Wafer bearing structure, wafer grinding device and wafer grinding equipment

Abstract

The utility model discloses a wafer bearing structure, a wafer grinding device and wafer grinding equipment, and relates to the technical field of semiconductor chip production equipment. The wafer bearing structure comprises a bearing disc, a plurality of grooves are formed in the surface of the bearing disc, wafer bearing areas and peripheral areas are arranged in the grooves, the peripheral areas are annularly arranged on the outer peripheries of the wafer bearing areas, and the grooves and the bearing disc are integrated. According to the wafer bearing structure provided by the invention, the overflowing wax liquid is received through the arrangement of the groove, and wax absorbing paper is not needed.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor chip production equipment, and in particular to a wafer supporting structure, a wafer grinding device and a wafer grinding device. Background Art

[0002] Before grinding and polishing, sapphire chips need to be waxed. During the waxing process, the surface of the pressure head is usually covered with wax-absorbing paper. As the pressure head descends and pressurizes, the wax-absorbing paper absorbs the overflowing liquid wax.

[0003] The use of wax blotting paper increases process steps and costs. Utility Model Content

[0004] In view of this, the present application provides a wafer supporting structure, a wafer grinding device and a wafer grinding equipment, the purpose of which is to solve one of the technical problems in the prior art.

[0005] To achieve the above objectives, the technical solutions adopted in this application are as follows:

[0006] In a first aspect, an embodiment of the present application provides a wafer supporting structure, comprising:

[0007] A carrier plate is provided with a plurality of grooves on its surface, wherein a wafer carrying area and a peripheral area are provided in the grooves, and the peripheral area is arranged around the outer periphery of the wafer carrying area, and the grooves and the carrier plate form an integrated carrier plate.

[0008] In one embodiment of the first aspect, the bottom of the groove is a plane, the wafer carrying area is arranged in the middle of the bottom of the groove, and the peripheral area is arranged around the outer periphery of the wafer carrying area.

[0009] In one embodiment of the first aspect, the groove comprises:

[0010] a first groove body, the first groove body being formed by being recessed from the surface of the carrier plate;

[0011] The second trough body is formed by being recessed from the bottom of the first trough body, and the bottom area of the second trough body is smaller than the bottom area of the first trough body. The chip carrying area is arranged in the second trough body, and the peripheral area is arranged in the first trough body and surrounds the chip carrying area.

[0012] In one embodiment of the first aspect, the connection between the groove wall and the groove bottom of the first groove body is in an arc shape.

[0013] In one embodiment of the first aspect, the groove comprises:

[0014] The third trough is formed by being recessed inward from the surface of the carrier, and the wafer carrying area is arranged in the third trough.

[0015] In one embodiment of the first aspect, the groove further comprises:

[0016] A fourth trough body is arranged around the wafer carrying area.

[0017] In one embodiment of the first aspect, a bottom area of the fourth trough body is smaller than a bottom area of the wafer supporting area.

[0018] In one embodiment of the first aspect, the longitudinal cross-section of the fourth trough body is any one of U-shaped, arc-shaped, and trapezoidal.

[0019] In a second aspect, an embodiment of the present application further provides a wafer grinding device, comprising:

[0020] The wafer supporting structure in any of the above embodiments;

[0021] The pressurizing mechanism comprises a pressurizing head, which is arranged relative to the wafer supporting structure, and the notch of the groove faces the pressurizing head.

[0022] In a third aspect, an embodiment of the present application further provides a wafer grinding device, comprising the wafer supporting structure in any of the above embodiments, or the wafer grinding device in any of the above embodiments.

