Adsorption device and processing equipment

Abstract

The utility model is applicable to the technical field of laser chip packaging, and provides an adsorption device and processing equipment, the adsorption device comprises an adsorption body, and an air suction channel is arranged in the adsorption body; adsorption holes are formed in the front face of the adsorption body and communicate with the air suction channel, and threads are arranged on the inner walls of the adsorption holes. According to the embodiment of the invention, the adsorption holes can generate negative pressure for adsorbing workpieces and can also be used for fixing threads so as to fix the top cylinder, so that the universality of the adsorption device is improved.

Description

Technical Field

[0001] This application relates to the technical field of laser chip packaging, and particularly relates to an adsorption device and a processing device. Background Art

[0002] Semiconductor laser devices have the characteristics of small size, light weight, long lifespan, and easy integration, and are widely used in fields such as laser processing, lighting and display, biological diagnostic medicine, laser wireless energy transmission, environmental monitoring, information storage and imaging, etc.

[0003] Due to the small size and light weight of semiconductor laser devices, the housing of semiconductor laser devices is relatively thin and light, and the phenomenon of housing warping is likely to occur during the production process. If the warping of the housing is not treated, it will affect the light coupling efficiency of the semiconductor laser device.

[0004] At present, an adsorption device is usually used to vacuum-adsorb and fix the housing of a semiconductor laser device to reduce the warping of the housing of the semiconductor laser device. However, this adsorption device cannot position the housing, resulting in poor versatility of the adsorption device. Utility Model Content

[0005] The embodiments of this application provide an adsorption device and a processing device, which can improve the versatility of the adsorption device.

[0006] In a first aspect, the embodiments of this application provide an adsorption device, and the adsorption device includes:

[0007] An adsorption body, an air suction channel is arranged inside the adsorption body, an adsorption hole is arranged on the front surface of the adsorption body, the adsorption hole is communicated with the air suction channel, and threads are arranged on the inner wall of the adsorption hole.

[0008] In some possible implementation manners of the first aspect, a fixing hole is arranged on the side surface of the adsorption body, and threads are arranged on the inner wall of the fixing hole.

[0009] In some possible implementation manners of the first aspect, the fixing holes are arranged on two adjacent side surfaces of the adsorption body.

[0010] In some possible implementation manners of the first aspect, the two side surfaces of the adsorption body provided with the fixing holes are perpendicular to each other.

[0011] In some possible implementation manners of the first aspect, the inner diameter of the adsorption hole is smaller than the inner diameter of the air suction channel.

[0012] In some possible embodiments of the first aspect, a plurality of suction channels are provided. The length directions of some of the suction channels are parallel to the length direction of the adsorption body, and the length directions of some of the suction channels are parallel to the width direction of the adsorption body.

[0013] In some possible embodiments of the first aspect, all the suction channels communicate with each other.

[0014] In some possible embodiments of the first aspect, at least two ports of the suction channel are suction ports.

[0015] In some possible embodiments of the first aspect, through holes are further provided on the front surface of the adsorption body, and threads are provided on the inner walls of the through holes.

[0016] In a second aspect, an embodiment of the present application provides a processing device, and the processing device includes the adsorption device according to any one of the above technical solutions.

[0017] In the adsorption device and the processing device provided by the embodiments of the present application, a suction channel is provided in the adsorption body, and an adsorption hole is provided on the front surface of the adsorption body. The adsorption hole communicates with the suction channel; when vacuum is pumped into the adsorption channel, it is convenient to generate negative pressure in the adsorption hole, so as to adsorb the workpiece on the front surface of the adsorption body through the adsorption hole; threads are provided on the inner wall of the adsorption hole to facilitate fixing screws in the adsorption hole, so as to fix the top cylinder on the front surface of the adsorption body through the screws; the top cylinder can be used to push the workpiece to move on the front surface of the adsorption body to position the workpiece; since the adsorption hole can both generate negative pressure for adsorbing the workpiece and be used for fixing threads to fix the top cylinder, the versatility of the adsorption device is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0019] Figure 1 It is a schematic structural diagram of an embodiment of the adsorption device of the present application;

[0020] Figure 2 It is a half-sectional view of another embodiment of the adsorption device of the present application.

