Wafer bearing device and wafer detection equipment

Abstract

The utility model relates to the field of semiconductors, and discloses a wafer bearing device and wafer detection equipment, and the wafer bearing device comprises a bearing seat, and a bearing area is provided with a limiting table; the supporting bracket comprises a friction contact surface protruding out of the bearing seat in the height direction of the bearing seat, and the friction contact surface is used for fixing the wafer through static friction force. In order to solve the problem that wafers made of some semiconductor materials cannot be adsorbed through static electricity, a supporting bracket is installed in a bearing area of a bearing seat, and the friction contact surface of the supporting bracket makes static friction contact with the wafers, so that the wafers are stabilized on the bearing seat through friction force, the requirement for bearing the wafers made of different semiconductor materials is met, the stability of the wafers is improved, and the service life of the wafers is prolonged. The wafer sliding probability is reduced, and the application range of the wafer bearing device is expanded; the wafer placed on the friction contact surface is limited through the limiting table, limiting protection after wafer sliding is achieved, and the safety of the wafer bearing device is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductors, and in particular to a wafer carrier and wafer detection equipment. Background Art

[0002] With the rapid development of third-generation semiconductor technology, the variety, size, and complexity of wafer materials have shown a significant growth trend. This places higher demands on the stability and precision of the wafer inspection process, especially the design and manufacture of wafer carriers, which are directly related to the accuracy and reliability of inspection results.

[0003] Currently, wafer carriers often use electrostatic chucks to hold the wafer, generating a capacitive signal to facilitate wafer transfer. However, third-generation semiconductor materials such as GaAs (gallium arsenide), LT (lithium tantalate), and LN (lithium niobate) are unable to generate a capacitive signal under static conditions, preventing wafer transfer. Some wafers even resist static absorption, leading to wafer slippage and damage. Utility Model Content

[0004] The embodiments of the present application provide a wafer carrying device and a wafer detection device, which can stably carry wafers made of different semiconductor materials and expand the scope of application.

[0005] On the one hand, an embodiment of the present application provides a wafer carrying device, comprising: a supporting seat, comprising a supporting area for accommodating a wafer, the supporting area being provided with a limiting platform, the limiting platform being used to limit the wafer; a supporting assembly, comprising one or more supporting supports detachably arranged in the supporting area and capable of defining a supporting surface, the supporting support comprising a friction contact surface protruding from the supporting seat along the height direction of the supporting seat, the friction contact surface being used to fix the wafer by static friction force.

[0006] According to the wafer carrying device provided in an embodiment of the present application, the plurality of support holders are spaced apart along the same distribution circle, and the diameter of the distribution circle is greater than or equal to one third of the diameter of the crystal source.

[0007] According to the wafer carrying device provided in the embodiment of the present application, the supporting area is provided with a stepped clamping hole passing through the supporting seat, and the clamping hole includes a first limiting surface facing away from the limiting platform; a portion of the support bracket is plugged into the clamping hole, and the middle section of the support bracket includes a first annular surface and a second annular surface arranged opposite to each other, the first annular surface is in contact with the supporting seat, and the second annular surface is abutted against the first limiting surface for limiting positioning.

[0008] According to the wafer carrying device provided in an embodiment of the present application, the support bracket includes a first column segment, a second column segment and a third column segment arranged in sequence along the axial direction, the radial dimension of the first column segment is larger than the radial dimension of the second column segment, the radial dimension of the third column segment is placed between the radial dimension of the first column segment and the radial dimension of the second column segment, and the side of the third column segment facing away from the first column segment has an inclined surface that gradually shrinks toward the axial direction of the support bracket; the first annular surface is formed at the intersection of the first column segment and the second column segment, the second annular surface is formed at the intersection of the second column segment and the third column segment, and the second column segment and the third column segment are placed in the clamping hole.

