Stacked circuit board for lighting device

Abstract

The utility model discloses a stacked circuit board for a lighting device, which is characterized in that heat conduction layers are arranged at the bottoms of a first circuit board and a second circuit board, and heat conduction wing plates are integrally connected to two sides of the heat conduction layers, so that the heat dissipation capability of the circuit board is effectively enhanced; through the design of the heat conduction wing plates, the heat dissipation efficiency is improved, the structural stability of the circuit board is improved, the circuit board is more suitable for the heat dissipation requirement of lighting elements such as a high-power LED, and the service life of the electronic equipment is prolonged. According to the stacked circuit board for the lighting device, a heat management system is further optimized through the arrangement of the heat dissipation middle layer, the heat conduction wing plates are fixed to the heat dissipation middle layer through the locking mechanisms, the stability and reliability of the circuit board in the long-time working process are ensured, and through the design of the multi-section arc-shaped structure of the supporting flow guide frame, the stability and reliability of the circuit board are improved. And more complex circuit layout can be realized, additional support is provided for the circuit board, and the overall mechanical strength is enhanced.

Description

Technical Field

[0001] The utility model relates to the technical field of lighting equipment, in particular to a stacked circuit board for a lighting device. Background Art

[0002] Stacked PCB technology is a method of increasing the number of PCB layers in the vertical direction to achieve higher functional integration and performance improvement. This technology is commonly used in applications that require high-density wiring and complex circuit design, such as high-performance computing devices, communications equipment, and advanced lighting systems.

[0003] However, stacked circuit boards face challenges in heat dissipation, especially when high-power heating components are integrated into the circuit board, such as in lighting devices. Not only must we consider that the bulb components will generate a lot of heat during operation, but we also need to consider that the use of stacked circuit board technology may not be able to effectively remove heat from the multi-layer stacked structure, resulting in overheating and performance degradation of the overall lighting device, affecting the stability and service life of the lighting device, and even causing high-temperature safety issues.

[0004] Therefore, how to effectively design the structure of the circuit boards so that the heat of the stacked circuit boards can be quickly transferred away has become an urgent problem to be solved. In view of this, a stacked circuit board for a lighting device is designed. Utility Model Content

[0005] The purpose of the present invention is to provide a stacked circuit board for a lighting device to solve the problems existing in the prior art mentioned in the above background art.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solution: a stacked circuit board for a lighting device, comprising a first circuit board and a second circuit board;

[0007] A heat conducting layer is provided at the bottom of the first circuit board and the second circuit board;

[0008] Two sets of heat-conducting wing plates are integrally connected to both sides of the heat-conducting layer, a plug-in is integrally connected to the bottom of the heat-conducting wing plates, and a heat dissipation middle layer is connected between the two sets of heat-conducting layers;

[0009] The heat dissipation middle layer is provided with a plurality of locking mechanisms, and the locking mechanisms are suitable for fixing the heat conduction wing plates on the heat dissipation middle layer.

[0010] Preferably, the inner side of the heat dissipation middle layer is provided through along its own length extension direction, and three groups of supporting guide frames are fixedly connected to the inner wall of the heat dissipation middle layer at equal intervals.

[0011] Preferably, the supporting guide frame is a multi-section arc structure.

[0012] Preferably, the locking mechanism includes two sets of slots, spring slots, springs, two sets of slides, and two sets of locking rods, wherein:

[0013] The two sets of slots are respectively opened in the top and bottom of the heat dissipation middle layer, and the two sets of slots are staggered up and down;

[0014] The spring slot is opened in the side surface of the heat dissipation middle layer, and the spring slot is arranged between the two groups of slots;

[0015] The spring is arranged in the spring groove;

[0016] The two sets of slides are fixedly connected to the two ends of the spring respectively, and the slides are movably arranged in the spring slots;

[0017] The two sets of locking rods are respectively fixedly connected to the sides of the two sets of sliding sheets that are away from each other, and the locking rods are movably inserted into the spring grooves and the slots.

[0018] Preferably, the slot is adapted to the shape of the plug-in, and the locking rod is inserted and connected to the inner side of the plug-in through a movable clearance fit.

