Clamp for single-face grinding of double-face grinding equipment

By using a single-sided grinding fixture in a double-sided grinding equipment and using mobile gaskets to protect the ceramic surface, the problems of grinding accuracy and yield of ceramic film circuits are solved, and a high-precision and low-cost single-sided grinding effect is achieved.

CN223223140UActive Publication Date: 2025-08-15GUANGZHOU AURORA TECHNOLOGIES CO LTD
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Patent Information

Application Number
CN202421970071.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-15
Publication Date
2025-08-15
Estimated Expiration
2034-08-15

AI Technical Summary

Technical Problem

In the prior art, the double-sided grinding method is difficult to ensure the grinding accuracy and yield of the ceramic film circuit, especially in the field of optical communication, which leads to scratches on the ceramic surface and uneven grinding efficiency.

Method used

A single-sided grinding fixture using a double-sided grinding equipment includes a fixed fixture and a moving gasket. The moving gasket is fitted with the fixed fixture. A through hole is provided on the fixed fixture. The moving gasket serves as a sacrificial layer to protect the ceramic surface, realizing single-sided grinding.

Benefits of technology

Improve the grinding processing accuracy and yield, avoid scratches on the ceramic surface, control the damage rate is less than 5%, and the appearance yield is greater than 95%.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a fixture for single-sided grinding of double-sided grinding equipment, which relates to the technical field of solid hole thin film circuit precision grinding and processing, and comprises a fixed fixture and a movable gasket, and the movable gasket is positioned on one side of the fixed fixture and can be attached to the fixed fixture. The cross section of the movable gasket and the cross section of the fixed clamp are the same in shape and size, and a through hole capable of containing a machined workpiece is formed in the fixed clamp. According to the clamp for single-face grinding of the double-face grinding equipment, the grinding machining precision and the grinding yield can be improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of precise grinding processing of solid hole thin film circuits, in particular to a single-side grinding fixture for double-side grinding equipment. Background Art

[0002] The manufacturing process of ceramic thin film circuits generally includes steps such as grinding and ceramic processing, sputtering heat treatment, and metal surface treatment. Among them, electronic components such as filters have high requirements for the thickness tolerance of ceramic dielectrics. Especially in the field of optical communications, the thickness tolerance is determined by the grinding process accuracy.

[0003] For bare ceramics, double-sided grinding cannot preserve the original fired surface of one side, causing scratches on the original sintered surface of the ceramic and low grinding accuracy.

[0004] For ceramic copper-plated sheets, due to the working principle of double-sided grinding, the rotation directions of the upper and lower grinding discs are relative, and the fixture will rotate during the processing, that is, one side will always have a higher grinding efficiency than the other side, and the grinding yield is low. Utility Model Content

[0005] The purpose of the utility model is to provide a single-side grinding fixture for double-side grinding equipment to solve the problems existing in the above-mentioned prior art and to improve the grinding accuracy and grinding yield.

[0006] To achieve the above purpose, the present invention provides the following solutions:

[0007] The utility model provides a fixture for single-side grinding of double-side grinding equipment, comprising a fixed fixture and a movable gasket, wherein the movable gasket is located on one side of the fixed fixture and can be fitted with the fixed fixture, the cross-section of the movable gasket is the same as the cross-section shape and size of the fixed fixture, and the fixed fixture is provided with a through hole for placing a workpiece to be processed.

[0008] Preferably, the fixing fixture and the movable gasket are both gear-shaped.

[0009] Preferably, the thickness of the movable gasket is 0.5 mm, 1.0 mm, 2.0 mm, 3.0 mm or 5.0 mm.

[0010] Preferably, the thickness of the fixing fixture is 0.1 mm, 0.2 mm, 0.3 mm, 0.5 mm or 1.0 mm.

[0011] Preferably, the thickness of the processed workpiece is 0.15±0.050 mm, 0.25±0.050 mm, 0.35±0.100 mm, 0.55±0.100 mm or 1.050±0.100 mm.

[0012] Compared with the prior art, the utility model has achieved the following technical effects:

[0013] For bare ceramics, a movable gasket is placed on one side of the fixed fixture, so that the movable gasket acts as a sacrificial layer to protect the ceramic surface during the machining process, achieving single-sided grinding. This can retain the original fired surface of one side and avoid scratches on the original sintered surface of the ceramic, effectively improving the single-sided grinding accuracy while ensuring low cost and easy operation.

