Evaporation mechanism

Abstract

The utility model discloses an evaporation mechanism which comprises an evaporation main body and a second evaporation container, the evaporation main body comprises a heating body and a first evaporation container, an evaporation tank is arranged in the heating body, and the first evaporation container is arranged in the evaporation tank; the second evaporation container is installed on the evaporation body and located on one side of the first evaporation container. The utility model solves the problems that the energy consumption generated by an evaporation source is higher and the coating cost is higher due to a separated evaporation mode of materials with different melting points.

Description

Technical Field

[0001] The present application relates to the field of thin film processing technology, and in particular to an evaporation mechanism. Background Art

[0002] Conductive film is a polymer material with a metal plated on its surface. It is widely used in lithium-ion batteries and is mainly used as a current collector in lithium-ion batteries. The coating on the conductive film can be obtained by thermal evaporation and / or magnetron sputtering. The thermal evaporation process is sensitive to the melting point of the material to be plated. For materials with a higher melting point, the evaporation source needs to provide a higher thermal evaporation temperature to the material to be plated. For materials with a lower melting point, the evaporation source can provide a lower thermal evaporation temperature to the material to be plated to achieve thermal evaporation of the corresponding material to be plated. In the coating structure of some conductive films, the melting points of different coating structures or different materials in the same coating have certain differences. For example, the melting point of the copper layer is higher than the melting point of other functional film layers plated on the copper layer. When a conductive film has a coating structure formed by evaporating materials with different melting points, due to the limitations of the current evaporation source structure, the materials with different melting points need to be heated and evaporated separately using corresponding heating sources (that is, the heating measures for the materials with different melting points are the same, and they are all directly heated by the heating electrodes). This method of separate evaporation of materials with different melting points results in high energy consumption generated by the evaporation source and high coating costs. Utility Model Content

[0003] The main purpose of the present application is to provide an evaporation mechanism to solve the problem mentioned in the background art that the separate evaporation of materials with different melting points results in high energy consumption of the evaporation source and high coating cost.

[0004] According to one aspect of the present application, there is provided an evaporation mechanism, comprising:

[0005] An evaporation body, the evaporation body comprising a heating element and a first evaporation container, the heating element being provided with an evaporation tank, the first evaporation container being provided in the evaporation tank;

[0006] A second evaporation container is installed on the evaporation main body and is located on one side of the first evaporation container.

[0007] Furthermore, it also includes:

[0008] A temperature adjustment component is installed between the evaporation body and the second evaporation container, and is used to adjust the distance between the second evaporation container and the evaporation body and / or to separate the second evaporation container at least partially from the evaporation body.

[0009] Furthermore, the evaporation body further includes a heat preservation component, a first accommodation space is provided through the heat preservation component, the heating element is installed in the first accommodation space, and the temperature adjustment component includes:

[0010] A heat insulation component is provided on the surface of the heat preservation component and is offset from the heat preservation component. The second evaporation container is provided on the heat insulation component.

[0011] Furthermore, the thermal insulation component includes:

[0012] A first thermal insulation gasket is laid on the surface of the thermal insulation component, and the second evaporation container is arranged on the surface of the first thermal insulation gasket away from the thermal insulation component.

[0013] Furthermore, the thermal insulation component further comprises:

[0014] A third evaporation container is provided on the surface of the heat preservation component, and the second evaporation container is placed in the third evaporation container.

[0015] Furthermore, the thermal insulation component further comprises:

[0016] A second thermal insulation gasket, at least one of which is laid between the heat preservation assembly and the third evaporation container, and / or at least one of which is laid between the bottom of the third evaporation container and the second evaporation container.

[0017] Furthermore, the evaporation body further includes a heat preservation component, a first accommodation space is provided in the heat preservation component, the heating element is installed in the first accommodation space, and the temperature adjustment component further includes:

[0018] driving parts;

[0019] A moving component is installed on one side of the evaporation body and is connected to the driving component and the second evaporation container respectively. The driving component drives the moving component to drive the second evaporation container to move back and forth in a direction close to or away from the evaporation body.

[0020] Furthermore, the moving part includes:

[0021] A support base, the support base being installed at the bottom of the evaporation body;

[0022] A rotating shaft, the rotating shaft being mounted on the supporting base and connected to the driving member, the driving member driving the rotating shaft to rotate around its own axis;

[0023] Gears, the gears comprising at least two, the at least two gears being mounted on opposite ends of the rotating shaft respectively;

[0024] Racks, including at least two racks, the at least two racks being disposed through the support base and movable relative to the support base along their own length direction, the at least two racks being meshed with the at least two gears in a one-to-one correspondence;

[0025] A first connecting member is installed at an end of the rack away from the gear and connected to the second evaporation container.

[0026] Furthermore, the moving component further includes:

[0027] A mounting frame, the mounting frame being mounted on one side of the evaporation body;

[0028] A bidirectional screw rod is mounted on the mounting frame and connected to the driving member, and the driving member drives the bidirectional screw rod to rotate around its own axis;

[0029] Moving blocks, the moving blocks comprising at least two blocks, the at least two moving blocks being screwed onto the bidirectional screw and being capable of reciprocating in directions approaching or moving away from each other under the drive of the bidirectional screw;

[0030] Connecting rods, including at least two connecting rods, wherein the at least two connecting rods are rotatably connected to the at least two moving blocks in a one-to-one correspondence;

[0031] A second connecting member, one end of at least two connecting rods away from the moving block is rotatably connected to the second connecting member respectively, and the second evaporation container is connected to the second connecting member.

[0032] Furthermore, it also includes:

[0033] A protective shell is provided with a fourth accommodating tank in the protective shell, and the evaporating body is located in the fourth accommodating tank, wherein a cooling flow channel is provided in the side wall of the protective shell close to the temperature adjustment component.

