip while ensuring the stability of the second metal strip, and further reduce the material consumption to lower the cost.

[0015] In some embodiments that may include the above embodiments, a receiving cavity is provided on the cooling structure, there is potting glue in the receiving cavity, and the second metal strip extends into the potting glue.

[0016] The second metal strip extends into the potting compound, allowing heat from the second electronic component and circuit board to be transferred to the potting compound through the second metal strip. The potting compound then transfers the heat to the cooling structure. The potting compound further increases the contact area between the second metal strip and the cooling structure, accelerating the heat transfer rate and thus improving the heat dissipation capacity of the electronic component and circuit board, ensuring their proper operation.

[0017] In some embodiments, which may include the above embodiments, a heat conductive material is provided between an end of the second metal strip close to the cooling structure and the cooling structure.

[0018] Heat from the electronic components and circuit boards is transferred through the second metal strip to the thermally conductive material, which then transfers it to the cooling structure. The thermally conductive material increases the contact area between the second metal strip and the cooling structure, accelerating heat transfer and improving the heat dissipation capacity of the electronic components and circuit boards, ensuring their proper operation.

[0019] In some embodiments including the above embodiments, an insulating material is further provided between an end of the second metal strip close to the cooling structure and the cooling structure.

[0020] The insulating material has good insulation properties and can effectively prevent current from being conducted from the second metal strip to the cooling structure. The insulating material can withstand a certain voltage to ensure that the insulating properties of the insulating material are not destroyed, thereby ensuring the safe operation of the charging module.

[0021] In a second aspect, an embodiment of the present application provides a charging pile, comprising the above-mentioned charging module and a charging gun, wherein the charging gun is used to output the current output by the charging module to an electric vehicle.

[0022] The charging pile provided in the embodiment of the present application includes the charging module in any of the above embodiments, so the two can solve the same technical problems and achieve the same technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural diagram of a charging module in related technology;

[0024] Figure 2 Schematic diagram of the structure of the charging pile provided in the embodiment of this application Figure 1 ;

[0025] Figure 3 Schematic diagram of the structure of the charging pile provided in the embodiment of this application Figure 2 ;

[0026] Figure 4 Schematic diagram of the structure of the charging module provided in the embodiment of the present application Figure 1 ;

[0027] Figure 5 is Figure 4 the A-A cross-sectional view of;

[0028] Figure 6 the structural schematic diagram of the first metal strip and the second metal strip provided by the embodiment of the present application Figure 1 ;

[0029] Figure 7 the structural schematic diagram of the first metal strip and the second metal strip provided by the embodiment of the present application Figure 2 ;

[0030] Figure 8 the structural schematic diagram of the first metal strip and the second metal strip provided by the embodiment of the present application Figure 3 ;

[0031] Figure 9 is Figure 8 the B-B cross-sectional view of;

[0032] Figure 10 the structural schematic diagram of the first metal strip and the second metal strip provided by the embodiment of the present application Figure 4 ;

[0033] Figure 11 the structural schematic diagram of the second metal strip and the third metal strip provided by the embodiment of the present application Figure 1 ;

[0034] Figure 12 the structural schematic diagram of the second metal strip and the third metal strip provided by the embodiment of the present application Figure 2 ;

[0035] Figure 13 the structural schematic diagram of the charging module provided by the embodiment of the present application Figure 2 ;

[0036] Figure 14 the structural schematic diagram of the charging module provided by the embodiment of the present application Figure 3 .

[0037] Explanation of reference numerals:

[0038] 1: charging pile; 2: power grid; 3: charging gun; 4: electric vehicle; 10: charging module; 111: AC / DC conversion module; 112: DC / DC conversion module; 113: DC bus; 114: power distribution module; 11: circuit board; 20: electronic device; 30: cooling structure; 31: cooling plate; 32: cover plate; 33: coolant; 34: accommodating cavity; 35: connecting plate; 41: first metal strip; 42: second metal strip; 421: first section of metal strip; 422: second section of metal strip; 423: third section of metal strip; 43: third metal strip; 61: potting adhesive; 62: thermal conductive material; 63: insulating material. Detailed implementation manners

[0039] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Apparently, the described embodiments are some but not all of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0040] Hereinafter, terms such as "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features.