[0014] For ceramic copper-plated sheets, the movable gasket is placed on one side of the fixed fixture, so that the movable gasket serves as a sacrificial layer to achieve single-sided grinding. This can not only improve the grinding yield and control the breakage rate to less than 5%, but also ensure that there are no obvious scratches on the surface of the processed workpiece, and the appearance yield is greater than 95%. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0016] Figure 1 A schematic structural diagram of a single-side grinding fixture for a double-side grinding device provided by the present invention;

[0017] Figure 2 A schematic structural diagram of the movable gasket provided by the utility model;

[0018] Figure 3 A schematic diagram of the structure of the fixing fixture provided by the utility model;

[0019] In the figure: 1-fixed fixture; 2-processed workpiece; 3-movable gasket. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] The purpose of the utility model is to provide a single-side grinding fixture for double-side grinding equipment to solve the problems existing in the prior art and to improve the grinding accuracy and grinding yield.

[0022] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0023] The utility model provides a single-side grinding fixture for double-side grinding equipment, such as Figures 1 to 3 As shown, it includes a fixed fixture 1 and a movable gasket 3. The movable gasket 3 is located on one side of the fixed fixture 1 and can fit with the fixed fixture 1. The cross-section of the movable gasket 3 is the same as the cross-section shape and size of the fixed fixture 1. The fixed fixture 1 is provided with a through hole for placing the workpiece 2.

[0024] Furthermore, the fixing fixture 1 and the movable gasket 3 are both gear-shaped.

[0025] Furthermore, the thickness of the movable gasket 3 is 0.5 mm, 1.0 mm, 2.0 mm, 3.0 mm or 5.0 mm.

[0026] Furthermore, the thickness of the fixing fixture 1 is 0.1 mm, 0.2 mm, 0.3 mm, 0.5 mm or 1.0 mm.

[0027] Furthermore, the thickness of the processed workpiece 2 is 0.15±0.050 mm, 0.25±0.050 mm, 0.35±0.100 mm, 0.55±0.100 mm or 1.050±0.100 mm.

[0028] Furthermore, the target thicknesses of the processed workpiece 2 are: 0.127±0.010mm, 0.22±0.010mm, 0.30±0.010mm, 0.50±0.010mm, and 0.80±0.010mm.

[0029] The utility model also provides a ceramic single-side grinding method using a single-side grinding fixture for double-side grinding equipment, comprising the following steps:

[0030] Step 1: After the bare ceramic is sintered and formed, the ceramic substrates with qualified warpage are screened according to industry standards, and the thickness tolerance is less than 10% of the ceramic thickness. A certain number of them are prepared for grinding processing;

[0031] Step 2: Make a fixture according to the required target thickness. The fixture includes a fixed fixture 1 and a movable gasket 3. The fixed fixture 1 is used to clamp the workpiece 2, such as ceramic, during the grinding and rotating process of the equipment, so that it does not move relatively. The fixed fixture 1 and the bare ceramic move with the equipment.

[0032] Step 3: When the workpiece 2 is a copper-plated ceramic sheet, the copper on both sides of the ceramic must be removed using the fixing fixture 1. When one side of the ceramic is completely exposed, the next step is to use the movable spacer 3 to protect the exposed side of the ceramic and only process the copper on the other side.

[0033] Step 4: The mobile gasket 3 is placed directly above the fixed fixture 1 and the ceramic. The number and size of the gears are the same as those of the fixed fixture 1. The mobile gasket 3, the fixed fixture 1 and the workpiece 2 move together with the equipment. The mobile gasket 3 acts as a sacrificial layer to protect the ceramic surface during the machining process.

[0034] Step 5: After completing the single-pass processing, remove the movable gasket 3 and measure the thickness of the workpiece 2. If it is qualified, stop processing. If it is unqualified, adjust the thickness direction and continue processing with the thicker side facing outwards until it is qualified.

[0035] Step 6: After completing the stage thickness processing, if you need to process the next stage target thickness, replace the thickness of the fixed fixture 1 and repeat the third and fourth steps.

