TO packaging semiconductor chip aging test fixture

Abstract

The utility model discloses a TO packaging semiconductor chip aging test fixture, and relates to the chip processing technology field, the TO packaging semiconductor chip aging test fixture comprises a bearing test assembly, the bearing test assembly comprises a lower bearing frame and an upper covering frame, the bottom of the inner cavity of the lower bearing frame is fixedly connected with a mounting frame, the side surface of the inner cavity of the lower bearing frame is fixedly connected with a supporting plate, and the upper covering frame is fixedly connected with the supporting plate. A convenient clamping piece is installed on the surface of the lower bearing frame in a penetrating mode and comprises a transverse rod and a fixing rod. The beneficial effects of the utility model are that through the arrangement of the convenient clamping member, the die placement assembly and the multi-point test assembly, the appropriate test ejector pin can be selected and moved downwards for installation according to the actual chip body specification and test requirements, and the installation stability of the test seat is ensured through the cooperation of the clamping block and the clamping groove; therefore, the purpose of well testing chip bodies of different specifications and models can be achieved, different test fixtures do not need to be repeatedly replaced and used, and actual use requirements are better met.

Description

Technical Field

[0001] The utility model relates to the field of chip processing, in particular to an aging test fixture for a TO packaged semiconductor chip. Background Art

[0002] TO package is a commonly used semiconductor device packaging form. Its main function is to seal chips and devices in a certain packaging material to protect them from physical and chemical damage. TO package not only plays a protective role, but also includes electrical connection and heat dissipation functions. After the chip is packaged and aged, a test fixture will be used to test the chip's performance.

[0003] Basic test fixtures are often not well adapted to install chips of various specifications. For chips of different specifications, corresponding sized fixtures and corresponding numbers of test pins need to be used, which increases the actual testing cost. At the same time, it cannot be easily disassembled and has certain limitations.

[0004] In summary, a TO package semiconductor chip aging test fixture is proposed to solve the above problems. Utility Model Content

[0005] The purpose of this section is to summarize some aspects of the embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the abstract of the specification and the name of the utility model of this application to avoid blurring the purpose of this section, the abstract of the specification and the name of the utility model, and such simplifications or omissions cannot be used to limit the scope of the present invention.

[0006] In view of the above problems and / or the problems existing in the prior art, the present utility model is proposed.

[0007] Therefore, the technical problem to be solved by the present invention is that the basic test fixture is often not well adapted to install chips of various specifications. For chips of different specifications, corresponding sized fixtures and corresponding numbers of test needles need to be adapted and used, which increases the actual testing cost and cannot be easily disassembled.

[0008] To solve the above technical problems, the present invention provides the following technical solutions: a TO package semiconductor chip aging test fixture, comprising a load-bearing test assembly, the load-bearing test assembly comprising a lower load-bearing frame and an upper cover frame, the bottom of the lower load-bearing frame inner cavity is fixedly connected to a mounting frame, the side of the lower load-bearing frame inner cavity is fixedly connected to a support plate, the surface of the lower load-bearing frame is penetrated by a convenient card assembly, the convenient card assembly comprises a cross bar and a fixed bar; the surface of the upper cover frame is penetrated by a pressure rod slidably installed, the surface of the pressure rod is sleeved with a first spring, and the bottom of the pressure rod is fixedly connected to a rubber anti-slip ball;

[0009] A mold placement assembly, the mold placement assembly comprising an auxiliary frame, a chip body being mounted at the center of the auxiliary frame;

[0010] A multi-point test assembly comprises a test seat, a side of the test seat is provided with a card slot, and a top of the test seat is fixedly connected with a test pin.

[0011] As a preferred solution of the TO package semiconductor chip aging test fixture of the present invention, wherein: a positioning frame is fixedly connected to the left side of the surface of the lower bearing frame, and the surface of the upper cover frame is movably connected to the connection between the positioning frame.

[0012] As a preferred solution of the TO-packaged semiconductor chip aging test fixture of the present invention, the four corners of the bottom of the lower carrier frame inner cavity are fixedly connected with first protrusions, and the four corners of the test seat surface are penetrated by first positioning holes used in conjunction with the first protrusions.

