Wafer box placing platform for packaging

Abstract

The utility model discloses a wafer box placing platform for packaging. The wafer box placing platform comprises a placing mechanism and a supporting mechanism, the placing mechanism comprises a tray used for placing a wafer box, the size of the tray is smaller than that of a wafer box packaging bag, and the tray can be completely sleeved with the wafer box packaging bag; the supporting mechanism is used for supporting the tray from the bottom, and the transverse size of the supporting mechanism adjacent to the tray is also smaller than that of the wafer box packaging bag, so that the tray can be smoothly arranged at the bottom of the wafer box packaging bag in a sleeving mode. According to the wafer box placing platform for packaging, the wafer box to be packaged can be placed on the platform in the packaging process by using the platform, then the wafer box and the platform are sleeved with a packaging bag from top to bottom, and therefore scratching between the wafer box and the packaging bag can be avoided in the packaging process; the packaging bag is prevented from being scratched, damaged and the like, and the purposes of improving the packaging quality, improving the product yield, reducing customer complaints and the like can be achieved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor production, and in particular relates to a wafer box placement platform for packaging. Background Art

[0002] Wafers are the basic materials for manufacturing semiconductor chips, so the surface cleanliness of wafers is very important for the processing of semiconductor chips. After processing, wafers need to be stored in wafer boxes. At the same time, in order to ensure that the wafers are not contaminated or damaged during transportation or handling, the wafer boxes need to be packaged in packaging bags. The packaging machine is a device used to evacuate and seal the packaging bag containing the wafer box. However, before placing it in the packaging machine, some preparatory work is required, including inspecting the wafer box, applying tape to the box, placing the box in the packaging bag, and adding desiccant. Among them, placing the wafer box in the packaging bag is a very critical step. If the operation is improper, the packaging bag may be damaged and cause product abnormalities.

[0003] In the actual packaging process of a wafer box, the wafer box to be packaged is first placed on a table. The packaging bag is then opened and placed over the wafer box from top to bottom along the outside of the wafer box. The packaging bag and wafer box are then laid down together, and the wafer box is manually pushed into the bag. Finally, the bag is folded over to facilitate subsequent sealing. However, since the wafer box is heavy when filled with wafers and the outside of the box is not flat but uneven, and the packaging bag is made of PE and aluminum foil, which are not scratch-resistant, the outer wall of the wafer box can easily scratch the bag during the process of pushing the wafer box into the bag, sometimes even scratching the bag. This poses a risk of air leakage after the bag is sealed. Air leakage can contaminate the wafers in the wafer box, resulting in wafer scraping and customer complaints.

[0004] Therefore, it is necessary to further improve the method of pushing the wafer box into the packaging bag during the wafer box packaging process, and provide a wafer box placement platform for packaging. Utility Model Content

[0005] The purpose of the utility model is to provide a wafer box placement platform for packaging in order to solve the deficiencies of the prior art.

[0006] The purpose of this utility model is achieved by the following technical solutions:

[0007] A wafer box placement platform for packaging, comprising a placement mechanism and a support mechanism;

[0008] The placement mechanism includes a tray for placing the wafer box, wherein the tray is smaller than the wafer box packaging bag and can be completely inserted into the wafer box packaging bag;

[0009] The support mechanism is used to support the tray from the bottom, and the lateral dimension of the support mechanism adjacent to the tray is also smaller than that of the wafer box packaging bag, so that the tray can be smoothly inserted into the bottom of the wafer box packaging bag.

[0010] Preferably, baffles are provided on three sides of the tray.

[0011] Preferably, grooves are formed above the two baffles that are arranged opposite to each other.

[0012] Preferably, each corner of the tray is provided with a rounded structure.

[0013] Preferably, the support mechanism comprises, from top to bottom, a bottom support, an upper support crossbar, a vertical rod and a lower support crossbar;

[0014] The bottom bracket is located at the bottom of the tray and is used to support the tray;

[0015] The upper supporting cross bar is located at the bottom of the bottom bracket and is used to support the bottom bracket;

[0016] The vertical rod is located between the upper supporting cross bar and the lower supporting cross bar, and is used to support the tray so that it is located at a certain height.

[0017] Preferably, the tray is made of plastic, and the base is made of metal.

