Laser attenuation device and laser processing equipment
Through the design of rotating half-wave plate and polarization assembly combined with the light absorber, effective attenuation of laser energy is achieved, solving the damage problem of high-energy lasers to the equipment, and ensuring the safety and accuracy of the equipment.
Patent Information
- Application Number
- CN202422464930.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-11
- Publication Date
- 2025-08-05
- Estimated Expiration
- 2034-10-11
AI Technical Summary
In the prior art, high energy laser beams may damage the device or material, resulting in reduced measurement accuracy or damage to the device.
Using a laser attenuation device, the P and S light components of the laser light are different by rotating the half-wave plate, and attenuating them with polarization components and light absorbing members. The absorbing groove absorbs S light to prevent excessive energy.
Effectively reduce laser energy, prevent equipment damage, ensure normal operation of equipment, and improve the safety and accuracy of laser processing.
Smart Images
Figure CN223193220U_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the field of laser processing technology, and more specifically, relates to a laser attenuation device and laser processing equipment. Background Art
[0002] With the continuous development of laser technology, the energy of laser beams is getting higher and higher. However, in some applications, excessive laser energy may damage equipment or materials. For example, sensitive optical components may be damaged by strong lasers, resulting in reduced measurement accuracy and even inability to operate normally. Therefore, the laser beam needs to be attenuated. Utility Model Content
[0003] The embodiments of the present application provide a laser attenuation device and laser processing equipment to attenuate the laser beam to prevent excessive laser energy from damaging the equipment.
[0004] The technical solution adopted in the embodiment of the present application is to provide a laser attenuation device, comprising:
[0005] The half-wave plate is rotatably arranged on the optical path of the incident laser light so that the P light and S light components of the laser light passing through are different;
[0006] A polarization component is provided on the optical path of the incident laser to pass the P light and reflect the S light;
[0007] The light absorbing member comprises a light absorbing surface, on which a plurality of light absorbing grooves are arranged, and the light absorbing grooves are used to absorb S light.
[0008] Optionally, a plurality of convex portions are provided on the light absorbing surface, and the light absorbing groove is formed between two adjacent convex portions.
[0009] Optionally, the surface of the convex portion is provided with a reflective slope.
[0010] Optionally, the angle between the polarization component and the incident laser is 45°, and the light absorbing surface of the light absorbing element is parallel to the incident laser.
[0011] Optionally, the polarization component includes a mounting seat, a bracket, a polarizer and an angle adjustment member, the polarizer is used to pass P light and reflect S light, the polarizer is mounted on the bracket, and the bracket is mounted on the mounting seat through the angle adjustment member.
[0012] Optionally, the angle adjustment member includes a rotating mounting part and a fixing part, the rotating mounting part is connected to the bracket, an arc-shaped waist-shaped hole is provided on the rotating mounting part, and a fixing hole is provided on the mounting seat. The fixing part is passed through the arc-shaped waist-shaped hole of the rotating mounting part and is threadedly connected to the fixing hole of the mounting seat to fix the rotating mounting part on the mounting seat.
[0013] Optionally, the laser attenuation device further includes a rotating assembly, which is transmission-connected to the half-wave plate to rotate the half-wave plate.
[0014] Optionally, the laser attenuation device further includes a positioning component, which is connected to the rotating component and the half-wave plate to determine the initial position of the half-wave plate.
[0015] Optionally, the positioning component includes a sensing plate and a sensor, the sensing plate is connected to the half-wave plate, the sensor is connected to the rotating component, and the sensing plate is inductively connected to the sensor.
[0016] An embodiment of the present application also provides a laser processing device, including the laser attenuation device described above.
[0017] The laser attenuation device and laser processing equipment provided by the embodiments of the present application have the following beneficial effects: the laser attenuation device of the embodiments of the present application rotates the half-wave plate to make the P light and S light components of the passing laser different, and then uses a polarization component to pass the P light and reflect the S light to achieve the effect of attenuating the laser, thereby preventing excessive laser energy from damaging the equipment;
[0018] In addition, the light absorption grooves on the light absorbing component can absorb S light to prevent the S light energy from being too high and affecting the operation of other equipment;
[0019] The laser processing equipment of the embodiment of the present application includes the laser attenuation device in the above embodiment, and therefore has the beneficial effects brought by the laser attenuation device in the above embodiment, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.
[0021] Figure 1 A schematic diagram of the three-dimensional structure of a laser attenuation device provided in an embodiment of the present application;
[0022] Figure 2 A schematic diagram of the explosion structure of the laser attenuation device provided in an embodiment of the present application;
[0023] Figure 3 for Figure 1 A local enlarged schematic diagram at point A.
[0024] Among them, the reference numerals in the figures are:
[0025] 100, polarization assembly; 110, mounting seat; 111, fixing hole; 120, bracket; 130, polarizer; 140, rotating mounting portion; 141, arc-shaped waist hole;
[0026] 200, half-wave plate;
[0027] 300. Light-absorbing part; 310. Light-absorbing groove; 320. Projection;
[0028] 400, rotating assembly;
[0029] 500, positioning component;
[0030] 510, sensor sheet; 520, sensor. DETAILED DESCRIPTION
[0031] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.