[0023] Compared with the prior art, the beneficial effects of the present application are as follows: the present application proposes a chip carrying structure, comprising a carrier plate, a plurality of grooves being provided on the surface of the carrier plate, a chip carrying area and a peripheral area being provided in the grooves, the peripheral area being arranged around the outer periphery of the chip carrying area, the grooves and the carrier plate being an integrated carrier plate, so that the overflowed wax liquid flows to the peripheral area surrounding the peripheral side of the chip carrying area, eliminating the process of using wax absorbing paper to suck out excess wax liquid on the edge before the pressed wax is cooled, thereby simplifying the process steps and reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 It shows one of the structural schematic diagrams of the wafer supporting structure in some embodiments of the present application;

[0026] Figure 2It shows one of the cross-sectional structural schematic diagrams of the wafer supporting structure in some embodiments of the present application;

[0027] Figure 3 A second structural diagram of a wafer supporting structure in some embodiments of the present application is shown;

[0028] Figure 4 The second schematic diagram of the cross-sectional structure of the wafer supporting structure in some embodiments of the present application is shown;

[0029] Figure 5 The third structural diagram of the wafer supporting structure in some embodiments of the present application is shown;

[0030] Figure 6 The third schematic diagram of the cross-sectional structure of the wafer supporting structure in some embodiments of the present application is shown;

[0031] Figure 7 A schematic diagram of the assembly structure of a wafer supporting structure and a pressure head in some embodiments of the present application is shown.

[0032] Explanation of the main component symbols: 100-chip carrying structure; 110-carrying plate; 120-groove; 130-chip; 121-chip carrying area; 122-peripheral area; 123-first trough body; 124-second trough body; 125-third trough body; 126-fourth trough body; 1000-chip grinding device; 200-pressure head. DETAILED DESCRIPTION

[0033] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0034] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0036] In this application, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components or interactions between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on specific circumstances.

[0037] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0038] To increase the brightness of the wafer, the wafer substrate often needs to be ground and thinned during the production process. Generally, industrial wax is used to fix the complete wafer on the wafer carrier and then ground. During the waxing process, excess wax is absorbed with wax paper.

[0039] For example, before grinding and polishing, the sapphire chip needs to be fixed on a ceramic plate, the wax is melted at high temperature and then dripped onto the surface of the sapphire chip, and the surface of the pressure head is covered with wax-absorbing paper. During the process of the pressure head descending and applying pressure, the wax-absorbing paper absorbs the overflowing liquid wax.

[0040] like Figure 1 and Figure 2 As shown, an embodiment of the present application provides a wafer supporting structure 100 , including a carrier plate 110 , which is mainly used to fix a wafer 130 and perform a waxing process on the wafer 130 .

[0041] The surface of the carrier plate 110 is formed with a plurality of grooves 120. The grooves 120 define a wafer-carrying area 121 and a peripheral area 122. The peripheral area 122 is disposed around the periphery of the wafer-carrying area 121. This allows the wafer 130 to be securely placed on the wafer-carrying area 121. During the waxing process, any excess wax flowing out of the waxing process flows into the peripheral area 122 surrounding the wafer-carrying area 121. This eliminates the need to use wax paper to absorb excess wax from the edges before the wax is cooled, simplifying the process and reducing costs.

[0042] The grooves 120 and the carrier plate 110 are integrated into one. In some embodiments, the notches of the grooves 120 are flush with the carrier plate 110, and the plurality of grooves 120 are evenly distributed along the circumference, which is conducive to uniform force on the wafer 130 on the carrier plate 110.

[0043] For example, Figure 1 、 Figure 3 and Figure 5 As shown, the number of the grooves 120 is respectively 5, 3 and 7. In the actual production process, the number of the grooves 120 can be set as needed and there is no special limitation.

[0044] In some embodiments, the carrier plate 110 is made of metal or ceramic.

[0045] In some embodiments, as Figure 1 and Figure 2 As described above, the bottom of the groove 120 is flat, the wafer carrying area 121 is arranged in the middle of the bottom of the groove 120 , and the peripheral area 122 is arranged around the outer periphery of the wafer carrying area 121 . Such a structure simplifies the processing steps of the groove 120 .

[0046] After the waxing process is completed, the wafer 130 is removed from the groove 120 and the bottom of the groove 120 is wiped with alcohol cotton to remove the overflowed wax liquid. Of course, the overflowed wax liquid can also be collected with a tool so that the wax liquid can be recycled to reduce costs.

