Remodeling liquid cooling equipment

Abstract

The utility model provides remodeling liquid cooling equipment, which has a first working state and a second working state, and comprises a box body, the box body comprises a bottom plate and a flow channel cover plate, a cooling liquid flow channel is enclosed at the concave part of the flow channel cover plate and the bottom plate, and the bottom plate is also provided with a remodeling area; the first model changing piece comprises a frame body; and the second model changing piece comprises a heat conducting plate. Compatible matching with the first remodeling piece and the second remodeling piece is achieved through the special box body structure, so that cooling machining can be conducted on different pieces to be cooled, in the actual use process, when different elements need to be cooled, overall equipment replacement or special mold customization does not need to be conducted, and the production efficiency is improved. Compared with conventional liquid cooling equipment, the liquid cooling equipment has the remarkable advantages of being flexible to use, high in universality, capable of reducing the production cost, convenient to operate and the like, and the mold state is the second remodeling part, and the first remodeling part can be obtained by milling the second remodeling part through machining.

Description

Technical Field

[0001] The utility model relates to the technical field of controllers, in particular to a type-changing liquid cooling device. Background Art

[0002] In today's power electronics field, insulated-gate bipolar transistor (IGBT) modules, as key components for efficient energy conversion and management, are widely used in a wide range of applications, including inverters, electric vehicles, and renewable energy generation systems. However, IGBT modules generate significant heat during high-speed switching, and effective heat dissipation is crucial for ensuring stable operation and extending their lifespan.

[0003] Currently, IGBT module heat dissipation designs on the market are mainly divided into two categories: modules using a PINFIN (pin-fin) structure and modules without a traditional PINFIN structure. However, existing cooling equipment is often optimized for only one of these structures.

[0004] In existing technology, dedicated water- or air-cooled heat sinks are typically required for PINFIN-structured IGBT modules to ensure a tight fit and efficient heat exchange between the pin-fin structure and the heat sink. For IGBT modules without a PINFIN structure, conventional heat pipes or thermal paste are often used as auxiliary cooling methods. While this approach of designing separate cooling devices for different heat dissipation structures meets heat dissipation requirements to a certain extent, it also presents a series of problems.

[0005] First, this design method leads to compatibility issues with cooling equipment. Companies need to develop and maintain a cooling system for IGBT modules with different structures. This not only increases the complexity of design and production, but also limits the versatility and interchangeability of the modules.

[0006] Secondly, this practice significantly increases the development cost of die-casting molds for the controller enclosures. Because IGBT modules with different heat dissipation structures require different cooling interfaces and mounting methods, companies must develop separate molds for each module, resulting in mold development investments reaching hundreds of thousands of yuan, a significant burden for small and medium-sized enterprises.

[0007] Furthermore, this differentiated design also leads to increased production costs and complex inventory management. Companies need to stockpile a variety of molds and accessories to meet the production needs of IGBT modules with different heat dissipation structures, which not only consumes a large amount of capital but also increases the difficulty of inventory management. Summary of the Invention

[0008] Therefore, the technical problem to be solved by the present invention is to overcome the problem that the prior art is difficult to be compatible with cooling of different IGBT modules and to provide a type-changing liquid cooling device.

[0009] In order to solve the above technical problems, the utility model provides a type-changing liquid cooling device, which has a first working state and a second working state, and comprises: a box body, the box body comprising a bottom plate and a flow channel cover plate, a part of the bottom plate being recessed toward the interior of the box body, the flow channel cover plate being connected to the recessed position of the bottom plate and surrounding a cooling liquid flow channel with the recessed position of the bottom plate, the bottom plate is also provided with a type-changing area, the type-changing area being connected to the cooling liquid flow channel and the interior of the box body; a first type-changing part, the first type-changing part comprising a frame body, when the type-changing liquid cooling device is in the first working state, the frame body is connected to the type-changing area, the first part to be cooled is passed through the frame body into the cooling liquid flow channel; a second type-changing part, the second type-changing part comprising a heat conducting plate, when the type-changing liquid cooling device is in the second working state, the heat conducting plate is connected to the type-changing area and covers the cooling liquid flow channel, the second part to be cooled is connected to the heat conducting plate and is in contact with the heat conducting plate.

