Chip mounter for chip packaging

Abstract

The utility model provides a chip mounter for chip packaging, which relates to the technical field of chip mounters and comprises a device body, a workbench is arranged on the surface of the top of the device body, an operation table is mounted on the surface of the top of the workbench, an air suction flow channel is formed in the end face of the operation table, and adsorption holes are formed in the surface of the top of the operation table. An installation plate is arranged in the device body, a negative pressure pump is installed on the surface of the top of the installation plate, a main pipe is arranged at the output end of the negative pressure pump, a branch pipe is arranged on the surface of the outer side of the main pipe in a penetrating mode, and the other end of the branch pipe is connected with the air suction flow channel in a penetrating mode; through the cooperative use of the adsorption hole, the air suction flow channel, the negative pressure pump, the main pipe and the branch pipe, the chip can be quickly adsorbed and fixed during chip surface mounting treatment, and the working efficiency is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip mounters, in particular to a chip mounter for chip packaging. Background Art

[0002] Chip placement machine is a device that accurately places chip components on PCB pads by moving the placement head. Placement is the most critical step in SMI production. Chip placement machine is an indispensable processing equipment in SMI production. The chip automatic loading mechanism can realize automatic loading of chip patches to ensure the automation of the production line.

[0003] After extensive searching, it was found that the chip fixing structure of the existing chip placement machine is relatively complicated. When the internal chip is replaced after use, it is extremely inconvenient to operate, which seriously affects production efficiency.

[0004] Therefore, it is necessary to provide a chip packaging placement machine to solve the above technical problems. Utility Model Content

[0005] The utility model provides a chip mounting machine for chip packaging, which solves the problems in the background technology.

[0006] In order to solve the above technical problems, the utility model provides a chip packaging placement machine, including a device body, a workbench is provided on the top surface of the device body, an operating table is installed on the top surface of the workbench, an air intake duct is provided on the end surface of the operating table, an adsorption hole is provided on the top surface of the operating table, the adsorption hole is connected with the air intake duct, a mounting plate is provided inside the device body, a negative pressure pump is installed on the top surface of the mounting plate, a main pipe is provided at the output end of the negative pressure pump, a branch pipe is provided on the outer surface of the main pipe, and the other end of the branch pipe is connected with the air intake duct, by arranging the adsorption hole, the air intake duct, the negative pressure pump, the main pipe and the branch pipe. It is convenient for the chip to be quickly adsorbed and fixed during the chip patch processing, so that during operation, the staff places the chip to be processed on the adsorption hole, and then starts the negative pressure pump. Then, under the action of the main pipe and the branch pipe, the suction flow channel and the adsorption hole are vacuum-treated, so that the adsorption hole can adsorb and fix the chip on the surface. This method is simple to operate and is convenient for improving the stability of the chip during the patch processing. Moreover, each suction flow channel is separately controlled by the branch pipe and the one-way valve, so that when the chips on other suction flow channels are processed, the remaining chips can be adsorbed and fixed to other adsorption holes. This method is simple to operate and does not interfere with each other, which greatly improves its work efficiency.

[0007] Preferably, a slide rail is provided at the edge of the top surface of the operating table, a slider is slidably connected inside the slide rail, a protective cover is provided on the top of the slider, two slide rails are provided, and the two slide rails are symmetrically provided about the center line of the operating table, and the protective cover, the slide rail and the slider are used in coordination, so that after a work is completed, the staff can slide the protective cover onto the operating table through the coordination of the slider and the slide rail, so that the protective cover covers the operating table. This method is simple to operate and is convenient for the protective cover to block the adsorption hole, avoiding external objects from clogging the adsorption hole when not in use, thereby ensuring the subsequent normal adsorption and fixation of the chip.

[0008] Preferably, a mounting frame is installed at the edge of the top surface of the workbench, and a patch mechanism is installed on the mounting frame. By setting up the patch mechanism, it is convenient to perform patch processing on the fixed chip.

[0009] Preferably, there are multiple intake air ducts, and the multiple intake air ducts are opened at equal distances on the end surface of the operating table, and each of the intake air ducts is connected to the main pipe through a branch pipe. A one-way valve is installed on the surface of each branch pipe. By setting up multiple intake air ducts, and each intake air duct is connected to a branch pipe, the various intake air ducts are independent of each other and work in a complementary and interfering manner.

