De-tinning device for semiconductor device

Abstract

The utility model provides a semiconductor device detinning device which comprises a heating unit, a detinning unit, a cooling unit and a filter screen, when the semiconductor device detinning device works, the heating unit heats the detinning unit to enable the temperature of the detinning unit to enable soldering tin to be melted, and a semiconductor device to be detinned is placed on the detinning unit. And the tin removing unit falls into the first hole body of the heating unit through the drainage hole after being heated and melted, and then falls into the second hole body below through the first hole body. And after entering the second hole body, the soldering tin is cooled and solidified into a solid which is blocked by the filter screen. The heating unit, the detinning unit, the cooling unit and the filter screen act together, soldering tin on the pins of the semiconductor device can be effectively removed, the soldering tin is removed in a high-temperature melting mode, the detinning effect is good, and the detinning efficiency is high. And the cooling unit and the filter screen are arranged below the heating unit, so that the removed soldering tin can be collected, and double benefits are achieved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor welding, and in particular relates to a tin removal device for semiconductor devices. Background Art

[0002] Semiconductor devices require soldering to PCBs during both application-side use and reliability testing at the packaging and testing facility to achieve their specific functions. This operation makes it difficult to quickly and effectively remove solder from semiconductor device pins and pads during application-side troubleshooting, leading to prolonged troubleshooting and misjudgment. It also causes significant discrepancies in data before and after reliability testing at the packaging and testing facility, leading to false positives.

[0003] In the existing technology, sandpaper friction or tin-wicking tape is often used to remove solder from the pins of semiconductor devices. However, sandpaper friction can easily cause ESD failure of semiconductor devices (referring to damage or performance degradation of electronic devices during electrostatic discharge). Tin-wicking tape is used to manually heat the pins with a hot air blower so that the solder on the pins no longer adheres to the pins. The molten tin is then sucked away by the tin-wicking tape. The operation is inefficient and easily leaves residue. The two common solder removal methods mentioned above in the existing technology are actually not effective in removing tin, and cannot effectively remove the solder on the sides of semiconductor devices, which affects the accuracy of semiconductor device test data. Utility Model Content

[0004] The utility model provides a device for removing tin from semiconductor devices, aiming to solve the problem that the soldering tin on semiconductor devices is not completely removed in the prior art.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is to provide a semiconductor device detinning device, comprising:

[0006] The heating unit has a first hole extending through the thickness of the heating unit in the vertical direction;

[0007] a desoldering unit, disposed above the heating unit, the desoldering unit having a plurality of drainage holes extending through the thickness of the unit, at least some of the drainage holes being in communication with the first hole body;

[0008] The cooling unit has a second hole extending through the thickness of the cooling unit in a vertical direction, the second hole being connected to the first hole in vertical connection; and

[0009] The filter screen is arranged at the lower end of the second hole body.

[0010] In one possible implementation, a heating cavity is formed in the interior of the heating unit, and the heating unit is provided with a first liquid inlet and a first liquid outlet, the first liquid inlet and the first liquid outlet are respectively connected to the heating cavity, and the heating cavity is arranged around the first hole body.

[0011] In a possible implementation, a plurality of the first hole bodies and the second hole bodies are provided in a one-to-one correspondence, and the top end of the first hole body is connected to the corresponding drainage hole.

[0012] In one possible implementation, a cooling cavity is formed in the interior of the cooling unit, and the cooling unit is provided with a second liquid inlet and a second liquid outlet, the second liquid inlet and the second liquid outlet are respectively connected to the cooling cavity, and the cooling cavity is arranged around the second hole body.

[0013] In a possible implementation, the semiconductor desoldering device further includes an air extraction unit, and the air extraction unit is provided on a side of the filter screen facing away from the desoldering unit.

[0014] In a possible implementation, the diameter of the drainage hole is less than or equal to 0.5 mm.

[0015] In a possible implementation, the desoldering unit is detachably connected to the heating unit.

[0016] In a possible implementation, the cooling unit is in the shape of a truncated cone or a prism that is thicker at the bottom and thinner at the top.

[0017] In a possible implementation, the filter is detachably disposed at the bottom of the cooling unit.

[0018] In a possible implementation, the semiconductor device desoldering apparatus further includes a transfer unit, which is used to move the semiconductor device to the desoldering unit and transfer the semiconductor device on the desoldering unit to another location.