[0010] In one embodiment of the present invention, the cooling liquid flow channel includes an inlet channel and an outlet channel, a baffle is provided between the inlet channel and the outlet channel, a connecting groove is provided on the baffle, and the inlet channel and the outlet channel are connected to each other through the connecting groove.

[0011] In one embodiment of the present invention, the mold changing area is arranged above the liquid outlet channel and is communicated with the liquid outlet channel.

[0012] In one embodiment of the present invention, a liquid inlet nozzle and a liquid outlet nozzle are provided on the side wall of the box body. The liquid inlet nozzle is communicated with the liquid inlet channel, and the liquid outlet nozzle is communicated with the liquid outlet channel.

[0013] In one embodiment of the present invention, a sealing protrusion is provided on the flow channel cover plate. The sealing protrusion is embedded in the coolant flow channel and protrudes toward the coolant flow channel.

[0014] In one embodiment of the present invention, the first mold-changing component further includes a sealing component. When the mold-changing liquid cooling device is in the first working state, the sealing component is embedded in the connection between the frame and the bottom plate.

[0015] In one embodiment of the present invention, the first part to be cooled includes a first substrate and a plurality of pin fins, and the plurality of pin fins are connected to the first substrate. When the liquid cooling device is in a first working state, the first substrate is connected to the frame, and the plurality of pin fins are inserted into the interior of the cooling liquid flow channel.

[0016] In one embodiment of the present invention, the second mold-changing component further includes a plurality of heat dissipation fins. When the mold-changing liquid cooling device is in the second working state, the plurality of heat dissipation fins are arranged in the coolant flow channel.

[0017] In one embodiment of the present invention, at least one first connecting portion is provided on the frame, and a connecting member is passed through the first connecting portion to connect the frame and the base plate; at least one second connecting portion is provided on the heat conducting plate, and a connecting member is passed through the second connecting portion to connect the heat conducting plate and the base plate.

[0018] In one embodiment of the present invention, the second change-over part further includes a heat-conducting layer, which is coated on the surface of the heat-conducting plate; the second part to be cooled includes a second substrate, and when the change-over liquid cooling device is in the second working state, the heat-conducting layer is bonded to the second substrate.

[0019] The above technical solution of the utility model has the following advantages compared with the prior art:

[0020] The mold-changing liquid cooling equipment described in the present invention achieves compatible matching with the first mold-changing part and the second mold-changing part respectively through its special box structure, thereby being able to perform cooling processing on different parts to be cooled. In actual use, when different components need to be cooled, there is no need to replace the equipment as a whole or customize special molds. Instead, compatible operation can be achieved only by disassembling and exchanging the first mold-changing part and the second mold-changing part. Therefore, compared with conventional liquid cooling equipment, the present application has significant advantages such as flexible use, high versatility, reduced production costs, and easy operation, and has broad application prospects in this industry. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to make the content of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments of the present invention in conjunction with the accompanying drawings.

[0022] Figure 1 This is an exploded structural diagram of the liquid cooling device in the preferred embodiment of the present utility model in the first working state;

[0023] Figure 2 yes Figure 1 An exploded structural diagram of the modified liquid cooling device from another perspective;

[0024] Figure 3 yes Figure 2 A schematic diagram of the three-dimensional structure of the replacement liquid cooling device shown;

[0025] Figure 4 This is an exploded structural diagram of the liquid cooling device in the second working state in the preferred embodiment of the utility model;

[0026] Figure 5 yes Figure 4 An exploded structural diagram of the modified liquid cooling device from another perspective;

[0027] Figure 6 yes Figure 5 Schematic diagram of the three-dimensional structure of the replacement liquid cooling equipment shown.