[0010] Preferably, there are multiple adsorption holes, and the multiple adsorption holes are equidistantly provided on the top surface of the operating table. By providing multiple adsorption holes, it is convenient to adsorb and fix multiple chips at a time, thereby improving its working efficiency.

[0011] Preferably, a sealing door is movably installed on the outer surface of the device body through a hinge. The provision of the sealing door facilitates maintenance of electrical components inside the device body.

[0012] Preferably, a controller is installed on the top surface of the workbench, and the provision of the controller facilitates the control of electrical components inside the device body.

[0013] Compared with related technologies, the chip packaging machine provided by the present invention has the following beneficial effects:

[0014] The utility model provides a chip packaging mounter, which is convenient for fast adsorption and fixation of chips during chip patch processing by arranging adsorption holes, suction flow channels, negative pressure pumps, main pipes and branch pipes. During operation, the staff puts the chip to be processed on the adsorption hole, then starts the negative pressure pump, and then, under the action of the main pipe and branch pipes, vacuum processes the suction flow channels and adsorption holes, so that the adsorption holes can adsorb and fix the chip on the surface. This method is simple to operate and is convenient for improving the stability of the chip during chip patch processing. In addition, each suction flow channel is connected to the branch pipe and the one-way valve. It is controlled separately, so that when processing chips on other suction air channels, the remaining chips can be adsorbed and fixed to other adsorption holes. This method is simple to operate and does not interfere with each other, which greatly improves its work efficiency. By setting up the protective cover, slide rails and sliders for use together, after a work is completed, the staff can slide the protective cover to cover the operating table through the cooperation of the slider and the slide rail, so that the protective cover covers the operating table. This method is simple to operate and is convenient for the protective cover to block the adsorption holes, avoiding blockage of the adsorption holes by external objects when not in use, thereby ensuring the normal adsorption and fixation of the chips in the future. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of the structure of a chip packaging machine provided by the present invention;

[0016] Figure 2 A schematic diagram of the operating table structure of a chip packaging mounter provided by the present invention;

[0017] Figure 3 This is a schematic diagram of the branch pipe structure of the chip packaging placement machine provided by the utility model;

[0018] Figure 4 A schematic diagram of the protective cover structure of a chip packaging placement machine provided by the present invention;

[0019] Figure 5 The present invention provides a schematic diagram of the structure of a slider of a chip packaging placement machine.

[0020] Numbers in the figure:

[0021] 1. Device body; 2. Workbench; 3. Patch mechanism; 4. Mounting frame; 5. Operating table; 6. Controller; 7. Branch pipe; 8. Main pipe; 9. Negative pressure pump; 10. Mounting plate; 11. Adsorption hole; 12. Suction flow channel; 13. Slide rail; 14. One-way valve; 15. Protective cover; 16. Slider. DETAILED DESCRIPTION

[0022] The present invention will be further described below with reference to the accompanying drawings and implementation examples.

[0023] Example 1

[0024] See Figure 1-5 , a chip packaging placement machine includes a device body 1, a workbench 2 is provided on the top surface of the device body 1, an operating table 5 is installed on the top surface of the workbench 2, an end surface of the operating table 5 is provided with an air intake duct 12, an adsorption hole 11 is provided on the top surface of the operating table 5, and the adsorption hole 11 is connected with the air intake duct 12, a mounting plate 10 is provided inside the device body 1, a negative pressure pump 9 is installed on the top surface of the mounting plate 10, the output end of the negative pressure pump 9 is provided with a main pipe 8, the outer surface of the main pipe 8 is provided with a branch pipe 7, and the other end of the branch pipe 7 is connected with the air intake duct 12, by setting the adsorption hole 11, the air intake duct 12, the negative pressure pump 9, the main pipe 8 and the branch pipe 7. When the chip is being processed, the chip can be quickly adsorbed and fixed, so that during operation, the staff places the chip to be processed on the adsorption hole 11, and then starts the negative pressure pump 9. Then, under the action of the main pipe 8 and the branch pipe 7, the suction flow channel 12 and the adsorption hole 11 are vacuum-treated, so that the adsorption hole 11 can adsorb and fix the chip on the surface. This method is simple to operate and is convenient for improving the stability of the chip during the patch processing. Moreover, each suction flow channel 12 is separately controlled by the branch pipe 7 and the one-way valve 14, so that when the chips on other suction flow channels 12 are processed, the remaining chips can be adsorbed and fixed to other adsorption holes 11. This method is simple to operate, does not interfere with each other, and greatly improves its work efficiency.

