U-shaped copper heat pipe fin heat dissipation device

Abstract

The utility model relates to the technical field of medical instruments, in particular to a U-shaped copper heat pipe fin heat dissipation device which comprises a heat conduction plate, a heat dissipation substrate, a heat dissipation piece and a heat conduction pipe. A laser is fixedly connected to the heat conduction plate, the heat dissipation substrate is fixedly connected to the side, away from the laser, of the heat conduction plate, a mounting groove is formed in the side, facing the heat conduction plate, of the heat dissipation substrate, and the heat dissipation piece is fixedly connected to the side, away from the heat conduction plate, of the heat dissipation substrate. One end of the heat conduction pipe is installed in the installation groove, the other end of the heat conduction pipe penetrates through the heat dissipation piece, and the heat conduction pipe is filled with working media. The heat conduction pipe is fully contacted with the heat conduction plate and the heat dissipation substrate, so that heat accumulated near the laser is transferred to the heat dissipation piece. The method has the effect that the temperature is more uniform in the heat dissipation process of the heat dissipation piece.

Description

Technical Field

[0001] The present application relates to the technical field of medical devices, and in particular to a U-shaped copper heat pipe fin heat dissipation device. Background Art

[0002] Laser technology has become an effective means of clinical treatment and a key technology in the development of medical diagnosis. High-power semiconductor lasers have begun to replace traditional gas lasers and solid-state lasers in the medical field due to their advantages such as small size, long life, system stability, and easy integration.

[0003] Among the various key technologies currently used in high-power semiconductor lasers, solving the heat dissipation problem is an extremely critical one. Because high-power semiconductor lasers can generate very high peak power, their electro-optical conversion efficiency is 40%-50%, meaning that 50%-60% of the input electrical energy is converted into heat energy. Therefore, the heat dissipation problem of high-power semiconductor lasers is directly related to the service life of the laser. If the heat dissipation of a high-power semiconductor laser is not good, the temperature of the laser active area will rise rapidly, causing optical catastrophe of the high-power semiconductor laser, or even burning the high-power semiconductor laser.

[0004] Regarding the above-mentioned related technologies, at present, high-power semiconductor lasers are usually cooled by heat conduction through a radiator. During the heat conduction process, the temperature of the radiator is relatively concentrated, and heat is easily accumulated near the high-power semiconductor laser, which will lead to a large temperature difference in the radiator and poor heat dissipation effect. Utility Model Content

[0005] In order to make the temperature of the radiator more uniform during the heat dissipation process, reduce heat accumulation, and improve the heat dissipation effect, the present application provides a U-shaped copper heat pipe fin heat dissipation device.

[0006] The present application provides a U-shaped copper heat pipe fin heat dissipation device adopts the following technical solution:

[0007] A U-shaped copper heat pipe fin heat dissipation device, comprising:

[0008] A heat conducting plate, to which a laser is fixedly connected;

[0009] a heat dissipation substrate, the heat dissipation substrate being fixedly connected to one side of the heat conducting plate, and the heat dissipation substrate having a mounting groove on a side facing the heat conducting plate;

[0010] a heat sink, fixedly connected to a side of the heat dissipation substrate away from the heat conducting plate; and

[0011] A heat pipe has one end mounted in the mounting groove and the other end passed through the heat sink. The heat pipe is filled with a working medium.

[0012] By adopting the above technical solution, the heat generated during the operation of the laser is transferred to the heat sink for dissipation by using the heat conducting plate and the heat dissipation substrate. At the same time, one end of the heat pipe is passed between the heat conducting plate and the heat dissipation substrate, and the other end is located in the heat sink. By utilizing the full contact between the heat conducting pipe and the heat dissipation substrate and the heat transfer of the working medium, the heat accumulated near the laser is transferred to the heat sink, so that the temperature of the heat sink is more uniform during the heat dissipation process, the heat accumulation is reduced, and the heat dissipation effect is improved.

[0013] Optionally, a plurality of the mounting grooves are provided, and a plurality of the heat conducting pipes are also provided. The heat conducting pipes are installed in the mounting grooves one by one, and the heat conducting pipes are in contact with the inner walls of the mounting grooves.

