Automatic chip mixing structure

Abstract

The utility model discloses an automatic chip mixing structure, which relates to the technical field of laser transfer, and comprises a driving part, a driving part, a driving part and a driving part, the carrier is provided with at least three mounting positions, the plurality of mounting positions are used for placing various chips, the chips in one mounting position are the same, and the driving part is in driving connection with the carrier; and the driving part drives the carrier to rotate, so that the plurality of mounting positions pass through the laser processing position one by one in a circulating manner. According to the technical scheme, the problem that an existing mixed splicing structure is poor in using effect can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of laser transfer, in particular to an automatic chip mixing structure. Background Art

[0002] During the mass transfer of LEDs, errors in the incoming LED chips necessitate mixing and rearranging before use. Without mixing, the resulting LED display screen will exhibit color smearing, screen distortion, or inconsistent brightness, reducing the user experience. Existing mixing structures combine multiple chips and then transfer them to the PCB using a laser. However, mixing the chips before transferring them can lead to a high concentration of identical chips, resulting in poor mixing and poor results. This can cause the same chip to be transferred repeatedly during the transfer process. Utility Model Content

[0003] The main purpose of the utility model is to propose an automatic chip mixing structure, aiming to solve the problem that the existing mixing structure has poor use effect.

[0004] To achieve the above objectives, the chip automatic mixing structure proposed in the present invention includes:

[0005] a drive member; and

[0006] The carrier has at least three mounting positions, wherein a plurality of the mounting positions are used to accommodate a plurality of chips, the chips in one of the mounting positions being identical, and the driving member is drivingly connected to the carrier;

[0007] The driving component drives the carrier to rotate so that the plurality of installation positions pass through the laser processing position one by one and cyclically.

[0008] In one embodiment, the plurality of mounting locations are evenly distributed along the rotational circumference of the carrier.

[0009] In one embodiment, the carrier is provided with a plurality of stepped holes, the plurality of stepped holes are evenly distributed along the rotation circumference of the carrier, and the mounting position is provided in the stepped holes.

[0010] In one embodiment, the carrier includes a base plate and a plurality of mounting plates extending outward from the base plate, the driving member is connected to the base plate, the plurality of mounting plates are evenly distributed along the rotating circumference of the carrier, the mounting position is provided on the mounting plate, and the stepped hole is opened on the mounting plate.

[0011] In one embodiment, the base plate and the plurality of mounting plates are integrally formed.

[0012] In one embodiment, the base plate and the plurality of mounting plates are detachably connected; a plurality of slots are provided on the outer side of the base plate, and the mounting plates are provided with inserts corresponding to the slots, and the inserts are plugged into the slots.

[0013] In one embodiment, the driving member is configured as a DD motor.

[0014] In one embodiment, the rotation trajectory of the carrier is arranged parallel to the ground plane.

[0015] In one embodiment, the driving component is disposed above the carrier.

[0016] In one embodiment, the number of the mounting positions is three, four, or six.

[0017] The technical solution of the present invention drives the carrier to rotate through a driving member so that multiple mounting positions on the carrier pass through the laser processing position one by one and cyclically. Since the multiple mounting positions on the carrier are used to place different chips, and the chips in one mounting position are the same; at this time, when transferring the chip, the driving member rotates the carrier to rotate the first mounting position to the laser processing position, and then the laser generator transfers the chip in the first mounting position to the PCB board on the fixture, and then the driving member continues to rotate to rotate the second mounting position to the laser processing position, and then the laser generator transfers the chip in the second mounting position to the PCB board on the fixture. At this time, the driving member continues to rotate to rotate the third mounting position to the laser processing position, and then the laser generator transfers the chip in the third mounting position to the PCB board on the fixture. Such a cycle can avoid the situation where the same chip is continuously transferred during the chip transfer process, thereby solving the problem of poor use effect of the existing mixed structure in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0019] Figure 1 This is a structural diagram of an embodiment of the chip automatic mixing structure provided by the present invention;

[0020] Figure 2 for Figure 1 Schematic diagram of the structure of the driving parts and the carrier;

[0021] Figure 3 for Figure 2 Top view of the middle drive and carrier;

[0022] Figure 4 This is a structural diagram of an embodiment of the chip automatic mixing structure provided by the present invention in which four mounting plates are configured;

[0023] Figure 5 This is a structural schematic diagram of an embodiment of the chip automatic mixing structure provided by the present invention in which six mounting plates are configured.

[0024] Description of Figure Numbers:

[0025] 100. Driving parts;

[0026] 200, carrier; 210, mounting position; 220, stepped hole; 230, base plate; 240, mounting plate;

[0027] 300. Laser generator;

[0028] 400. Fixture;

[0029] 500, laser processing position;

[0030] 600. Wafer.