[0034] The evaporation mechanism provided by the present application includes an evaporation body and a second evaporation container. The heating body of the evaporation body is provided with an evaporation tank. The first evaporation container is provided in the evaporation tank so that the heating body can heat the target material with a higher melting point placed in the first evaporation container. The second evaporation container is installed on the evaporation body and is located on one side of the first evaporation container. Thus, in the process of the heating body heating the first evaporation container, the residual heat (or dissipated heat) generated by the evaporation body can be used to heat the target material with a lower melting point in the second evaporation container. In other words, the present application does not need to add a heating body to heat the second evaporation container. It only needs to install the second evaporation container on the evaporation body to use the heat generated by the evaporation body to heat the second evaporation container, so as to achieve the heating and evaporation of the target material with a lower melting point, thereby reducing the energy consumption and coating cost generated by the evaporation mechanism. Moreover, since the evaporation mechanism can be used to sequentially plate at least two metal layers with different melting points on the surface of the substrate layer, the coating efficiency of the evaporation mechanism is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0036] Figure 1 A schematic structural diagram of an evaporation mechanism provided in one embodiment of the present utility model;

[0037] Figure 2 A schematic diagram of the structure of the temperature adjustment component of the evaporation mechanism including a driving part and a moving part;

[0038] Figure 3 for Figure 2 Schematic diagram of the structure from another angle;

[0039] Figure 4 Schematic diagram of another structure of the evaporation mechanism;

[0040] Figure 5 It is a structural diagram of the evaporation mechanism when the moving parts include a bidirectional screw rod;

[0041] Figure 6 It is a structural schematic diagram of the evaporation mechanism including the electric cylinder.

[0042] The above drawings include the following reference numerals:

[0043] 10. Evaporation body; 11. Heating element; 111. Evaporation tank; 12. First evaporation container; 13. Insulation assembly; 131. Heat-conducting and heat-insulating body; 311. First accommodating space; 312. Second accommodating tank; 132. Insulation foam; 20. Second evaporation container; 30. Temperature adjustment assembly; 31. Third evaporation container; 32. Second thermal insulation gasket; 33. Driving element; 34. Moving element; 41. Support seat; 42. Rotating shaft; 43. Gear; 44. Rack; 45. First connecting element Parts; 451, first connecting block; 452, second connecting block; 46, mounting bracket; 47, bidirectional screw rod; 48, first moving block; 49, second moving block; 410, connecting rod; 411, second connecting part; 4111, third connecting block; 4112, avoidance groove; 4113, fourth connecting block; 412, electric cylinder; 413, guide rod; 35, temperature control part; 36, heat conducting part; 361, third accommodating groove; 362, avoidance port; 40, protective shell; 401, fourth accommodating groove. DETAILED DESCRIPTION

[0044] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0045] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0046] Unless otherwise specifically stated, the relative arrangement of the parts and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to actual proportional relationships. The techniques, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered as part of the authorization specification. In all examples shown and discussed here, any specific values should be interpreted as being merely exemplary, not as limitations. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, and therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0047] Since the existing evaporation source heats and evaporates target materials with different melting points to deposit metal film layers with different melting points on the conductive film, the energy consumption is large and the coating cost is high. In order to solve the above problems, the first embodiment of the present invention provides an evaporation mechanism, see Figures 1 to 6 The evaporation mechanism includes an evaporation body 10 and a second evaporation container 20. The evaporation body 10 includes a heating element 11 and a first evaporation container 12. The heating element 11 is provided with an evaporation tank 111, and the first evaporation container 12 is provided within the evaporation tank 111. The second evaporation container 20 is mounted on the evaporation body 10 and is located on one side of the first evaporation container 12, so that the evaporation mechanism can utilize the heat generated by the evaporation body 10 to heat the second evaporation container 20. In this embodiment, the heat generated by the evaporation body 10 (i.e., the waste heat or dissipated heat generated by the evaporation body 10) includes not only the heat generated by the heating element 11 heating the first evaporation container 12, but also the heat generated by the first evaporation container 12 being heated and the heat generated by the metal particles evaporated from the first evaporation container 12.

[0048] As a result, the evaporation mechanism eliminates the need for an additional heating element 11 to heat the second evaporation vessel 20, saving energy consumed by the evaporation mechanism. In this embodiment, the heating element 11 is an electrode, which heats the metal target in the first evaporation vessel 12 to achieve thermal evaporation of the metal target. Both the first evaporation vessel 12 and the second evaporation vessel 20 can comprise graphite crucibles or high-temperature resistant metal crucibles. Specifically, the metal crucibles can include tungsten crucibles, molybdenum crucibles, tantalum crucibles, zirconium crucibles, and alloy crucibles of any two or more elements.

[0049] In some embodiments of the present invention, after a copper layer is deposited on the conductive film substrate layer, a functional film layer with a lower melting point than the copper layer is deposited on the surface of the copper layer. For example, if the functional film layer includes an isolation layer having a lower melting point than the copper layer, which is used to prevent the copper layers on opposite sides of the conductive film from adhering to each other, the copper target for evaporating the copper layer can be placed in the first evaporation vessel 12, and the isolation target (such as at least one of a zinc target and a tin target) for evaporating the isolation layer can be placed in the second evaporation vessel 20. To achieve effective copper deposition, the heating element 11 must heat the copper target in the first evaporation vessel 12 at a temperature of at least 1100°C or above. Thus, by utilizing the residual heat generated by the heating element 11 heating and evaporating the copper target in the first evaporation vessel 12, the isolation target in the second evaporation vessel 20 can be heated and evaporated, ensuring that the isolation target is fully heated and evaporated, thereby reducing energy consumption of the evaporation mechanism. For example, when the isolation target is a zinc target, since zinc has a lower melting point than copper (419.5°C), the temperature generated by the second evaporation vessel 20 in an environment of 1100°C or above is sufficient to fully heat and evaporate the zinc target. When the isolation target is a tin target, since tin has a lower melting point than copper (approximately 232°C), the residual heat generated by the heating element 11 can be used to heat and evaporate the tin target in the second evaporation vessel 20, thereby depositing a tin layer on the surface of the copper layer, thereby reducing the energy consumption of the coating equipment.

