Machining head and laser machining equipment

By designing a processing head with through holes, blow holes and air pump holes in the laser annealing equipment, real-time monitoring of oxygen concentration and smoke removal are achieved, the problem of single function of laser annealing equipment is solved and the processing quality is improved.

CN223185770UActive Publication Date: 2025-08-05SHENZHEN HANS SEMICONDUCTOR EQUIPMENT TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202422076349.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-26
Publication Date
2025-08-05
Estimated Expiration
2034-08-26

AI Technical Summary

Technical Problem

The processing head functions of existing laser annealing equipment are relatively single, and it is difficult to meet a variety of processing needs, such as cooling treatment and protective atmosphere treatment.

Method used

A processing head is designed, including through holes, blow holes and air pump holes, which are used to inject protective gas, extract smoke and dust, and detect oxygen concentration, and monitor and control the protective gas flow in real time through an oxygen concentration detector.

Benefits of technology

Real-time monitoring of oxygen concentration during laser processing and effective removal of smoke and dust is achieved, improving the quality and stability of laser processing.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a machining head and laser machining equipment. The machining head comprises a shell and an oxygen concentration detector. The shell is provided with a through hole, an air blowing hole and an air exhausting hole, the through hole is used for allowing laser to pass through, and an orifice, closer to a product, of the through hole is a first orifice; the air suction hole is communicated with the through hole and is used for sucking air in the through hole; the blowing hole communicates with the through hole and is used for blowing shielding gas towards the first hole opening, and the shielding gas is used for reducing the concentration of oxygen at the first hole opening; and the oxygen concentration detector is used for detecting the oxygen content of the gas at the first orifice. The machining head can inject protective gas, exhaust dust and detect the oxygen concentration, and the functions are more comprehensive.
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Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to a processing head and laser processing equipment. Background Art

[0002] During the semiconductor device manufacturing process, ion implantation is performed on the backside of the wafer, source, or drain of certain devices. This ion implantation process can severely damage the silicon lattice, causing the doped impurity ions to fail to occupy the correct lattice positions, and some doped areas to become electrically inactive.

[0003] After the ion implantation process, the wafer needs to be heated. When the wafer is heated to a high temperature, the impurity atoms will diffuse in the crystal lattice and occupy replacement positions to achieve activation. In the subsequent rapid cooling, the atoms in the crystal lattice are rearranged to achieve the desired lattice structure. This heating treatment is called an annealing process.

[0004] Laser annealing is a process that uses pulsed lasers to heat treat materials. Due to its advantages, such as high instantaneous temperature, short exposure time, and minimal heat-affected zone, laser annealing is well suited to the requirements of electroactive activation, making it a key process in chip manufacturing.

[0005] During the laser annealing process of wafers, the annealing area of the product requires various treatments, such as cooling and protective atmosphere treatment. In related technologies, the processing head of laser annealing equipment has a relatively single function and is unable to meet various requirements. Utility Model Content

[0006] To this end, the present application proposes a processing head that can inject protective gas, extract dust and detect oxygen concentration, with more comprehensive functions.

[0007] The present application also proposes a laser processing device having the above-mentioned processing head.

[0008] The processing head according to the first embodiment of the present application includes:

[0009] The housing is provided with a through hole, an air blowing hole, and an air extraction hole. The through hole is used for passing the laser, and the opening of the through hole closer to the product is set as the first opening; the air extraction hole is connected to the through hole and is used to suck the gas in the through hole; the air blowing hole is connected to the through hole and is used to blow protective gas toward the first opening, and the protective gas is used to reduce the concentration of oxygen at the first opening;

[0010] The oxygen concentration detector is used to detect the oxygen content of the gas at the first orifice.

[0011] According to the processing head of the embodiment of the present application, there are at least the following beneficial effects: when the laser passes through the through hole to process the product, the blowing hole is used to blow protective gas toward the first orifice, and the protective gas can cover the processing part of the product, thereby reducing the oxygen concentration near the processing part of the product; the oxygen concentration detector detects the oxygen content of the gas at the first orifice, and can monitor the oxygen content of the gas at the first orifice in real time, which is conducive to controlling the flow rate of the blowing hole according to the oxygen content of the gas at the first orifice; the exhaust hole sucks the gas in the through hole, which is conducive to taking away the smoke and dust generated during processing, and thus is conducive to protecting the laser lens.

