CMP wafer polishing carrier

Abstract

The utility model discloses a CMP wafer polishing carrier which comprises a carrier shell, a plurality of containing holes are formed in the upper portion of the carrier shell, safe edges are fixedly connected to the inner side walls of the containing holes, through holes are formed in the bottom ends of the containing holes, a containing cavity is formed in the carrier shell, the containing cavity is communicated with the through holes, and the containing cavity is communicated with the through holes. A lifting assembly is arranged in the storage cavity, and a material pushing assembly is connected to the upper portion of the lifting assembly in a lifting mode. Through the arrangement of the material pushing assembly, the lifting assembly and the placement hole, after the wafer is polished and when the wafer is taken out, the lifting assembly pushes the material pushing assembly upwards, the wafer is directly pushed out of the placement hole, the side edge of the wafer is protected without the help of a tool and a protective edge, the wafer is prevented from being scratched in the process of stripping from the hole, and the yield is improved; through the arrangement of the supporting columns, the through holes and the push plate, when materials are pushed, all the wafers can be removed from the holes at the same time, all the wafers can be taken out at a time, and the machining efficiency is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing and manufacturing, in particular to a CMP wafer polishing carrier. Background Art

[0002] As an advanced polishing method that combines chemical etching and mechanical friction, CMP technology has become an important means of flattening the surface of semiconductors. In the CMP process, wafer polishing carriers play a vital role.

[0003] Currently, the aperture of the CMP wafer polishing carrier is circular. Once a circular wafer is placed in the carrier hole, it is not easy to remove it. Auxiliary tools need to be used to force it out. During operation, it is easy to cause damage such as scratches and chipping of the wafer. Moreover, manual labor can only be used to remove the wafer one by one, which affects processing efficiency. Utility Model Content

[0004] In order to overcome the shortcomings of the existing technology, one of the purposes of the present invention is to provide a CMP wafer polishing carrier. Through the set pushing assembly, lifting assembly, and placement hole, after the wafer polishing is completed, when the wafer is taken out, the lifting assembly pushes the pushing assembly upward to push the wafer directly out of the placement hole without the aid of tools. The edge guard protects the side edges of the wafer, avoiding scratches on the wafer during the process of removing the hole, thereby improving the yield; through the set support columns, through holes, and push plates, all wafers can be removed from the hole together when pushing the material, and all wafers can be taken out at one time, greatly improving the processing efficiency.

[0005] One of the objectives of the present invention is achieved by the following technical solution: a CMP wafer polishing carrier, comprising: a carrier housing, a plurality of placement holes being formed on the upper portion of the carrier housing, edge guards being fixedly connected to the inner sidewalls of the placement holes, through holes being formed at the bottom ends of the placement holes, a storage cavity being formed inside the carrier housing, the storage cavity being connected to the through holes, a lifting assembly being provided inside the storage cavity, and a material pushing assembly being connected to the lifting portion above the lifting assembly;

[0006] The lifting assembly includes a servo motor, a side plate, and a movable shell 6. A bidirectional threaded rod is rotatably connected between the opposite surfaces of the two side plates. The output end of the servo motor is fixedly connected to one end of the bidirectional threaded rod. The outer wall of the bidirectional threaded rod is threadedly connected to a symmetrically arranged displacement plate. The side walls of the two displacement plates are rotatably connected to a movable frame. The top of the movable frame is provided with a sliding rod. The inner walls of the front and rear sides of the movable shell 6 are each provided with a sliding groove. The side walls of the two sliding rods are slidably connected to the inner wall of the sliding groove.

[0007] The pusher assembly includes a push plate corresponding to the placement hole position, the bottom end of each push plate is fixedly connected to a support column, and the bottom end of each support column is fixedly connected to a bottom plate. Through the provided pusher assembly, lifting assembly, and placement hole, after the wafer is polished and removed, the lifting assembly pushes the pusher assembly upward to directly push the wafer out of the placement hole without the need for tools. The edge guard protects the side of the wafer, avoiding scratches during the removal process, thereby improving the yield rate. Through the provided support column, through hole, and pusher plate, all wafers can be removed from the hole together during pushing, and all wafers can be removed at once, greatly improving processing efficiency.