[0050] As can be seen, the evaporation mechanism provided in this embodiment includes an evaporation body 10 and a second evaporation container 20. The heating element 11 of the evaporation body 10 is provided with an evaporation tank 111. The first evaporation container 12 is disposed within the evaporation tank 111, enabling the heating element 11 to heat the target material with a higher melting point placed in the first evaporation container 12. The second evaporation container 20 is mounted on the evaporation body 10 and located to one side of the first evaporation container 12. Thus, while the heating element 11 heats the first evaporation container 12, the residual heat (or dissipated heat) generated by the evaporation body 10 can be used to heat the target material with a lower melting point in the second evaporation container 20. In other words, this embodiment eliminates the need for a heating element 11 to heat the second evaporation container 20. Simply mounting the second evaporation container 20 on the evaporation body 10 allows the heat generated by the evaporation body 10 to heat the second evaporation container 20, thereby achieving heating and evaporation of the target material with a lower melting point. This reduces the energy consumption of the evaporation mechanism and reduces the coating cost. Moreover, since the evaporation mechanism can be used to sequentially deposit at least two metal layers with different melting points on the surface of the substrate layer, the coating efficiency of the evaporation mechanism is improved.

[0051] Because the second evaporation vessel 20 can accommodate different low-melting-point metal targets, some require higher heating temperatures, while others require relatively lower temperatures, depending on their melting points. To adjust the temperature generated in the second evaporation vessel 20 based on the different metal targets, the evaporation mechanism in this embodiment also includes a temperature adjustment assembly 30. The temperature adjustment assembly 30 is installed between the evaporation body 10 and the second evaporation vessel 20. The temperature adjustment assembly 30 is used to adjust the distance between the second evaporation vessel 20 and the evaporation body 10 and / or to at least partially separate the second evaporation vessel 20 from the evaporation body 10.

[0052] When the temperature required for the second evaporation container 20 is high, the temperature adjustment assembly 30 can be used to adjust the distance between the second evaporation container 20 and the evaporation body 10, or even to place the second evaporation container 20 in direct contact with the heating element 11. Furthermore, the temperature adjustment assembly 30 can be used to increase the area of the second evaporation container 20 exposed to the heat radiation from the evaporation body 10, thereby increasing the amount of heat radiation received by the second evaporation container 20 from the evaporation body 10 and thereby increasing the heating temperature generated by the second evaporation container 20. When the temperature required for the second evaporation container 20 is low, the temperature adjustment assembly 30 can be used to increase the distance between the second evaporation container 20 and the evaporation body 10, or even to at least partially isolate the second evaporation container 20 from the evaporation body 10, thereby reducing the amount of heat radiation received by the second evaporation container 20 from the evaporation body 10 and thereby lowering the heating temperature generated by the second evaporation container 20. Actual temperature adjustment primarily involves two aspects: the insulation between the heat-insulating assembly 13 and the second evaporation container 20, and the distance between the second evaporation container 20 and the heating element 11.

[0053] In order to reduce heat loss from the evaporation body 10, the evaporation body 10 in this embodiment further includes a heat preservation assembly 13, wherein a first accommodation space 311 is provided in the heat preservation assembly 13. The heating element 11 is installed in the first accommodation space 311. Specifically, the heating element 11 is installed through the first accommodation space 311 of the heat preservation assembly 13. In this case, the first accommodation space 311 can be a through hole provided in the heat preservation assembly 13, and the total length of the heating element 11 along the axial direction of the through hole is greater than the hole depth of the through hole, so that the opposite ends of the heating element 11 along the axial direction of the first accommodation space 311 can be connected to an external power source, thereby achieving the purpose of current input and heating. On the other hand, when the heat preservation assembly 13 is a structure formed by splicing multiple heat preservation sheets, the first accommodation space 311 can be a groove provided in the middle area of the heat preservation assembly 13 (which can be integrated with the heating element 11), and the end of the heat preservation assembly 13 is provided with an opening connected to the groove, so that the heating element 11 can be electrically connected to the external power source through the corresponding opening. In summary, after ensuring that the heating element 11 is installed in the thermal insulation component 13, an opening is reserved on the thermal insulation component 13 so that the heating element 11 can be connected to an external power source. This embodiment does not make a sole limitation on this. In this embodiment, the temperature adjustment component 30 includes a thermal insulation component. The thermal insulation component is arranged on the surface of the thermal insulation component 13 offset from the heating element 11, and the second evaporation container 20 is arranged on the thermal insulation component. In this embodiment, the second evaporation container 20 and the evaporation body 10 can be separated by the thermal insulation component to adjust the temperature of the second evaporation container 20, and to prevent the temperature generated by the second evaporation container 20 from being too high and affecting the effective evaporation of the low-melting-point metal target.

[0054] The thermal insulation component in this embodiment may include a first thermal insulation gasket, which is placed on the surface of the insulation assembly 13. The second evaporation container 20 is located on the surface of the first thermal insulation gasket facing away from the insulation assembly 13. In other words, in this embodiment, the first thermal insulation gasket separates the second evaporation container 20 from the evaporation body 10. Since the second evaporation container 20 is located on the first thermal insulation gasket, if the temperature of the second evaporation container 20 needs to be lowered, multiple first thermal insulation gaskets can be placed between the bottom of the second evaporation container 20 and the evaporation body 10. If the temperature of the second evaporation container 20 needs to be higher, the number of first thermal insulation gaskets placed between the bottom of the second evaporation container 20 and the evaporation body 10 can be reduced, thereby increasing the temperature of the second evaporation container 20. This reduces energy consumption of the evaporation mechanism and provides simple and convenient operation.

[0055] like Figure 1As shown, the thermal insulation component in this embodiment further includes a third evaporation container 31, which is disposed on the surface of the heat-insulating assembly 13. The volume of the third evaporation container 31 is larger than that of the second evaporation container 20, and the second evaporation container 20 is placed within the third evaporation container 31. Therefore, this embodiment not only increases the distance between the second evaporation container 20 and the evaporation body 10 through the third evaporation container 31, but also separates the second evaporation container 20 from the evaporation body 10 except for the container opening, thereby achieving temperature regulation of the second evaporation container 20.