[0013] As a preferred solution of the TO-packaged semiconductor chip aging test fixture of the utility model, transparent glass is fixedly inlaid at the center of the surface of the upper cover frame, one end of the first spring is fixedly connected to the top of the upper cover frame, and the other end of the first spring is fixedly connected to the surface of the pressure rod.

[0014] As a preferred solution of the TO package semiconductor chip aging test fixture of the present invention, the surface of the mounting frame is respectively provided with a first groove and a second groove, and the first groove and the second groove are in a connected state.

[0015] As a preferred solution of the TO-packaged semiconductor chip aging test fixture of the utility model, the surface of the lower supporting frame is provided with a storage groove for use with the cross bar, the top of the support plate is fixedly connected with a second protrusion, and the surface of the auxiliary frame is provided with a second positioning hole for use with the second protrusion.

[0016] As a preferred solution of the TO-packaged semiconductor chip aging test fixture described in the utility model, the inner wall of the receiving groove and the surface of the cross bar are fixedly inlaid with magnetic rings, the surface of the cross bar and the inner cavity of the lower supporting frame are sleeved with a second spring, and one end of the cross bar is fixedly connected to a pressure plate.

[0017] As a preferred solution of the TO-packaged semiconductor chip aging test fixture of the present invention, one end of the second spring is fixedly connected to the inner wall of the lower supporting frame, and the other end of the second spring is fixedly connected to the pressure plate, and the pressure plate is adapted to the first groove.

[0018] As a preferred solution of the TO package semiconductor chip aging test fixture of the present invention, the surface of the fixing rod is fixedly connected to the inner wall of the second groove, and the surface of the fixing rod is respectively provided with a torsion spring and a clamping block.

[0019] As a preferred solution of the TO-packaged semiconductor chip aging test fixture of the utility model, wherein: the surface of the clamping block is movably connected to the connection between the fixed rod, one end of the torsion spring is fixedly connected to the inner wall of the second groove, and the other end of the torsion spring is fixedly connected to the surface of the clamping block.

[0020] The beneficial effects of the present invention are as follows: by arranging convenient card-mounting parts, mold placement components and multi-point test components, it has the advantage of convenient testing, can select appropriate test ejector pins and move them downward for installation according to the actual chip body specifications and test requirements, and the card block and card slot cooperate to ensure the installation stability of the test seat, so that the purpose of good testing can still be achieved for chip bodies of different specifications and models, without the need to repeatedly replace and use different test fixtures, which is more in line with actual use needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without inventive work. Among them:

[0022] Figure 1 It is a three-dimensional schematic diagram of the structure of the utility model;

[0023] Figure 2 This is a sectional perspective view of the structure of the utility model;

[0024] Figure 3 This is a three-dimensional diagram of the utility model when the structure is separated;

[0025] Figure 4 This is a sectional perspective view of the local structure of the utility model;

[0026] Figure 5 For this utility model Figure 4 A is an enlarged schematic diagram. DETAILED DESCRIPTION

[0027] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0028] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0029] Next, the present invention is described in detail with reference to schematic diagrams. For ease of illustration, cross-sectional views of device structures may be partially enlarged and not to scale when describing embodiments of the present invention. Furthermore, the schematic diagrams are merely illustrative and should not limit the scope of protection of the present invention. Furthermore, in actual production, three-dimensional dimensions, including length, width, and depth, should be included.

[0030] Furthermore, the term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0031] Example 1

[0032] Reference Figures 1 to 5 The present embodiment provides a TO package semiconductor chip aging test fixture, including a load-bearing test assembly 100, which includes a lower load-bearing frame 101 and an upper cover frame 102. The bottom of the inner cavity of the lower load-bearing frame 101 is fixedly connected to a mounting frame 101b, and the side of the inner cavity of the lower load-bearing frame 101 is fixedly connected to a support plate 101c. A convenient card assembly 103 is installed through the surface of the lower load-bearing frame 101, and the convenient card assembly 103 includes a cross bar 103a and a fixed bar 103e; a pressure rod 102a is slidably installed through the surface of the upper cover frame 102, and the surface of the pressure rod 102a is sleeved with a first spring 102d, and the bottom of the pressure rod 102a is fixedly connected to a rubber anti-slip ball 102b.

[0033] Furthermore, a positioning frame 101d is fixedly connected to the left side of the surface of the lower carrying frame 101, and the surface of the upper covering frame 102 is movably connected to the connection between the positioning frame 101d.