[0041] In addition, in the embodiments of the present application, orientation terms such as "upper", "lower", "left", "right", "horizontal" and "vertical" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, which are used for relative description and clarification and may change correspondingly according to the change of the orientation of the components placed in the accompanying drawings.

[0042] In the embodiments of the present application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" may be a fixed connection, a detachable connection, or integrated; it may be directly connected or indirectly connected through an intermediate medium.

[0043] It should be noted that in the description of the embodiments of the present application, unless otherwise clearly specified and limited, the terms "connected" and "connection" in the terms should be understood in a broad sense. For example, it may be a fixed connection or an integral connection; it may also be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, or the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0044] Please refer to Figure 1, in the related art, the charging module 10 includes a circuit board 11, electronic devices 20, and a cooling structure 30. The electronic devices 20 are disposed on one side of the circuit board 11 and are electrically connected to the circuit board 11. The cooling structure 30 is disposed on the side of the electronic devices 20 away from the circuit board 11. Some of the electronic devices 20 (such as Hall devices, resistors, capacitors, etc.) are small in size and are further away from the cooling structure 30, and cannot be in direct heat conduction contact with the cooling structure 30, resulting in poor cooling effect of the electronic devices 20, causing the temperature of the corresponding part on the circuit board 11 to be too high and affecting the normal use of the circuit board 11.

[0045] Please refer to Figure 2 and Figure 3 , an embodiment of the present application provides a charging pile 1, including a charging module 10 and a charging gun 3. The charging gun 3 is used to output the current output by the charging module 10 to the electric vehicle 4. The charging module 10 can receive the alternating current output from the power grid 2 and convert the alternating current into a stable direct current and then transmit it to the electric vehicle 4.

[0046] Exemplarily, the charging module 10 may include a plurality of AC / DC conversion modules 111 and a plurality of DC / DC conversion modules 112. The input end of the AC / DC conversion module 111 is connected to the power grid 2, and the output end is connected to the DC bus 113. The input end of the DC / DC conversion module 112 is connected to the DC bus 113, and the output end is connected to the input end of the power distribution module 114. The output end of the power distribution module 114 is connected to the charging gun 3.

[0047] Among them, the AC / DC conversion module 111 is used to receive the alternating current output from the power grid 2 and convert the alternating current into a direct current and then output it to the DC bus 113. The DC / DC conversion module 112 is used to obtain the direct current from the DC bus 113 and further convert the obtained direct current into a direct current suitable for the electric vehicle 4 and then output it to the power distribution module 114. The power distribution module 114 is used to dynamically distribute the direct current output by the DC / DC conversion module 112 according to the actual charging power required by the electric vehicle 4, and transmit the distributed charging power to the electric vehicle 4 through the charging gun 3.

[0048] The charging pile 1 further includes a housing, a human-machine interaction interface, a charging control unit, a metering and billing unit, etc., and is used for information interaction, energy transmission, metering and billing, etc. with the electric vehicle 4.

[0049] The electric vehicle 4 is a means of transportation driven by electric energy. The electric vehicle 4 may include a pure electric vehicle (pure electric vehicle / battery electric vehicle, pure EV / battery EV), a hybrid electric vehicle (HEV), a range extended electric vehicle (REEV), a plug-in hybrid electric vehicle (PHEV), etc.