[0008] According to the CMP wafer polishing carrier, the outer side walls of the push plate are in contact with the inner side walls of the edge guard.

[0009] According to the CMP wafer polishing carrier, the side walls of the support pillars are slidably connected to the inner side walls of the through holes.

[0010] A CMP wafer polishing carrier is provided, wherein the bottom end of the base plate is fixedly connected to the top end of the movable shell 6 .

[0011] According to the CMP wafer polishing carrier, the side plates and the bottom ends of the servo motor are fixedly connected to the bottom inner wall of the storage chamber.

[0012] According to the CMP wafer polishing carrier, the edge guard is made of rubber material, which protects the wafer from being scratched when the hole is removed.

[0013] According to the CMP wafer polishing carrier, the side walls of the placement hole are provided with auxiliary ears to assist in placing the wafer.

[0014] According to the CMP wafer polishing carrier, the shape of the push plate is adapted to the shape of the placement hole.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0017] Figure 1 This is a three-dimensional diagram of a CMP wafer polishing carrier according to the present invention;

[0018] Figure 2 This is a three-dimensional diagram of a carrier shell of a CMP wafer polishing carrier of the present invention;

[0019] Figure 3This is a cross-sectional view of a CMP wafer polishing carrier according to the present invention;

[0020] Figure 4 This is a structural diagram of the pusher assembly and the lifting assembly of a CMP wafer polishing carrier of the present utility model.

[0021] Legend:

[0022] 1. Carrier shell; 2. Edge guard; 3. Pusher assembly; 4. Lifting assembly; 101. Placement hole; 102. Auxiliary ear; 103. Through hole; 104. Storage cavity; 301. Bottom plate; 302. Support column; 303. Pusher plate; 401. Displacement plate; 402. Bidirectional threaded rod; 403. Servo motor; 404. Side plate; 405. Slide rod; 406. Movable shell; 407. Slide groove; 408. Movable frame. DETAILED DESCRIPTION

[0023] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0024] Reference Figure 1-4 The present invention provides a CMP wafer polishing carrier according to an embodiment of the present invention, which includes: a carrier shell 1, a plurality of placement holes 101 are provided on the upper portion of the carrier shell 1, and auxiliary ears 102 are provided on the side walls of the placement holes 101 to facilitate the placement of wafers. A protective edge 2 is fixedly connected to the inner side wall of the placement hole 101. The protective edge 2 is made of rubber material to protect the wafer from being scratched when the wafer is removed from the hole. A through hole 103 is provided at the bottom end of each placement hole 101. A storage cavity 104 is provided inside the carrier shell 1, and the storage cavity 104 is connected to the through hole 103. A lifting assembly 4 is provided inside the storage cavity 104, and a pusher assembly 3 is connected to the lifting assembly 4.

[0025] The lifting assembly 4 includes a servo motor 403, a side plate 404, and a movable shell 406. A bidirectional threaded rod 402 is rotatably connected between the opposite surfaces of the two side plates 404. The output end of the servo motor 403 is fixedly connected to one end of the bidirectional threaded rod 402. The bottom ends of the side plates 404 and the servo motor 403 are fixedly connected to the bottom inner wall of the storage chamber 104. The outer wall of the bidirectional threaded rod 402 is threadedly connected to a symmetrically arranged displacement plate 401. The side walls of the two displacement plates 401 are rotatably connected to a movable frame 408. The top of the movable frame 408 is provided with a sliding rod 405. The inner walls of the front and rear sides of the movable shell 406 are each provided with a sliding groove 407. The side walls of the two sliding rods 405 are slidably connected to the inner wall of the sliding groove 407.

