Wafer bearing device for semiconductor detection

Abstract

The utility model discloses a wafer bearing device for semiconductor detection, which belongs to the technical field of wafer bearing devices and comprises a supporting plate, a circular notch is arranged on the supporting plate, a circular plate is fixed in the circular notch, two straight notches are arranged on the side wall of the circular notch, a plurality of clamping rods are uniformly distributed on the circular plate, one end of each clamping rod is fixedly provided with a rotating rod, and the other end of each clamping rod is fixedly provided with a rotating shaft. A first transmission wheel is fixed at the bottom end of the rotating rod; a second transmission wheel and a driving mechanism are connected to the center of the bottom end of the circular plate through a first rotating shaft; two round rods are connected to the supporting plate, a bearing plate is fixed to the bottom ends of the round rods, second rotating shafts are fixed to one ends of the round rods, gears are fixed to the other ends of the round rods, moving rods are connected to the side faces of the second rotating shafts through round pipes, and pressing mechanisms are arranged at the other ends of the moving rods; straight rods are connected to the bearing plate through hydraulic cylinders, movable rods are fixed to the two ends of one side of each straight rod through connecting rods, and a plurality of racks are fixed to the inner sides of the movable rods; by using the device, the fixing effect is good, the clamping requirements of wafers of different sizes are met, and the diversified requirements of enterprises are met.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer supporting devices, in particular to a wafer supporting device used for semiconductor testing. Background Art

[0002] A wafer refers to the silicon chip used in the manufacture of silicon semiconductor integrated circuits. Due to its round shape, it is called a wafer. The wafer carrier is a fixing device used to fix and support the wafer blank during the wafer processing and polishing process. It is related to the accuracy of the subsequent processing of the wafer. In the process of semiconductor integrated circuit manufacturing, many processes require the use of a supporting device to handle the wafer in advance in order to ensure the uniform position of the operating wafer and facilitate process expansion.

[0003] Currently, the wafer support device used in semiconductor testing is rather troublesome when limiting and clamping the placed wafers. Moreover, the support device can only clamp and support wafers of a specified size, and is inconvenient to clamp and limit wafers of different sizes. It has great limitations. Therefore, it is urgent to design a wafer support device for semiconductor testing to solve the above problems. Utility Model Content

[0004] The purpose of the present utility model is to provide a wafer supporting device for semiconductor testing, so as to solve the problems that the existing wafer supporting device used for semiconductor testing is troublesome in limiting and clamping the placed wafers, and the supporting device can only clamp and support wafers of a specified size, which makes it inconvenient to clamp and limit wafers of different sizes, thus solving the problem of large limitations.

[0005] In order to solve the above technical problems, the utility model provides a wafer supporting device for semiconductor testing, comprising a support plate, wherein the support plate is provided with a circular notch, a circular plate is fixed in the circular notch, and two straight notches are provided on the side wall thereof at opposite positions, a plurality of clamping rods are evenly distributed on the circular plate, a rotating rod is fixed at one end of a plurality of the clamping rods, a plurality of the rotating rods are movably connected to the circular plate and a first transmission wheel is fixed at the bottom end thereof, a second transmission wheel is movably connected to the center of the bottom end of the circular plate via a first rotating shaft and a driving mechanism is provided; the second transmission wheel is connected to a plurality of the first transmission wheels via a conveyor belt;

[0006] Two round rods are movably connected to the support plate and a supporting plate is fixed to the bottom end of the two round rods, one end of the two round rods is respectively located in the two straight slots and fixed with a second rotating shaft, and the other end is located at the bottom end of the support plate and fixed with a gear, a round tube is fixed on the side of the second rotating shaft, a moving rod is fixed on the side of the round tube, and a clamping mechanism is provided at the other end of the moving rod; a hydraulic cylinder is installed on the support plate, a piston rod of which is connected to a straight rod, and movable rods are fixed to both ends of one side of the straight rod through connecting rods, and the two movable rods are respectively located on the outside of the two gears and a number of racks meshing with them are fixed on the side close to the gear.

[0007] Optionally, the driving mechanism includes a driving motor and a first gear, the first gear is fixed to the bottom end of the first rotating shaft, the driving motor is fixed to the bottom end of the circular plate and its output end is connected to a second gear that meshes with the first gear for transmission.

[0008] Optionally, the clamping mechanism includes a sliding rod, which is slidably connected to the other end of the moving rod and has a pressing block fixed at its bottom end and a connecting block fixed at the top end. The connecting block is connected to the moving rod through a spring surrounding the side of the sliding rod.

[0009] Optionally, the supporting plate and the straight rod are connected via two telescopic rods.