[0050] Please refer to Figure 4 and Figure 5 , an embodiment of the present application provides a charging module 10, which includes a circuit board 11 and electronic devices 20. The charging module 10 includes a circuit board 11, electronic devices 20, and a cooling structure 30. The electronic devices 20 are disposed on one side of the circuit board 11, and the cooling structure 30 is disposed on the side of the electronic devices 20 away from the circuit board 11. The electronic devices 20 in the embodiments of the present application are not limited. Exemplarily, the electronic devices 20 may include switching tubes, magnetic devices, Hall devices, capacitors, resistors, etc. The magnetic device may include a transformer for realizing voltage conversion.

[0051] The cooling structure 30 in the embodiments of the present application is not limited. In some embodiments, the cooling structure 30 may include a fan and a heat sink inside the charging module 10. The heat sink may be in contact with the electronic devices 20, and the fan is used to drive air to flow through the heat sink to cool the heat sink, thereby realizing the cooling of the charging module 10.

[0052] In some embodiments, the cooling structure 30 includes a cooling plate 31 and a cover plate 32. The cooling plate 31 includes a long plate and two short plates, forming a groove, and a coolant 33 may be disposed in the groove. The cover plate 32 covers the cooling plate 31 to seal the coolant 33. The cooling structure 30 further includes a refrigeration device, which is communicated with the groove. The coolant 33 may circulate in the refrigeration device and the groove, and at the same time, the refrigeration device may supply low-temperature coolant 33 to the groove to realize the cooling of the charging module 10.

[0053] Please refer to Figure 4 and Figure 6 , the charging module 10 further includes a first metal strip 41 and a second metal strip 42. The first metal strip 41 is electrically connected to the electronic devices 20 and the circuit board 11. It can be understood that in the embodiments where the electronic devices 20 include Hall devices, the first metal strip 41 may include a conductor penetrating the magnetic core; in the embodiments where the electronic devices 20 include inductors, the first metal strip 41 may include pins connected to the circuit board 11.

[0054] One end of the second metal strip 42 is connected to the first metal strip 41 or to the circuit board 11, and the other end of the second metal strip 42 is in thermally conductive contact with the cooling structure 30. The second metal strip 42 can transfer the heat of the first metal strip 41 or the circuit board 11 to the cooling structure 30, so as to cool the electronic device 20 or the circuit board 11 and improve the heat dissipation capacity of the electronic device 20 or the circuit board 11.

[0055] The second metal strip 42 is electrically isolated from the cooling structure 30. It can be understood that there is a certain distance L between the second metal strip 42 and the cooling structure 30. Since the second metal strip 42 is connected to the first metal strip 41 or the circuit board 11, the second metal strip 42 is likely to be charged. In an embodiment where a thermally conductive metal is used on the surface of the cooling structure 30, if the distance between the second metal strip 42 and the cooling structure 30 is too close, the cooling structure 30 will be charged, which will cause the charging module 10 to be charged and result in electric shock injury. The embodiment of the present application does not limit the distance L between the second metal strip 42 and the cooling structure 30. Exemplarily, the distance L can be greater than or equal to 3 mm.

[0056] In the charging module 10 provided by the embodiment of the present application, one end of the second metal strip 42 is connected to the first metal strip 41 or to the circuit board 11, and the other end extends to the cooling structure 30, which can transfer the heat of the circuit board 11 or the electronic device 20 to the second metal strip 42, and then transfer the heat from the second metal strip 42 to the cooling structure 30, reducing the temperature of the circuit board 11 and ensuring the normal use of the circuit board 11. At the same time, the second metal strip 42 and the cooling structure 30 are electrically isolated, which can prevent the cooling structure 30 from being charged and prevent electric shock injury.

[0057] Continue to refer to Figure 4 , in some embodiments, one end of the second metal strip 42 is connected to the first metal strip 41, and the other end of the second metal strip 42 is in thermally conductive contact with the cooling structure 30. The heat of the electronic device 20 is transferred to the second metal strip 42 through the first metal strip 41, and then the second metal strip 42 transfers the heat to the cooling structure 30, accelerating the heat dissipation rate of the electronic device 20, thereby realizing the heat dissipation of the cooling structure 30 to the electronic device 20, reducing the temperature of the circuit board 11, and ensuring the normal use of the circuit board 11.