[0019] Preferably, the inner width of the spring slot is greater than the outer width of the spring slot, and the width of one end of the slide is adapted to the inner width of the spring slot, the width of the other end of the slide is adapted to the outer width of the spring slot, and the slide extends to the outside of the spring slot.

[0020] Compared with the prior art, the beneficial effects of the present invention are:

[0021] 1. The stacked circuit boards used in this lighting device effectively enhance the heat dissipation capacity of the circuit boards by providing a heat-conducting layer at the bottom of the first and second circuit boards, and integrally connecting heat-conducting wing plates on both sides of the heat-conducting layer, thereby improving the stability and service life of the electronic device.

[0022] 2. The stacked circuit boards used in this lighting device not only improve heat dissipation efficiency through the design of thermal wing plates, but also increase the structural stability of the circuit boards, making the circuit boards more suitable for the heat dissipation requirements of lighting components such as high-power LEDs;

[0023] 3. The stacked circuit boards used in this lighting device further optimize the thermal management system by providing a heat dissipation middle layer. The thermally conductive wing plates are fixed to the heat dissipation middle layer through a locking mechanism, ensuring the stability and reliability of the circuit boards during long-term operation.

[0024] 4. The stacked circuit boards used in this lighting device utilize a multi-segment arc-shaped structure to support the guide frame, facilitating the realization of more complex circuit layouts while also providing additional support for the circuit boards and enhancing overall mechanical strength.

[0025] 5. The stacked circuit boards used in this lighting device adopt an innovative design of the locking mechanism, including a combination of slots, spring slots, springs, slides and locking rods. This not only simplifies the assembly process but also provides a reliable fixing method, making the circuit boards more stable during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic structural diagram of a stacked circuit board for a lighting device according to the present invention;

[0027] Figure 2 An exploded view of a stacked circuit board for a lighting device according to the present invention;

[0028] Figure 3 This is a schematic diagram of a heat dissipation middle layer structure of a stacked circuit board for a lighting device according to the present invention;

[0029] Figure 4 This is a top cross-sectional view of a heat dissipation middle layer of a stacked circuit board for a lighting device according to the present invention;

[0030] Figure 5 This is a front view of a stacked circuit board for a lighting device according to the present invention;

[0031] Figure 6 This is a partial side structural cross-sectional view of a stacked circuit board for a lighting device according to the present invention;

[0032] Figure 7 This is a partial front structural cross-sectional view of a stacked circuit board for a lighting device according to the present invention;

[0033] Figure 8 The figure is a schematic diagram of the heat-conducting layer structure of a stacked circuit board for a lighting device according to the present invention.

[0034] In the picture:

[0035] 1. First circuit board; 2. Second circuit board; 3. Heat conducting layer; 4. Heat conducting wing plate;

[0036] 5. Heat dissipation middle layer; 6. Support guide frame; 7. Locking mechanism; 71. Slot;

[0037] 72. Spring slot; 73. Spring; 74. Slide; 75. Locking rod; 8. Plug-in. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0039] In the description of the utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," "the other end," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely to facilitate the description of the utility model and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0040] In the description of the utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "connected," etc. should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0041] See also Figure 1-8 The utility model provides a technical solution: a stacked circuit board for a lighting device, comprising a first circuit board 1 and a second circuit board 2.

[0042] A heat conducting layer 3 is provided on the bottom of the first circuit board 1 and the second circuit board 2 .

[0043] Two groups of heat-conducting wing plates 4 are integrally connected to both sides of the heat-conducting layer 3 , and a plug-in 8 is integrally connected to the bottom of the heat-conducting wing plates 4 . A heat dissipation middle layer 5 is connected between the two groups of heat-conducting layers 3 .

[0044] Specifically, the heat conducting layer 3 can be made of a high thermal conductivity material such as copper, aluminum, etc., and the heat dissipating middle layer 5 and the heat conducting wing plate 4 can be made of a high thermal conductivity material such as copper, aluminum, etc.

[0045] Specifically, according to actual use requirements, the heat-conducting layer 3 and the heat-dissipating middle layer 5 may be connected by a thermally conductive adhesive to improve stability.