[0032] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.
[0033] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.
[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.
[0035] See also Figure 1 and Figure 2The laser attenuation device provided in an embodiment of the present application is now described. The laser attenuation device provided in an embodiment of the present application includes a polarization component 100, a half-wave plate 200, and a light absorbing element 300. The half-wave plate 200 is rotatably disposed in the optical path of the incident laser light so that the P light and S light components of the passing laser light are different. The polarization component 100 is disposed in the optical path of the incident laser light and is used to pass the P light and reflect the S light. The light absorbing element 300 includes a light absorbing surface, on which a plurality of light absorbing grooves 310 are provided, and the light absorbing grooves 310 are used to absorb the S light.
[0036] Among them, P light refers to light with a polarization direction parallel to the incident plane, and S light refers to light with a polarization direction perpendicular to the incident plane.
[0037] The polarization assembly 100 may include a mounting base 110 and a polarizer 130 . The polarizer 130 is mounted on the mounting base 110 at a fixed angle.
[0038] The laser attenuation device of the embodiment of the present application rotates the half-wave plate 200 to make the P light and S light components of the passing laser different, and then passes the P light and reflects the S light through the polarization component 100 to achieve the effect of attenuating the laser and prevent the laser energy from being too high to damage the equipment.
[0039] Although the energy of S-light is lower than that of the original laser light, if it is emitted to other external devices, it will still cause the temperature of other devices to rise, causing damage to other devices and affecting their normal operation. The light absorption groove 310 on the light absorption member 300 can absorb the S-light and consume the energy of the S-light.
[0040] In the embodiment of the present application, the light absorbing member 300 may be block-shaped, and the light absorbing groove 310 may be a groove recessed within the light absorbing member 300, or may have an arc-shaped bottom. After the filtered light enters the light absorbing groove 310, it is reflected multiple times by the bottom and walls of the groove 310, thereby dissipating the light energy and allowing the light to be absorbed.
[0041] See also Figure 3 A plurality of convex portions 320 are provided on the light absorbing surface, and a light absorbing groove 310 is formed between two adjacent convex portions 320 .
[0042] The light absorbing member 300 can be plate-shaped, and the protrusion 320 can be a conical protrusion, an arc-shaped protrusion, or another irregularly shaped protrusion. A light absorbing groove 310 is formed between two adjacent protrusions. The S light is reflected multiple times on the opposing surfaces of the two adjacent protrusions, thereby dissipating energy.
[0043] The protrusion 320 may be connected to the light absorbing element 300 by gluing or welding.
[0044] Compared with directly digging a groove on the light absorbing member 300 , providing the protrusion 320 on the light absorbing member 300 to form the light absorbing groove 310 is easier to process.
[0045] The surface of the convex portion 320 is provided with a reflective slope.
[0046] The convex portion 320 can be a triangular pyramid, a quadrangular pyramid or other pyramids. After the S light is irradiated on the reflective inclined surface of the convex portion 320, it will be reflected to the reflective inclined surface of the adjacent convex portion 320, and then undergo multiple reflections to achieve the purpose of consuming light energy.
[0047] The angle between the polarization component 100 and the incident laser is 45°, and the light absorbing surface of the light absorbing element 300 is parallel to the incident laser.
[0048] The angle of 45° between the polarization component 100 and the incident laser is to achieve the best polarization selection effect. When the laser beam is incident on the polarization component 100 at a 45-degree angle, its polarization components are evenly distributed in two perpendicular directions of the transmission axis, thereby achieving smooth attenuation of the laser power.
[0049] The light absorption surface is parallel to the incident laser light so as to absorb the S light reflected by the polarization component 100 .
[0050] Preferably, the polarization component 100 includes a mounting base 110, a bracket 120, a polarizer 130 and an angle adjustment member. The polarizer 130 is used to pass P light and reflect S light. The polarizer 130 is installed on the bracket 120, and the bracket 120 is installed on the mounting base 110 through the angle adjustment member.
[0051] Since the angle of the polarizer 130 of the polarization assembly 100 is fixed, if the polarizer 130 is installed, the angle of the polarizer 130 may not meet the requirements due to component errors. The angle adjustment member can adjust the angle of the polarizer 130 so that the angle of the polarizer 130 meets the requirements. The angle adjustment member can be a rotating motor.
[0052] Preferably, the angle adjustment member includes a rotating mounting portion 140 and a fixing portion, the rotating mounting portion 140 is connected to the bracket 120, an arc-shaped waist-shaped hole 141 is provided on the rotating mounting portion 140, and a fixing hole 111 is provided on the mounting seat 110, the fixing portion is passed through the arc-shaped waist-shaped hole 141 of the rotating mounting portion 140, and is threadedly connected to the fixing hole 111 of the mounting seat 110 to fix the rotating mounting portion 140 on the mounting seat 110.