[0058] In the embodiment where the first metal strip 41 and the second metal strip 42 are connected, the embodiment of the present application does not limit the connection method between the first metal strip 41 and the second metal strip 42. Exemplarily, the first metal strip 41 and the second metal strip 42 can be an integral structural member, and the first metal strip 41 and the second metal strip 42 can also be connected by welding. The first metal strip 41 and the second metal strip 42 being an integral structural member can simplify the processing steps and reduce the processing difficulty.

[0059] Continue to refer to Figure 6 In other embodiments, one end of the second metal strip 42 is connected to the circuit board 11, and the other end of the second metal strip 42 is connected to the cooling structure 30 ( Figure 5 As shown in the figure, the heat of the circuit board 11 is transferred to the cooling structure 30 through the second metal strip 42, thereby cooling the circuit board 11, accelerating the heat dissipation rate of the circuit board 11, reducing the temperature of the circuit board 11, and ensuring the normal use of the circuit board 11.

[0060] At the same time, the temperature of the circuit board 11 and the electronic device 20 will affect the temperature of the connection between the circuit board 11 and the first metal strip 41. If the temperature of the circuit board 11 and the electronic device 20 is too high, the temperature of the solder joints at the connection between the circuit board 11 and the first metal strip 41 will increase, causing the solder joints to melt, resulting in poor contact between the first metal strip 41 and the circuit board 11, and thus causing a circuit break.

[0061] One end of the second metal strip 42 is connected to the first metal strip 41 or the circuit board 11, which can reduce the solder joint temperature at the connection between the first metal strip 41 and the circuit board 11, ensure the reliability of the solder joint, and avoid thermal fatigue failure of the solder joint.

[0062] Please refer to Figure 7 In some implementations, the second metal strip 42 extends in a direction perpendicular to the circuit board 11 and is in an “I” shape.

[0063] Continue to refer to Figure 5 In some implementations, the second metal strip 42 extends perpendicular to the circuit board 11. The portion of the second metal strip 42 near the cooling structure 30 is bent parallel to the surface of the cooling structure 30, forming an "L" shape. This portion of the second metal strip 42 near the cooling structure 30 extends parallel to the surface of the cooling structure 30, increasing the contact area between the second metal strip 42 and the cooling structure 30 and improving the thermal conductivity of the second metal strip 42. This accelerates the cooling rate of the electronic device 20 and the circuit board 11, further improving the heat dissipation capabilities of the electronic device 20 and the circuit board 11, and ensuring normal operation of the electronic device 20 and the circuit board 11.

[0064] Please refer to Figure 8 and Figure 9, in some implementations, the second metal strip 42 surrounds the outer periphery of the electronic device 20 and is in a "U" shape. The second metal strip 42 includes a first metal strip segment 421, a second metal strip segment 422, and a third metal strip segment 423, and the first metal strip segment 421, the second metal strip segment 422, and the third metal strip segment 423 are connected in sequence. The first metal strip segment 421 and the third metal strip segment 423 extend in a direction perpendicular to the plane of the circuit board 11, and the second metal strip segment 422 extends in a direction parallel to the surface of the cooling structure 30, and the second metal strip segment 422 is in thermally conductive contact with the cooling structure 30.

[0065] The second metal strip segment 422 increases the contact area between the second metal strip 42 and the cooling structure 30, improves the heat conduction rate of the second metal strip 42, thereby accelerating the cooling rate of the electronic device 20 and the circuit board 11, and further improving the heat dissipation capacity of the electronic device 20 and the circuit board 11.

[0066] At the same time, the first metal strip segment 421, the second metal strip segment 422, and the third metal strip segment 423 are connected in sequence and are in a "U" shape, so that the stability of the second metal strip 42 is improved, and the second metal strip 42 can be prevented from toppling. The second metal strip 42 surrounds the outer periphery of the electronic device 20, which can save space on the circuit board 11 and improve the space utilization rate of the circuit board 11.