[0056] The thermal insulation component in this embodiment also includes a second thermal insulation gasket 32. The second thermal insulation gasket 32 includes at least two gaskets, at least one of which is placed between the thermal insulation assembly 13 and the third evaporation container 31, and / or at least one of which is placed between the bottom of the third evaporation container 31 and the second evaporation container 20. Thus, in this embodiment, by placing one or more second thermal insulation gaskets 32 between the thermal insulation assembly 13 and the third evaporation container 31, the distance between the second evaporation container 20 and the evaporation body 10 is further increased, thereby reducing the temperature of the second evaporation container 20. If the temperature of the second evaporation container 20 needs to be lowered, one or more second thermal insulation gaskets 32 can be placed between the second evaporation container 20 and the third evaporation container 31 to further increase the distance between the second evaporation container 20 and the evaporation body 10, thereby further reducing the temperature generated by the second evaporation container 20. Based on the aforementioned arrangement, when the temperature of the second evaporation container 20 needs to be relatively high, the number of second thermal insulation spacers 32 can be reduced to reduce the distance between the second evaporation container 20 and the evaporation body 10. This reduces the thermal barrier between the second evaporation container 20 and the evaporation body 10, thereby increasing the temperature of the second evaporation container 20.

[0057] In this embodiment, the first and second thermal insulation gaskets 32 can each include at least one high-temperature resistant ceramic sheet such as a boron nitride ceramic sheet, a silicon nitride ceramic sheet, an aluminum oxide ceramic sheet, or a zirconium oxide ceramic sheet. Alternatively, they can be silicone resin-based thermal insulation materials (which can achieve a temperature resistance of up to 800°C). The thermal insulation gaskets can have a porous structure. These thermal insulation gaskets have good high-temperature stability and high thermal conductivity, and are suitable for insulation and heat dissipation in high-temperature environments such as evaporation coating. Silicon nitride ceramic sheets have high thermal stability and can withstand high temperatures and chemical erosion. When a silicon nitride ceramic sheet is provided between the second evaporation container 20 and the evaporation body 10, the reliability and service life of the temperature regulating assembly 30 can be improved.

[0058] Of course, in this embodiment, the second evaporation container 20 can also be suspended above the evaporation body 10 via a support member, so that the temperature generated by the second evaporation container 20 can be adjusted by adjusting the distance between the second evaporation container 20 and the evaporation body 10. However, this method requires manual adjustment of the suspended height of the second evaporation container 20, which is inconvenient. Moreover, the position of the second evaporation container 20 must be adjusted before the evaporation mechanism is operating or after cooling.

[0059] In order to conveniently adjust the second evaporation container 20 and the evaporation body 10, as shown in FIG. Figures 2 to 6 As shown, the temperature adjustment assembly 30 in this embodiment further includes a driving member 33 and a moving member 34. The moving member 34 is mounted on one side of the evaporation body 10 and is connected to the driving member 33 and the second evaporation container 20 respectively. The driving member 33 drives the moving member 34 to drive the second evaporation container 20 to move back and forth in a direction close to or away from the evaporation body 10. Specifically, the moving member 34 can be driven by the driving member 33 along a first direction (such as Figure 2 The second evaporation container 20 is moved closer to or away from the evaporation main body 10 by the moving component 34, so as to adjust the distance between the second evaporation container 20 and the evaporation main body 10 along the first direction, thereby adjusting the amount of heat radiation received by the second evaporation container 20, and further adjusting the heating temperature reached by the second evaporation container 20 under the heat generated by the evaporation main body 10. And / or, the moving component 34 in this embodiment can also be moved in the second direction (such as Figure 2 The second evaporation container 20 is moved closer to or further away from the evaporation body 10 (in the direction indicated by the arrow Y shown). The temperature generated by the second evaporation container 20 is adjusted by adjusting the spacing between the second evaporation container 20 and the evaporation body 10 along the first direction and / or the second direction. This adjustment method saves time and effort, requires no manual operation, and the operation time is not limited by the operating time of the evaporation mechanism.

[0060] Therefore, in this embodiment, the distance between the second evaporation container 20 and the evaporation main body 10 is adaptively adjusted by the driving member 33 driving the moving member 34. The automatic adjustment of the distance between the second evaporation container 20 and the evaporation main body 10 can be achieved by simply starting the driving member 33. This is convenient to operate. The position of the second evaporation container 20 can be adjusted at any time according to the evaporation status of the metal target material in the second evaporation container 20, ensuring that the second evaporation container 20 can effectively evaporate the metal target material and improving the working efficiency of the evaporation mechanism.

[0061] Specifically, in this embodiment, when a thermal insulation member is provided between the second evaporation vessel 20 and the heat-insulating assembly 13, the thermal insulation member in this embodiment does not need to be fixedly connected to the second evaporation vessel 20. That is, the second evaporation vessel 20 is movable relative to the thermal insulation member. When the second evaporation vessel 20 is moved by the movable member 34 to a position farther from the evaporation body 10, the thermal insulation member remains on the evaporation body 10 to block some of the thermal radiation emitted by the evaporation body 10. This ensures that the second evaporation vessel 20 receives less thermal radiation when it is away from the evaporation body 10, effectively cooling the second evaporation vessel 20 and achieving efficient evaporation of the low-melting-point metal target.

[0062] This embodiment also allows the thermal insulation component to move with the second evaporation container 20, that is, the thermal insulation component is directly fixedly connected to the second evaporation container 20. In this case, when the second evaporation container 20 is lifted to a higher position away from the heat-insulating assembly 13 or the evaporation body 10 by the movable component 34 to achieve temperature adjustment, the thermal insulation component (such as the first thermal insulation gasket and the second thermal insulation gasket 32) can also move with the second evaporation container 20 to a position farther from the evaporation body 10. While the second evaporation container 20 is farther away from the evaporation body 10, the thermal insulation component directly insulates the second evaporation container 20, allowing the temperature of the second evaporation container 20 to reach a lower temperature more quickly, thereby ensuring the effective evaporation of the low-melting-point metal target by the second evaporation container 20.