[0028] Explanation of the reference numerals in the specification: 100, casing; 110, bottom plate; 111, mold changing area; 120, coolant flow channel; 121, liquid inlet channel; 122, liquid outlet channel; 123, baffle; 130, liquid inlet nozzle; 140, liquid outlet nozzle; 150, flow channel cover; 151, sealing protrusion; 200, first mold changing part; 210, frame; 211, first connecting portion; 220, sealing part; 300, second mold changing part; 310, heat conducting plate; 311, second connecting portion; 320, heat dissipating fins; 400, first part to be cooled; 410, first substrate; 420, pin fins; 500, second part to be cooled; 510, second substrate. DETAILED DESCRIPTION

[0029] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.

[0030] Example

[0031] See also Figures 1 to 6As shown, this embodiment provides a type-changing liquid cooling device, which has a first working state and a second working state. When it is in the first working state, it is used to cool an IGBT module with a pin fin 420 (PINFIN), and when it is in the second working state, it is used to cool an IGBT module without a PINFIN structure. It specifically includes: a box body 100, the box body 100 includes a bottom plate 110 and a flow channel cover plate 150, a portion of the bottom plate 110 is recessed toward the interior of the box body 100, the flow channel cover plate 150 is connected to the recess of the bottom plate 110, and a cooling liquid flow channel 120 is surrounded by the recess of the bottom plate 110, and a type-changing area 111 is further provided on the bottom plate 110. The mold area 111 is connected to the coolant flow channel 120 and the interior of the box body 100; the first mold changing part 200, the first mold changing part 200 includes a frame body 210, when the mold changing liquid cooling device is in the first working state, the frame body 210 is connected to the mold changing area 111, and the first part to be cooled 400 is passed through the frame body 210 to the interior of the coolant flow channel 120; the second mold changing part 300, the second mold changing part 300 includes a heat conducting plate 310, when the mold changing liquid cooling device is in the second working state, the heat conducting plate 310 is connected to the mold changing area 111 and covers the coolant flow channel 120, and the second part to be cooled 500 is connected to the heat conducting plate 310 and fits with the heat conducting plate 310.

[0032] The mold-changing liquid cooling equipment described in the present invention achieves compatibility matching with the first mold-changing part 200 and the second mold-changing part 300 respectively through its special box body 100 structure, thereby being able to perform cooling processing on different parts to be cooled. In actual use, when different components need to be cooled, there is no need to replace the equipment as a whole or customize special molds. Instead, compatible operation can be achieved only by disassembling and exchanging the first mold-changing part 200 and the second mold-changing part 300. Therefore, compared with conventional liquid cooling equipment, the present application has significant advantages such as flexible use, high versatility, reduced production costs, and easy operation, and has broad prospects for use in this industry.

[0033] Figures 1 to 3The structure of the modified liquid cooling device in a first working state is shown, wherein the box body 100 is preferably a cubic container with an open top, including side walls and a bottom plate 110. The components to be cooled enter the box body 100 from the top of the box body 100. The cooling liquid flow channel 120 is provided at the bottom of the box body 100. The coolant flows through the cooling liquid flow channel 120 to cool the components to be cooled thereon. Furthermore, in this embodiment, circulating cooling water is used to cool the components to be cooled. Thus, the cooling liquid flow channel 120 includes an inlet channel 121 and an outlet channel 122. A baffle 123 is provided between the inlet channel 121 and the outlet channel 122. The baffle 123 is provided with a connecting groove. The inlet channel 121 and the outlet channel 122 are connected to each other through the connecting groove. Specifically, a liquid inlet nozzle 130 and a liquid outlet nozzle 140 are correspondingly provided on the side walls of the box body 100. The liquid inlet nozzle 130 is connected to the liquid inlet channel 121, and the liquid outlet nozzle 140 is connected to the liquid outlet channel 122. The coolant enters the liquid inlet channel 121 through the liquid inlet nozzle 130, enters the liquid outlet channel 122 through the connecting groove, and then leaves the coolant flow channel 120 through the liquid outlet nozzle 140 to complete the circulation processing of the coolant.