[0067] In the above embodiment, along the direction perpendicular to the extension direction of the first metal strip segment 421 and perpendicular to the direction from the first metal strip segment 421 pointing to the third metal strip segment 423, the width d1 of the first metal strip segment 421, the width d2 of the second metal strip segment 422, and the width d3 of the third metal strip segment 423 are all equal. While ensuring the heat conduction rate of the second metal strip 42, it is convenient to integrally process and manufacture the second metal strip 42, and the processing difficulty of the second metal strip 42 can be reduced.

[0068] Please refer to Figure 10 , in some implementations, along the direction perpendicular to the extension direction of the first metal strip segment 421 and perpendicular to the direction from the first metal strip segment 421 pointing to the third metal strip segment 423, the width d1 of the first metal strip segment 421 is greater than the width d2 of the second metal strip segment 422 and the width d3 of the third metal strip segment 423. It can be understood that the widths d2 of the second metal strip segment 422 and d3 of the third metal strip segment 423 are smaller, which can reduce the volume of the second metal strip 42 while ensuring the stability of the second metal strip 42, and further reduce the material consumption to reduce the cost.

[0069] In some embodiments, along a direction perpendicular to the extension direction of the first metal strip 421 and perpendicular to the direction in which the first metal strip 421 points to the third metal strip 423, the width d2 of the second metal strip 422 is equal to the width d3 of the third metal strip 423. While ensuring the stability of the second metal strip 42, it is convenient to integrally process and manufacture the second metal strip 42, which can reduce the processing difficulty of the second metal strip 42.

[0070] Please refer to Figure 11 and Figure 12 , in some implementation manners, the charging module 10 further includes a third metal strip 43, and the third metal strip 43 and the second metal strip 42 are arranged at intervals. One end of the third metal strip 43 is connected to the first metal strip 41 or the circuit board 11, and the other end of the third metal strip 43 is in thermally conductive contact with the cooling structure 30 (as shown in Figure 9 ), and the third metal strip 43 is electrically isolated from the cooling structure 30.

[0071] Continuing to refer to Figure 11 , one end of the third metal strip 43 is connected to the first metal strip 41, and the other end of the third metal strip 43 is in thermally conductive contact with the cooling structure 30 (as shown in Figure 9 ). The third metal strip 43 can transfer the heat of the electronic device 20 to the cooling structure 30.

[0072] Continuing to refer to Figure 12 , one end of the third metal strip 43 is connected to the circuit board 11, and the other end of the third metal strip 43 is in thermally conductive contact with the cooling structure 30 (as shown in Figure 9 ). The third metal strip 43 can transfer the heat of the circuit board 11 to the cooling structure 30.

[0073] The third metal strip 43 and the second metal strip 42 can transfer the heat of the electronic device 20 or the circuit board 11 to the cooling structure 30, strengthening the heat transfer rate and further improving the heat dissipation capacity of the electronic device 20 and the circuit board 11. The third metal strip 43 is electrically isolated from the cooling structure 30, which can prevent the third metal strip 43 from transferring current to the cooling structure 30, thereby avoiding the cooling structure 30 and the charging module 10 from being charged and preventing electric shock injuries.

[0074] The embodiments of the present application do not limit the position of the third metal strip 43. Exemplarily, the third metal strip 43 and the second metal strip 42 can be arranged on opposite sides of the first metal strip 41; the third metal strip 43 and the second metal strip 42 can also be arranged on the same side of the first metal strip 41.

[0075] In the embodiments of the present application, the shapes of the second metal strip 42 and the third metal strip 43 are not limited. Exemplarily, the shapes of the second metal strip 42 and the third metal strip 43 can be the same. For example, both the second metal strip 42 and the third metal strip 43 are in an "L" shape; the shapes of the second metal strip 42 and the third metal strip 43 can also be different. For example, the second metal strip 42 is in an "L" shape and the third metal strip 43 is in a "U" shape.