[0046] Specifically, by providing a thermally conductive layer 3 at the bottom of the first and second circuit boards 1 and 2, and integrally connecting thermally conductive fins 4 to both sides of the thermally conductive layer 3, the heat dissipation efficiency of the entire circuit board system is significantly improved. The presence of the thermally conductive layer 3 allows heat to be quickly transferred away from the circuit boards, reducing the risk of damage to electronic components due to heat accumulation, thereby improving the reliability and service life of the lighting device. During installation, the thermally conductive fins 4 are in contact with the surface of the heat dissipation middle layer 5. This design not only improves heat dissipation efficiency but also increases the structural stability of the circuit boards, making the circuit boards more suitable for the heat dissipation requirements of lighting components such as high-power LEDs.

[0047] The inner side of the heat dissipation middle layer 5 is provided along its own length extension direction, and the inner wall of the heat dissipation middle layer 5 is fixedly connected with three groups of support guide frames 6 at equal intervals. Figure 3-4 The heat dissipation middle layer 5 not only serves as a bridge connecting the two circuit boards, but also forms an effective air circulation channel through the through-hole design on the inside, further enhancing the heat dissipation effect, allowing air to flow inside the heat dissipation middle layer 5, taking away excess heat and ensuring the stability of the circuit board when working under high load.

[0048] The support guide frame 6 is a multi-section arc structure. Figure 4 The multi-segment arc design not only increases the structural strength of the support guide frame 6, provides additional support for the circuit board, and enhances the overall mechanical strength, but also optimizes the air flow path, making heat dissipation more efficient. The three groups of support guide frames 6 divide the inner side of the heat dissipation middle layer 5 into four groups of spaces. Wires can be passed through the inner side of the heat dissipation middle layer 5, which helps to achieve more complex circuit layouts.

[0049] A plurality of locking mechanisms 7 are provided on the heat dissipation middle layer 5 , and the locking mechanisms 7 are suitable for fixing the heat conducting wing plates 4 on the heat dissipation middle layer 5 .

[0050] The locking mechanism 7 includes two sets of slots 71, spring slots 72, springs 73, two sets of slides 74, and two sets of locking rods 75, wherein:

[0051] The two groups of slots 71 are respectively opened in the top and bottom of the heat dissipation middle layer 5, and the two groups of slots 71 are staggered in the upper and lower positions;

[0052] The spring groove 72 is opened in the side surface of the heat dissipation middle layer 5, and the spring groove 72 is set between the two groups of slots 71;

[0053] The spring 73 is disposed in the spring slot 72;

[0054] Two sets of slides 74 are fixedly connected to the two ends of the spring 73, and the slides 74 are movably arranged in the spring slot 72;

[0055] The two sets of locking rods 75 are respectively fixedly connected to the sides of the two sets of sliding plates 74 that are away from each other, and the locking rods 75 are movably inserted into the spring grooves 72 and the slots 71 .

[0056] For details, please refer to the attached manual. Figure 1-3 Since the plug-in 8 is arranged at the bottom of the heat-conducting wing plate 4, when the lower group of heat-conducting wing plates 4 is flipped 180 degrees, the plug-in 8 originally below it is flipped to the top, so that the plug-in 8 on the lower heat-conducting wing plate 4 can be inserted into the bottom slot 71 of the heat dissipation middle layer 5.

[0057] Specifically, by using the spring 73 and the slide 74 in combination, the heat-conducting wing plate 4 can be quickly fixed on the heat-dissipating middle layer 5, thereby realizing a rapid fixed connection between the circuit board, the heat-dissipating middle layer 5, and the heat-conducting layer 3, simplifying the assembly process of the circuit board, reducing assembly time, and improving efficiency.

[0058] Slot 71 matches the shape of insert 8, and locking rod 75 is inserted and connected to the inner side of insert 8 with a movable clearance. Specifically, a cylindrical hole is formed through insert 8, and a corresponding cylindrical groove is provided between slot 71 and spring groove 72. The cooperation between locking rod 75 and insert 8 makes the connection between the circuit boards more stable, and also makes the circuit boards easy to disassemble and maintain when needed, improving the maintainability of the circuit boards.