[0063] Therefore, the movable component 34 in this embodiment can adjust the distance between the first thermal insulation gasket, the second thermal insulation gasket 32 and the heat preservation assembly 13, so as to adjust the temperature in the second evaporation container 20 or the third evaporation container 31 in combination with the change in the distance from the second evaporation container 20, so as to achieve evaporation of a material at a lower temperature than that of the material to be evaporated in the first evaporation container 12.

[0064] The moving component 34 in this embodiment may include a transmission belt and at least two gears 43. For example, if the evaporation mechanism in this embodiment also includes a protective housing 40, a fourth receiving groove 401 is provided in the protective housing 40, and the evaporation body 10 is located in the fourth receiving groove 401. The at least two gears 43 can be rotatably connected to opposite sides of the protective housing 40 in the height direction via corresponding connecting shafts. A transmission belt (or transmission chain) is mounted on the at least two gears 43, and the second evaporation container 20 is connected to the transmission belt. A driving member (such as a motor) drives the gears 43 to rotate, so that the transmission belt can drive the second evaporation container 20 to move vertically closer to or farther from the evaporation body 10, thereby adjusting the heated position of the second evaporation container 20.

[0065] like Figures 2 to 4As shown, the movable component 34 in this embodiment includes a support base 41, a rotating shaft 42, a gear 43, a rack 44, and a first connecting member 45. The support base 41 is mounted on the bottom of the evaporation body 10. The rotating shaft 42 is mounted on the support base 41 and connected to the driving member 33, which drives the rotating shaft 42 to rotate about its own axis. There are at least two gears 43, one mounted at each opposite end of the rotating shaft 42. There are at least two racks 44, each extending through the support base 41 and movable relative to the support base 41 along its length. The at least two racks 44 mesh with the at least two gears 43 in a one-to-one correspondence. The first connecting member 45 is mounted on the end of the rack 44 away from the gear 43 and is connected to the second evaporation container 20. When the driving member 33 drives the rotating shaft 42 to rotate, the gear 43 on the rotating shaft 42 drives the rack 44 to move along its length relative to the support base 41. At the same time, the first connecting member 45 drives the second evaporation container 20 to move along the length of the rack 44 to a position away from or closer to the evaporation body 10. Therefore, in this embodiment, the driving member 33 drives the rotating shaft 42 to rotate, so that the rack 44, meshing with the gear 43, can drive the second evaporation container 20 to move relative to the evaporation body 10, thereby adjusting the heating temperature of the second evaporation container 20. This not only facilitates operation but also improves adjustment efficiency.

[0066] In this embodiment, the rack 44 can be tilted away from the evaporation body 10 or vertically arranged along the first direction. When the rack 44 is arranged vertically, the rack 44 moves in the direction indicated by the arrow X. Thus, the second evaporation container 20 can be moved closer to or farther away from the evaporation body 10 along the first direction under the influence of the rack 44. This ensures that the second evaporation container 20 can always be exposed to heat radiation from the evaporation body 10 and can adjust its temperature.

[0067] When the evaporation body 10 also includes a heat preservation assembly 13, the support base 41 is mounted on the bottom of the heat preservation assembly 13 to prevent the support base 41 from directly contacting the heating element 11, which would place higher demands on the material selection of the movable component 34. The heat preservation assembly 13 not only reduces heat loss from the heating element 11 but also forms a certain thermal barrier between the movable component 34 and the heating element 11, thereby improving the reliability and stability of the movable component 34 in high-temperature operating environments. Secondly, along the first direction, this embodiment positions the projected outer contour of the second evaporation container 20 on the heat preservation assembly 13. When the temperature of the second evaporation container 20 needs to be increased, the movable component 34 can be used to drive the second evaporation container 20 to the surface of the heat preservation assembly 13 for direct contact with the heat preservation assembly 13. This ensures that the second evaporation container 20 can generate a higher heating temperature, while preventing the second evaporation container 20 from overheating due to direct contact with the heating element 11, which would otherwise affect the evaporation effect of the first evaporation container 12.

[0068] The length of the second evaporation container 20 extends along the length of the rotating shaft 42. For example, if the second evaporation container 20 is a crucible, the crucible has an elongated trough-shaped structure. The elongated second evaporation container 20 is adapted to the width of the conductive film to be plated, so that the second evaporation container 20 can deposit a metal film layer that meets the required width on the conductive film in a single pass. In this embodiment, the first connecting member 45 includes a first connecting block 451 and a second connecting block 452. The first connecting block 451 includes at least two first connecting blocks 451, and the at least two first connecting blocks 451 are fixedly connected to the ends of the at least two racks 44 away from the gear 43. The second connecting blocks 452 include at least two second connecting blocks 452, which are respectively mounted at opposite ends of the second evaporation container 20 along its own length and are detachably connected to the at least two first connecting blocks 451 in a one-to-one correspondence.

[0069] Driven by the rack 44, the first connecting block 451 can move the second evaporation container 20, which is connected to the second connecting block 452, toward or away from the evaporation body 10. Because the second connecting block 452 is detachably connected to the first connecting block 451, the second connecting block 452 can be separated from the first connecting block 451 when the first evaporation container 12 needs to be replaced or removed. Furthermore, because the second connecting blocks 452 are located at opposite ends of the second evaporation container 20 in the longitudinal direction, a larger area of the second evaporation container 20 is exposed to heat radiation and a smaller area of contact between the second evaporation container 20 and the movable member 34 is reduced. This prevents heat loss to the second evaporation container 20 from the movable member 34 and ensures that the movable member 34 does not generate high temperatures and cause operational failure.

[0070] Specifically, in this embodiment, a snap-fit structure that facilitates disassembly can be provided between the first connecting block 451 and the second connecting block 452. This snap-fit structure includes a snap-fit groove and a snap-fit protrusion. The snap-fit groove can be provided on at least one of the first connecting block 451 and the second connecting block 452, while the snap-fit protrusion is provided on the other of the first connecting block 451 and the second connecting block 452. Thus, in this embodiment, when the second evaporation container 20 needs to be connected to the movable member 34, the second evaporation container 20 can be installed by simply snapping the snap-fit groove and / or snap-fit protrusion on the second connecting block 452 into the snap-fit groove and / or snap-fit protrusion on the first connecting block 451. This provides simple and convenient operation and high assembly efficiency.