[0019] Compared with the prior art, the semiconductor device detinning device provided by the present invention has the following beneficial effects:

[0020] The present invention provides a semiconductor device desoldering device comprising a heating unit, a desoldering unit, a cooling unit, and a filter. The desoldering unit is disposed above the heating unit and has a drainage hole. A first hole in the heating unit and a second hole in the cooling unit form a flow channel extending vertically. The filter is disposed at the bottom of the flow channel to block solid matter. During operation, the heating unit heats the desoldering unit to a temperature sufficient to melt the solder. The semiconductor device to be desoldered is placed on the desoldering unit. The desoldering unit melts due to the heat and then falls from the first hole into the second hole below. After entering the second hole, the solder solidifies upon cooling and is blocked by the filter. The heating unit, desoldering unit, cooling unit, and filter work together to effectively remove solder from the pins of semiconductor devices. The high-temperature melting method used to remove the solder provides excellent desoldering effectiveness and efficiency. The cooling unit and filter provided below the heating unit allow the removed solder to be collected, achieving two goals at once. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic structural diagram of the semiconductor device detinning device provided by the utility model;

[0022] Figure 2 This is an exploded view of the assembly of the semiconductor device desoldering device provided by the utility model.

[0023] Description of reference numerals:

[0024] 1. Semiconductor device detinning device; 10. Heating unit; 11. First aperture; 12. First liquid inlet; 13. First liquid outlet; 20. Detinning unit; 21. Drainage hole; 30. Cooling unit; 31. Second aperture; 32. Second liquid inlet; 33. Second liquid outlet; 40. Filter; 50. Vacuum unit; DETAILED DESCRIPTION

[0025] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0026] It should be noted that when an element is referred to as being "fixed to," "fixed," or "fixedly disposed" on another element, it may be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected to," "connected to" another element, it may be directly connected to the other element or there may also be an intermediate element. When an element is referred to as being "set on," "disposed on" another element, it may be directly on the other element or there may also be an intermediate element. "Multiple" refers to two or more. "At least one" refers to one or more. "Several" refers to one or more.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

[0028] The embodiment of the utility model provides a semiconductor device detinning device 1, which aims to solve the problem of incomplete detinning of solder on semiconductor devices in the prior art.

[0029] Please also refer to Figure 1 and Figure 2 The following describes the semiconductor device detinning device 1 provided by the embodiment of the present invention. Figure 1 This is a structural diagram of the semiconductor device detinning device 1 provided by the utility model; Figure 2 This is an exploded view of the assembly of the semiconductor device desoldering device 1 provided by the present invention.

[0030] The semiconductor device detinning device 1 includes a heating unit 10, a detinning unit 20, a cooling unit 30 and a filter 40. The heating unit 10 has a first hole 11 that penetrates its thickness in the up-down direction; the detinning unit 20 is arranged above the heating unit 10, and the detinning unit 20 has a plurality of drainage holes 21 that penetrate its thickness, and at least some of the drainage holes 21 are connected to the first hole 11; the cooling unit 30 has a second hole 31 that penetrates its thickness in the up-down direction, and the second hole 31 is connected to the first hole 11 in the up-down direction; the filter 40 is arranged at the lower end of the second hole 31.

[0031] Compared with the prior art, the semiconductor device detinning device 1 provided by the embodiment of the present invention has the following beneficial effects:

[0032] The semiconductor device detinning device 1 provided by the embodiment of the present invention includes a heating unit 10, a detinning unit 20, a cooling unit 30 and a filter 40. The detinning unit 20 is arranged above the heating unit 10 and has a drainage hole 21. The first hole 11 of the heating unit 10 and the second hole 31 of the cooling unit 30 form a flow channel that runs through from top to bottom. The filter 40 is arranged at the bottom of the flow channel and can block solid matter. During operation, the heating unit 10 heats the detinning unit 20 so that the temperature of the detinning unit 20 can melt the solder. The semiconductor device to be detinned is placed on the detinning unit 20. After the detinning unit 20 is heated and melted, it falls from the drainage hole 21 into the first hole 11 of the heating unit 10, and then falls from the first hole 11 into the second hole 31 below. After entering the second hole 31, the solder solidifies into a solid when it is cooled and is blocked by the filter 40. The heating unit 10, the desoldering unit 20, the cooling unit 30, and the filter 40 of the present invention work together to effectively remove solder from the pins of semiconductor devices. The removal of solder by high-temperature melting achieves excellent desoldering efficiency. The cooling unit 30 and the filter 40 are disposed below the heating unit 10 to collect the removed solder, achieving two goals at once.

[0033] In the embodiment of the present invention, the desoldering unit 20 is a plate having a plurality of liquid absorbing holes. When the solder is heated and melted, the solder can flow from the pins of the semiconductor device into the liquid absorbing holes. To facilitate the flow of solder, the desoldering unit 20 can be made of a metal composite material with good compatibility with solder.