[0014] By adopting the above technical solution and arranging multiple heat pipes, the heat transfer effect is improved and the temperature on the heat sink is more uniform.

[0015] Optionally, a fitting surface is provided on a side of the heat conducting pipe close to the heat conducting plate, and the fitting surface is used to fit with the heat conducting plate.

[0016] By adopting the above technical solution, the contact area between the heat pipe and the heat conducting plate is increased by utilizing the bonding surface, so that the heat conducting effect of the heat pipe is better.

[0017] Optionally, the heat sink is a plurality of parallel heat sink fins, each of the heat sink fins is fixedly connected to the heat sink substrate, and the distance between adjacent heat sink fins is equal. A stretching hole is provided on each of the heat sink fins, and the heat pipe is passed through the stretching hole to be connected to each of the heat sink fins.

[0018] By adopting the above technical solution, a number of parallel heat sink fins are used to increase the heat dissipation area of the heat sink substrate, so that the heat dissipation effect of the heat sink is better. At the same time, the stretching holes on the heat sink fins are used to connect the heat pipe to the heat sink fins, so that the heat conducted by the heat pipe can be directly transferred to the heat sink fins.

[0019] Optionally, a semiconductor refrigeration plate is provided between the laser and the heat conducting plate, and a cooling surface of the semiconductor refrigeration plate is in contact with the laser.

[0020] By adopting the above technical solution, the laser is cooled by using a semiconductor refrigeration sheet, and the heat is transferred to the heat conducting plate at the same time.

[0021] Optionally, a dense-tooth heat sink is fixedly connected to a side of the heat conducting plate away from the heat dissipation substrate, and a bottom surface of the dense-tooth heat sink is in contact with the heat conducting plate.

[0022] By adopting the above technical solution, the dense-tooth heat sink is provided to conduct away excess heat from the front side of the heat conducting plate, further reducing heat accumulation.

[0023] Optionally, an outer shell cover is fixedly connected to the heat conducting plate, and the heat conducting plate, the heat dissipation substrate, the heat dissipation element and the heat conducting pipe are all located in the outer shell cover.

[0024] By adopting the above technical solution, the setting of the outer shell cover protects the internal heat conducting plate, heat dissipation substrate, heat dissipation component and heat conducting pipe.

[0025] Optionally, a ventilation hole is provided on the outer shell cover, and a heat dissipation fan is provided on one side of the outer shell cover.

[0026] By adopting the above technical solution, an air flow channel is formed inside the outer shell by using the vents and the heat dissipation fan, which greatly accelerates the air flow inside the outer shell and quickly brings the heat inside the outer shell to the external environment.

[0027] Optionally, an auxiliary fan is provided on a side of the outer shell away from the heat dissipation fan, and an air outlet of the auxiliary fan faces the heat dissipation element.

[0028] By adopting the above technical solution and utilizing the provision of an auxiliary fan, the air flow in the outer shell is further accelerated.

[0029] Optionally, the surface of the heat conducting plate is coated with thermal grease.

[0030] By adopting the above technical solution, the gaps between the release surfaces are filled with thermal grease, thereby increasing the heat conduction area and achieving a better heat conduction effect.

[0031] In summary, this application includes at least one of the following beneficial technical effects:

[0032] 1. Through the cooperation of the heat conducting plate, laser, heat dissipation substrate, heat sink, heat pipe and working medium, the heat accumulated near the laser is transferred to the heat sink by utilizing the heat transfer between the heat pipe and the working medium. This makes the temperature of the heat sink more uniform during the heat dissipation process, reduces heat accumulation, and thus achieves the effect of improving heat dissipation.

[0033] 2. Through the cooperation of heat dissipation fins and dense-tooth heat dissipation elements, the heat on both sides of the heat conduction plate is dissipated, thereby reducing the heat accumulation of the heat conduction plate;

[0034] 3. Through the cooperation of the outer shell, the cooling fan and the auxiliary fan, the air flow in the outer shell is greatly accelerated, and the heat in the outer shell is quickly brought to the external environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1It is a structural schematic diagram of a U-shaped copper heat pipe fin heat dissipation device in an embodiment of the present application.