[0031] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0033] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0034] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0035] During the mass transfer of LEDs, errors occur in the incoming LED chips, requiring mixing and rearrangement before use. Without mixing, the resulting LED display screen will exhibit color smearing, screen distortion, or inconsistent brightness, reducing the user experience. The existing mixing structure mixes multiple chips together and then transfers them to the PCB via laser. During the transfer process, the laser transfers the mixed chips one by one, requiring one chip to be different from the adjacent two. However, mixing the chips before transferring them results in a high concentration of identical chips mixed together, resulting in poor mixing and poor results, causing the same chips to be transferred continuously during the transfer process.

[0036] In this application, the chip automatic mixing structure can be used to mix chips of different wavelengths to solve the problem caused by LED fluctuation errors, and can also be used to mix chips of different colors and other multiple color chips.

[0037] The present invention proposes an automatic chip mixing structure to solve the problem of poor performance of existing mixing structures. The automatic LED chip mixing structure is applied to LED chip mass transfer equipment, wherein the automatic LED chip mixing structure of this application can be applied to Mini LED chip mass transfer equipment, wherein the Mini LED chip mass transfer equipment is only one usage scenario of this application. In other usage scenarios, it can also be applied to other chip transfer equipment, such as the transfer of MicroLED chips, or other scenarios that require chip mixing.

[0038] The LED chip mass transfer device is provided with a laser generator 300 and a fixture 400 for placing the LED substrate (PCB board), and a laser processing position 500 is provided between the fixture 400 and the laser generator 300.

[0039] See also Figure 1 、 Figure 2 In one embodiment of the present invention, the automatic chip mixing structure includes a driver 100 and a carrier 200. The carrier 200 has at least three mounting positions 210, each of which is used to accommodate a variety of chips. The chips in each mounting position 210 are identical. Specifically, identical chips refer to identical chip models, that is, chips of the same type are placed in the mounting positions 210 via a wafer 600 carrier. The driver 100 drives the carrier 200 to rotate, causing the plurality of mounting positions 210 to pass through the laser processing position 500 one by one. The rack for mounting the driver 100 is not shown in this application.

[0040] Specifically, the driving member 100 drives the carrier 200 to rotate so that the multiple mounting positions 210 on the carrier 200 pass through the laser processing position 500 one by one and cyclically. Since the multiple mounting positions 210 on the carrier 200 are used to place different chips, and the multiple chips in the same mounting position 210 are the same; at this time, when transferring the chips, the driving member 100 rotates the carrier 200 to rotate the first mounting position 210 to the laser processing position 500, and then the laser generator 300 transfers the chip in the first mounting position 210 to the PCB board on the fixture 400, and then the driving member 100 continues to rotate. The second mounting position 210 is rotated to the laser processing position 500, and then the laser generator 300 transfers the chip in the second mounting position 210 to the PCB board on the fixture 400. At this time, the driving member 100 continues to rotate, and rotates the third mounting position 210 to the laser processing position 500, and then the laser generator 300 transfers the chip in the third mounting position 210 to the PCB board on the fixture 400. This cycle can avoid the situation where the same chip is continuously transferred during the chip transfer process, thereby solving the technical problems existing in the prior art and improving the use effect of the mixed structure. At the same time, when the same chip is continuously transferred to the PCB board, the chip continuously transferred to the PCB board needs to be removed, which wastes time in the removal process. The mixed structure of the present application can avoid the situation where the same chip is continuously transferred during the chip transfer process, and thus can avoid the problem of chip removal caused by the continuous transfer of the same chip, and can effectively improve the time for mass transfer of LED chips and improve processing efficiency.

[0041] At the same time, in this embodiment, since the chips on the wafer 600 are of the same type, the processing difficulty between the chips and the wafer 600 can be reduced.

[0042] In one embodiment, reference Figure 2 、 Figure 3The plurality of mounting positions 210 are evenly distributed along the rotation circumference of the carrier 200. That is, when the driving member 100 drives the carrier 200 to rotate multiple times so that the plurality of mounting positions 210 are located at the laser processing position 500, the angle of rotation of the carrier 200 is the same, thereby enabling the plurality of mounting positions 210 to take the same amount of time to enter the laser processing position 500. This facilitates the laser generator 300 to transfer the chip.

[0043] In one embodiment, reference Figure 2 、 Figure 3 The carrier 200 is provided with a plurality of stepped holes 220, which are evenly distributed along the rotational circumference of the carrier 200. The mounting position 210 is disposed within the stepped holes 220. Specifically, when a chip is placed in the mounting position 210, the chip and its carrier are placed into the stepped holes 220. When the carrier 200 rotates, the stepped holes 220 are driven to rotate, thereby driving the chip located in the stepped holes 220 and its carrier wafer 600 to rotate. In this embodiment, the carrier 200 can be configured as a disc structure.

[0044] In one embodiment, reference Figure 2 、 Figure 3 The carrier 200 can adopt the following structure, the carrier 200 includes a base plate 230 and a plurality of mounting plates 240 extending outward from the base plate 230, the driving member 100 is drivingly connected to the base plate 230, and the plurality of mounting plates 240 are evenly distributed along the rotation circumference of the carrier 200, the mounting position 210 is provided on the mounting plate 240, and the stepped hole 220 is opened on the mounting plate 240. Specifically, when the driving member 100 drives the base plate 230 to rotate, the base plate 230 can drive the mounting plate 240 to rotate, thereby causing the stepped hole 220 provided on the mounting plate 240 to rotate.