[0009] According to the wafer carrying device provided in the embodiment of the present application, the supporting seat includes a detachably connected base plate and a mounting block, the base plate forms the supporting area, a stepped mounting hole penetrating the base plate is provided in the supporting area, and the mounting block is placed in the mounting hole; the clamping hole is opened through the mounting block and is connected to the mounting hole, and the friction contact surface of the support bracket protrudes from the base plate.

[0010] According to the wafer carrying device provided in the embodiment of the present application, the base plate includes a detachably connected protective plate and a chuck, a chuck hole is opened in the middle of the protective plate, the chuck includes the supporting area, the chuck is sunk in the chuck hole, and the limit platform protruding from the chuck is formed in the circumference of the chuck.

[0011] According to the wafer carrying device provided in the embodiment of the present application, the protective plate includes a main plate and a protective platform protruding from the side of the main plate facing away from the limit platform, the clamping hole passes through the main plate and the protective platform, and the protective platform is arranged along the circumference of the chuck to cover the chuck.

[0012] According to the wafer carrying device provided in an embodiment of the present application, the friction coefficient of the friction contact surface of the support holder at 300 degrees Celsius is greater than half of the friction coefficient of the support holder at 24 degrees Celsius.

[0013] On the other hand, an embodiment of the present application further provides a wafer inspection device, including the above-mentioned wafer carrying device.

[0014] The wafer carrying device and wafer detection equipment of the embodiments of the present application install a support support in the supporting area of the support seat, and the friction contact surface of the support support is in static friction contact with the wafer, so that the wafer is firmly fixed on the support seat through friction, which meets the carrying requirements of wafers of different semiconductor materials, improves the stability of the wafer, reduces the probability of wafer slippage, and expands the scope of application of the wafer carrying device; the wafer placed on the friction contact surface is limited by the limit table, so as to realize limit protection after the wafer slides, thereby improving the safety of the wafer carrying device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0016] Figure 1 A schematic structural diagram of a wafer carrier provided in some embodiments of the present application is shown;

[0017] Figure 2 A top view of a wafer carrier provided by some embodiments of the present application is shown;

[0018] Figure 3 Showing an example Figure 2 Cross-section along the BB direction;

[0019] Figure 4 A cross-sectional view of a support bracket provided in some embodiments of the present application is shown;

[0020] Figure 5 Another example is shown Figure 2 Cross-section along AA direction;

[0021] Figure 6 A bottom schematic diagram of a wafer carrier provided in some embodiments of the present application is shown.

[0022] Reference numerals:

[0023] 100: Support seat; 101: Limiting platform; 102: Supporting area; 110: Clamping hole; 111: First hole section; 112: Second hole section; 113: First limiting surface; 120: Bottom plate; 121: Mounting block; 122: Mounting hole; 130: Chuck; 140: Protective plate; 141: Clamping hole; 142: Main plate; 143: Protective platform;

[0024] 200: Support assembly; 201: Friction contact surface; 202: First column segment; 203: Second column segment; 204: Third column segment; 205: First annular surface; 206: Second annular surface; 207: Inclined surface; 210: Support bracket. DETAILED DESCRIPTION

[0025] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating the examples of the present application.

[0026] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article, or device comprising the elements.

[0027] With the rapid development of semiconductors, the third generation of semiconductors involves an increasing number of wafer materials. During wafer inspection, absolute stability must be ensured to ensure that the wafer does not shift throughout the entire transmission path, ensuring accurate measurement of the wafer line width. To ensure accurate process measurement, the wafer carrier must be extremely stable.

[0028] Currently, electrostatic chuck adsorption is a common method of carrying wafers during wafer transfer to ensure that the wafers do not shift. An electrostatic chuck is a general term for ultra-clean wafer carriers and gripping and handling equipment suitable for atmospheric or vacuum environments. The principle of electrostatic chuck adsorption technology is that when an object with static electricity approaches another object without static electricity, due to electrostatic induction, the side of the object without static electricity near the static electricity object will accumulate charges of opposite polarity to the charges carried by the charged object (the other side will generate the same amount of charges of the same polarity). Since opposite charges attract each other, the phenomenon of "electrostatic adsorption" will occur.