[0010] Optionally, rubber pads are fixed on the inner sides of several clamping rods.

[0011] Optionally, pillars are fixed to the four corners of the bottom end of the support plate.

[0012] The utility model provides a wafer support device for semiconductor testing, which includes a support plate, the support plate having a circular groove, a circular plate fixed in the circular groove and two straight grooves arranged oppositely on its side wall, a plurality of clamping rods are evenly distributed on the circular plate, a rotating rod is fixed at one end of the plurality of clamping rods, a plurality of rotating rods are movably connected to the circular plate and a first transmission wheel is fixed at the bottom end thereof, the center of the bottom end of the circular plate is movably connected to the second transmission wheel through a first rotating shaft and a driving mechanism is provided, the second transmission wheel is connected to the plurality of first transmission wheels through a conveyor belt; two round rods are movably connected to the support plate and a carrying plate is fixed at the bottom end thereof, and the two round rods are movably connected to the support plate and a carrying plate is fixed at the bottom end thereof. One end of the round rod is located in the two straight slots and is fixed with a second rotating shaft, and the other end is located at the bottom of the support plate and is fixed with a gear, a round tube is fixed on the side of the second rotating shaft, a moving rod is fixed on the side of the round tube, and a clamping mechanism is provided at the other end of the moving rod; a hydraulic cylinder is installed on the supporting plate, and its piston rod is connected to a straight rod, and movable rods are fixed at both ends of one side of the straight rod through a connecting rod, and the two movable rods are respectively located on the outside of the two gears and a number of racks meshing with them are fixed on the side close to the gears; using this device, the fixing effect is good and meets the clamping needs of wafers of different sizes, has a wide range of applications, and meets the diversified needs of enterprises. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic structural diagram of a wafer support device for semiconductor testing provided by the present invention;

[0014] Figure 2 This is a top view of a wafer support device for semiconductor testing provided by the present invention;

[0015] Figure 3 yes Figure 2 Middle AA section view;

[0016] Figure 4 This is a bottom view of a wafer supporting device for semiconductor testing provided by the present invention. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0018] It should be noted that when a component is referred to as being "fixed to" another component, it may be directly on the other component or there may also be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may also be a central component. When a component is considered to be "set on" another component, it may be directly set on the other component or there may also be a central component. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of this invention are intended only to describe specific embodiments and are not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0020] The utility model provides a wafer supporting device for semiconductor testing, the structure of which is as follows Figures 1 to 4 As shown, it includes a support plate 1, a circular notch 2 is opened on the support plate 1, a circular plate 3 is fixed in the circular notch 2 and its side wall has two straight notches 4 arranged in opposite positions, a plurality of clamping rods 5 are evenly distributed on the circular plate 3, a rotating rod 6 is fixed at one end of the plurality of clamping rods 5, a plurality of rotating rods 6 are movably connected to the circular plate 3 and a first transmission wheel 7 is fixed at the bottom end thereof, the center of the bottom end of the circular plate 3 is movably connected to the second transmission wheel 9 through the first rotating shaft 8 and a driving mechanism is provided, and the second transmission wheel 9 is connected to the plurality of first transmission wheels 7 through a conveyor belt 10; two round rods 12 are movably connected to the support plate 1 and a load-bearing Plate 16, one end of the two round rods 12 is respectively located in the two straight slots 4 and fixed with the second rotating shaft 13, and the other end is located at the bottom end of the support plate 1 and fixed with a gear 14, a round tube 28 is fixed on the side of the second rotating shaft 13, and a moving rod 15 is fixed on the side of the round tube 28, and a clamping mechanism is provided at the other end of the moving rod 15; a hydraulic cylinder 17 is installed on the supporting plate 16, and its piston rod is connected to a straight rod 18, and both ends of one side of the straight rod 18 are fixed with movable rods 20 through connecting rods 19. The two movable rods 20 are respectively located on the outside of the two gears 14 and are fixed with a number of racks 21 meshing with them on the side close to the gears 14. The use of the wafer support device for semiconductor testing has a good fixing effect and meets the clamping needs of wafers of different sizes. It has a wide range of applications and meets the diversified needs of enterprises.

[0021] Specifically, the driving mechanism includes a driving motor 22 and a first gear 11. The first gear 11 is fixed to the bottom end of the first rotating shaft 8. The driving motor 22 is fixed to the bottom end of the circular plate 3 and its output end is connected to the second gear 23 that is engaged with the first gear 11. The output end of the driving motor 22 drives the second gear 23 to engage with the first gear 11 so that the second transmission wheel 9 drives several first transmission wheels 7 to rotate through the conveyor belt 10. At this time, several rotating rods 6 drive the clamping rod 5 to rotate to clamp the wafer.

