Efficient and accurate semiconductor chip thickness measuring equipment

Abstract

The utility model discloses an efficient and accurate semiconductor chip thickness measuring device, which comprises a testing mechanism, an upper laser sensor and a lower laser sensor, the testing mechanism comprises a testing table, an upper laser sensor and a lower laser sensor, the testing table is provided with a testing groove, the upper laser sensor is arranged above the testing groove, and the lower laser sensor is arranged right below the upper laser sensor; the feeding mechanism is arranged on one side of the test bench; the positioning mechanism is arranged at the end, away from the testing mechanism, of the feeding mechanism and comprises a mounting frame, symmetrically-arranged air cylinders are arranged on the mounting frame, clamping plates are arranged on the air cylinders, a plurality of connecting rods are arranged at the bottoms of the clamping plates, clamping blocks are arranged on the connecting rods, and a rotating table is arranged below the clamping plates. A vacuum placing suction cup is arranged on the rotating table, and a detection camera is arranged on one side of the rotating table. Compared with the prior art, the chip thickness measuring device can solve the problem of low measuring precision caused by manually adopting a micrometer to measure the thickness of a chip.

Description

Technical Field

[0001] The utility model relates to the technical field of chip thickness detection, and in particular to an efficient and accurate semiconductor chip thickness measuring device. Background Art

[0002] During chip production, inconsistent chip thickness can occur due to factors such as raw materials, production equipment, and processing techniques, resulting in raw material waste and reduced yield rates for finished products. Therefore, chip thickness measurement is necessary during production. Traditionally, this measurement method involves manual micrometer measurement, which has low accuracy and poor results, failing to provide effective guidance for process improvements. Furthermore, because chips are relatively soft, contact-type measuring tools like micrometers can cause chip deformation, impacting measurement accuracy. Utility Model Content

[0003] The purpose of the utility model is to provide an efficient and accurate semiconductor chip thickness measuring device in order to solve the problem of low measurement accuracy caused by manual chip thickness measurement using a micrometer.

[0004] In order to achieve the above objectives, the present invention adopts the following technical solutions: an efficient and accurate semiconductor chip thickness measurement device, which includes:

[0005] A testing mechanism, comprising a testing platform, an upper laser sensor, and a lower laser sensor, wherein the testing platform is provided with a testing slot, the upper laser sensor is provided above the testing slot, and the lower laser sensor is provided directly below the upper laser sensor;

[0006] A loading mechanism is provided on one side of the test bench, the loading mechanism comprising a manipulator and a clamping claw, the clamping claw being detachably connected to the manipulator, and the manipulator drives the clamping claw to place the chip into the test slot;

[0007] A positioning mechanism is provided at one end of the feeding mechanism away from the testing mechanism, the positioning mechanism includes a mounting frame, symmetrically arranged cylinders are provided on the mounting frame, a clamping plate is provided on the cylinder, a plurality of connecting rods are provided at the bottom of the clamping plate, a clamping block is provided on the connecting rod, a rotating table is provided below the clamping plate, a vacuum placement suction cup is provided on the rotating table, and a detection camera is provided on one side of the rotating table.

[0008] As a further description of the above technical solution:

[0009] At least one upper laser sensor is provided, and the number of the lower laser sensors is the same as the number of the upper laser sensors.

[0010] As a further description of the above technical solution:

[0011] The feeding mechanism further includes a lifting platform, and the manipulator is arranged on the lifting platform.

[0012] As a further description of the above technical solution:

[0013] The clamping jaws are provided with a vacuum suction cup.

[0014] As a further description of the above technical solution:

[0015] The clamping jaws are provided with avoidance holes.

[0016] As a further description of the above technical solution:

[0017] The clamping block is provided with a clamping groove.