[0029] After the electrostatic chuck attaches the wafer, it displays a capacitance value to signal that it has attached. The machine then uses this feedback to transfer the wafer. However, with the emergence of third-generation semiconductor materials, many wafers made of materials like GaAs (gallium arsenide), LT (lithium tantalate), and LN (lithium niobate) lack capacitance feedback. Without this capacitance signal, the machine cannot proceed, disrupting the entire wafer transfer process.

[0030] In addition, some wafers cannot be electrostatically adsorbed, such as glass. If the electrostatic chuck cannot adsorb, the entire wafer transfer and inspection process cannot be carried out, and it will cause the wafer to slip, resulting in greater losses.

[0031] In order to solve the problems in the prior art, the embodiments of the present application provide a wafer carrier and a wafer detection device.

[0032] Figure 1 The following is a schematic structural diagram of a wafer carrier provided in some embodiments of the present application. Figure 2 A top view of a wafer carrier provided in some embodiments of the present application is shown.

[0033] like Figure 1 and Figure 2 As shown, an embodiment of the present application provides a wafer carrying device, including a support seat 100 and a support assembly 200. The support seat 100 includes a support area 102 for accommodating wafers, and the support area 102 is provided with a limit platform 101, which is used to limit the wafer. The support assembly 200 includes one or more support trays 210 detachably provided in the support area 102, and the support tray 210 includes a friction contact surface 201 protruding from the support seat 100 along the height direction of the support seat 100, and the friction contact surface 201 is used to fix the wafer by static friction.

[0034] The wafer is placed in the supporting area 102 of the supporting seat 100, and a limiting platform 101 is set along the periphery of the supporting area 102. The limiting platform 101 is used to limit the wafer circumferentially to prevent it from sliding when subjected to external force. A support 210 is installed in the supporting area 102. The friction contact surface 201 of the support 210 is in static friction contact with the surface of the wafer, so that the wafer is firmly placed on the supporting seat 100. There is a gap between the limiting platform 101 and the wafer. Only when the wafer and the support 210 move relative to each other, for example, when the support 210 exceeds its service life, the limiting platform 101 contacts the wafer to prevent the wafer from sliding out of the supporting area 102. The use of static friction contact can stably carry the wafer without losing its stabilizing effect due to the material of the wafer, and is better suitable for multiple generations of semiconductor materials. In addition, after the wafer is stabilized by the static friction contact of the support 210, the wafer carrying device does not need to feedback a signal to the machine, which simplifies the operating process and improves the efficiency of wafer transmission.

[0035] Among them, the friction contact surface 201 of the support bracket 210 can adopt a high-performance dry glue non-sliding pad or a perfluoroelastomer, which has strong friction, no bounce and no pollution, and no damage to the wafer surface after contact. For example, the limit table 101 is at least 1 mm higher than the thickness of the wafer. The support bracket 210 can be circular in shape, and the side close to the support seat 100 is detachably connected to the support seat 100 for easy replacement. The side facing away from the support seat 100 is a circular support surface, and the support surface is in a horizontal state so that the wafer is in a horizontal state after being placed on the support surface. The support bracket 210 can also be composed of multiple components, such as a plurality of spaced strip-shaped or arc-shaped support members, which together form a support surface to support the wafer.

[0036] Furthermore, in one embodiment of the present application, the sum of the maximum static friction forces between the friction contact surfaces 201 of the plurality of support trays 210 and the wafer is greater than the inertia force of the wafer during the wafer transfer process.