[0034] Specifically, when the reshape liquid cooling device is in the first working state, it is used to cool the first part to be cooled 400. The first part to be cooled 400 is preferably an IGBT module with pin fins 420 (PINFIN), which includes a first substrate 410 and a plurality of pin fins 420. The plurality of pin fins 420 are connected to the first substrate 410. During the cooling operation, the pin fins 420 need to be inserted into the coolant flow channel 120. Therefore, the reshape area 111 is arranged above the liquid outlet channel 122 and is connected to the liquid outlet channel 122. Specifically, the reshape area 111 in this embodiment is preferably a through opening that matches the shape and position of the liquid outlet channel 122 to facilitate contact between the pin fins 420 and the coolant.

[0035] When the modified liquid cooling device is in the first operating state, the first substrate 410 is connected to the frame 210, and the plurality of pin fins 420 are inserted into the interior of the coolant flow channel 120. Furthermore, the frame 210 is provided with at least one first connecting portion 211, through which a connecting member is inserted to connect the frame 210 and the base plate 110. The first connecting portion 211 is preferably a connecting hole, and the connecting member is preferably a screw. Furthermore, in this embodiment, first connecting portions 211 are provided at all four corners of the frame 210, thereby achieving stable connection and fixation of the frame 210.

[0036] In this embodiment, in order to improve the sealing between the flow channel cover plate 150 and the base plate 110 and prevent the coolant from flowing out of the connecting gap between the two, a sealing protrusion 151 is provided on the flow channel cover plate 150. The sealing protrusion 151 is embedded in the coolant flow channel 120 and protrudes toward the coolant flow channel 120. Correspondingly, in order to improve the sealing between the first mold changing part 200 and the base plate 110, the first mold changing part 200 also includes a sealing member 220. When the mold changing liquid cooling device is in the first working state, the sealing member 220 is embedded in the connection between the frame 210 and the base plate 110. Specifically, the sealing member 220 in this embodiment is preferably a rubber ring. When the first mold changing part 200 is connected to the base plate 110, the sealing member 220 can fill the connecting gap between the two. In other embodiments, the sealing member 220 can also be set to other materials or set to other sealing structures, and the present invention does not impose specific restrictions on this.

[0037] Figures 4 to 6 The structure of the liquid cooling device in the second working state is shown. Specifically, when the liquid cooling device is in the second working state, it is used to cool the second component to be cooled 500, which is preferably an IGBT module without a PINFIN structure and includes a second substrate 510.

[0038] When the reshaping liquid cooling device is in the second operating state, the heat conducting plate 310 is fixedly connected to the reshaping area 111 to cover the coolant flow channel 120. The second component to be cooled 500 is supported above the heat conducting plate 310. The heat conducting plate 310 thus isolates the coolant from the second component to be cooled 500, while simultaneously enabling heat exchange between the coolant and the second component to be cooled 500. Specifically, the heat conducting plate 310 is provided with at least one second connecting portion 311. A connecting member passes through the second connecting portion 311 to connect the heat conducting plate 310 and the base plate 110. In this embodiment, the second connecting portion 311 is configured similarly to the first connecting portion 211 and is also passed through and fixed by a connecting member.

[0039] Furthermore, to improve the heat transfer efficiency of the heat conducting plate 310, the second mold change member 300 in this application also includes a heat conducting layer, which is coated on the surface of the heat conducting plate 310. When the liquid cooling device is in the second operating state, the heat conducting layer is bonded to the second substrate 510. The present invention does not limit the specific type of heat conducting layer. Furthermore, the second mold change member 300 in this embodiment also includes a plurality of heat dissipating fins 320. When the liquid cooling device is in the second operating state, the plurality of heat dissipating fins 320 are disposed in the coolant flow channel 120. The heat dissipating fins 320 increase the contact area between the heat dissipating fins 320 and the coolant, thereby increasing the cooling rate.