[0036] Figure 2 yes Figure 1 Cross-sectional view at AA in the middle.

[0037] Figure 3 This is an exploded view of a U-shaped copper heat pipe fin heat dissipation device in an embodiment of the present application.

[0038] Description of reference numerals:

[0039] 1. Heat conducting plate; 11. Laser; 12. Semiconductor cooling plate; 13. Close-tooth heat sink; 2. Heat sink substrate; 21. Mounting slot; 3. Heat sink; 31. Heat sink fin; 32. Stretching hole; 4. Heat pipe; 41. Fitting surface; 5. Housing cover; 51. Ventilation port; 6. Cooling fan; 7. Auxiliary fan. DETAILED DESCRIPTION

[0040] The following is combined with Figure 1-3 This application is described in further detail.

[0041] The embodiment of the present application discloses a U-shaped copper heat pipe fin heat dissipation device.

[0042] Reference Figure 1-3 A U-shaped copper heat pipe fin heat dissipation device includes a heat conducting plate 1, a heat dissipation substrate 2, a heat sink 3 and a heat conducting pipe 4. A laser 11 is fixedly connected to the heat conducting plate 1, and the heat dissipation substrate 2 is fixedly connected to the side of the heat conducting plate 1 away from the laser 11. The heat dissipation substrate 2 is provided with a mounting groove 21 on the side facing the heat conducting plate 1, and the heat sink 3 is fixedly connected to the side of the heat dissipation substrate 2 away from the heat conducting plate 1. One end of the heat conducting pipe 4 is installed in the mounting groove 21, and the other end is passed through the heat sink 3, and the heat conducting pipe 4 is filled with a working medium. By utilizing the full contact between the heat conducting pipe 4 and the heat conducting plate 1 and the heat dissipation substrate 2, the heat accumulated near the laser 11 is transferred to the heat sink 3, so that the temperature of the heat sink 3 is more uniform during the heat dissipation process, the heat accumulation is reduced, and the heat dissipation effect is improved.

[0043] Both the heat conducting plate 1 and the heat dissipation substrate 2 are made of heat conducting materials. In this embodiment, the heat conducting plate 1 is a copper plate, and the heat dissipation substrate 2 is an aluminum plate. Other heat conducting metals may also be used in other embodiments. In this embodiment, the surface of the heat conducting plate 1 is coated with thermal grease. The thermal grease fills the gaps between the release surfaces, thereby increasing the heat conducting area of the heat conducting plate 1 and achieving better heat conduction effect.

[0044] Multiple mounting slots 21 are provided, and multiple heat pipes 4 are also provided. In this embodiment, five mounting slots 21 are provided, and five heat pipes 4 are also provided. The heat pipes 4 are installed in a one-to-one correspondence within the mounting slots 21, and the heat pipes 4 are in contact with the inner walls of the mounting slots 21. In other embodiments, the number of mounting slots 21 may be four or six, depending on the area of the heat dissipation substrate 2. The number of heat pipes 4 is consistent with the number of mounting slots 21. The arrangement of five heat pipes 4 improves heat transfer and makes the temperature on the heat sink 3 more uniform.

[0045] The heat conducting tubes 4 in this embodiment are thick copper tubes. Each heat conducting tube 4 is riveted into the mounting groove 21 of the heat dissipation substrate 2. After riveting, the heat conducting tubes 4 are polished so that a bonding surface 41 is provided on the side of the heat conducting tube 4 close to the heat conducting plate 1. The bonding surface 41 is completely bonded to the heat conducting plate 1. The bonding surface 41 increases the contact area between the heat conducting tube 4 and the heat conducting plate 1, thereby improving the heat conduction effect of the heat conducting tube 4.