[0034] Furthermore, the four corners of the bottom of the inner cavity of the lower carrying frame 101 are fixedly connected with first protruding columns 101 a.

[0035] Furthermore, a transparent glass 102c is fixedly inlaid at the center of the surface of the upper cover frame 102, one end of the first spring 102d is fixedly connected to the top of the upper cover frame 102, and the other end of the first spring 102d is fixedly connected to the surface of the pressing rod 102a.

[0036] Furthermore, a first groove 101b-1 and a second groove 101b-2 are respectively formed on the surface of the installation frame 101b, and the first groove 101b-1 and the second groove 101b-2 are in a communicating state.

[0037] Furthermore, a receiving groove 101e for cooperating with the cross bar 103a is formed through the surface of the lower carrying frame 101, and a second protruding column 101c-1 is fixedly connected to the top of the supporting plate 101c.

[0038] Furthermore, the inner wall of the receiving groove 101e and the surface of the cross bar 103a are fixedly inlaid with a magnetic ring 101e-1, and the surface of the cross bar 103a and the inner cavity of the lower supporting frame 101 are sleeved with a second spring 103b, and one end of the cross bar 103a is fixedly connected to a pressure plate 103c.

[0039] Furthermore, one end of the second spring 103b is fixedly connected to the inner wall of the lower bearing frame 101, and the other end of the second spring 103b is fixedly connected to the pressing plate 103c, and the pressing plate 103c is adapted to the first groove 101b-1.

[0040] Furthermore, the surface of the fixing rod 103e is fixedly connected to the inner wall of the second groove 101b-2, and the surface of the fixing rod 103e is respectively sleeved with a torsion spring 103d and a clamping block 103f.

[0041] Furthermore, the surface of the block 103f is movably connected to the connection between the fixing rod 103e, one end of the torsion spring 103d is fixedly connected to the inner wall of the second groove 101b-2, and the other end of the torsion spring 103d is fixedly connected to the surface of the block 103f.

[0042] The mold placement assembly 200 is also included. The mold placement assembly 200 includes an auxiliary frame 201 . A chip body 202 is mounted at the center of the auxiliary frame 201 .

[0043] Furthermore, a second positioning hole 201 a is formed through the surface of the auxiliary frame 201 for use with the second protruding column 101 c - 1 .

[0044] The multi-point test assembly 300 is also included. The multi-point test assembly 300 includes a test socket 301 . A slot 301 a is provided on the side of the test socket 301 . A test pin 301 b is fixedly connected to the top of the test socket 301 .

[0045] Furthermore, first positioning holes 301 c for use with the first protruding pillars 101 a are formed through the four corners of the surface of the test socket 301 .

[0046] It should be noted that by providing the first boss 101a and the first positioning hole 301c, a positioning installation function can be achieved, which facilitates the rapid and accurate downward movement and installation of the test socket 301. By providing the installation frame 101b, the requirements for the opening of the first groove 101b-1 and the second groove 101b-2 can be met. At the same time, the installation space of the test socket 301 is limited to ensure the installation stability of the test socket 301. By providing the support plate 101c, the auxiliary frame 201 can be supported and placed. By providing the second boss 101c-1 and the second positioning hole 201a, a positioning installation function can be achieved. The auxiliary frame 201 is quickly and accurately placed on the support plate 101c. By setting the positioning frame 101d, the upper cover frame 102 can be movably installed on the lower bearing frame 101. By setting the storage groove 101e, the storage space requirement for the cross bar 103a can be met. By setting the magnetic ring 101e-1, the two magnetic rings 101e-1 can be in contact and magnetically attracted when the cross bar 103a is installed, thereby preventing the cross bar 103a from moving randomly. By setting the rubber anti-slip ball 102b, the chip body 202 can be pressed against the corners in the installed state to ensure the test stability of the chip body 202. The rubber design achieves the purpose of insulation protection. By setting up the transparent glass 102c, it is convenient for the staff to observe the surface state of the chip body 202 during the test. By setting up the first spring 102d, the pressure rod 102a can be elastically supported to prevent the pressure rod 102a from being displaced at will without external force. By setting up the cross bar 103a and the pressure plate 103c, the pressure plate 103c can press the block 103f in the installed state, thereby preventing the block 103f from rotating and displacing at will. By setting up the second spring 103b, the cross bar 103a can be elastically supported. In the absence of external force, the cross bar 103a is prevented from being displaced at will. By setting the torsion spring 103d, the card block 103f can be provided with a torsion force, thereby preventing the card block 103f from rotating at will. By setting the fixing rod 103e, the card block 103f can be positioned and installed so that the card block 103f can rotate around the fixing rod 103e. By setting the card block 103f and the card slot 301a, the card block 103f can buckle the test seat 301 in the installed state to prevent the test seat 301 from moving up at will. By setting the auxiliary frame 201, the chip body 202 can be supported and placed.