[0012] According to some embodiments of the present application, the air suction hole and the air blowing hole are respectively located on opposite sides of a first center line of the through hole.

[0013] According to some embodiments of the present application, the air suction hole is located on a side of the air blowing hole away from the first orifice.

[0014] According to some embodiments of the present application, the center line of the air extraction hole is located inside the air blowing hole.

[0015] According to some embodiments of the present application, a plurality of the blowing holes are provided, and the plurality of the blowing holes are spaced apart and distributed around the first center line of the through hole.

[0016] According to some embodiments of the present application, the shell is further provided with a transfer chamber, the transfer chamber is communicated with each of the blowing holes, and the transfer chamber is also used to communicate with a protective gas source.

[0017] According to some embodiments of the present application, an angle α formed between the second center line of the blowing hole and the first center line of the through hole is an acute angle, and the blowing hole faces outward from the through hole.

[0018] According to some embodiments of the present application, the cross-section of the through hole is circular, elliptical or polygonal.

[0019] According to some embodiments of the present application, the oxygen concentration detector includes one of an electrochemical oxygen detector, a magnetomechanical oxygen analyzer, an infrared oxygen analyzer, and a cobalt oxide oxygen analyzer.

[0020] A laser processing device according to an embodiment of the second aspect of the present application includes:

[0021] The above-mentioned processing head;

[0022] A laser device is used to generate the laser to process the product.

[0023] The laser processing equipment according to the embodiment of the present application has at least the following beneficial effects: by using the above-mentioned processing head, it is possible to inject protective gas, extract dust and detect oxygen concentration, the functions are more comprehensive, and the processing quality of the laser processing equipment is better.

[0024] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The present application is further described below with reference to the accompanying drawings and embodiments, wherein:

[0026] Figure 1 A perspective view of a processing head according to an embodiment of the present application;

[0027] Figure 2 for Figure 1 Cross-sectional view of the processing head;

[0028] Figure 3 for Figure 1 Bottom view of the middle processing head;

[0029] Figure 4 This is a schematic diagram of a laser processing device according to an embodiment of the present application.

[0030] Reference numerals: housing 100 , through hole 110 , first orifice 111 , air blowing hole 120 , second center line 121 , air extraction hole 130 , transfer cavity 140 , mounting hole 150 ;

[0031] Oxygen concentration detector 200;

[0032] Products 300;

[0033] Laser device 400. DETAILED DESCRIPTION

[0034] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0035] In the description of this application, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application.

[0036] In the description of this application, "several" means one or more, "more" means two or more, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" is solely for the purpose of distinguishing technical features and is not to be construed as indicating or implying relative importance, or implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0037] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0038] In the description of this application, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples.

[0039] Reference Figure 1 and Figure 2 , it should be noted that, Figure 2 The arrow with a spline curve in the middle is used to indicate the flow direction of the gas. The processing head according to the embodiment of the first aspect of the present application includes a shell 100 and an oxygen concentration detector 200. The shell 100 is provided with a through hole 110, an air blowing hole 120 and an air extraction hole 130. The through hole 110 is used for passing the laser, and the opening of the through hole 110 closer to the product 300 is set as the first opening 111. The air extraction hole 130 is connected to the through hole 110, and the air extraction hole 130 is used to suck the gas in the through hole 110. The air blowing hole 120 is connected to the through hole 110, and the air blowing hole 120 is used to blow protective gas toward the first opening 111, and the protective gas is used to reduce the concentration of oxygen at the first opening 111. The oxygen concentration detector 200 is used to detect the oxygen content of the gas at the first opening 111.

[0040] According to the processing head of the embodiment of the present application, there are at least the following beneficial effects: when the laser processes the product 300 through the through hole 110, the blowing hole 120 is used to blow protective gas toward the first orifice 111, and the protective gas can cover the processing part of the product 300, thereby reducing the oxygen concentration near the processing part of the product 300; the oxygen concentration detector 200 detects the oxygen content of the gas at the first orifice 111, and can monitor the oxygen content of the gas at the first orifice 111 in real time, which is conducive to controlling the flow rate of the blowing hole 120 according to the oxygen content of the gas at the first orifice 111; the exhaust hole 130 sucks the gas in the through hole 110, which is conducive to taking away the smoke and dust generated during processing, and thus is conducive to protecting the laser lens.