[0046] The working medium in the heat pipe 4 is a volatile liquid, for example, condensate as a heat exchange medium. The working medium begins to evaporate after being heated near one end of the heat conducting plate 1. The steam is transported to the heat sink 3 with the latent heat of vaporization, and then releases the latent heat of vaporization. The condensate is returned to the other end of the heat conducting plate 1 by the action of capillary pumping force, completing a cycle, thereby achieving efficient transfer of heat energy.

[0047] The heat sink 3 is a plurality of parallel heat sink fins 31. In this embodiment, the number of heat sink fins 31 is 45. Each heat sink fin 31 is fixedly connected to the heat sink substrate 2, and the distance between adjacent heat sink fins 31 is equal. A stretching hole 32 is opened at the end of each heat sink fin 31 away from the heat sink substrate 2. The heat pipe 4 is passed through the stretching hole 32 to connect the heat pipe 4 to each heat sink fin 31 and transfer heat to the end away from the heat sink substrate 2.

[0048] The heat dissipation area of the heat dissipation substrate 2 is increased by using the parallelly arranged heat dissipation fins 31, so that the heat dissipation effect of the heat dissipation element 3 is better. At the same time, the stretching holes 32 on the heat dissipation fins 31 are used to connect the heat pipe 4 to the heat dissipation fins 31, so that the heat conducted by the heat pipe 4 can be directly transferred to the heat dissipation fins 31 with a lower temperature away from the heat dissipation substrate 2, so that the temperature of the heat dissipation fins 31 is more balanced, thereby achieving better heat dissipation effect.

[0049] In an optional embodiment, a semiconductor refrigeration plate 12 is provided between the laser 11 and the heat conducting plate 1, and the cooling surface of the semiconductor refrigeration plate 12 is in contact with the laser 11. The semiconductor refrigeration plate 12 is used to cool the laser 11 and transfer heat to the heat conducting plate 1 at the same time.

[0050] A dense-tooth heat sink 13 is fixedly connected to the side of the heat conducting plate 1 away from the heat dissipation substrate 2. In this embodiment, the dense-tooth heat sink 13 comprises a plurality of densely toothed aluminum plates or blocks, with the bottom surface of the dense-tooth heat sink 13 in contact with the heat conducting plate 1. The dense-tooth heat sink 13 dissipates excess heat from the front of the heat conducting plate 1, further reducing heat accumulation.

[0051] The heat conducting plate 1 is fixedly connected to a housing cover 5. The heat conducting plate 1, heat dissipation substrate 2, heat sink 3, heat pipe 4, and dense-tooth heat sink 13 are all located within the housing cover 5. The housing cover 5 protects the heat conducting plate 1, heat dissipation substrate 2, heat sink 3, and heat pipe 4 inside, preventing other parts from contacting or squeezing the heat dissipation structure, which could cause deformation of the heat dissipation structure.

[0052] At the same time, a ventilation hole 51 is opened on the outer shell cover 5, and a high-power cooling fan 6 is provided on one side of the outer shell cover 5. The air inlet of the cooling fan 6 is oriented toward the gap between the cooling fins 31 and the dense-tooth heat sink 13, so that the flowing air driven by the cooling fan 6 can pass through the largest surface area of the cooling fins 31 and the dense-tooth heat sink 13, so that the cooling effect of the cooling fins 31 and the dense-tooth heat sink 13 is better.

[0053] The ventilation opening 51 and the heat dissipation fan 6 form an air flow channel inside the outer shell 5, which greatly accelerates the air flow inside the outer shell 5 and quickly brings the heat inside the outer shell 5 to the external environment.

[0054] In an optional embodiment, a high-power auxiliary fan is provided on the side of the outer cover 5 away from the cooling fan 6, with the air outlet of the auxiliary fan facing the gap between the cooling fins 31. The provision of the auxiliary fan further accelerates the air flow within the outer cover 5 and also increases the air flow rate in the gap between the cooling fins 31, thereby achieving a better heat dissipation effect.