[0037] Specifically, during the wafer transfer process, the wafer carrier is in a uniform motion process, but at the moment when the wafer carrier starts or stops, there will be a certain acceleration or deceleration, so the wafer will be subjected to inertia. In order to achieve the stability of the wafer, the maximum static friction force provided by the friction contact surface 201 to the wafer needs to overcome the inertia force that the wafer is subjected to during the specific operation process of the wafer carrier. The maximum static friction force provided by the friction contact surface 201 to the wafer is related to the pressure and friction coefficient of the friction contact surface 201. A wafer is supported on the friction contact surface 201, and the pressure on the friction contact surface 201 is determined and fixed. Therefore, the friction coefficient of the friction contact surface 201 is a key factor in ensuring that the support 210 is stable on the wafer. For example, at room temperature, perfluororubber with a friction coefficient of 0.61 is used as the support surface material. A friction contact surface 201 with a suitable friction coefficient is selected so that the sum of the maximum static friction forces between the friction contact surfaces 201 of multiple support 210 and the wafer is greater than the inertia force of the wafer to ensure the stability of the wafer.

[0038] Furthermore, in other embodiments of the present application, the friction coefficient of the friction contact surface 201 of the support bracket 210 at 300 degrees Celsius is greater than half of the friction coefficient of the support bracket 210 at 24 degrees Celsius.

[0039] Because the wafer carrier moves the wafer for transport and inspection, the operating temperature range of the wafer environment is between 24 degrees Celsius and 300 degrees Celsius. To ensure that the friction contact surface 201 of the support 210 can consistently stabilize the wafer in any temperature environment, the difference between the friction coefficient of the support surface at 24 degrees Celsius and 300 degrees Celsius should be greater than half of the friction coefficient at 24 degrees Celsius. In other words, the smaller the change in the friction coefficient of the friction contact surface 201 as the wafer environment rises, the better, and more conducive to wafer stability, especially when continuously switching between different temperature environments.

[0040] like Figure 1 and Figure 2 As shown, in some optional embodiments of the present application, a plurality of support holders are spaced apart along the same distribution circle, and the diameter of the distribution circle is greater than or equal to one third of the diameter of the crystal source.

[0041] For example, the three support brackets 210 are distributed in an isosceles triangle or an equilateral triangle. The center of the triangle formed by the three support brackets 210 can coincide with the center of the wafer to evenly support the wafer and ensure the stability of the wafer. Since the maximum static friction provided by the support surface is independent of the contact area between the friction contact surface 201 and the wafer, the support bracket 210 structure of the three support brackets 210 can reduce assembly accuracy. The area of the friction contact surface 201 of the three support brackets 210 can be as small as possible relative to the size of the wafer, thereby ensuring that the height of the three support brackets 210 can make the wafer parallel. For example, the area ratio of a single friction contact surface 201 to the wafer is 1:10.

[0042] In order to ensure the stability of the three support holders 210 to the wafer, the diameter of the circumscribed circle (ie, distribution circle) formed by the three support holders 210 is greater than or equal to one third of the diameter of the wafer source.

[0043] Figure 3 Showing an example Figure 2 Cross-section along the BB direction.

[0044] like Figure 3 As shown, in some optional embodiments of the present application, the supporting area 102 is provided with a stepped snap-in hole 110 that passes through the supporting seat 100, and the snap-in hole 110 includes a first limiting surface 113 facing away from the limiting platform 101; a portion of the support bracket 210 is plugged into the snap-in hole 110, and the middle section of the support bracket 210 includes a first annular surface 205 and a second annular surface 206 that are relatively arranged, the first annular surface 205 is in contact with the supporting seat 100, and the second annular surface 206 is abutted against the first limiting surface 113 for limiting.

[0045] Specifically, since the wafer is placed on the wafer carrier and transferred to the working position, the working position is in a vacuum environment. Therefore, in order to ensure that the wafer is in a vacuum adsorption state, the clamping hole 110 passes through the support seat 100. For example, the support tray 210 has a through hole opened in the height direction, and the through hole is connected to the clamping hole 110. Specifically, the stepped clamping hole 110 includes a first hole section 111 and a second hole section 112 arranged along the axial direction. The radial dimension of the first hole section 111 is smaller than the radial dimension of the second hole section 112. The second hole section 112 faces away from the limiting platform 101, and a first limiting surface 113 facing away from the limiting platform 101 is formed at the intersection of the first hole section 111 and the second hole section 112. Part of the support tray 210 is plugged into the clamping hole 110 and contacts and limits the first limiting surface 113, so that the support tray 210 is clamped in the clamping hole 110. Since the support bracket 210 is made of a material with a certain elastic deformation, it can be inserted into the engaging hole 110 and form a limit with the first limiting surface 113 .