[0041] Specifically, the protective gas can be an inert gas or nitrogen.

[0042] It should be noted that Figure 1 The oxygen concentration detector 200 in FIG. 1 is only for illustration, and the specific shape of the oxygen concentration detector 200 depends on the specific type of the oxygen concentration detector 200 .

[0043] Reference Figure 2 In some embodiments of the present application, the air extraction hole 130 and the air blowing hole 120 are respectively located on opposite sides of the first center line 111 of the through hole 110 .

[0044] When the exhaust hole 130 and the blowing hole 120 are respectively located on opposite sides of the first center line 111, after the protective gas blown out of the blowing hole 120 passes through the product 300, most of the protective gas just flows to the position of the exhaust hole 130. The protective gas can be extracted by the exhaust hole 130, and a stable airflow can be formed above the processing part of the product 300, which is conducive to maintaining a stable protective gas atmosphere.

[0045] Specifically, refer to Figure 2 The exhaust hole 130 may be located in front of the first center line 111, and the blowing hole 120 may be located behind the first center line 111. The protective gas blown out of the blowing hole 120 is blown forward and passes through the product 300 before being drawn away by the exhaust hole 130 located on the rear side of the housing 100, thereby forming a stable airflow from the back to the front.

[0046] Reference Figure 2 In an improved solution of the above embodiment, the air extraction hole 130 is located on a side of the air blowing hole 120 away from the first orifice 111 .

[0047] The exhaust hole 130 is located on the side of the blowing hole 120 away from the first orifice 111, that is, the exhaust hole 130 and the blowing hole 120 are staggered in the axial direction of the through hole 110. Therefore, the protective gas blown out of the blowing hole 120 will not be immediately extracted by the exhaust hole 130, and the protective gas stays at the product 300 for a longer time, which is conducive to forming a stable and large-scale protective atmosphere.

[0048] Specifically, refer to Figure 2 , the air extraction hole 130 may be located above the air blowing hole 120 .

[0049] Appropriate reference Figure 2 , it should be noted that, Figure 2 The air extraction hole 130 shown in FIG is located above the air blowing hole 120, and the center line of the air extraction hole 130 is not located within the air blowing hole 120. Figure 2 In this embodiment, it is only for reference.

[0050] In an improved solution of the above embodiment, the center line of the air extraction hole 130 is located inside the air blowing hole 120 .

[0051] The centerline of the extraction hole 130 is located within the blowing hole 120, meaning that the extraction hole 130 and the blowing hole 120 are roughly or completely aligned. At this point, the shielding gas blown from the blowing hole 120 passes through the product 300 and is quickly extracted by the extraction hole 130. The shielding gas stays in the product 300 for a short time, quickly removing the smoke and heat generated during processing, achieving excellent dust removal and cooling effects.

[0052] Reference Figure 3 In some embodiments of the present application, a plurality of blowing holes 120 are provided, and the plurality of blowing holes 120 are spaced apart and distributed around the first center line 111 of the through hole 110 .

[0053] By providing a plurality of blowing holes 120 , the range of the protective gas atmosphere can be expanded, thereby facilitating obtaining a stable processing effect.

[0054] Specifically, the number of the blowing holes 120 may be two, three, four or other numbers.

[0055] Reference Figure 2 In an improved solution of the above embodiment, the housing 100 is further provided with a transfer chamber 140, which is communicated with each blowing hole 120, and the transfer chamber 140 is also used to communicate with a shielding gas source.

[0056] By providing the transfer chamber 140 , the air pressure of each blowing hole 120 can be made more uniform, the flow rate of the protective gas in each blowing hole 120 can be made more consistent, and the protective atmosphere formed on the product 300 can be made more uniform and stable.

[0057] Reference Figure 2In some embodiments of the present application, the angle α between the second center line 121 of the blowing hole 120 and the first center line 111 of the through hole 110 is an acute angle, and the blowing hole 120 faces outside the through hole 110 .

