Limiting device for semiconductor chip test

Abstract

The utility model belongs to the technical field of chip detection, and particularly discloses a limiting device for semiconductor chip testing, which comprises a bottom plate and a push plate, a limiting frame is arranged on the upper surface of the bottom plate, the limiting frame is provided with three edges, the three edges of the limiting frame are sequentially connected to form a U shape, the front side of the limiting frame is open, and the push plate is arranged on the bottom plate. A first concave groove is formed in the inner side wall of one edge of the middle of the limiting frame, the push plate is movably connected into the first concave groove, the push plate corresponds to the position of an opening of the limiting frame, a mounting support is arranged on the outer side wall of one edge of the middle of the limiting frame, and a telescopic air cylinder is mounted on the mounting support. Through the arrangement of the limiting frame, the three edges of the chip are limited and blocked, the chip is prevented from laterally moving from the bottom plate, after detection, the chip can be pushed out through the telescopic end of the telescopic air cylinder and the push plate, and the chip is pushed out from an opening in the front side of the limiting frame and is convenient to take down.

Description

Technical Field

[0001] The utility model relates to the technical field of chip detection, in particular to a limiting device for semiconductor chip testing. Background Art

[0002] In electronics, semiconductor chips are a way to miniaturize circuits (mainly semiconductor devices, but also passive components, etc.) and are often manufactured on the surface of semiconductor wafers.

[0003] After production and processing, semiconductor chips need to be tested as a basis for judging whether the chip quality meets production standards.

[0004] Currently, semiconductor chip testing typically involves placing the chip on a testing platform and inspecting it using testing equipment. However, due to the small size of the chip, it is prone to sideways movement during testing on the testing platform, impacting both testing and chip placement. Utility Model Content

[0005] The purpose of the present invention is to provide a limiting device for semiconductor chip testing to solve the problem in the above background technology that the chip size is small and is prone to lateral shift when tested on a test platform, thus affecting the test and chip placement.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a semiconductor chip testing limit device, comprising:

[0007] A bottom plate, wherein a limit frame is provided on the upper surface of the bottom plate, wherein the limit frame is configured to have three sides, wherein the three sides of the limit frame are sequentially connected to form a U shape, and the front side of the limit frame is open;

[0008] A push plate, a recessed groove is provided on the inner side wall of one side in the middle of the limit frame, the push plate is movably connected in the recessed groove, the push plate corresponds to the opening position of the limit frame, and a mounting bracket is provided on the outer side wall of one side in the middle of the limit frame, a telescopic cylinder is installed on the mounting bracket, and the telescopic end of the telescopic cylinder passes through one side in the middle of the limit frame and is connected to the push plate.

[0009] Preferably, two sides of the limiting frame are provided with through slots at one end close to the opening, and locking blocks are provided in the through slots.

[0010] Preferably, the locking block includes an inner clamping plate, a support rod is connected to the outer wall of the locking block, the end of the support rod away from the inner clamping plate is connected to a baffle, the outer end of the baffle is connected to an arc block, the inner clamping plate, the support rod and the baffle are all located in the through groove, the arc block is located on the outside of the through groove, the baffle is connected to a spring on the side facing the inner clamping plate, and the end of the spring away from the baffle is connected to the inner wall of the through groove.

[0011] Preferably, the outer sides of the two sides of the limit frame are movably connected with side plates, and the side of the side plate facing the locking block is provided with a second recessed groove, and both sides of the second recessed groove are set as inclined edges, and the second recessed groove corresponds to the position of the arc block.

[0012] Preferably, two connecting rods are connected to the telescopic end of the telescopic cylinder, and one end of the two connecting rods away from the telescopic end of the telescopic cylinder is connected to the side plates on both sides.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] By setting the limit frame, the three sides of the chip are limited and blocked to prevent the chip from moving sideways from the bottom plate. After detection, the chip can be pushed out through the telescopic end of the telescopic cylinder and the push plate. The chip is pushed out from the front opening of the limit frame for easy removal. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the utility model after removing the side panels and connecting rods;

[0017] Figure 3 This is a structural diagram of the locking block of the utility model.

[0018] In the figure: 1. Base plate; 2. Limit frame; 3. Locking block; 31. Arc block; 32. Baffle; 33. Support rod; 34. Inner clamping plate; 35. Spring; 4. Side plate; 5. Recessed groove 2; 6. Connecting rod; 7. Mounting bracket; 8. Telescopic cylinder; 9. Push plate; 10. Recessed groove 1. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0021] Example 1:

[0022] See also Figure 1-3 , the utility model provides a technical solution: a limiting device for semiconductor chip testing, comprising: a bottom plate 1, a push plate 9;

[0023] A limit frame 2 is provided on the upper surface of the base plate 1, and the limit frame 2 is set to three sides. The three sides of the limit frame 2 are connected in sequence to form a U shape, and the front side of the limit frame 2 is open. A recessed groove 10 is provided on the inner side wall of one side in the middle of the limit frame 2, and the push plate 9 is movably connected in the recessed groove 10. The push plate 9 corresponds to the position of the opening of the limit frame 2, and a mounting bracket 7 is provided on the outer side wall of one side in the middle of the limit frame 2. A telescopic cylinder 8 is installed on the mounting bracket 7. The telescopic end of the telescopic cylinder 8 passes through one side in the middle of the limit frame 2 and is connected to the push plate 9.