[0046] The middle section of the support bracket 210 includes a first annular surface 205 and a second annular surface 206 that are arranged opposite to each other. That is, the support bracket 210 forms a limiting structure through the middle section and is locked and limited with the engaging hole 110, so that the upper section of the support bracket 210 protrudes from the surface of the support seat 100, and the friction contact surface 201 is placed on the upper end surface. The lower section of the support bracket 210 is placed in the engaging hole 110 to form a stable connection. Specifically, the arrangement of the first annular surface 205 and the second annular surface 206 allows the support bracket 210 to form a stepped structure. The first annular surface 205 contacts the support seat 100 to prevent the support bracket 210 from being pressed down or sinking toward the engaging hole 110. The second annular surface 206 abuts against the first limiting surface 113 to prevent the support bracket 210 from being easily pulled out of the engaging hole 110 under the action of external force, thereby achieving a stable connection with the engaging hole 110. Of course, when the support bracket 210 is replaced, the support bracket 210 can be pulled out to the engaging hole 110 under the action of a sufficiently large external force, or the support bracket 210 can be pulled out of the engaging hole 110 with the help of other work.

[0047] Figure 4 A cross-sectional view of a support tray 210 provided in some embodiments of the present application is shown.

[0048] like Figure 4 As shown, in a specific embodiment of the present application, the support bracket 210 includes a first column segment 202, a second column segment 203 and a third column segment 204 arranged in sequence along the axial direction, the radial dimension of the first column segment 202 is greater than the radial dimension of the second column segment 203, the radial dimension of the third column segment 204 is placed between the radial dimension of the first column segment 202 and the radial dimension of the second column segment 203, and the side of the third column segment 204 facing away from the first column segment 202 has an inclined surface 207 that gradually shrinks toward the axial direction of the support bracket 210; the first annular surface 205 is formed at the intersection of the first column segment 202 and the second column segment 203, and the second annular surface 206 is formed at the intersection of the second column segment 203 and the third column segment 204, and the second column segment 203 and the third column segment 204 are placed in the snap-in hole 110.

[0049] The support bracket 210 is divided into three sections, namely the first column section 202, the second column section 203 and the third column section 204, and are arranged in sequence along the axial direction. The radial dimension of the first column section 202 is the largest, and it bears the main load in the support bracket 210. The upper surface of the first column section 202 is the friction contact surface 201, which is used to directly contact the wafer and provide static friction. The larger size helps to increase its stability and load-bearing capacity. The radial dimension of the second column section 203 is smaller than that of the first column section 202. A first annular surface 205 is formed at the intersection of the first column section 202 and the second column section 203, which is used to contact and limit with the support seat 100. The radial dimension of the third column section 204 is between the first column section 202 and the second column section 203. A second annular surface 206 is formed at the intersection of the second column section 203 and the third column section 204, which is used to contact and limit with the first limiting surface 113.

[0050] The side of the third column section 204 facing away from the first column section 202 has an inclined surface 207 that tapers toward the axis of the support bracket 210. This guides the support bracket 210 when it is inserted into the engaging hole 110, allowing it to more easily and accurately enter the engaging hole 110. The inclined surface 207 reduces resistance during insertion, allowing the support bracket 210 to be installed in a press-fit manner. The second column section 203 and the third column section 204 are placed within the engaging hole 110, allowing the support bracket 210 to be securely fixed therein. The restraining effect provided by the engaging hole 110 prevents the support bracket 210 from shifting or loosening during use.

[0051] Figure 5 Another example is shown Figure 2 Cross-section along the AA direction.