[0036] The ceramic single-side grinding processing method provided by the present invention is specifically used for the grinding processing of ceramics such as aluminum oxide, aluminum nitride, and beryllium oxide, including the grinding processing of bare ceramics and ceramics with solid hole thin film circuits after copper plating (referred to as ceramic copper-plated sheets). Bare ceramics and ceramic copper-plated sheets are collectively referred to as processing workpieces 2.

[0037] The utility model provides a single-side grinding fixture for double-side grinding equipment and a ceramic single-side grinding method. For bare ceramics, this method can retain the original fired surface of one side, avoid scratches on the original sintered surface of the ceramic, effectively improve the single-side grinding accuracy, and ensure low cost and easy operation.

[0038] For ceramic copper-plated sheets, due to the working principle of double-sided grinding, the rotation directions of the upper and lower grinding discs are relative, and the fixture will rotate during the processing, that is, one side will always have a higher grinding efficiency than the other side. Using this method can not only improve the grinding yield and control the breakage rate to less than 5%, but also there are no obvious scratches on the surface of the processed workpiece 2, and the appearance yield is greater than 95%;

[0039] This method is effective for both types of workpieces and can reduce the thickness tolerance of workpiece 2. The thickness tolerance of bare ceramics before processing is ±0.050mm, and the thickness tolerance of ceramic copper-plated sheets before processing is ±0.100mm. After processing, both can be reduced to within ±0.010mm. This method can also play the same role for similar products.

[0040] Example 1

[0041] In this embodiment, the workpiece 2 is made of bare ceramic, with a thickness of 0.15±0.050 mm. The fixed fixture 1 has a thickness of 0.1 mm and a movable spacer of 30.5 mm. The upper and lower grinding discs of the equipment rotate at a speed of 2-20 rpm, the internal gear at 2-10 rpm, the processing pressure at 50-200 kg, and the number of pieces processed is 3-22. The workpiece 2 is placed in sequence and then placed in the fixed fixture 1. The process is then performed with an inching motion to check if the workpiece 2 has slipped out. Finally, the movable spacer 3 is placed over the workpiece 2 and the fixed fixture 1. An inching motion is performed to check if the workpiece 2 has slipped out and if the fixed fixture 1 and movable spacer 3 overlap. Abrasive fluid is then dripped in to evenly wet the upper and lower grinding discs. The upper grinding disc is then pressed down. The process time is set to 10-30 minutes, and the equipment is started. After processing is completed, the thickness of the workpiece 2 is tested. The thickness range is within 0.127 mm ± 0.010 mm, the breakage rate is 4.5%, there are no obvious scratches on the surface of the workpiece 2, and the appearance yield is greater than 95%.

[0042] Example 2

[0043] In this embodiment, the workpiece 2 is bare ceramic, with a thickness of 0.25±0.050mm. The fixed fixture 1 has a thickness of 0.1mm and a movable spacer of 30.5mm. The upper and lower grinding discs of the equipment rotate at a speed of 2-20r / min, the internal gear at 2-10r / min, the processing pressure at 50-200kg, and the number of pieces processed is 3-22. The workpiece 2 is placed in order and then placed in the fixed fixture 1. The workpiece 2 is checked for slippage by inching. Finally, the movable spacer 3 is placed over the workpiece 2 and the fixed fixture 1. The workpiece 2 is checked for slippage and for overlap between the fixed fixture 1 and the movable spacer 3 by inching. Abrasive liquid is then added to evenly wet the upper and lower grinding discs. The upper grinding disc is pressed down, the processing time is set to 10-30 minutes, and the equipment is started. After processing is completed, the thickness of the workpiece 2 is tested. The thickness range is within 0.22±0.010mm, the breakage rate is 2.5%, there are no obvious scratches on the surface of the workpiece 2, and the appearance yield rate is greater than 95%.

[0044] Example 3

[0045] In this embodiment, the workpiece 2 is a copper-plated ceramic sheet with a thickness of 0.35±0.100mm. The fixed fixture 1 is 0.1mm thick, and the movable spacer is 30.5mm. The upper and lower grinding discs of the equipment rotate at a speed of 2-20r / min, the internal gear at 2-10r / min, the processing pressure at 50-200kg, and the number of pieces processed is 3-22. The workpiece 2 is arranged in sequence and then placed in the fixed fixture 1. The workpiece 2 is checked for slippage by inching. Finally, the movable spacer 3 is placed over the workpiece 2 and the fixed fixture 1. The inching is checked for slippage and for overlap between the fixed fixture 1 and the movable spacer 3. Abrasive fluid is then added to evenly wet the upper and lower grinding discs. The upper grinding disc is then pressed down. The processing time is set to 10-30 minutes, and the equipment is started. After processing is completed, the thickness of the workpiece 2 is tested. The thickness is within the range of 0.30±0.010mm, the breakage rate is 0%, there are no obvious scratches on the surface of the workpiece 2, and the appearance yield rate is greater than 95%.