[0021] Explanation of the reference numerals in the drawings:

[0022] 1. Adsorption body; 11. Suction channel; 12. Adsorption hole; 13. Fixing hole; 14. Through hole; Bung 2.

[0023] The realization of the purpose of this application, its functional features and advantages will be further described in conjunction with the embodiments and with reference to the accompanying drawings. Specific Embodiments

[0024] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the scope of protection of the present application.

[0025] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0026] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0027] It should be understood that the term "and / or" used in the specification and appended claims of the present application refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0028] In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality of" means two or more, unless otherwise specifically defined.

[0029] The embodiments of the present application provide an adsorption device and a processing device, which are used to solve the technical problem of poor versatility of the adsorption device.

[0030] In the embodiments of the present application, as Figure 1 and Figure 2As shown in the figure, the adsorption device includes an adsorption body 1, and an air suction channel 11 is arranged inside the adsorption body 1. An adsorption hole 12 is arranged on the front surface of the adsorption body 1. The adsorption hole 12 is communicated with the air suction channel 11, and a thread is arranged on the inner wall of the adsorption hole 12.

[0031] In this embodiment, the shape of the adsorption body 1 can be a cuboid. The adsorption device is used for adsorbing and fixing a workpiece, and the workpiece can be the housing of a semiconductor laser device.

[0032] In the embodiment of the present application, an air suction channel 11 is arranged inside the adsorption body 1, and an adsorption hole 12 is arranged on the front surface of the adsorption body 1. The adsorption hole 12 is communicated with the air suction channel 11; when vacuum is pumped into the adsorption channel, it is convenient to generate negative pressure in the adsorption hole 12, so as to adsorb the workpiece on the front surface of the adsorption body 1 through the adsorption hole 12; a thread is arranged on the inner wall of the adsorption hole 12, so as to facilitate fixing a screw in the adsorption hole 12, and thus fix the top cylinder on the front surface of the adsorption body 1 through the screw; the top cylinder can be used to push the workpiece to move on the front surface of the adsorption body 1 to position the workpiece; since the adsorption hole 12 can both generate negative pressure for adsorbing the workpiece and be used for fixing the thread to fix the top cylinder, the versatility of the adsorption device is improved.

[0033] In one embodiment, as Figure 2 shown, a fixing hole 13 is arranged on the side surface of the adsorption body 1, and a thread is arranged on the inner wall of the fixing hole 13. The fixing hole 13 is used for fixing a screw, so as to fix the positioning block on the side surface of the adsorption body 1 through the screw. The positioning block protrudes from the side surface of the adsorption body 1 to block the workpiece and position the workpiece.

[0034] In this embodiment, when a top cylinder is arranged on the front surface of the adsorption body 1, the workpiece can be pushed towards the positioning block through the top cylinder, so as to realize the positioning of the workpiece.

[0035] In one embodiment, fixing holes 13 are arranged on two adjacent side surfaces of the adsorption body 1. So as to arrange positioning blocks on two adjacent side surfaces of the adsorption body 1, and thus position the workpiece in two directions.

[0036] In one embodiment, as Figure 2 shown, the two side surfaces of the adsorption body 1 provided with the fixing holes 13 are perpendicular to each other. So as to position the workpiece in two mutually perpendicular directions, thus facilitating the positioning of the workpiece.

[0037] In one embodiment, as Figure 1 and Figure 2 shown, the inner diameter of the adsorption hole 12 is smaller than the inner diameter of the air suction channel 11. So as to increase the negative pressure in the adsorption hole 12, and thus increase the adsorption force of the adsorption hole 12 on the workpiece.