[0076] In some embodiments, the second metal strip 42 can be connected to the first metal strip 41, and the third metal strip 43 is connected to the circuit board 11, so that the heat on the electronic device 20 and the circuit board 11 is respectively transferred to the cooling structure 30 through the second metal strip 42 and the third metal strip 43, and the temperatures of the electronic device 20 and the circuit board 11 can be reduced synchronously to ensure the normal use of the electronic device 20 and the circuit board 11.

[0077] In other embodiments, both the second metal strip 42 and the third metal strip 43 can be connected to the first metal strip 41.

[0078] In other embodiments, both the second metal strip 42 and the third metal strip 43 can be connected to the circuit board 11.

[0079] In some embodiments, there can be multiple third metal strips 43 and second metal strips 42. It can be understood that the more the number of the third metal strip 43 and the second metal strip 42, the faster the heat transfer rate and the greater the heat dissipation capacity of the electronic device 20 and the circuit board 11. However, at the same time, the more space the second metal strip 42 and the third metal strip 43 occupy, which may lead to an increase in the volume of the charging module 10. The corresponding number of the third metal strip 43 and the second metal strip 42 can be set according to the actual heat dissipation requirements.

[0080] In the embodiments of the present application, the widths L1 of the second metal strip 42 and L2 of the third metal strip 43 are not limited. It can be understood that the larger L1 and L2 are, the faster the heat transfer rate and the greater the heat dissipation capacity of the electronic device 20 and the circuit board 11. However, at the same time, the more space the second metal strip 42 and the third metal strip 43 occupy, which may lead to an increase in the volume of the charging module 10. The corresponding widths of the third metal strip 43 and the second metal strip 42 can be set according to the actual heat dissipation requirements.

[0081] Continue to refer to Figure 9 , in some implementation manners, a receiving cavity 34 is provided on the cooling structure 30, there is potting glue 61 in the receiving cavity 34, and the second metal strip 42 extends into the potting glue 61. Exemplarily, the material of the potting glue 61 can include silicone rubber. The second metal strip 42 extends into the potting glue 61, and the heat of the electronic device 20 and the circuit board 11 can be transferred to the potting glue 61 through the second metal strip 42, and then the potting glue 61 transfers the heat to the cooling structure 30.

[0082] The potting glue 61 can further increase the contact area between the second metal strip 42 and the cooling structure 30, accelerate the heat transfer rate, thereby improving the heat dissipation capacity of the electronic device 20 and the circuit board 11, and ensuring the normal use of the electronic device 20 and the circuit board 11.

[0083] In some embodiments, a connecting plate 35 is disposed on the side of the cooling structure 30 facing the electronic device 20, and the connecting plate 35 encloses a receiving cavity 34. The embodiments of the present application do not limit the connection manner between the connecting plate 35 and the cooling structure 30. Exemplarily, the connecting plate 35 and the cooling structure 30 may be an integral structural member; the connecting plate 35 and the cooling structure 30 may also be connected by welding.

[0084] Please refer to Figure 13 , in some implementation manners, a heat-conducting material 62 is disposed between the end of the second metal strip 42 close to the cooling structure 30 and the cooling structure 30. The heat of the electronic device 20 and the circuit board 11 can be transferred to the heat-conducting material 62 through the second metal strip 42, and then transferred from the heat-conducting material 62 to the cooling structure 30. The heat-conducting material 62 can increase the contact area between the second metal strip 42 and the cooling structure 30, accelerate the heat transfer rate, thereby improving the heat dissipation capacity of the electronic device 20 and the circuit board 11, and ensuring the normal use of the electronic device 20 and the circuit board 11.