[0025] The working principle of the chip packaging machine provided by the utility model is as follows:

[0026] During operation, the staff places the chip to be processed on the adsorption hole 11, then starts the negative pressure pump 9, and then under the action of the main pipe 8 and the branch pipe 7, the suction flow channel 12 and the adsorption hole 11 are vacuum treated, so that the adsorption hole 11 can adsorb and fix the chip on the surface. This method is simple to operate and is convenient for improving the stability of the chip during patch processing. Moreover, each suction flow channel 12 is independently controlled by the branch pipe 7 and the one-way valve 14, so that when the chip on the other suction flow channel 12 is processed, the remaining chip can be adsorbed and fixed to another suction hole 11. On the attached hole 11, this method is simple to operate, does not interfere with each other, and greatly improves its work efficiency. By setting the protective cover 15, the slide rail 13 and the slider 16 for use in conjunction, after a work is completed, the staff uses the slider 16 and the slide rail 13 to slide the protective cover 15 to cover the operating table 5, so that the protective cover 15 covers the operating table 5. This method is simple to operate and is convenient for the protective cover 15 to block the adsorption hole 11, avoiding external objects from clogging the adsorption hole 11 when not in use, thereby ensuring the subsequent normal adsorption and fixation of the chip.

[0027] Compared with related technologies, the chip packaging machine provided by the present invention has the following beneficial effects:

[0028] By setting up the adsorption hole 11, the suction flow channel 12, the negative pressure pump 9, the main pipe 8 and the branch pipe 7 for coordinated use, it is convenient to quickly adsorb and fix the chip during the chip patch processing, so that during operation, the staff puts the chip to be processed on the adsorption hole 11, then starts the negative pressure pump 9, and then under the action of the main pipe 8 and the branch pipe 7, the suction flow channel 12 and the adsorption hole 11 are vacuum-treated, so that the adsorption hole 11 can adsorb and fix the chip on the surface. This method is simple to operate and is convenient for improving the stability of the chip during the patch processing. Moreover, each suction flow channel 12 is individually controlled by the branch pipe 7 and the one-way valve 14, so that When processing chips on other suction flow channels 12, the remaining chips are adsorbed and fixed to other adsorption holes 11. This method is simple to operate, does not interfere with each other, and greatly improves its work efficiency. By setting up the protective cover 15, the slide rail 13 and the slider 16 for use, after a work is completed, the staff can slide the protective cover 15 to cover the operating table 5 through the slider 16 and the slide rail 13, so that the protective cover 15 covers the operating table 5. This method is simple to operate and is convenient for the protective cover 15 to block the adsorption holes 11, avoiding external objects from clogging the adsorption holes 11 when not in use, thereby ensuring the normal adsorption and fixation of the chips in the future.

[0029] Example 2

[0030] Based on the first embodiment, see Figure 1-5 , a slide rail 13 is provided at the edge of the top surface of the operating table 5, and a slider 16 is slidably connected inside the slide rail 13. A protective cover 15 is provided on the top of the slider 16. There are two slide rails 13, and the two slide rails 13 are symmetrically opened about the center line of the operating table 5. By setting the protective cover 15, the slide rail 13 and the slider 16 for coordinated use, after a work is completed, the staff can slide the protective cover 15 over the operating table 5 through the cooperation of the slider 16 and the slide rail 13, so that the protective cover 15 covers the operating table 5. This method is simple to operate and is convenient for the protective cover 15 to block the adsorption hole 11, avoiding external objects from clogging the adsorption hole 11 when not in use, thereby ensuring the subsequent normal adsorption and fixation of the chip.