[0047] In one embodiment, the connection between the groove wall and the groove bottom of the groove 120 is rounded so that the connection between the groove wall and the groove bottom of the groove 120 is in an arc shape, which facilitates the above-mentioned wiping cleaning and wax liquid recovery operations.

[0048] In some embodiments, as Figure 3 and Figure 4 As shown, the groove 120 includes a first groove body 123 and a second groove body 124 .

[0049] The first slot body 123 and the second slot body 124 are distributed in a stepped manner, and the size of the first slot body 123 is larger than that of the second slot body 124 .

[0050] Specifically, the first trough body 123 is formed by being recessed inward from the surface of the carrier plate 110, and the second trough body 124 is formed by being recessed inward from the bottom of the first trough body 123; and the bottom area of the second trough body 124 is smaller than the bottom area of the first trough body 123, the chip carrying area 121 is set in the second trough body 124, and the peripheral area 122 is set in the first trough body 123 and surrounds the chip carrying area 121.

[0051] The wafer carrying area 121 is disposed in the second trough 124 , and the peripheral area 122 is disposed in the first trough 123 , so that the wafer 130 is placed in the second trough 124 and the overflowed wax liquid flows to the bottom of the first trough 123 .

[0052] In some embodiments, the connection between the groove wall and the groove bottom of the first groove body 123 is arc-shaped, which facilitates the above-mentioned wiping cleaning and wax liquid recovery operations.

[0053] In some embodiments, as Figure 5 and Figure 6 As shown, the groove 120 includes a third groove body 125 and a fourth groove body 126 .

[0054] The third trough 125 is recessed from the surface of the carrier plate 110. The wafer-carrying area 121 is disposed within the third trough 125, and the wafer is placed within the third trough 125. The fourth trough 126 surrounds the wafer-carrying area 121. The bottom area of the fourth trough 126 is smaller than the bottom area of the wafer-carrying area 121.

[0055] In some embodiments, the fourth trough 126 is formed by extending and bending from the outer edge of the wafer supporting area 121 upward and away from the wafer supporting area 121 , so that the overflowed wax liquid flows into the fourth trough 126 .

[0056] In some embodiments, the longitudinal section of the second tank body 124 is any one of a U-shape, an arc shape, and a trapezoidal shape, which is convenient for storing the overflowed wax liquid and also convenient for the above-mentioned wiping cleaning and wax liquid recovery operations. Figure 2 、 Figure 4 and Figure 6 As shown, the wafer carrying area 121 is circular, the diameter of the wafer carrying area 121 is D1, the peripheral area 122 is annular, the width of the peripheral area 122 is D2, and the following condition is satisfied: 0.7%≤D2 / D1≤1.3%.

[0057] For example, the wafer 130 has a size of 4 inches, a diameter of 100 mm, and a diameter D1 of the wafer supporting area 121 of 100 mm. Accordingly, the width D2 of the annular peripheral area 122 is 0.7 to 1.3 mm. In this embodiment, the width D2 of the annular peripheral area 122 is 1.3 mm. In other embodiments, the width D2 of the annular peripheral area 122 is 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, 1.2 mm, etc., without limitation to the exemplary widths.

[0058] In some embodiments, the distance between the wafer supporting area 121 and the surface of the carrier plate 110 is L1, and the thickness of the wafer is L2, which satisfies the following relationship: 25%≤L1 / L2≤35%.

[0059] For example, the wafer 130 is 4 inches in size and has an original thickness of 650 μm. The depth L1 of the wafer support area 121 is 180 to 220 μm. This facilitates loading and unloading of the wafer and allows the wafer 130 to be fixed to the wafer support area 121, preventing it from moving during the waxing process. In this embodiment, the distance L1 between the wafer support area 121 and the surface of the carrier 110 is 200 μm. In other embodiments, the distance L1 between the wafer support area 121 and the surface of the carrier 110 is 180 μm, 190 μm, 210 μm, 220 μm, etc., without limitation to the exemplary widths.