[0055] The implementation principle of a U-shaped copper heat pipe fin heat sink in the embodiment of the present application is as follows: the heat generated during the operation of the laser 11 is cooled by the semiconductor refrigeration sheet 12, and at the same time, the semiconductor refrigeration sheet 12 transfers the heat to the heat dissipation fins 31 and the dense-tooth heat sink 13 through the heat conduction plate 1 and the heat conduction pipe 4 for heat dissipation. In order to reduce the heat accumulation at the heat conduction plate 1 and the heat dissipation substrate 2, one end of the heat conduction pipe 4 is inserted between the heat conduction plate 1 and the heat dissipation substrate 2, and the other end is located in the heat dissipation fins 31. By utilizing the full contact between the heat conduction pipe 4 and the heat dissipation substrate 2, and then utilizing the heat transfer of the working medium, the heat accumulated near the laser 11 is transferred to the heat sink 3, so that the temperature of the heat sink 3 is more uniform during the heat dissipation process, reducing heat accumulation and improving the heat dissipation effect.

[0056] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A U-shaped copper heat pipe fin heat dissipation device, characterized in that: include: A heat conducting plate (1), wherein a laser (11) is fixedly connected to the heat conducting plate (1); a heat dissipation substrate (2), the heat dissipation substrate (2) being fixedly connected to one side of the heat conducting plate (1), and a mounting groove (21) being provided on a side of the heat dissipation substrate (2) facing the heat conducting plate (1); a heat sink (3) fixedly connected to a side of the heat dissipation substrate (2) away from the heat conducting plate (1); and A heat conducting pipe (4) has one end mounted in the mounting groove (21) and the other end passed through the heat dissipating element (3); the heat conducting pipe (4) is filled with a working medium.

2. The U-shaped copper heat pipe fin heat dissipation device according to claim 1, characterized in that: A plurality of the installation grooves (21) are provided, and a plurality of the heat conducting pipes (4) are also provided. The heat conducting pipes (4) are installed in the installation grooves (21) in a one-to-one correspondence, and the heat conducting pipes (4) are in contact with the inner wall of the installation groove (21).

3. The U-shaped copper heat pipe fin heat dissipation device according to claim 1, characterized in that: The heat conducting pipe (4) is provided with a fitting surface (41) on one side close to the heat conducting plate (1), and the fitting surface (41) is used to fit the heat conducting plate (1).

4. The U-shaped copper heat pipe fin heat dissipation device according to claim 1, characterized in that: The heat sink (3) is a plurality of parallel heat sink fins (31), each of the heat sink fins (31) is fixedly connected to the heat sink substrate (2), and the distance between adjacent heat sink fins (31) is equal. A stretching hole (32) is provided on each of the heat sink fins (31), and the heat pipe (4) is passed through the stretching hole (32) to be connected to each of the heat sink fins (31).

5. The U-shaped copper heat pipe fin heat sink according to claim 1, characterized in that: A semiconductor refrigeration plate (12) is provided between the laser (11) and the heat conducting plate (1), and a cooling surface of the semiconductor refrigeration plate (12) is in contact with the laser (11).

6. The U-shaped copper heat pipe fin heat sink according to claim 1, characterized in that: A dense-tooth heat sink (13) is fixedly connected to the side of the heat conducting plate (1) away from the heat dissipation substrate (2), and the bottom surface of the dense-tooth heat sink (13) is in contact with the heat conducting plate (1).

7. The U-shaped copper heat pipe fin heat sink according to any one of claims 1 to 6, characterized in that: An outer shell (5) is fixedly connected to the heat conducting plate (1); the heat conducting plate (1), the heat dissipation substrate (2), the heat dissipation element (3) and the heat conducting pipe (4) are all located inside the outer shell (5).

8. The U-shaped copper heat pipe fin heat sink according to claim 7, characterized in that: A vent (51) is provided on the outer shell cover (5), and a heat dissipation fan (6) is provided on one side of the outer shell cover (5).

9. The U-shaped copper heat pipe fin heat sink according to claim 8, characterized in that: An auxiliary fan (7) is provided on a side of the outer shell (5) away from the heat dissipation fan (6), and an air outlet of the auxiliary fan (7) faces the heat dissipation element (3).

10. The U-shaped copper heat pipe fin heat sink according to claim 1, characterized in that: The surface of the heat conducting plate (1) is coated with thermal grease.

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