[0038] In one embodiment, asFigure 1 and Figure 2 As shown in Figure 2 , a plurality of air intake channels 11 are provided. The length direction of some of the air intake channels 11 is parallel to the length direction of the adsorption body 1, and the length direction of some of the air intake channels 11 is parallel to the width direction of the adsorption body 1. The number of the air intake channels 11 can be increased to make the distribution position of the air intake channels 11 more reasonable, thereby increasing the number of adsorption holes 12.

[0039] In one embodiment, as Figure 2 shown, all the air intake channels 11 are interconnected so that the negative pressure in all the air intake channels 11 is equal, and further the negative pressure in all the adsorption holes 12 is equal, so that the workpiece is uniformly stressed. The number of vacuum pumping devices can also be saved.

[0040] In one embodiment, as Figure 2 shown, at least two ports of the air intake channel 11 are air inlets, so that each air inlet is respectively connected to a vacuum pumping device, thereby increasing the negative pressure in the air intake channel 11.

[0041] In this embodiment, the air intake channel 11 is a through hole. When the port of the air intake channel 11 is an air inlet, it is used to communicate with the vacuum pumping device. The remaining ports of the air intake channel 11 except the air inlets are sealed with plugs 2 to facilitate increasing the negative pressure in the adsorption holes 12.

[0042] In one embodiment, as Figure 1 and Figure 2 shown, a through hole 14 is further provided on the front surface of the adsorption body 1, and a thread is provided on the inner wall of the through hole 14. The through hole 14 is used for a screw to pass through, so as to fix the adsorption body 1 to the carrier table through the screw.

[0043] In addition, an embodiment of the present application further provides a processing device, which includes an adsorption device. The specific structure of the adsorption device refers to the above embodiment. Since the processing device adopts all the technical solutions of the above all embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments.

[0044] In this embodiment, when the workpiece is the housing of a semiconductor laser device, the adsorption body 1 can be fixed to the carrier table of the processing device through a screw, and then the housing is adsorbed and fixed through the adsorption body 1. Then, components such as a semiconductor crystal are encapsulated in the housing through a grasping device, thereby realizing the manufacture of a semiconductor laser.

[0045] The above is only the preferred embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structural transformation made by using the content of the specification and drawings of the present application under the inventive concept of the present application, or directly / indirectly applied to other related technical fields, is included in the patent protection scope of the present application.

Claims

1. An adsorption device, characterized in that: The adsorption device comprises: The adsorption body is provided with an air suction channel, the front of the adsorption body is provided with an adsorption hole, the adsorption hole is communicated with the air suction channel, and the inner wall of the adsorption hole is provided with a thread.

2. The adsorption device according to claim 1, characterized in that A fixing hole is provided on the side surface of the adsorption body, and a thread is provided on the inner wall of the fixing hole.

3. The adsorption device according to claim 2, characterized in that The fixing holes are provided on two adjacent side surfaces of the adsorption body.

4. The adsorption device according to claim 3, characterized in that The two side surfaces of the adsorption body where the fixing holes are provided are perpendicular to each other.

5. The adsorption device according to claim 1, wherein The inner diameter of the adsorption hole is smaller than the inner diameter of the air suction channel.

6. The adsorption device according to claim 1, wherein There are multiple air intake channels, the length directions of some of the air intake channels are parallel to the length direction of the adsorption body, and the length directions of some of the air intake channels are parallel to the width direction of the adsorption body.

7. The adsorption device according to claim 6, characterized in that All the air intake channels are communicated with each other.

8. The adsorption device according to claim 7, characterized in that At least two ports of the air intake channel are air intake ports.

9. The adsorption device according to claim 1, wherein The front surface of the adsorption body is further provided with a through hole, and the inner wall of the through hole is provided with a thread.

10. A processing equipment, characterized in that, The processing equipment includes the adsorption device according to any one of claims 1 to 9.

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