[0085] In some implementation manners, the heat-conducting material 62 includes at least one of a heat-conducting gasket or a heat-conducting adhesive. The embodiments of the present application do not limit the materials of the heat-conducting gasket and the heat-conducting adhesive. Exemplarily, the material of the heat-conducting gasket may include silica gel and metal oxide, and the metal oxide is doped in the silica gel to form the heat-conducting gasket. The material of the heat-conducting adhesive may include silicone rubber and heat-conducting filler, and the heat-conducting filler may include alumina, boron nitride, silicon oxide, etc. The heat-conducting gasket has a relatively high hardness, and the heat-conducting adhesive has a relatively good elasticity.

[0086] Please refer to Figure 14 , in some implementation manners, an insulating material 63 is further disposed between the end of the second metal strip 42 close to the cooling structure 30 and the cooling structure 30. Exemplarily, the insulating material 63 may include a heat-conducting insulating film, a ceramic sheet, etc. The material of the heat-conducting insulating film may include at least one of silicone rubber, glass fiber, and polyimide.

[0087] The insulating material 63 has good insulation performance and can effectively prevent current from conducting from the second metal strip 42 to the cooling structure 30. The insulating material 63 can withstand a certain voltage, ensure that the insulation performance of the insulating material 63 is not damaged, and ensure the safe operation of the charging module 10.

[0088] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A charging module, characterized in that, include: circuit boards; an electronic device, wherein the electronic device is arranged on one side of the circuit board; a cooling structure, the cooling structure being arranged on a side of the electronic device facing away from the circuit board; a first metal strip and a second metal strip, wherein the first metal strip electrically connects the electronic device and the circuit board, one end of the second metal strip is connected to the first metal strip or the circuit board, the other end of the second metal strip is in thermal contact with the cooling structure, and the second metal strip is electrically isolated from the cooling structure.

2. The charging module according to claim 1, wherein The charging module further includes: a third metal strip, the third metal strip being spaced apart from the second metal strip; One end of the third metal strip is connected to the first metal strip, the other end of the third metal strip is in thermal contact with the cooling structure, and the third metal strip is electrically isolated from the cooling structure.

3. The charging module according to claim 1, characterized in that, The second metal strip extends in a direction perpendicular to the circuit board, and a portion of the second metal strip close to the cooling structure is bent in a direction parallel to a surface of the cooling structure.

4. The charging module according to claim 1, wherein The second metal strip surrounds the periphery of the electronic device; The second metal strip includes a first metal strip section, a second metal strip section, and a third metal strip section, wherein the first metal strip section, the second metal strip section, and the third metal strip section are connected in sequence; The first section of the metal strip and the third section of the metal strip extend in a direction perpendicular to the plane of the circuit board, the second section of the metal strip extends in a direction parallel to the surface of the cooling structure, and the second section of the metal strip is in thermal contact with the cooling structure.

5. The charging module according to claim 4, characterized in that, Along a direction perpendicular to the extension direction of the first metal strip and perpendicular to the direction pointing from the first metal strip to the third metal strip, the width of the first metal strip is greater than the width of the second metal strip and the width of the third metal strip.

6. The charging module according to any one of claims 1-5, characterized in that, The cooling structure is provided with an accommodating cavity, the accommodating cavity contains a potting compound, and the second metal strip extends into the potting compound.

7. The charging module according to any one of claims 1-5, characterized in that The second metal strip is close to an end portion of the cooling structure, and a heat conductive material is provided between the second metal strip and the cooling structure.

8. The charging module according to claim 7, characterized in that, The thermally conductive material includes at least one of a thermally conductive pad and a thermally conductive adhesive.

9. The charging module according to claim 8, wherein An insulating material is further provided between the end of the second metal strip close to the cooling structure and the cooling structure.

10. A charging pile, characterized in that, The charging pile includes a charging module and a charging gun as described in any one of claims 1 to 9, and the charging gun is used to output the current output by the charging module to the electric vehicle.

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