[0040] In summary, the box body 100 in the present application can be used compatibly during the mold change process, so it only requires one die-casting mold to prepare a box body 100 structure with a compatible effect, which fundamentally reduces the cost of the die-casting mold. In actual use, when different components need to be cooled, there is no need to replace the equipment as a whole or customize special molds. Instead, compatible operations can be achieved only by disassembling and exchanging the first mold changer 200 and the second mold changer 300. Therefore, compared with conventional liquid cooling equipment, the present application has significant advantages such as flexible use, high versatility, reduced production costs, and easy operation, and has broad prospects for use in this industry.

[0041] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will readily appreciate that other variations or modifications based on the above descriptions are possible. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. A liquid cooling device, characterized in that: It has a first working state and a second working state, which includes: A box body, the box body comprising a bottom plate and a flow channel cover plate, a portion of the bottom plate being recessed toward the interior of the box body, the flow channel cover plate being connected to the recessed portion of the bottom plate and forming a coolant flow channel with the recessed portion of the bottom plate, and a change area being further provided on the bottom plate, the change area being in communication with the coolant flow channel and the interior of the box body; a first mold-changing member, the first mold-changing member including a frame, wherein when the mold-changing liquid cooling device is in a first working state, the frame is connected to the mold-changing area, and the first part to be cooled is passed through the frame to the interior of the coolant flow channel; The second mold-changing part includes a heat conducting plate. When the mold-changing liquid cooling device is in the second working state, the heat conducting plate is connected to the mold-changing area and covers the coolant flow channel. The second part to be cooled is connected to the heat conducting plate and fits with the heat conducting plate.

2. The liquid cooling device according to claim 1, characterized in that: The cooling liquid flow channel includes a liquid inlet channel and a liquid outlet channel. A baffle is provided between the liquid inlet channel and the liquid outlet channel. A connecting groove is provided on the baffle. The liquid inlet channel and the liquid outlet channel are connected to each other through the connecting groove.

3. The liquid cooling device according to claim 2, characterized in that: The changing area is arranged above the liquid outlet channel and is communicated with the liquid outlet channel.

4. The liquid cooling device according to claim 2, characterized in that: A liquid inlet nozzle and a liquid outlet nozzle are provided on the side wall of the box body. The liquid inlet nozzle is communicated with the liquid inlet channel, and the liquid outlet nozzle is communicated with the liquid outlet channel.

5. The liquid cooling device according to claim 1, characterized in that: The flow channel cover plate is provided with a sealing protrusion, which is embedded in the coolant flow channel and protrudes toward the coolant flow channel.

6. The liquid cooling device according to claim 1, characterized in that: The first mold-changing component further includes a sealing component. When the mold-changing liquid cooling device is in the first working state, the sealing component is embedded in the connection between the frame and the bottom plate.

7. The liquid cooling device according to claim 1, characterized in that: The first part to be cooled includes a first substrate and a plurality of pin fins, wherein the plurality of pin fins are connected to the first substrate. When the liquid cooling device is in a first working state, the first substrate is connected to the frame, and the plurality of pin fins are inserted into the cooling liquid flow channel.

8. The liquid cooling device according to claim 1, characterized in that: The second change-over component further includes a plurality of heat dissipation fins. When the change-over liquid cooling device is in the second working state, the plurality of heat dissipation fins are arranged in the coolant flow channel.

9. The liquid cooling device according to claim 1, characterized in that: The frame is provided with at least one first connecting portion, and a connecting member passes through the first connecting portion to connect the frame and the base plate; the heat conducting plate is provided with at least one second connecting portion, and a connecting member passes through the second connecting portion to connect the heat conducting plate and the base plate.

10. The liquid cooling device according to claim 1, characterized in that: The second changeable part further includes a heat-conducting layer, which is coated on the surface of the heat-conducting plate; the second part to be cooled includes a second substrate, and when the changeable liquid cooling device is in the second working state, the heat-conducting layer is in contact with the second substrate.

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