[0031] Based on the first embodiment, see Figure 1 A mounting frame 4 is installed at the edge of the top surface of the workbench 2, and a patch mechanism 3 is installed on the mounting frame 4. By setting the patch mechanism 3, it is convenient to perform patch processing on the fixed chip.

[0032] Based on the first embodiment, see Figure 1-4There are multiple intake air ducts 12, and multiple intake air ducts 12 are opened at equal distances on the end surface of the operating table 5, and each of the intake air ducts 12 is connected to the main pipe 8 through a branch pipe 7. A one-way valve 14 is installed on the surface of each branch pipe 7. By setting up multiple intake air ducts 12, and each intake air duct 12 is connected to a branch pipe 7, the various intake air ducts 12 are independent of each other and work in a complementary interference manner.

[0033] Based on the first embodiment, see Figure 1-3 There are multiple adsorption holes 11, and multiple adsorption holes 11 are opened at equal distances on the top surface of the operating table 5. By setting multiple adsorption holes 11, it is convenient to adsorb and fix multiple chips at a time, thereby improving its work efficiency.

[0034] Based on the first embodiment, see Figure 1 A sealing door is installed on the outer surface of the device body 1 through a hinge. By setting the sealing door, it is convenient to inspect and repair the electrical components inside the device body 1.

[0035] Based on the first embodiment, see Figure 1 A controller 6 is installed on the top surface of the workbench 2. By setting up the controller 6, it is convenient to control the electrical components inside the device body 1. The controller 6 and the patch mechanism 3 control circuit can be realized through simple programming by technicians in this field. It belongs to the common knowledge in this field. It is only used without modification, so the control method and circuit connection are not described in detail.

[0036] It should be noted that all types of components used in this application document are standard parts and can be purchased on the market. The specific connection methods of each part adopt conventional means such as mature bolts, rivets and welding in the existing technology. The machinery, parts and electrical equipment all adopt conventional models in the existing technology. The circuit connection adopts the conventional connection method in the existing technology. The electrical equipment is connected to the external safe power supply, and no further detailed description is given here.

[0037] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A chip mounting machine for chip packaging, characterized in that: The invention comprises a device body (1), a workbench (2) is provided on the top surface of the device body (1), an operating table (5) is installed on the top surface of the workbench (2), an end surface of the operating table (5) is provided with an air intake duct (12), an adsorption hole (11) is provided on the top surface of the operating table (5), and the adsorption hole (11) is connected to the air intake duct (12), a mounting plate (10) is provided inside the device body (1), a negative pressure pump (9) is installed on the top surface of the mounting plate (10), an output end of the negative pressure pump (9) is provided with a main pipe (8), an outer surface of the main pipe (8) is provided with a branch pipe (7), and the other end of the branch pipe (7) is connected to the air intake duct (12).

2. The chip packaging machine according to claim 1, characterized in that: A slide rail (13) is provided at the edge of the top surface of the operating table (5), a slider (16) is slidably connected inside the slide rail (13), a protective cover (15) is provided at the top of the slider (16), and two slide rails (13) are provided, and the two slide rails (13) are symmetrically provided about the center line of the operating table (5).

3. The chip packaging mounter according to claim 1, characterized in that: A mounting frame (4) is installed at the edge of the top surface of the workbench (2), and a patch mechanism (3) is installed on the mounting frame (4).

4. The chip packaging machine according to claim 1, characterized in that: A plurality of the suction flow channels (12) are provided, and the plurality of suction flow channels (12) are provided at equal distances on the end surface of the operating table (5), and each of the suction flow channels (12) is connected to the main pipe (8) via a branch pipe (7), and a one-way valve (14) is installed on the surface of each branch pipe (7).

5. The chip packaging mounter according to claim 1, characterized in that: A plurality of adsorption holes (11) are provided, and the plurality of adsorption holes (11) are provided at equal distances on the top surface of the operating table (5).

6. The chip packaging mounter according to claim 1, characterized in that: A sealing door is movably mounted on the outer surface of the device body (1) via hinges.

7. The chip packaging mounter according to claim 1, characterized in that: A controller (6) is installed on the top surface of the workbench (2).

Images