[0034] like Figure 1 As shown, the detinning unit 20 can be in the shape of a thin plate (such as a PCB board with a thickness of 0.254mm), with uniform through holes distributed on the surface. The diameter of the through holes can be less than or equal to 0.5mm, which is convenient for the absorption of molten solder. After the detinning unit 20 has been used for a period of time, the detinning effect will be reduced. At this time, a new detinning unit 20 can be replaced. In order to facilitate the replacement of the detinning unit 20, the detinning unit 20 and the heating unit 10 can be fixed by screw connection, riveting, etc. The drainage holes 21 on the detinning unit 20 can be evenly distributed, or can be set corresponding to the first hole body 11 above and below.

[0035] The heating unit 10 is used to heat the desoldering unit 20 to a temperature sufficient to melt the solder (e.g., 250°C). The specific structure of the heating unit 10 is not limited; the heating unit 10 may be a heating plate, a heating wire, a heating block with thermal oil flowing therein, or the like, as long as it can heat the desoldering unit 20 to the desired temperature.

[0036] The cooling unit 30 is used to cool the molten solder to turn it into a solid. The solid solder will eventually fall onto the filter 40 below. The solder is collected by the filter 40 and can be reused, saving materials.

[0037] The cooling unit 30 is positioned below the heating unit 10. To prevent mutual interference between the two, thermal insulation material can be placed between the cooling unit 30 and the heating unit 10 to isolate heat transfer. The aperture of the filter 40 is not limited; it only needs to be able to block solid solder. To facilitate the removal of solder collected by the filter 40, the filter 40 can be detachably connected to the cooling unit 30 using magnetic attraction, screw fixation, or snap fastening.

[0038] See also Figure 1 and Figure 2 In some possible embodiments, a heating cavity is formed in the interior of the heating unit 10 , and the heating unit 10 is provided with a first liquid inlet 12 and a first liquid outlet 13 . The first liquid inlet 12 and the first liquid outlet 13 are respectively connected to the heating cavity, and the heating cavity is arranged around the first hole 11 .

[0039] In this embodiment, the heating unit 10 is a hollow block. The heating unit 10 can be made of a heat-conducting material such as aluminum or copper and anodized. The first liquid inlet 12 and the first liquid outlet 13 are connected to heat transfer pipes, allowing the input of high-temperature liquids (such as thermal oil, brake fluid, etc.).

[0040] Metal tubes are provided inside the heating unit 10 and the cooling unit 30 described below to form the first hole 11 and the second hole 31. The metal material can be a metal with poor solder compatibility to prevent solder from adhering to the inner wall of the hole.

[0041] There is no limitation on the diameters of the first hole 11 and the second hole 31 , and they can be, for example, 3 mm, 4 mm, etc.

[0042] See also Figure 1 and Figure 2 In some possible embodiments, a plurality of first holes 11 and second holes 31 are provided in a one-to-one correspondence, and the top of the first hole 11 is connected to the corresponding drainage hole 21.

[0043] The first holes 11 and the second holes 31 are connected one by one in the upper and lower directions. For ease of manufacture, the first holes 11 and the second holes 31 can be formed from the same metal tube. Of course, the first holes 11 and the second holes 31 can also be made of different tubes. The first holes 11 and the second holes 31 can be arranged in a circular, rectangular, or other arrangement.

[0044] See also Figure 1 and Figure 2In some possible embodiments, the cooling unit 30 is hollowed out to form a cooling cavity. The cooling unit 30 is provided with a second liquid inlet 32 and a second liquid outlet 33, each of which is in communication with the cooling cavity. The cooling cavity is disposed around the second hole 31. The removed solder condenses into a solid after passing through the metal tube wrapped around the cooling unit.

[0045] In this embodiment, a cooling cavity is formed inside the cooling unit 30 , and the second liquid inlet 32 and the second liquid outlet 33 are respectively connected to the refrigerant delivery pipeline. The refrigerant can be water or other liquids that can solidify the solder after passing through the cooling unit 30 .

[0046] See also Figure 1 and Figure 2 In some possible embodiments, the semiconductor desoldering device further includes an exhaust unit 50, which is disposed on a side of the filter screen 40 facing away from the desoldering unit 20. The exhaust unit 50 includes an air suction plate and a vacuum suction device. The air suction plate has air suction holes corresponding one-to-one with the second holes 31. The vacuum suction device is connected to the air suction holes via a gas delivery pipe. When the air pump of the vacuum suction device is in operation, it can generate vacuum suction force, which is sucked into the first hole 11 from the drainage hole 21 through the air suction holes, the second hole 31, and the first hole 11, so that the solder falls off from the desoldering unit 20.