[0071] See Figure 5In another optional embodiment of the present invention, the movable component 34 in this embodiment further includes a mounting bracket 46, a bidirectional screw 47, a movable block, a connecting rod 410, and a second connecting member 411. The mounting bracket 46 is mounted on one side of the evaporation body 10 (specifically, on the side of the insulation assembly 13). The bidirectional screw 47 is mounted on the mounting bracket 46 and connected to the driving member 33, which drives the bidirectional screw 47 to rotate about its own axis. The movable block includes at least two movable blocks, which are screwed onto the bidirectional screw 47 and can reciprocate toward or away from each other under the drive of the bidirectional screw 47. The connecting rod 410 includes at least two connecting rods 410, which are rotatably connected to the at least two movable blocks in a one-to-one correspondence. The ends of the at least two connecting rods 410 away from the movable blocks are rotatably connected to the second connecting member 411, and the second evaporation container 20 is connected to the second connecting member 411. If the moving block includes a first moving block 48 and a second moving block 49, and the driving member 33 includes a motor, when the motor drives the bidirectional screw rod 47 in forward rotation, because the second connecting member 411 is rotatably connected to the connecting rod 410, if the first moving block 48 and the second moving block 49 move away from each other along the axial direction of the bidirectional screw rod 47, the second connecting member 411 will drive the second evaporation container 20 to move downward in the first direction toward the evaporation body 10. If the first moving block 48 and the second moving block 49 move toward each other along the axial direction of the bidirectional screw rod 47, the second connecting member 411 will drive the second evaporation container 20 to move upward in the first direction toward the evaporation body 10.

[0072] As can be seen from the above, in this embodiment, the second connecting member 411 drives the second evaporation container 20 in the first direction by driving at least two movable blocks via the driving member 33, thereby adjusting the distance between the second evaporation container 20 and the evaporation body 10. Therefore, to increase the temperature of the second evaporation container 20, the second evaporation container 20 can be driven downward in the first direction to a position close to or even in direct contact with the evaporation body 10. To decrease the temperature of the second evaporation container 20, the second evaporation container 20 can be driven upward in the first direction to a position away from the evaporation body 10. This convenient and flexible adjustment method allows the automatic adjustment of the distance between the second evaporation container 20 and the evaporation body 10 simply by activating the driving member 33, resulting in simple and convenient operation.

[0073] In this embodiment, the second connecting member 411 includes a third connecting block 4111 and a fourth connecting block 4113. The third connecting block 4111 is rotatably connected to the connecting rod 410. The fourth connecting block 4113 comprises at least two blocks, each disposed at opposite ends of the second evaporation container 20 along its length. A relief groove 4112 is provided on the side of the third connecting block 4111 proximal to the second evaporation container 20. This allows the second evaporation container 20 to be positioned within the relief groove 4112, allowing the fourth connecting blocks 4113 to be removably connected to the third connecting block 4111. In this embodiment, a snap-fit structure for easy disassembly may be provided between the third and fourth connecting blocks 4111 and 4113. The snap-fit groove of the snap-fit structure may be provided on at least one of the third and fourth connecting blocks 4111 and 4113, and a snap-fit protrusion may be provided on the other of the third and fourth connecting blocks 4111 and 4113, respectively. Therefore, in this embodiment, when the second evaporation container 20 needs to be connected to the movable member 34, the second evaporation container 20 can be installed by simply engaging the engaging groove and / or engaging protrusion on the fourth connecting block 4113 with the engaging groove and / or engaging protrusion on the third connecting block 4111. This is simple and convenient to operate, and has high assembly efficiency.

[0074] The movable member 34 is connected to the outer peripheral wall of the second evaporation container 20, and the projection of the second evaporation container 20 along the first direction is located on the evaporation body 10 (specifically, on the insulation assembly 13 when the evaporation body 10 includes the insulation assembly 13). In this embodiment, to achieve more precise temperature regulation of the second evaporation container 20, the temperature adjustment assembly 30 also includes a temperature control member 35. The temperature control member 35 is disposed on the bottom surface of the second evaporation container 20 near the insulation assembly 13 and is movable with the second evaporation container 20. The temperature control member 35 is used to heat or cool the second evaporation container 20.

[0075] Therefore, this embodiment enables more precise active adjustment of the temperature of the second evaporation vessel 20 through the temperature control member 35 that moves with the second evaporation vessel 20. For example, when the second evaporation vessel 20 is located relatively far from the evaporation body 10 but the temperature of the second evaporation vessel 20 is still high, this embodiment can cool the second evaporation vessel 20 through the temperature control member 35 to ensure efficient evaporation of the low-melting-point metal target. When the second evaporation vessel 20 is located relatively close to the evaporation body 10 but the temperature of the second evaporation vessel 20 is still low, this embodiment can actively heat the second evaporation vessel 20 through the temperature control member 35 to increase the temperature of the second evaporation vessel 20. Therefore, this embodiment can compensate for the inaccurate temperature adjustment caused by the limited travel distance of the movable member 34 by providing the temperature control member 35. When it is necessary for the temperature control member 35 to actively heat the second evaporation vessel 20, it can be a conventional heater with active heating function. When the temperature control component 35 needs to cool the second evaporation container 20, a cooling flow channel can be set in the temperature control component 35 to pass coolant into the cooling flow channel to take away the temperature of the second evaporation container 20, thereby cooling the second evaporation container 20.

[0076] The evaporation mechanism in this embodiment also includes a protective shell 40, in which a fourth accommodating groove 401 is provided, and the evaporation body 10 is located in the fourth accommodating groove 401. Among them, a cooling channel is provided in the side wall of the protective shell 40 close to the temperature adjustment component 30. In this embodiment, cold water or cold air can be introduced into the cooling channel of the protective shell 40 to cool the temperature adjustment component 30 and improve the service life of the temperature adjustment component 30. In particular, when the temperature adjustment component 30 includes a driving member 33 and a moving part 34, the working reliability of the driving member 33 and the moving part 34 can be improved. In particular, in this embodiment, the driving member 33 can be arranged outside the protective shell 40 to prevent the driving member 33 from failing or even being damaged due to long-term operation at high temperatures.