[0052] like Figure 2 and Figure 5 As shown, in another embodiment of the present application, the supporting seat 100 includes a detachably connected base plate 120 and a mounting block 121, the base plate 120 forms a supporting area 102, and a stepped mounting hole 122 is opened in the supporting area 102 and passes through the base plate 120, and the mounting block 121 is placed in the mounting hole 122; the snap-fit hole 110 is opened through the mounting block 121 and is connected to the mounting hole 122, and the friction contact surface 201 of the support bracket 210 protrudes from the base plate 120.

[0053] Because the working environment of the wafer is hot and corrosive, the material selected for the support bracket 210 is relatively hard and relatively elastic to prevent the support bracket 210 from being affected by the environment and causing a gap between the support bracket 210 and the clamping hole 110, thereby affecting the clamping fit accuracy. To facilitate the removal of the support bracket 210, the support bracket 210 is detachably connected to the base plate 120 via a mounting block 121. When the support bracket 210 needs to be replaced, the mounting block 121 can be completely removed.

[0054] In order to prevent the support surface from protruding too high from the height of the support seat 100, and to prevent the wafer from sliding out of the support area 102 and causing greater damage when the support 210 fails, a mounting hole 122 is opened on the base plate 120 and passes through the base plate 120, and the mounting block 121 is completely placed in the mounting hole 122. In order to prevent the support 210 from being too high and causing shaking, the upper surface of the mounting block 121 is basically flush with the upper surface of the base plate 120. The mounting hole 122 is configured as a stepped hole, and the aperture of the first section of the mounting hole 122 on the side close to the surface where the limit platform 101 is located is larger than the aperture of the second section of the mounting hole 122 on the side away from the plane where the limit platform 101 is located. The mounting block 121 is placed in the first section of the mounting hole 122. The second section of the mounting hole 122 is used to communicate with the snap-on hole 110.

[0055] like Figure 1 As shown, in other embodiments of the present application, the base plate 120 includes a detachably connected protective plate 140 and a chuck 130, a chuck hole 141 is opened in the middle of the protective plate 140, the chuck 130 includes a supporting area 102, the chuck 130 is sunk in the chuck hole 141, and a limit platform 101 protruding from the chuck 130 is formed in the circumference of the chuck 130.

[0056] Among them, the base plate 120 includes a detachably connected protective disc 140 and a chuck 130, so as to facilitate the replacement of the chuck 130. Based on wafers of different sizes, the arrangement position of the support bracket 210 on the chuck 130 is different. By replacing the chuck 130, the wafer carrying device can be adapted to carry wafers of different sizes, thereby improving practicality. The protective disc 140 is arranged on the periphery of the chuck 130, and can carry and protect the wafer of the slide to prevent the wafer from falling out of the wafer carrying device and being completely damaged. The radial dimension of the protective disc 140 is at least 2 mm larger than the diameter of the wafer, and the protective disc 140 can be round or square. The chuck 130 is sunk in the card hole 141 to form a limit table 101, which has a simple structure. A rubber layer can be provided on the inner circumference of the limit table 101 near the chuck 130 to prevent the wafer from contacting the limit table 101 during the sliding process and causing damage.

[0057] Figure 6 A bottom schematic diagram of a wafer carrier provided in some embodiments of the present application is shown.

[0058] like Figure 6 As shown, in one embodiment of the present application, the protective plate 140 includes a main plate 142 and a protective platform 143 protruding from the side of the main plate 142 facing away from the limit platform 101, the clamping hole 141 passes through the main plate 142 and the protective platform 143, and the protective platform 143 is arranged along the circumference of the chuck 130 to cover the chuck 130.

[0059] Main plate 142 serves as a foundation for supporting and securing other components, while protective platform 143 primarily provides added physical protection for chuck 130. Protective platform 143 fully encloses the circumference of chuck 130, minimizing damage from external shocks or accidental collisions. Furthermore, protective platform 143 provides a cushioning effect, further protecting chuck 130 from vibration and impact, and providing a certain degree of stability. In some embodiments, main plate 142 and protective platform 143 can be integrally formed for increased strength.