[0046] Example 4

[0047] In this embodiment, the workpiece 2 is a copper-plated ceramic sheet with a thickness of 0.55±0.100mm. The fixed fixture 1 is 0.1mm thick, and the movable spacer is 30.5mm. The upper and lower grinding discs rotate at a speed of 2-20r / min, the internal gear at 2-10r / min, the processing pressure at 50-200kg, and the number of pieces processed is 3-22. The workpiece 2 is placed in order and then placed in the fixed fixture 1. The process is then performed with an inching motion to check if the workpiece 2 has slipped out. Finally, the movable spacer 3 is placed over the workpiece 2 and the fixed fixture 1. The process is then performed with an inching motion to check if the workpiece 2 has slipped out and if the fixed fixture 1 and movable spacer 3 are aligned. Abrasive fluid is then added to evenly wet the upper and lower grinding discs. The upper grinding disc is then pressed down. The process time is set to 10-30 minutes, and the equipment is started. After processing is completed, the thickness of the workpiece 2 is tested. The thickness is within the range of 0.50±0.010mm, the breakage rate is 0%, there are no obvious scratches on the surface of the workpiece 2, and the appearance yield is greater than 95%.

[0048] Example 5

[0049] In this embodiment, the workpiece 2 is a copper-plated ceramic sheet with a thickness of 1.050±0.100mm. The fixed fixture 1 is 0.1mm thick, and the movable spacer is 30.5mm. The upper and lower grinding discs rotate at a speed of 2-20r / min, the internal gear at 2-10r / min, the processing pressure at 50-200kg, and the number of pieces processed is 3-22. The workpiece 2 is placed in order and then placed in the fixed fixture 1. The workpiece 2 is checked for slippage by inching. Finally, the movable spacer 3 is placed over the workpiece 2 and the fixed fixture 1. The inching is checked for slippage and for overlap between the fixed fixture 1 and the movable spacer 3. Abrasive fluid is then added to evenly wet the upper and lower grinding discs. The upper grinding disc is then pressed down. The processing time is set to 10-30 minutes, and the equipment is started. After processing, the thickness of the workpiece 2 is tested. The thickness is within the range of 0.80±0.010mm, the breakage rate is 0%, there are no obvious scratches on the surface of the workpiece 2, and the appearance yield is greater than 95%.

[0050] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only intended to help understand the method and core concept of the present invention. At the same time, those skilled in the art will find that the specific implementation methods and application scopes may vary based on the concept of the present invention. In summary, the contents of this specification should not be construed as limiting the present invention.

Claims

1. A single-side grinding fixture for a double-side grinding device, characterized in that: It includes a fixed fixture and a movable gasket, the movable gasket is located on one side of the fixed fixture and can fit with the fixed fixture, the cross section of the movable gasket has the same shape and size as the cross section of the fixed fixture, and the fixed fixture is provided with a through hole for placing the workpiece to be processed.

2. The single-side polishing fixture for double-side polishing equipment according to claim 1, characterized in that: The fixing fixture and the moving gasket are both gear-shaped.

3. The single-side polishing fixture for double-side polishing equipment according to claim 1, characterized in that: The thickness of the movable gasket is 0.5 mm, 1.0 mm, 2.0 mm, 3.0 mm or 5.0 mm.

4. The single-side polishing fixture for double-side polishing equipment according to claim 1, characterized in that: The thickness of the fixing fixture is 0.1 mm, 0.2 mm, 0.3 mm, 0.5 mm or 1.0 mm.

5. The single-side polishing fixture for double-side polishing equipment according to claim 1, characterized in that: The thickness of the processed workpiece is 0.15±0.050mm, 0.25±0.050mm, 0.35±0.100mm, 0.55±0.100mm or 1.050±0.100mm.