[0047] When in use, all components are in the initial installation state, the test socket 301 is located in the lower supporting frame 101, and the block 103f cooperates with the card slot 301a to ensure the installation stability of the test socket 301, and the torsion spring 103d is in a tightened state. At this time, the pressure plate 103c is in contact with the block 103f, ensuring that the block 103f is in good contact with the test socket 301 and is buckled and installed. The two adjacent magnetic rings 101e-1 are in contact and magnetically attracted to ensure the installation stability of the cross bar 103a. When the chip body 202 needs to be tested, the chip body 202 is pre-installed in the auxiliary frame 201, and with the cooperation of the second positioning hole 201a and the second boss 101c-1, the auxiliary frame 201 and the chip body 202 are quickly and accurately installed. At this time, the bottom of the chip body 202 is in contact with the top of the test pin 301b, and then the upper cover frame 102 is rotated and buckled into the lower supporting frame 10 1, in the buckled state, the bottom of the rubber anti-slip ball 102b contacts the corner of the chip body 202, the pressing rod 102a moves up a distance, the first spring 102d is stretched, and then provides a pressing force for the chip body 202, ensuring that the chip body 202 can be in good contact with the test ejector 301b; in actual application, for different models of chip bodies 202, corresponding test ejector pins 301b need to be installed, or when the test ejector pins 301b need to be repaired, the multi-point test assembly 300 will be disassembled and assembled. Simply pull the cross bar 103a outward, the pressing plate 103c no longer contacts the block 103f, and the second spring 103b is compressed. At this time, the test socket 301 is moved upward, and with the assistance of the torsion spring 103d, the block 103f can be rotated in the second groove 101b-2, so that the test socket 301 can be quickly taken out for disassembly and replacement, which is more in line with actual use needs.

[0048] In summary, by setting up a convenient card assembly 103, a mold placement component 200 and a multi-point test component 300, it has the advantage of convenient testing. According to the actual chip body 202 specifications and test requirements, a suitable test pin 301b can be selected and moved downward for installation. The card block 103f and the card slot 301a cooperate to ensure the installation stability of the test seat 301, and thus the purpose of good testing can still be achieved for chip bodies 202 of different specifications and models, without the need to repeatedly replace and use different test fixtures, which is more in line with actual usage needs.

[0049] It is important to note that the construction and arrangement of the present application shown in a number of different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, it should be readily understood by those who refer to this disclosure that many modifications are possible (e.g., the size, scale, structure, shape and proportion of various elements, and parameter values (e.g., temperature, pressure, etc.), mounting arrangements, use of materials, colors, directional changes, etc.) without departing substantially from the novel teachings and advantages of the subject matter described in this application. For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of the element may be inverted or otherwise changed, and the nature or number or position of the discrete elements may be altered or changed. Therefore, all such modifications are intended to be included within the scope of the present invention. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. In the claims, any "means plus function" clause is intended to cover the structure of performing the function described herein, and is not only structurally equivalent but also an equivalent structure. Without departing from the scope of the present invention, other substitutions, modifications, changes and omissions may be made in the design, operating conditions and arrangement of the exemplary embodiments. Therefore, the present invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0050] Additionally, in order to provide a concise description of example embodiments, all features of an actual embodiment (ie, those features that are not relevant to the best mode presently contemplated for carrying out the invention or those that are not relevant to implementing the invention) may not be described.

[0051] It will be appreciated that in the development of any actual embodiment, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort may be complex and time-consuming, but will, for those of ordinary skill having the benefit of this disclosure, be a routine undertaking of design, fabrication, and production without undue experimentation.