[0045] In one embodiment, reference Figure 2 、 Figure 3 The base plate 230 and the plurality of mounting plates 240 are integrally formed, so that the stability of the carrier 200 can be improved. That is, when the base plate 230 rotates, it can drive the mounting plates 240 to rotate synchronously, avoiding position errors caused by the mounting plates 240 not rotating to the angle after the base plate 230 rotates.

[0046] In one embodiment, the base plate 230 and the plurality of mounting plates 240 are detachably connected; a plurality of slots are provided on the outer side of the base plate 230, and the mounting plates 240 are provided with plug-in blocks corresponding to the slots, and the plug-in blocks are plugged into the slots; further, in this embodiment, a plurality of slots can be provided on the base plate 230. When a plurality of slots are provided on the base plate 230, the carrier 200 of the present application can select an appropriate number of mounting plates 240 according to the use requirements. For example, when three mounting positions 210 are required, three mounting plates 240 are selected to be connected to the base plate 230. When six mounting positions 210 are required, six mounting plates 240 are selected to be connected to the base plate 230. Specifically, when the base plate 230 and the mounting plate 240 are detachably connected, in order to improve the connection stability between the two, the base plate 230 and the mounting plate 240 can be directly plugged in and fixed together by screw locking.

[0047] In one embodiment, reference Figure 2 、 Figure 3 The driving component 100 is configured as a DD motor (Direct Drive Motor). Furthermore, the present application adopts a DD motor as the driving component 100, which enables the present application to have the advantages of higher precision, higher response speed, and greater torque output.

[0048] In one embodiment, reference Figure 1 The rotation trajectory of the carrier 200 is arranged parallel to the ground plane. That is, when the driving member 100 drives the carrier 200 to rotate, the carrier 200 is in a horizontal rotation state. However, the present design is not limited to this. In other embodiments, the rotation trajectory of the carrier 200 can also be arranged perpendicular to the ground plane. Specifically, the plane surrounded by the rotation trajectory of the carrier 200 is arranged perpendicular to the ground plane.

[0049] In one embodiment, reference Figure 1 The driving member 100 is disposed above the carrier 200 , so that more space can be provided below the carrier 200 for convenient use of other structures.

[0050] In one embodiment, reference Figure 3 、 Figure 4 、 Figure 5 The mounting positions 210 are configured as three, four, or six. In this application, three, four, or six mounting positions 210 can be used according to usage requirements, and the chips in each mounting position 210 are different.

[0051] Of course, in other embodiments, when there are six mounting positions 210, three types of chips can also be set in the six mounting positions 210, and two groups of three types of chips are provided, which are interspersed and placed in the mounting positions 210, so that the carrier 200 rotates one circle, and the chips on the carrier 200 enter the laser processing position 500 in the order of the first chip, the second chip, the third chip, the first chip, the second chip, and the third chip.

[0052] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A chip automatic mixing structure, characterized in that: The chip automatic mixing structure includes: a drive member; and The carrier has at least three mounting positions, wherein a plurality of the mounting positions are used to accommodate a plurality of chips, the chips in one of the mounting positions being identical, and the driving member is drivingly connected to the carrier; The driving component drives the carrier to rotate so that the plurality of installation positions pass through the laser processing position one by one and cyclically.

2. The chip automatic mixing structure according to claim 1, characterized in that: The plurality of installation positions are evenly distributed along the rotation circumference of the carrier.

3. The chip automatic mixing structure according to claim 2, characterized in that: The carrier is provided with a plurality of stepped holes, which are evenly distributed along the rotation circumference of the carrier, and the mounting positions are provided in the stepped holes.

4. The chip automatic mixing structure according to claim 3, characterized in that: The carrier includes a base plate and a plurality of mounting plates extending outward from the base plate. The driving member is drivingly connected to the base plate. The plurality of mounting plates are evenly distributed along the rotating circumference of the carrier. The mounting position is provided on the mounting plate, and the stepped hole is opened on the mounting plate.

5. The chip automatic mixing structure according to claim 4, characterized in that: The base plate and the plurality of mounting plates are integrally formed.

6. The chip automatic mixing structure according to claim 4, characterized in that: The base plate and the plurality of mounting plates are detachably connected; a plurality of slots are provided on the outer side of the base plate, and the mounting plates are provided with inserting blocks corresponding to the slots, and the inserting blocks are plugged into the slots.

7. The chip automatic mixing structure according to any one of claims 1 to 6, characterized in that: The driving member is configured as a DD motor.

8. The chip automatic mixing structure according to any one of claims 1 to 6, characterized in that: The rotation track of the carrier is arranged parallel to the ground plane.

9. The chip automatic mixing structure according to any one of claims 1 to 6, characterized in that: The driving component is arranged above the carrier.

10. The chip automatic mixing structure according to any one of claims 1 to 6, characterized in that: The number of the mounting positions is three, four, or six.

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