[0024] Analysis of the above content: When performing testing, the base plate 1 is fixedly installed on the testing platform in advance, so that the chip can be limited by simply placing the chip in the limiting frame 2.

[0025] The chip is placed in the limit frame 2, and the chip is restricted by the limit frame 2 and cannot move left or right or backward, so that the chip is relatively stable during detection. The exit on the front side is convenient for removing the chip.

[0026] Example 2:

[0027] See also Figure 1-3 The utility model provides a technical solution: two sides of the limiting frame 2 are provided with through grooves near one end of the opening, and a locking block 3 is provided in the through groove.

[0028] Analysis of the above content: The locking block 3 can move in the through groove. When the chip is placed in the limit frame 2, the locking block 3 is pushed into the limit frame 2 to block the chip. After the chip is detected, the locking block 3 is moved outward and then the chip is taken out.

[0029] Example 3:

[0030] See also Figure 1-3The present invention provides a technical solution: the locking block 3 includes an inner clamping plate 34, a support rod 33 is connected to the outer wall of the locking block 3, the end of the support rod 33 away from the inner clamping plate 34 is connected to a baffle 32, the outer end of the baffle 32 is connected to an arc block 31, the inner clamping plate 34, the support rod 33, and the baffle 32 are all located in a through slot, the arc block 31 is located on the outside of the through slot, the baffle 32 is connected to a spring 35 on the side facing the inner clamping plate 34, and the end of the spring 35 away from the baffle 32 is connected to the inner wall of the through slot. The outer sides of the two sides of the limiting frame 2 are movably connected to the side plates 4, and the side plates 4 facing the locking block 3 are provided with a recessed groove 2 5, both sides of the recessed groove 2 5 are set as inclined edges, and the recessed groove 2 5 corresponds to the position of the arc block 31. The telescopic end of the telescopic cylinder 8 is connected to two connecting rods 6 , and one end of the two connecting rods 6 away from the telescopic end of the telescopic cylinder 8 is connected to the side plates 4 on both sides.

[0031] Analysis of the above content: During testing, when the chip is placed and clamped, the telescopic end of the telescopic cylinder 8 drives the push plate 9 to shrink into the recessed groove 10. At the same time, the telescopic end of the telescopic cylinder 8 drives the side plate 4 to move backward through the connecting rod 6. The oblique side of the recessed groove 2 5 of the side plate 4 contacts the arc block 31, squeezing the arc block 31, so that the arc block 31 drives the inner clamping plate 34, the support rod 33, and the baffle 32 to move toward the inside of the limit frame 2, blocking the front opening of the limit frame 2 to prevent the chip from falling forward.

[0032] After detection, the telescopic end of the telescopic cylinder 8 drives the push plate 9 to push outward from the recessed groove 10, and at the same time, the connecting rod 6 drives the side plate 4 to move forward. The recessed groove 2 5 of the side plate 4 corresponds to the position of the locking block 3. The spring 35 pushes the inner clamping plate 34, the support rod 33, and the baffle 32 to retract into the through groove, which will not block the movement of the chip. As the push plate 9 moves, the chip is pushed out from the limit frame 2.

[0033] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention; therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is limited by the appended claims rather than the above description. Therefore, it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the present invention, and any figure marks in the claims should not be regarded as limiting the claims involved.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip testing limit device, characterized in that: include: A bottom plate (1), wherein a limiting frame (2) is provided on the upper surface of the bottom plate (1), wherein the limiting frame (2) is configured to have three sides, wherein the three sides of the limiting frame (2) are sequentially connected to form a U shape, and the front side of the limiting frame (2) is open; A push plate (9) is provided with a recessed groove (10) on the inner side wall of one side in the middle of the limit frame (2), and the push plate (9) is movably connected in the recessed groove (10). The push plate (9) corresponds to the opening position of the limit frame (2). A mounting bracket (7) is provided on the outer side wall of one side in the middle of the limit frame (2), and a telescopic cylinder (8) is installed on the mounting bracket (7). The telescopic end of the telescopic cylinder (8) passes through one side in the middle of the limit frame (2) and is connected to the push plate (9).

2. The semiconductor chip testing limit device according to claim 1, wherein: Two sides of the limiting frame (2) are provided with through slots close to one end of the opening, and locking blocks (3) are provided in the through slots.

3. The semiconductor chip testing limit device according to claim 2, wherein: The locking block (3) includes an inner card plate (34), a support rod (33) is connected to the outer wall of the locking block (3), an end of the support rod (33) away from the inner card plate (34) is connected to a baffle (32), the outer end of the baffle (32) is connected to an arc block (31), the inner card plate (34), the support rod (33) and the baffle (32) are all located in the through groove, the arc block (31) is located on the outside of the through groove, the baffle (32) is connected to a spring (35) on the side facing the inner card plate (34), and the end of the spring (35) away from the baffle (32) is connected to the inner wall of the through groove.

4. The semiconductor chip testing limit device according to claim 3, wherein: The outer sides of the two sides of the limiting frame (2) are movably connected with side plates (4), and the side of the side plate (4) facing the locking block (3) is provided with a second recessed groove (5), and both sides of the second recessed groove (5) are arranged as inclined edges, and the position of the second recessed groove (5) corresponds to the arc block (31).

5. The semiconductor chip testing limit device according to claim 4, characterized in that: Two connecting rods (6) are connected to the telescopic end of the telescopic cylinder (8), and one end of the two connecting rods (6) away from the telescopic end of the telescopic cylinder (8) is connected to the side plates (4) on both sides.

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