[0052] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, and all of these should be included in the scope of the claims of the present invention.

Claims

1. A TO package semiconductor chip aging test fixture, characterized by: include, A load-bearing test assembly (100), the load-bearing test assembly (100) comprising a lower load-bearing frame (101) and an upper covering frame (102), the bottom of the inner cavity of the lower load-bearing frame (101) being fixedly connected to a mounting frame (101b), the side of the inner cavity of the lower load-bearing frame (101) being fixedly connected to a supporting plate (101c), the surface of the lower load-bearing frame (101) being penetrated by a convenient card-mounting component (103), the convenient card-mounting component (103) comprising a cross bar (103a) and a fixing bar (103e); the surface of the upper covering frame (102) being penetrated by a pressing rod (102a) being slidably mounted, the surface of the pressing rod (102a) being sleeved with a first spring (102d), and the bottom of the pressing rod (102a) being fixedly connected to a rubber anti-slip ball (102b); A mold placement assembly (200), the mold placement assembly (200) comprising an auxiliary frame (201), a chip body (202) being mounted at the center of the auxiliary frame (201); A multi-point test assembly (300) comprises a test seat (301), a side surface of the test seat (301) is provided with a card slot (301a), and a top of the test seat (301) is fixedly connected with a test pin (301b).

2. The TO package semiconductor chip aging test fixture according to claim 1, characterized in that: A positioning frame (101d) is fixedly connected to the left side of the surface of the lower supporting frame (101), and the surface of the upper covering frame (102) is movably connected to the connection between the positioning frame (101d).

3. The TO package semiconductor chip aging test fixture according to claim 2, characterized in that: The four corners of the bottom of the inner cavity of the lower bearing frame (101) are fixedly connected with first convex columns (101a), and the four corners of the surface of the test seat (301) are penetrated by first positioning holes (301c) used in conjunction with the first convex columns (101a).

4. The TO package semiconductor chip aging test fixture according to claim 3, characterized in that: A transparent glass (102c) is fixedly inlaid at the center of the surface of the upper covering frame (102), one end of the first spring (102d) is fixedly connected to the top of the upper covering frame (102), and the other end of the first spring (102d) is fixedly connected to the surface of the pressing rod (102a).

5. The TO package semiconductor chip aging test fixture according to claim 4, characterized in that: A first groove (101b-1) and a second groove (101b-2) are respectively formed on the surface of the installation frame (101b), and the first groove (101b-1) and the second groove (101b-2) are in a communicating state.

6. The TO package semiconductor chip aging test fixture according to claim 5, characterized in that: The surface of the lower supporting frame (101) is provided with a receiving groove (101e) for use with the cross bar (103a), the top of the supporting plate (101c) is fixedly connected with a second convex column (101c-1), and the surface of the auxiliary frame (201) is provided with a second positioning hole (201a) for use with the second convex column (101c-1).

7. The TO package semiconductor chip aging test fixture according to claim 6, characterized in that: The inner wall of the receiving groove (101e) and the surface of the cross bar (103a) are both fixedly inlaid with a magnetic ring (101e-1); the surface of the cross bar (103a) and the inner cavity of the lower supporting frame (101) are sleeved with a second spring (103b); one end of the cross bar (103a) is fixedly connected to a pressure plate (103c).

8. The TO package semiconductor chip aging test fixture according to claim 7, characterized in that: One end of the second spring (103b) is fixedly connected to the inner wall of the lower supporting frame (101), and the other end of the second spring (103b) is fixedly connected to the pressure plate (103c), and the pressure plate (103c) is adapted to the first groove (101b-1).

9. The TO package semiconductor chip aging test fixture according to claim 8, characterized in that: The surface of the fixing rod (103e) is fixedly connected to the inner wall of the second groove (101b-2), and the surface of the fixing rod (103e) is respectively sleeved with a torsion spring (103d) and a clamping block (103f).

10. The TO package semiconductor chip aging test fixture according to claim 9, characterized in that: The surface of the clamping block (103f) is movably connected to the connection point of the fixing rod (103e), one end of the torsion spring (103d) is fixedly connected to the inner wall of the second groove (101b-2), and the other end of the torsion spring (103d) is fixedly connected to the surface of the clamping block (103f).

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