[0022] Specifically, the clamping mechanism includes a sliding rod 24, which is slidably connected to the other end of the moving rod 15 and has a pressure block 25 fixed at its bottom end and a connecting block 26 fixed at the top end. The connecting block 26 is connected to the moving rod 15 through a spring 27 surrounding the side of the sliding rod 24. Under the elastic action of the spring 27, the pressure block 25 presses the wafer.

[0023] Furthermore, the supporting plate 16 is connected to the straight rod 18 via two telescopic rods 29 for supporting the movement of the straight rod 18 .

[0024] Furthermore, rubber pads 31 are fixed on the inner sides of the plurality of clamping rods 5 to protect the wafers from being damaged by excessive clamping force.

[0025] Furthermore, pillars 30 are fixed at the four corners of the bottom end of the support plate 1.

[0026] The working principle of the present utility model is as follows: first, the wafer is placed on the circular plate 3 and located between several clamping rods 5, then the drive motor 22 is started, and its output end drives the second gear 23 to engage with the first gear 11 for transmission so that the second transmission wheel 9 drives several first transmission wheels 7 to rotate through the conveyor belt 10. At this time, several rotating rods 6 all drive the clamping rods 5 to rotate to clamp and fix the wafer, then start the hydraulic cylinder 17, and its piston rod drives the two movable rods 20 to move so that several racks 21 engage with the gear 14 for transmission, and finally the two round rods 12 all drive the second rotating shaft 13, the round tube 28 and the movable rod 15 to rotate so that the pressure block 25 is located above the wafer. At this time, under the elastic action of the spring 27, the pressure block 25 presses the wafer.

[0027] The above description is only a description of the preferred embodiment of the present invention and does not limit the scope of the present invention. Any changes and modifications made by ordinary technicians in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A wafer support device for semiconductor testing, comprising a support plate (1), characterized in that: The support plate (1) is provided with a circular notch (2), a circular plate (3) is fixed in the circular notch (2) and two straight notches (4) are provided on the side wall thereof, and a plurality of clamping rods (5) are evenly distributed on the circular plate (3), a rotating rod (6) is fixed at one end of the plurality of clamping rods (5), a plurality of rotating rods (6) are movably connected to the circular plate (3) and a first transmission wheel (7) is fixed at the bottom end thereof, the center of the bottom end of the circular plate (3) is movably connected to a second transmission wheel (9) through a first rotating shaft (8) and a driving mechanism is provided; the second transmission wheel (9) is connected to a plurality of the first transmission wheels (7) through a conveyor belt (10); Two round rods (12) are movably connected to the support plate (1) and a supporting plate (16) is fixed to the bottom end thereof. One end of the two round rods (12) is respectively located in the two straight notches (4) and fixed with a second rotating shaft (13), and the other end is located at the bottom end of the support plate (1) and fixed with a gear (14). A round tube (28) is fixed to the side of the second rotating shaft (13), and a moving rod (15) is fixed to the side of the round tube (28). The other end of the moving rod (15) is provided with a clamping mechanism; a hydraulic cylinder (17) is installed on the supporting plate (16), and its piston rod is connected to a straight rod (18). Both ends of one side of the straight rod (18) are fixed with a movable rod (20) through a connecting rod (19). The two movable rods (20) are respectively located outside the two gears (14) and a plurality of racks (21) meshing with the gears (14) are fixed on the side of the movable rods (20).

2. The wafer support device for semiconductor testing according to claim 1, wherein: The driving mechanism comprises a driving motor (22) and a first gear (11), wherein the first gear (11) is fixed to the bottom end of the first rotating shaft (8), and the driving motor (22) is fixed to the bottom end of the circular plate (3), and an output end thereof is connected to a second gear (23) meshing with the first gear (11) for transmission.

3. The wafer support device for semiconductor testing according to claim 1, wherein: The clamping mechanism includes a slide rod (24), the slide rod (24) is slidably connected to the other end of the moving rod (15), and a pressure block (25) is fixed at the bottom end thereof, and a connecting block (26) is fixed at the top end thereof, and the connecting block (26) is connected to the moving rod (15) via a spring (27) surrounding the side of the slide rod (24).

4. The wafer support device for semiconductor testing according to claim 1, wherein: The bearing plate (16) and the straight rod (18) are connected via two telescopic rods (29).

5. The wafer support device for semiconductor testing according to claim 1, wherein: A rubber pad (31) is fixed on the inner side of each of the clamping rods (5).

6. The wafer support device for semiconductor testing according to claim 1, wherein: Support pillars (30) are fixed to the four corners at the bottom end of the support plate (1).

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