[0026] The pushing assembly 3 includes a pushing plate 303 corresponding to the position of the placement hole 101. The shape of the pushing plate 303 is adapted to the shape of the placement hole 101. The outer side walls of the pushing plate 303 are in contact with the inner side walls of the edge guard 2. The bottom ends of the pushing plates 303 are fixedly connected to the support columns 302. The side walls of the support columns 302 are slidingly connected to the inner side walls of the through holes 103. The bottom ends of the support columns 302 are fixedly connected to the bottom plate 301. The bottom end of the bottom plate 301 is fixedly connected to the top of the movable shell 406. After polishing, the wafer is taken out by starting the servo motor 403 to drive the two-way threaded rod 402 to rotate, driving the two displacement plates 401 to move toward each other, thereby driving the movable frame 408 to extend, and the slide rod 405 moves upward to cooperate with the slide groove 407 to slide, thereby pushing the pushing assembly 3 upward to push the wafer out of the placement hole 101 directly without the help of tools. The edge guard 2 protects the side of the wafer, avoiding scratches on the wafer during the removal process, thereby improving the yield rate; through the support column 302, through hole 103, and push plate 303 provided, when pushing the material, because the bottom end of each placement hole 101 is provided with a push plate 303, it is connected to the bottom plate 301 through the support column 302, and then when the lifting assembly 4 is pushed upward, each push plate 303 is pushed upward together, thereby removing all the wafers together, and taking out all the wafers at one time, which greatly improves the processing efficiency.

[0027] Working principle: When in use, the auxiliary ear 102 is used to assist in placing the chip into the placement hole 101, and then polishing is performed. After polishing is completed, when the chip is taken out, the servo motor 403 is started to drive the bidirectional threaded rod 402 to rotate, driving the two displacement plates 401 to move toward each other, and then driving the movable frame 408 to extend, and the slide rod 405 moves upward to cooperate with the slide groove 407 to slide, and then push the pushing assembly 3 upward. Because the bottom end of each placement hole 101 is provided with a push plate 303, it is connected to the bottom plate 301 through the support column 302, and then when the lifting assembly 4 is pushed upward, each push plate 303 is pushed upward together, and then all the chips are removed from the hole together, and all the chips are taken out at one time.

[0028] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A CMP wafer polishing carrier, comprising: The carrier shell (1) is characterized in that a plurality of placement holes (101) are provided on the upper part of the carrier shell (1), the inner side walls of the placement holes (101) are fixedly connected with edge guards (2), the bottom ends of the placement holes (101) are provided with through holes (103), a storage cavity (104) is provided inside the carrier shell (1), the storage cavity (104) is connected with the through holes (103), a lifting assembly (4) is provided inside the storage cavity (104), and a material pushing assembly (3) is connected to the lifting assembly (4); The lifting assembly (4) includes a servo motor (403), a side plate (404), and a movable shell (406); a bidirectional threaded rod (402) is rotatably connected between the opposite surfaces of the two side plates (404); the output end of the servo motor (403) is fixedly connected to one end of the bidirectional threaded rod (402); the outer wall of the bidirectional threaded rod (402) is threadedly connected to a symmetrically arranged displacement plate (401); the side walls of the two displacement plates (401) are rotatably connected to a movable frame (408); the top of the movable frame (408) is provided with a sliding rod (405); the inner walls of the front and rear sides of the movable shell (406) are each provided with a sliding groove (407); the side walls of the two sliding rods (405) are slidably connected to the inner wall of the sliding groove (407); The pushing assembly (3) comprises a pushing plate (303) corresponding to the position of the placement hole (101), the bottom end of each pushing plate (303) is fixedly connected to a supporting column (302), and the bottom end of each supporting column (302) is fixedly connected to a bottom plate (301).

2. A CMP wafer polishing carrier according to claim 1, characterized in that: The outer side walls of the push plate (303) are in contact with the inner side walls of the edge guard (2).

3. A CMP wafer polishing carrier according to claim 1, characterized in that: The side walls of the support column (302) are slidably connected to the inner side walls of the through hole (103).

4. A CMP wafer polishing carrier according to claim 1, characterized in that: The bottom end of the bottom plate (301) is fixedly connected to the top end of the movable shell (406).

5. A CMP wafer polishing carrier according to claim 1, characterized in that: The bottom ends of the side plates (404) and the servo motor (403) are fixedly connected to the inner wall of the bottom end of the storage cavity (104).

6. A CMP wafer polishing carrier according to claim 1, characterized in that: The material of the edge guard (2) is rubber.

7. A CMP wafer polishing carrier according to claim 1, characterized in that: Side walls of the placement hole (101) are each provided with a secondary ear (102).

8. A CMP wafer polishing carrier according to claim 1, characterized in that: The shape of the push plate (303) is adapted to the shape of the placement hole (101).

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