[0018] Preferably, the upper supporting cross bar and the lower supporting cross bar are both arranged in a cross shape, the vertical bar is connected to the center position of the cross, and the vertical bar is located at the center position of the placement platform.

[0019] Preferably, a height-adjustable storage box is provided on the vertical rod.

[0020] Preferably, the upper supporting cross bar and the vertical bar are hollow metal bars, and the lower supporting cross bar is a solid metal bar.

[0021] Preferably, a moving wheel is provided below the lower supporting cross bar.

[0022] This application further improves the practice of pushing a wafer box into a packaging bag during the wafer box packaging process, and provides a packaging wafer box placement platform. Using this platform, the wafer box to be packaged can be placed on the platform during the packaging process, and then the packaging bag can be inserted from top to bottom to insert the wafer box and platform together. This can avoid scratching between the wafer box and the packaging bag during packaging, preventing the packaging bag from being scratched or damaged, and can achieve the goals of improving packaging quality, increasing product yield, and reducing customer complaints. Therefore, the packaging wafer box placement platform provided by this application has great practical value and technical improvement significance in the packaging process of semiconductor wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the front structure of the placement platform provided by this application;

[0024] Figure 2 This is a schematic diagram of the rear structure of the placement platform provided by this application;

[0025] Figure 3 This is a schematic diagram of the lower structure of the placement platform provided in this application;

[0026] Figure 4 It is a structural diagram of the support mechanism of the placement platform provided in this application;

[0027] Figure 5 It is a structural diagram of the pallet placed on the platform.

[0028] Description of reference numerals:

[0029] 1-tray; 11-baffle; 12-groove; 2-storage box; 3-lower support crossbar; 4-moving wheel; 5-vertical rod; 6-upper support crossbar; 7-screw; 8-bottom bracket. DETAILED DESCRIPTION

[0030] The wafer box placement platform provided in this application is as follows: Figures 1 to 5 As shown, it is mainly divided into two parts, the upper part is used to place the wafer box, and the lower part is used to support the platform. Specifically, it includes a placement mechanism located at the upper part and a support mechanism located at the lower part.

[0031] The placement mechanism includes a tray 1, which is located at the top of the platform. Its size is slightly larger than the wafer box and smaller than the wafer box packaging bag. The tray is used to place the wafer box and can be completely inserted into the wafer box packaging bag.

[0032] The shape of the tray 1 is preferably adapted to the shape of the wafer box, such as Figure 5 As shown, a typical tray is rectangular in shape as a whole.

[0033] The support mechanism is used to support the tray from the bottom, and the lateral dimension of the support mechanism adjacent to the tray is also smaller than the wafer box packaging bag. In this way, the packaging bag inserts the wafer box and the tray together from top to bottom. Since the size of the adjacent support mechanism is also smaller than the packaging bag, the packaging bag can continue to insert the adjacent support mechanism downward, so that the tray can be smoothly inserted into the bottom of the wafer box packaging bag.

[0034] When using this application, first place the chip box to be packaged on the tray 1, then put the chip box, tray and adjacent support mechanism into the packaging bag from top to bottom, and finally hold the part of the packaging bag with the packaging box inside, take out the chip box and packaging bag together, and fold the bag mouth for the subsequent sealing process.

[0035] When using this application to put the chip box into the bottom of the packaging bag, the packaging bag basically does not contact the chip box, so it can effectively avoid scratches between the chip box and the packaging bag during packaging, and prevent the packaging bag from being scratched and damaged. It has important technical value for subsequently improving packaging quality, improving product yield, and reducing customer complaints.

[0036] Preferably, baffles 11 are provided on three sides of the tray 1. The baffles 11 are mainly used to position the wafer box and also to prevent it from falling.

[0037] Because the packaging bag also inserts the tray into the wafer box, providing baffles on three sides of the tray, rather than providing baffles on all four sides, not only helps position the wafers but also minimizes the size of the tray, allowing it to fit into the packaging bag. Furthermore, preferably, rectangular grooves 12 are formed above the two opposing baffles 11. These grooves 12 are primarily intended to facilitate the packaging staff in placing and removing the wafer box.

[0038] Preferably, each corner of the tray 1 is provided with a rounded structure to ensure that the packaging bag will not be scratched when it contacts the tray during the process of taking and placing.

[0039] The tray 1 is preferably made of plastic to reduce scratches on the wafer box.