[0018] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0019] 1. In the present invention, the chip wafer to be measured is placed on a vacuum placement suction cup. After that, the rotating table rotates. After the detection camera recognizes the laser code on the chip wafer, the rotating table stops rotating. The cylinder drives the clamping blocks to approach each other, so that the clamping blocks clamp the chip wafer to be measured. Then, the robot drives the clamping claws to move to the chip wafer to be measured. The clamping claws suck the chip wafer to be measured through the vacuum suction cup on it. The clamping blocks release the chip wafer to be measured. Finally, the robot sends the chip wafer to be measured into the testing mechanism for thickness measurement. In this way, the same point of different chip wafers can be tested each time.

[0020] 2. In the present invention, through the provision of a manipulator and a clamp, when the chip wafer is being measured, the clamp absorbs the chip wafer, and then the manipulator drives the clamp holding the chip wafer to move, so that the chip wafer is placed in the test slot, and then the thickness of the chip wafer is measured by the upper laser sensor and the lower laser sensor. The laser measurement of thickness effectively avoids direct contact with the chip wafer, thereby avoiding the influence of the deformation of the chip under force on the measurement result. After the measurement is completed, the manipulator drives the clamp chip wafer away together, realizing automatic loading and unloading of the chip wafer during measurement, with high test accuracy and high efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 This is a structural diagram of an efficient and accurate semiconductor chip thickness measurement device.

[0023] Figure 2 This is a structural schematic diagram of the loading mechanism in an efficient and accurate semiconductor chip thickness measurement device.

[0024] Figure 3 This is a reference diagram of the working status of the upper laser sensor and the lower laser sensor.

[0025] Figure 4 A top view of an efficient and accurate semiconductor chip thickness measurement device.

[0026] Figure 5 This is a structural schematic diagram of the positioning mechanism in an efficient and accurate semiconductor chip thickness measurement device.

[0027] Legend:

[0028] 1. Test bench; 2. Upper laser sensor; 3. Lower laser sensor; 4. Test slot; 5. Loading mechanism; 51. Robot; 52. Gripper; 53. Lifting platform; 6. Positioning mechanism; 61. Mounting frame; 62. Cylinder; 63. Clamping plate; 64. Connecting rod; 65. Clamping block; 66. Rotating table; 67. Vacuum placement suction cup; 68. Detection camera; 7. Avoidance hole. DETAILED DESCRIPTION

[0029] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] See also Figure 1-5 The present invention provides a technical solution: an efficient and accurate semiconductor chip thickness measuring device, which includes:

[0031] The testing mechanism includes a test table 1, an upper laser sensor 2, and a lower laser sensor 3. The test table 1 is provided with a test slot 4. The upper laser sensor 2 is provided above the test slot 4. The lower laser sensor 3 is provided directly below the upper laser sensor 2.

[0032] A loading mechanism 5 is provided on one side of the test table 1 and includes a manipulator 51 and a gripper 52. The gripper 52 is detachably connected to the manipulator 51. The manipulator 51 drives the gripper 52 to place the chip into the test slot 4.

[0033] The positioning mechanism 6 is arranged at the end of the feeding mechanism 5 away from the testing mechanism. The positioning mechanism 6 includes a mounting frame 61, on which symmetrically arranged cylinders 62 are provided. A clamping plate 63 is provided on the cylinder 62. A plurality of connecting rods 64 are provided at the bottom of the clamping plate 63. A clamping block 65 is provided on the connecting rod 64. A rotating table 66 is provided below the clamping plate 63. A vacuum placement suction cup 67 is provided on the rotating table 66. A detection camera 68 is provided on one side of the rotating table 66. The detection camera is a CCD camera. The function of the CCD camera is to find the laser code on the silicon carbide wafer and the positioning flat edge on the wafer. The two cylinders drive the corresponding clamping blocks to move, thereby clamping or releasing the chip wafer. The connecting rods can move up and down and are fixed by nuts to facilitate the adjustment of the height of the clamping blocks.