[0059] The inner width of the spring slot 72 is greater than the outer width of the spring slot 72, and the width of one end of the slide 74 is adapted to the inner width of the spring slot 72, and the width of the other end of the slide 74 is adapted to the outer width of the spring slot 72, and the slide 74 extends to the outer side of the spring slot 72. Figure 7 The slide 74 is a rectangular parallelepiped structure, and the spring groove 72 has a positioning and moving function on the slide 74, so that the slide 74 can move freely horizontally in the spring groove 72 while maintaining a stable connection. The side of the spring groove 72 close to its opening is the outer side, and the outer side of the spring groove 72 has a limiting effect on the slide 74 to prevent the slide 74 from falling off from the spring groove 72.

[0060] Specifically, during use, the first circuit board 1 and the second circuit board 2 can be connected to the top and bottom of the heat dissipation middle layer 5 through two groups of heat-conducting layers 3. When the two groups of heat-conducting layers 3 are connected to the heat dissipation middle layer 5, each group of plug-ins 8 is respectively inserted into each group of slots 71. Under the elastic force of the spring 73, the locking rod 75 is stably connected to the inner side of the plug-in 8, thereby realizing a firm connection between the first circuit board 1, the second circuit board 2, the heat-conducting layer 3 and the heat dissipation middle layer 5. When disassembly is required, the user can control the two groups of slides 74 in the same group of spring slots 72 to move closer, thereby controlling the locking rod 75 to detach from the inner side of the plug-in 8, and then the plug-in 8 can be pulled out from the slot 71, thereby realizing disassembly between the circuit board and the heat dissipation middle layer 5.

[0061] Specifically, when in use, the air circulation opening of the heat dissipation middle layer 5 can be installed at the heat dissipation opening of the lighting device housing, and the heat can be taken out of the lighting device through the heat dissipation middle layer 5.

[0062] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A stacked circuit board for a lighting device, characterized in that: Comprising a first circuit board (1) and a second circuit board (2); The bottoms of the first circuit board (1) and the second circuit board (2) are both provided with a heat-conducting layer (3); Two groups of heat-conducting wing plates (4) are integrally connected to both sides of the heat-conducting layer (3); a plug-in unit (8) is integrally connected to the bottom of the heat-conducting wing plates (4); and a heat dissipation middle layer (5) is connected between the two groups of heat-conducting layers (3); The heat dissipation middle layer (5) is provided with a plurality of locking mechanisms (7), and the locking mechanisms (7) are suitable for fixing the heat conduction wing plate (4) on the heat dissipation middle layer (5).

2. The stacked circuit board for a lighting device according to claim 1, wherein: The inner side of the heat dissipation middle layer (5) is provided through along its own length extension direction, and three groups of supporting guide frames (6) are fixedly connected to the inner wall of the heat dissipation middle layer (5) at equal intervals.

3. The stacked circuit board for a lighting device according to claim 2, wherein: The supporting guide frame (6) is a multi-section arc structure.

4. The stacked circuit board for a lighting device according to claim 1, wherein: The locking mechanism (7) comprises two groups of slots (71), a spring slot (72), a spring (73), two groups of slides (74), and two groups of locking rods (75), wherein: The two groups of slots (71) are respectively opened in the top and bottom of the heat dissipation middle layer (5), and the two groups of slots (71) are staggered in the upper and lower parts; The spring groove (72) is opened in the side surface of the heat dissipation middle layer (5), and the spring groove (72) is arranged between the two groups of slots (71); The spring (73) is arranged in the spring groove (72); Two sets of slides (74) are respectively fixedly connected to the two ends of the spring (73), and the slides (74) are movably arranged in the spring slot (72); The two sets of locking rods (75) are respectively fixedly connected to the sides of the two sets of slides (74) that are away from each other, and the locking rods (75) are movably inserted and connected in the spring groove (72) and the slot (71).

5. The stacked circuit board for a lighting device according to claim 4, wherein: The slot (71) is adapted to the shape of the plug-in unit (8), and the locking rod (75) is connected to the inner side of the plug-in unit (8) through a movable clearance fit.

6. The stacked circuit board for a lighting device according to claim 4, wherein: The inner width of the spring slot (72) is greater than the outer width of the spring slot (72), and the width of one end of the slide (74) is adapted to the inner width of the spring slot (72), the width of the other end of the slide (74) is adapted to the outer width of the spring slot (72), and the slide (74) extends to the outer side of the spring slot (72).

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