[0047] The suction plate is flat, with suction holes running through it. Gas delivery pipes are set up one-to-one with the suction holes and can be connected to the suction holes using airtight joints. Given sufficient power, multiple gas delivery pipes can be supplied with suction force by a single vacuum suction device.

[0048] In order to avoid air leakage, a sealing gasket can be provided between the air suction plate and the cooling unit 30 to ensure good air tightness.

[0049] See also Figure 1 and Figure 2 In some possible embodiments, the cooling unit 30 is in the shape of a truncated cone or a prism that is thicker at the bottom and thinner at the top.

[0050] See also Figure 1 and Figure 2 In some possible embodiments, the filter 40 is detachably disposed at the bottom of the cooling unit 30 for easy installation and fixation.

[0051] See also Figure 1 and Figure 2 In some possible embodiments, the semiconductor device desoldering apparatus 1 further includes a transfer unit, which is used to move the semiconductor device to the desoldering unit 20 and transfer the semiconductor device on the desoldering unit 20 to other locations.

[0052] The specific structure of the transfer unit is not limited and can be a conventional semiconductor device transfer device, such as a multi-axis robotic arm. The transfer unit uses mechanical gripping and vacuum suction to pick up and release semiconductor devices. The semiconductor device to be desoldered is placed on the desoldering unit 20. After the solder is completely melted and removed, the desoldered semiconductor device is removed from the desoldering unit 20.

[0053] It can be understood that the various parts in the above embodiments can be freely combined or deleted to form different combination embodiments. The specific contents of each combination embodiment will not be repeated here. After this description, it can be considered that the specification of the utility model has recorded various combination embodiments and can support different combination embodiments.

[0054] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor device detinning device, characterized in that: include: The heating unit (10) has a first hole (11) extending through the thickness of the heating unit in the vertical direction; a desoldering unit (20) disposed above the heating unit (10), the desoldering unit (20) having a plurality of drainage holes (21) extending through the thickness of the desoldering unit (20), at least some of the drainage holes (21) being in communication with the first hole body (11); The cooling unit (30) has a second hole (31) extending through the thickness of the cooling unit in the vertical direction, the second hole (31) being connected to the first hole (11) in the vertical direction; and The filter screen (40) is provided at the lower end of the second hole body (31).

2. The semiconductor device desoldering device according to claim 1, characterized in that: The heating unit (10) is hollow inside to form a heating cavity. The heating unit (10) is provided with a first liquid inlet (12) and a first liquid outlet (13). The first liquid inlet (12) and the first liquid outlet (13) are respectively connected to the heating cavity. The heating cavity is arranged around the first hole (11).

3. The semiconductor device desoldering device according to claim 1, characterized in that: A plurality of the first hole bodies (11) and the second hole bodies (31) are provided in a one-to-one correspondence, and the top end of the first hole body (11) is communicated with the corresponding drainage hole (21).

4. The semiconductor device desoldering device according to claim 1, wherein: The cooling unit (30) is hollow inside to form a cooling cavity. The cooling unit (30) is provided with a second liquid inlet (32) and a second liquid outlet (33). The second liquid inlet (32) and the second liquid outlet (33) are respectively connected to the cooling cavity. The cooling cavity is arranged around the second hole (31).

5. The semiconductor device desoldering device according to claim 1, wherein: The semiconductor detinning device further comprises an air extraction unit (50), and the air extraction unit (50) is arranged on a side of the filter screen (40) facing away from the detinning unit (20).

6. The semiconductor device desoldering device according to claim 1, characterized in that: The diameter of the drainage hole (21) is less than or equal to 0.5 mm.

7. The semiconductor device desoldering device according to claim 1, characterized in that: The desoldering unit (20) is detachably connected to the heating unit (10).

8. The semiconductor device desoldering device according to claim 1, wherein: The cooling unit (30) is in the shape of a cone or prism with a thicker bottom and a thinner top.

9. The semiconductor device desoldering device according to claim 1, characterized in that: The filter screen (40) is detachably arranged at the bottom of the cooling unit (30).

10. The semiconductor device desoldering device according to claim 1, characterized in that: The semiconductor device desoldering device further comprises a transfer unit, which is used to move the semiconductor device to the desoldering unit (20) and transfer the semiconductor device on the desoldering unit (20) to another location.

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