[0034] The upper laser sensor 2 is provided with at least one, and the number of the lower laser sensors 3 is the same as the number of the upper laser sensors 2. By testing with multiple groups of upper laser sensors and lower laser sensors, the test accuracy can be improved; specifically, Figure 3 When performing thickness testing, the distance between the upper laser sensor and the lower laser sensor is fixed. The upper laser sensor and the lower laser sensor are used to measure the distance to the chip respectively, and then the thickness of the chip at this point is obtained by subtracting the measured distance from the fixed distance.

[0035] The loading mechanism further comprises a lifting platform 53, and the manipulator 51 is arranged on the lifting platform 53. In this way, the height of the manipulator can be adjusted to facilitate loading and unloading of chip wafers.

[0036] The clamping jaws 52 are provided with vacuum suction cups, which can prevent the chip wafer from being damaged by suction.

[0037] The clamping jaws 52 are provided with avoidance holes 7. The avoidance holes can prevent the clamping jaws from interfering with the measurement.

[0038] The clamping block 65 is provided with a clamping groove to facilitate fixing the chip wafer.

[0039] Working principle: The chip wafer to be measured is placed on the vacuum placement suction cup. Then, the turntable rotates. After the detection camera recognizes the laser code on the chip wafer, the turntable stops rotating. The cylinder drives the clamping blocks to approach each other, so that the clamping blocks clamp the chip wafer to be measured. Then the robot drives the clamping claw to move to the chip wafer to be measured. The clamping claw sucks the chip wafer to be measured through the vacuum suction cup on it. The clamping block releases the chip wafer to be measured. Finally, the robot sends the chip wafer to be measured into the testing mechanism for thickness measurement. In this way, the same point of different chip wafers can be tested each time, thereby improving the test quality. Through the set manipulator and gripper, the chip wafer is sucked by the gripper when measuring. After that, the manipulator drives the gripper holding the chip wafer to move, so that the chip wafer is placed in the test slot. The thickness of the chip wafer is then measured by the upper laser sensor and the lower laser sensor. The laser measurement of thickness effectively avoids direct contact with the chip wafer, thereby avoiding the influence of the deformation of the chip wafer under force on the measurement result. After the measurement is completed, the manipulator drives the gripper and chip wafer away together, realizing automatic loading and unloading of chip wafers during measurement, with high test accuracy and high efficiency.

[0040] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An efficient and accurate semiconductor chip thickness measuring device, characterized in that: include: A testing mechanism, comprising a testing platform, an upper laser sensor, and a lower laser sensor, wherein the testing platform is provided with a testing slot, the upper laser sensor is provided above the testing slot, and the lower laser sensor is provided directly below the upper laser sensor; A loading mechanism is provided on one side of the test bench, the loading mechanism comprising a manipulator and a clamping claw, the clamping claw being detachably connected to the manipulator, and the manipulator drives the clamping claw to place the chip into the test slot; A positioning mechanism is provided at one end of the feeding mechanism away from the testing mechanism, the positioning mechanism includes a mounting frame, symmetrically arranged cylinders are provided on the mounting frame, a clamping plate is provided on the cylinder, a plurality of connecting rods are provided at the bottom of the clamping plate, a clamping block is provided on the connecting rod, a rotating table is provided below the clamping plate, a vacuum placement suction cup is provided on the rotating table, and a detection camera is provided on one side of the rotating table.

2. The efficient and accurate semiconductor chip thickness measuring device according to claim 1, characterized in that: At least one upper laser sensor is provided, and the number of the lower laser sensors is the same as the number of the upper laser sensors.

3. The efficient and accurate semiconductor chip thickness measuring device according to claim 1, characterized in that: The feeding mechanism further includes a lifting platform, and the manipulator is arranged on the lifting platform.

4. The efficient and accurate semiconductor chip thickness measuring device according to claim 1, characterized in that: The clamping jaws are provided with a vacuum suction cup.

5. The efficient and accurate semiconductor chip thickness measuring device according to claim 1, characterized in that: The clamping jaws are provided with avoidance holes.

6. The efficient and accurate semiconductor chip thickness measuring device according to claim 1, characterized in that: The clamping block is provided with a clamping groove.

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