[0053] The fixing portion can be a bolt or a screw. The head of the fixing portion can abut against the edge of the arc-shaped waist-shaped hole 141 on the rotating mounting portion 140.
[0054] When the angle of the polarizer 130 does not meet the requirements, loosen the fixing part so that the rotating mounting part 140 can rotate, then rotate the bracket 120 on the rotating mounting part 140 to adjust the angle of the polarizer 130 so that the angle of the polarizer 130 meets the requirements, and finally tighten the fixing part so that the head of the fixing part presses against the edge of the arc-shaped waist hole 141 of the rotating mounting part 140 to prevent the rotating mounting part 140 from rotating.
[0055] The laser attenuation device further includes a rotating assembly 400 , which is transmission-connected to the half-wave plate 200 to rotate the half-wave plate 200 .
[0056] The rotating assembly 400 may be a rotating motor or a rotating cylinder, preferably a centrally controlled rotating motor.
[0057] By continuously rotating the half-wave plate 200 through the rotating assembly 400, the laser light can be continuously attenuated, thereby improving working efficiency.
[0058] The half-wave plate 200 can be fixed to the fixing ring by pins, and the fixing ring is transmission-connected to the rotating assembly 400 via the fixing adapter plate, thereby realizing transmission connection between the half-wave plate 200 and the rotating assembly 400 .
[0059] The laser attenuation device further includes a positioning assembly 500 , which is connected to the rotating assembly 400 and the half-wave plate 200 to determine the initial position of the half-wave plate 200 .
[0060] Determining the initial position of the half-wave plate 200 by the positioning component 500 is helpful for determining the rotation angle and direction of the half-wave plate 200 and facilitating precise adjustment of the rotation angle of the half-wave plate 200. The positioning component 500 may be a positioning pin.
[0061] The positioning assembly 500 includes a sensing plate 510 and a sensor 520 . The sensing plate 510 is connected to the half-wave plate 200 , and the sensor 520 is connected to the rotating assembly 400 . The sensing plate 510 and the sensor 520 are inductively connected.
[0062] The sensor 520 may be a photoelectric sensor 520. The sensor 520 can accurately obtain the initial position of the half-wave plate 200, and the position is consistent with good repeatability.
[0063] An embodiment of the present application also provides a laser processing device, including the above-mentioned laser attenuation device.
[0064] Since the laser processing equipment of the embodiment of the present application includes the laser attenuation device in any of the above embodiments, it has the beneficial effects brought by the laser attenuation device in any of the above embodiments, which will not be repeated here.
[0065] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.
Claims
1. A laser attenuation device, characterized in that: include: The half-wave plate is rotatably arranged on the optical path of the incident laser light so that the P light and S light components of the laser light passing through are different; A polarization component is provided on the optical path of the incident laser to pass the P light and reflect the S light; The light absorbing member comprises a light absorbing surface, on which a plurality of light absorbing grooves are arranged, and the light absorbing grooves are used to absorb S light.
2. The laser attenuation device according to claim 1, characterized in that: A plurality of convex portions are provided on the light absorbing surface, and the light absorbing groove is formed between two adjacent convex portions.
3. The laser attenuation device according to claim 2, characterized in that: A reflective slope is provided on the surface of the convex portion.
4. The laser attenuation device according to claim 1, wherein: The angle between the polarization component and the incident laser is 45 degrees, and the light absorbing surface of the light absorbing element is parallel to the incident laser.
5. The laser attenuation device according to claim 1, characterized in that: The polarization component includes a mounting seat, a bracket, a polarizer and an angle adjustment member. The polarizer is used to pass P light and reflect S light. The polarizer is mounted on the bracket, and the bracket is mounted on the mounting seat through the angle adjustment member.
6. The laser attenuation device according to claim 5, characterized in that: The angle adjustment member includes a rotating mounting portion and a fixing portion, the rotating mounting portion is connected to the bracket, an arc-shaped waist-shaped hole is provided on the rotating mounting portion, and a fixing hole is provided on the mounting seat. The fixing portion is passed through the arc-shaped waist-shaped hole of the rotating mounting portion and is threadedly connected to the fixing hole of the mounting seat to fix the rotating mounting portion on the mounting seat.
7. The laser attenuation device according to any one of claims 1 to 6, characterized in that: It also includes a rotating component, which is in driving connection with the half-wave plate to rotate the half-wave plate.
8. The laser attenuation device according to claim 7, characterized in that: It also includes a positioning component, which is connected to the rotating component and the half-wave plate to determine the initial position of the half-wave plate.
9. The laser attenuation device according to claim 8, characterized in that: The positioning component includes an induction plate and a sensor. The induction plate is connected to the half-wave plate. The sensor is connected to the rotating component. The induction plate is inductively connected to the sensor.
10. A laser processing device, characterized in that: The laser attenuation device comprises the laser attenuation device according to any one of claims 1 to 9.