[0058] At this time, the blowing hole 120 is tilted toward the product 300, and the blowing hole 120 is aligned with the product 300. The protective gas blown out of the blowing hole 120 can flow directly to the product 300, the protective atmosphere is more stable, and the processing effect is better.

[0059] Specifically, the angle α may be 30°, 35°, 40° or other angles.

[0060] Appropriate reference Figure 2 In some embodiments of the present application, the cross-section of the through hole 110 is circular, elliptical or polygonal.

[0061] The through hole 110 can match laser lenses of different shapes by adopting different cross-sectional shapes, thereby facilitating the installation of the processing head.

[0062] Need to explain yes, Figure 2 The cross section of the through hole 110 is circular. When the cross section of the through hole 110 is other shapes, Figure 2 For reference only.

[0063] Reference Figure 3 In some embodiments of the present application, the oxygen concentration detector 200 includes one of an electrochemical oxygen detector, a magnetomechanical oxygen analyzer, an infrared oxygen analyzer, and a cobalt oxide oxygen analyzer.

[0064] Electrochemical oxygen detectors, magnetomechanical oxygen analyzers, infrared oxygen analyzers, and cobalt oxide oxygen analyzers are all readily available, thereby contributing to lowering the production cost of the processing head.

[0065] It should be noted that, referring to Figure 3 In some embodiments of the present application, the housing 100 is further provided with a mounting hole 150 , and the mounting hole 150 is used to mount the oxygen concentration detector 200 .

[0066] Reference Figure 4 The laser processing equipment according to the second embodiment of the present application includes a processing head and a laser device 400. The laser device 400 is used to generate laser to process the product 300.

[0067] The laser processing equipment according to the embodiment of the present application has at least the following beneficial effects: by using the above-mentioned processing head, it is possible to inject protective gas, extract dust and detect oxygen concentration, the functions are more comprehensive, and the processing quality of the laser processing equipment is better.

[0068] Specifically, the product 300 may be processed by one of annealing, welding, marking, cutting or drilling.

[0069] The embodiments of the present application have been described in detail above with reference to the accompanying drawings. However, the present application is not limited to the above embodiments. Various modifications can be made within the scope of knowledge possessed by ordinary technicians in the relevant technical field without departing from the purpose of the present application. In addition, the embodiments of the present application and the features of the embodiments can be combined with each other unless there is a conflict.

Claims

1. A processing head, characterized in that include: The housing is provided with a through hole, an air blowing hole, and an air extraction hole. The through hole is used for passing the laser, and the opening of the through hole closer to the product is set as the first opening; the air extraction hole is connected to the through hole and is used to suck the gas in the through hole; the air blowing hole is connected to the through hole and is used to blow protective gas toward the first opening, and the protective gas is used to reduce the concentration of oxygen at the first opening; The oxygen concentration detector is used to detect the oxygen content of the gas at the first orifice.

2. The processing head according to claim 1, characterized in that The air extraction hole and the air blowing hole are respectively located on two opposite sides of a first center line of the through hole.

3. The processing head according to claim 2, characterized in that The air extraction hole is located on a side of the air blowing hole away from the first orifice.

4. The processing head according to claim 2, characterized in that The center line of the air extraction hole is located inside the air blowing hole.

5. The processing head according to any one of claims 1 to 4, characterized in that There are a plurality of blowing holes, and the plurality of blowing holes are distributed at intervals around the first center line of the through hole.

6. The processing head according to claim 5, characterized in that The shell is further provided with a transfer chamber, which is communicated with each of the blowing holes and is also used to communicate with a protective gas source.

7. The processing head according to any one of claims 1 to 4, characterized in that An included angle α between the second center line of the blowing hole and the first center line of the through hole is an acute angle, and the blowing hole faces outward from the through hole.

8. The processing head according to any one of claims 1 to 4, characterized in that The cross section of the through hole is circular, elliptical or polygonal.

9. The processing head according to any one of claims 1 to 4, characterized in that The oxygen concentration detector includes one of an electrochemical oxygen detector, a magnetomechanical oxygen analyzer, an infrared oxygen analyzer and a cobalt oxide oxygen analyzer.

10. Laser processing equipment, characterized in that include: The processing head according to any one of claims 1 to 9; A laser device is used to generate the laser to process the product.