[0077] Furthermore, the temperature adjustment assembly 30 in this embodiment may also comprise an electric cylinder 412, a second connecting member 411, and a guide rod 413 fixedly mounted on one side of the evaporation body 10. The second connecting member 411 is connected to the actuating end of the electric cylinder 412, so that the electric cylinder 412 drives the second connecting member 411 to move up and down in a first direction, thereby moving the second evaporation container 20 closer to or further away from the evaporation body 10. Furthermore, guide rods 413 may be provided at opposite ends of the second connecting member 411, enabling the second connecting member 411 to move relative to the guide rods 413 in the first direction. As the second connecting member 411 is driven to move by the electric cylinder 412, the guide rods 413 further stabilize the movement of the second connecting member 411.

[0078] Regardless of the structure of the temperature adjustment component 30 in this embodiment, this embodiment can control the temperature of the second evaporation container 20 to be less than or equal to 1000°C. Without the need to separately provide the second evaporation container 20 with a heating element 11, the second evaporation container 20 can effectively evaporate a metal target material with a melting point below 1000°C, thereby significantly reducing the energy consumption of the evaporation mechanism during the evaporation coating process and improving the evaporation efficiency of the evaporation mechanism. For example, in this embodiment, the temperature of the second evaporation container 20 can be adjusted to one of 1000°C, 900°C, 840°C, 825°C, 753°C, 720°C, 600°C, 560°C, 510°C, 500°C, 450°C, 430°C, 300°C, 290°C, 270°C, 240°C, 210°C, 190°C, 180°C, 140°C, 110°C, and 100°C through the temperature adjustment component 30. Preferably, the second evaporation vessel 20 in this embodiment heats and evaporates a low-melting-point metal target having a melting point below 600°C, thereby utilizing the waste heat generated by the evaporation body 10 to efficiently evaporate the low-melting-point metal target and reduce energy consumption of the evaporation mechanism. In other words, in this embodiment, the temperature of the second evaporation vessel 20 is preferably controlled within a temperature range not exceeding 600°C, such as 560°C, 510°C, 500°C, 450°C, 430°C, 300°C, 290°C, 270°C, 240°C, 210°C, 190°C, 180°C, 140°C, 110°C, or 100°C.

[0079] The second embodiment of the present invention provides a method for preparing a conductive film. The method is performed by an evaporation mechanism. The structure of the evaporation mechanism is described in detail in the first embodiment of the present invention and will not be described in detail in this embodiment. The method includes:

[0080] The substrate layer is transferred to the evaporation body 10 of the evaporation mechanism. The heating element 11 of the evaporation body 10 heats and evaporates the first metal target in the first evaporation container 12, causing metal particles evaporated from the first metal target to deposit on the surface of the substrate layer to form a first metal layer. Simultaneously, the heat radiation generated by the evaporation body 10 heats the second evaporation container 20, causing metal particles evaporated from the second metal target in the second evaporation container 20 to deposit on the surface of the first metal layer to form a second metal layer. The second metal target comprises a metal target having a lower melting point than the first metal target. The heating element 11 comprises electrodes. In this embodiment, both ends of the evaporation body 10 can be extended to form electrode chucks, which connect the electrodes to the circuit. When powered on, the heating element 11 is heated to a higher temperature, thereby raising the temperature within the first evaporation container 12. This allows the high-melting-point metal target to be heated while the residual heat generated heats and evaporates the lower-melting-point metal target in the second evaporation container 20.

[0081] In this embodiment, the thermal radiation generated by the evaporation body 10 includes not only the thermal radiation generated when the heating element 11 heats the first evaporation container 12, but also the thermal radiation generated by the first evaporation container 12 being heated and the thermal radiation generated by metal particles evaporated from the first evaporation container 12. If the evaporation body 10 includes a heat-insulating assembly 13, the thermal radiation generated by the heat-insulating assembly 13 is also included. If the temperature required for the second evaporation container 20 is relatively low, the temperature adjustment assembly 30 can be used to increase the distance between the second evaporation container 20 and the evaporation body 10, or even to at least partially isolate the second evaporation container 20 from the evaporation body 10, thereby reducing the amount of thermal radiation from the evaporation body 10 on the second evaporation container 20 and thereby lowering the heating temperature generated by the second evaporation container 20.

[0082] Therefore, this embodiment can utilize the residual heat generated by the evaporation body 10 to heat the target material with a lower melting point in the second evaporation body 20 while the heating element 11 heats the first evaporation vessel 12. In other words, this embodiment eliminates the need for a heating element 11 to heat the second evaporation vessel 20. Simply attaching the second evaporation vessel 20 to the evaporation body 10 allows the heat generated by the evaporation body 10 to heat the second evaporation vessel 20, thereby achieving heating and evaporation of the target material with a lower melting point. This reduces the energy consumption of the evaporation mechanism and the coating cost. Furthermore, because the evaporation mechanism can be used to sequentially deposit at least two metal layers with different melting points on the surface of the substrate layer, the coating efficiency of the evaporation mechanism is improved.

[0083] The third embodiment of the present invention provides a conductive film, which is prepared by an evaporation mechanism. For details on the structure of the evaporation mechanism, please refer to the content provided in the first embodiment of the present invention. Alternatively, the conductive film is prepared by a conductive film preparation method. For details on the conductive film preparation method, please refer to the content provided in the second embodiment of the present invention. The conductive film in this embodiment includes a substrate layer, a first metal layer, and a second metal layer. Along the thickness direction of the substrate layer, the substrate layer includes a first surface and a second surface. The first metal layer is disposed on at least one of the first surface and the second surface. The second metal layer is disposed on a surface of the first metal layer away from the substrate layer, wherein the second metal layer includes a film layer structure having a melting point lower than that of the first metal layer.