[0060] An embodiment of the present application further provides a wafer inspection device, comprising the wafer carrying device of the above embodiment.

[0061] Wafer inspection equipment is a comprehensive device that integrates transfer, calibration, and inspection functions. It can transfer wafers from one process step to another during the semiconductor manufacturing process, while ensuring the wafer's positional accuracy and stability during transfer. Furthermore, wafer inspection equipment has a calibration function that automatically adjusts the wafer's position to meet preset inspection standards. Finally, through its built-in inspection system, wafer inspection equipment can perform comprehensive performance and defect inspections on wafers. The inspection system may utilize advanced technologies such as electron beams and X-rays to achieve high-precision inspection of the wafer's internal structure and surface defects.

[0062] The above description is only a specific embodiment of the present application. Those skilled in the art will clearly understand that for the convenience and brevity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the scope of protection of the present application is not limited thereto. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the scope of protection of the present application.

Claims

1. A wafer carrying device, characterized in that: include: The supporting seat includes a supporting area for accommodating the wafer, wherein the supporting area is provided with a limiting platform for limiting the position of the wafer; The support assembly includes one or more support brackets detachably arranged in the support area, and the support bracket includes a friction contact surface protruding from the support seat along the height direction of the support seat, and the friction contact surface is used to fix the wafer by static friction force.

2. The wafer carrier device according to claim 1, wherein: The plurality of support brackets are distributed at intervals along the same distribution circle, and the diameter of the distribution circle is greater than or equal to one third of the diameter of the wafer.

3. The wafer carrier device according to claim 2, characterized in that: The supporting area is provided with a stepped clamping hole penetrating the supporting seat, and the clamping hole includes a first limiting surface facing away from the limiting platform; Part of the support bracket is plugged into the snap-in hole, and the middle section of the support bracket includes a first annular surface and a second annular surface arranged opposite to each other. The first annular surface contacts the supporting seat, and the second annular surface abuts against the first limiting surface for limiting position.

4. The wafer carrying device according to claim 3, characterized in that: The support bracket includes a first column segment, a second column segment, and a third column segment arranged in sequence along the axial direction. The radial dimension of the first column segment is larger than the radial dimension of the second column segment. The radial dimension of the third column segment is between the radial dimensions of the first column segment and the radial dimensions of the second column segment. The side of the third column segment facing away from the first column segment has an inclined surface that gradually shrinks toward the axial direction of the support bracket. The first annular surface is formed at the intersection of the first column segment and the second column segment, the second annular surface is formed at the intersection of the second column segment and the third column segment, and the second column segment and the third column segment are placed in the clamping hole.

5. The wafer carrying device according to claim 3, wherein: The supporting seat includes a detachably connected bottom plate and a mounting block, wherein the bottom plate forms the supporting area, a stepped mounting hole penetrating the bottom plate is provided in the supporting area, and the mounting block is placed in the mounting hole; The clamping hole is formed through the mounting block and communicates with the mounting hole. The friction contact surface of the support bracket protrudes from the bottom plate.

6. The wafer carrying device according to claim 5, characterized in that: The base plate includes a detachably connected protective plate and a chuck, a chuck hole is provided in the middle of the protective plate, the chuck includes the supporting area, the chuck is sunk in the chuck hole, and the limit platform protruding from the chuck is formed in the circumference of the chuck.

7. The wafer carrying device according to claim 6, characterized in that: The protection plate includes a main plate and a protection platform protruding from the side of the main plate facing away from the limit platform. The clamping hole passes through the main plate and the protection platform. The protection platform is arranged along the circumference of the chuck to cover the chuck.

8. The wafer carrying device according to claim 1, wherein: The friction coefficient of the friction contact surface of the support bracket at 300 degrees Celsius is greater than half of the friction coefficient of the support bracket at 24 degrees Celsius.

9. A wafer inspection device, characterized in that: A wafer carrier device comprising any one of claims 1 to 8.

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