[0060] like Figure 7 As shown, an embodiment of the present application also provides a wafer grinding device 1000, including the wafer supporting structure 100 and a pressurizing mechanism in any of the above embodiments, the pressurizing mechanism including a pressurizing head 200, the pressurizing head 200 is arranged relative to the wafer supporting structure 100, and the notch of the groove 120 faces the pressurizing head 200.

[0061] The waxing process of the wafer grinding apparatus 1000 is as follows:

[0062] First, evenly spread or drop the molten wax liquid on the surface of the chip supporting area 121 of the groove 120, and then place the chip 130 on the chip supporting area 121. The pressure head 200 pressurizes the top surface of the chip 130, and the bottom surface of the chip 130 is waxed.

[0063] The present application also provides a wafer polishing apparatus, including the wafer support structure 100 of any of the aforementioned embodiments, or the wafer polishing device 1000 of any of the aforementioned embodiments. By securing the wafer 130 in the wafer support area 121, wax overflowing during the waxing process flows to the peripheral area 122 surrounding the wafer support area 121. This eliminates the need to use wax blotting paper to absorb excess wax from the edges of the pressed wax prior to cooling, thereby simplifying the process and reducing costs.

[0064] In addition, by placing the wafer 130 in the groove 120, it is not easy to move during the subsequent grinding and polishing process, thereby improving the quantity and quality of the wafer 130 products; by placing the wafer 130 in the groove 120, the bottom edge of the wafer 130 can be attached to the wax body, reducing the occurrence of gaps on the bottom edge of the wafer 130 where the wax body is not attached, and reducing the probability of the wafer 130 being damaged during the subsequent grinding and polishing process due to the lack of wax attachment.

[0065] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0066] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A wafer supporting structure, characterized in that: include: A carrier plate, wherein a plurality of grooves are formed on the surface of the carrier plate, wherein a wafer carrying area and a peripheral area are formed in the grooves, wherein the peripheral area is arranged around the outer periphery of the wafer carrying area, and the grooves and the carrier plate form an integrated carrier plate; The groove comprises: a first groove body, the first groove body being formed by being recessed from the surface of the carrier plate; The second trough body is formed by being recessed from the bottom of the first trough body, and the bottom area of the second trough body is smaller than the bottom area of the first trough body. The chip carrying area is arranged in the second trough body, and the peripheral area is arranged in the first trough body and surrounds the chip carrying area.

2. The wafer supporting structure according to claim 1, wherein: The bottom of the groove is a plane, the wafer carrying area is arranged in the middle of the bottom of the groove, and the peripheral area is arranged around the outer periphery of the wafer carrying area.

3. The wafer supporting structure according to claim 1, wherein: The connection between the groove wall and the groove bottom of the first groove body is in an arc shape.

4. The wafer supporting structure according to claim 1, wherein: The groove comprises: The third trough is formed by being recessed from the surface of the carrier, and the wafer carrying area is arranged in the third trough.

5. The wafer supporting structure according to claim 4, characterized in that: The groove further comprises: A fourth trough body is arranged around the wafer carrying area.

6. The wafer supporting structure according to claim 5, characterized in that: The bottom area of the fourth trough body is smaller than the bottom area of the wafer supporting area.

7. The wafer supporting structure according to claim 5, wherein: The longitudinal section of the fourth trough body is any one of U-shaped, arc-shaped and trapezoidal.

8. A wafer grinding device, characterized in that: include: The wafer supporting structure according to any one of claims 1 to 7; The pressurizing mechanism comprises a pressurizing head, which is arranged opposite to a side of the carrier having the groove, so that the notch of the groove faces the pressurizing head.

9. A wafer grinding device, characterized in that: A wafer supporting structure comprising the wafer supporting structure according to any one of claims 1 to 7, or a wafer grinding device according to claim 8.

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