[0084] In this embodiment, while the heating element 11 of the evaporation mechanism heats the first evaporation vessel 12, the metal target material with a higher melting point within the first evaporation vessel 12 can be deposited on the surface of the substrate layer to form a first metal layer. Simultaneously, as the substrate layer is transferred from the first evaporation vessel 12 to the second evaporation vessel 20, the second evaporation vessel 20 can utilize the waste heat generated by the evaporation body 10 to heat the target material with a lower melting point. This allows the metal particles produced by the low-melting-point target material in the second evaporation vessel 20 to be deposited on the surface of the first metal layer to form a second metal layer. In other words, this embodiment eliminates the need for a heating element 11 to heat the second evaporation vessel 20. Simply attaching the second evaporation vessel 20 to the evaporation body 10 and utilizing the heat generated by the evaporation body 10 to heat the second evaporation vessel 20 allows the second metal layer to be deposited on the surface of the first metal layer of the substrate layer. This reduces energy consumption and coating costs associated with the evaporation mechanism and improves the production efficiency of the conductive film.

[0085] The fourth embodiment of the present invention further provides a pole piece, which includes a current collector, and the current collector includes a conductive film. The structure of the conductive film can be found in the third embodiment of the present invention, and will not be described in detail in this embodiment.

[0086] The fifth embodiment of the present invention further provides an energy storage device, which can be at least one of a blade battery, a cylindrical battery, etc., and includes a pole piece. The structure of the pole piece is described in the fourth embodiment of the present invention and will not be further described in this embodiment.

[0087] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0088] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0089] The above are merely preferred embodiments of the present application and are not intended to limit the present application. Those skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. An evaporation mechanism, characterized in that: include: An evaporation body (10), the evaporation body (10) comprising a heating element (11) and a first evaporation container (12), an evaporation tank (111) being provided in the heating element (11), and the first evaporation container (12) being provided in the evaporation tank (111); A second evaporation container (20) is installed on the evaporation main body (10) and is located on one side of the first evaporation container (12).

2. The evaporation mechanism according to claim 1, characterized in that: Also includes: A temperature adjustment component (30) is installed between the evaporation body (10) and the second evaporation container (20), and the temperature adjustment component (30) is used to adjust the distance between the second evaporation container (20) and the evaporation body (10) and / or to separate the second evaporation container (20) at least partially from the evaporation body (10).

3. The evaporation mechanism according to claim 2, characterized in that: The evaporation main body (10) further comprises a heat preservation component (13), a first accommodation space (311) is provided in the heat preservation component (13), the heating element (11) is installed in the first accommodation space (311), and the temperature adjustment component (30) comprises: A heat insulation component is provided on the surface of the heat preservation component (13) and is offset from the heating element (11); and the second evaporation container (20) is provided on the heat insulation component.

4. The evaporation mechanism according to claim 3, characterized in that: The thermal insulation component comprises: A first thermal insulation gasket is laid on the surface of the thermal insulation component (13), and the second evaporation container (20) is arranged on the surface of the first thermal insulation gasket facing away from the thermal insulation component (13).

5. The evaporation mechanism according to claim 3, characterized in that: The thermal insulation component further comprises: A third evaporation container (31) is provided on the surface of the heat preservation component (13), and the second evaporation container (20) is placed in the third evaporation container (31).

6. The evaporation mechanism according to claim 5, characterized in that: The thermal insulation component further comprises: A second thermal insulation gasket (32), at least one of the second thermal insulation gaskets (32) is laid between the heat preservation component (13) and the third evaporation container (31), and / or at least one of the second thermal insulation gaskets (32) is laid between the bottom of the third evaporation container (31) and the second evaporation container (20).

7. The evaporation mechanism according to any one of claims 2 to 6, characterized in that: The temperature regulating assembly (30) further comprises: A driving member (33); A moving component (34) is installed on one side of the evaporation main body (10) and is respectively connected to the driving component (33) and the second evaporation container (20); the driving component (33) drives the moving component (34) to drive the second evaporation container (20) to move back and forth in a direction close to or away from the evaporation main body (10).

8. The evaporation mechanism according to claim 7, characterized in that: The moving part (34) comprises: A support base (41), the support base (41) being installed at the bottom of the evaporation body (10); A rotating shaft (42), the rotating shaft (42) is mounted on the supporting seat (41) and connected to the driving member (33), and the driving member (33) drives the rotating shaft (42) to rotate around its own axis; Gears (43), the gears (43) comprising at least two, the at least two gears (43) being respectively mounted on opposite ends of the rotating shaft (42); Racks (44), the racks (44) comprising at least two, the at least two racks (44) being disposed through the support base (41) and being movable relative to the support base (41) along their own length direction, the at least two racks (44) being meshed with the at least two gears (43) in a one-to-one correspondence; A first connecting member (45) is installed on an end of the rack (44) away from the gear (43) and is connected to the second evaporation container (20).

9. The evaporation mechanism according to claim 7, characterized in that: The moving part (34) further comprises: a mounting frame (46), the mounting frame (46) being mounted on one side of the evaporation body (10); a bidirectional screw rod (47), the bidirectional screw rod (47) being mounted on the mounting frame (46) and connected to the driving member (33), the driving member (33) driving the bidirectional screw rod (47) to rotate around its own axis; A moving block, the moving block comprising at least two blocks, the at least two moving blocks being screwed onto the bidirectional screw rod (47) and being capable of reciprocating in directions of approaching or moving away from each other under the drive of the bidirectional screw rod (47); Connecting rods (410), the connecting rods (410) comprising at least two, the at least two connecting rods (410) being rotatably connected to at least two of the moving blocks in a one-to-one correspondence; A second connecting member (411), at least two ends of the connecting rods (410) away from the moving block are rotatably connected to the second connecting member (411), and the second evaporation container (20) is connected to the second connecting member (411).

10. The evaporation mechanism according to any one of claims 2 to 6 or 8 to 9, characterized in that: Also includes: A protective shell (40), wherein a fourth accommodating groove (401) is provided in the protective shell (40), and the evaporating body (10) is located in the fourth accommodating groove (401), wherein a cooling flow channel is provided in a side wall of the protective shell (40) close to the temperature adjustment component (30).

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