[0040] Preferably, the support mechanism includes, from top to bottom, a bottom support 8 , an upper support cross bar 6 , a vertical bar 5 and a lower support cross bar 3 .

[0041] The base 8 is located at the bottom of the tray 1. The base 8 has the same shape and size as the bottom surface of the tray 1. The base 8 is preferably made of metal, which has good pressure resistance. When fixed together with the tray 1, it can provide support for the tray 1 and ensure that the tray 1 does not deform after being placed with wafer boxes multiple times. The tray and the base can be bonded together using adhesive.

[0042] The upper support cross bar 6 is located at the bottom of the base 8 and is used to support and fix the base 8 to ensure the stability of the base 8 and the tray 1.

[0043] The vertical rod 5 is located between the upper supporting cross bar 6 and the lower supporting cross bar 3, and is used to support the pallet 1 so that it is located at a certain height to facilitate the operation of the packaging personnel.

[0044] Preferably, the upper support cross bar 6 and the lower support cross bar 3 are arranged in a cross shape, and the vertical bar 5 is connected to the center position of the cross and is located in the center position of the entire platform to prevent unbalanced weight from causing the platform to tip over.

[0045] Furthermore, a height-adjustable storage box 2 is preferably provided on the vertical rod 5. A recess is provided in the center of the storage box 2 for storing materials and tools frequently used during packaging. The storage box 2 is preferably rectangular and is secured to the vertical rod 5 by two screws 7. The mounting position of the storage box 2 can be adjusted as needed.

[0046] Preferably, the upper support crossbar 6 and vertical bars 5 are hollow metal bars, while the lower support crossbar 3 is solid metal bar. Using hollow metal bars for the upper support crossbar 6 and vertical bars 5 reduces the weight of the platform and facilitates mobility. Using solid metal bars for the lower support crossbar 3 not only increases the strength of the lower crossbar 3 and prevents deformation, but also lowers the center of gravity of the entire platform, ensuring stability during packaging or movement.

[0047] The upper supporting crossbar 6, the vertical bar 5 and the lower supporting crossbar 3 are preferably connected together by welding.

[0048] Preferably, a moving wheel 4 is installed on the lower side of each of the four ends of the lower supporting cross bar 3. The moving wheel 4 is a universal wheel with a brake function, which can facilitate the operation of the platform to move back and forth or fix its position.

[0049] This application further improves the practice of pushing a wafer box into a packaging bag during the wafer box packaging process, and provides a packaging wafer box placement platform. Using this platform, the wafer box to be packaged can be placed on the platform during the packaging process, and then the packaging bag can be inserted from top to bottom to insert the wafer box and platform together. This can avoid scratching between the wafer box and the packaging bag during packaging, preventing the packaging bag from being scratched or damaged, and can achieve the goals of improving packaging quality, increasing product yield, and reducing customer complaints. Therefore, the packaging wafer box placement platform provided by this application has great practical value and technical improvement significance in the packaging process of semiconductor wafers.

[0050] Although preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they are aware of the basic inventive concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention. Clearly, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, to the extent such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to encompass such changes and modifications.

Claims

1. A wafer box placement platform for packaging, characterized in that: including a placement mechanism and a support mechanism; The placement mechanism includes a tray for placing the wafer box, wherein the tray is smaller than the wafer box packaging bag and can be completely inserted into the wafer box packaging bag; The support mechanism is used to support the tray from the bottom, and the lateral dimension of the support mechanism adjacent to the tray is also smaller than that of the wafer box packaging bag, so that the tray can be smoothly inserted into the bottom of the wafer box packaging bag.

2. The wafer box placement platform for packaging according to claim 1, wherein: Three side surfaces around the tray are provided with baffles.

3. The wafer box placement platform for packaging according to claim 2, wherein: A groove is formed above the two baffles which are arranged opposite to each other.

4. The wafer box placement platform for packaging as claimed in claim 1, characterized in that: Each corner of the tray is provided with a rounded structure.

5. The wafer box placement platform for packaging according to claim 1, wherein: The support mechanism includes, from top to bottom, a bottom support, an upper support crossbar, a vertical rod and a lower support crossbar; The bottom bracket is located at the bottom of the tray and is used to support the tray; The upper supporting cross bar is located at the bottom of the bottom bracket and is used to support the bottom bracket; The vertical rod is located between the upper supporting cross bar and the lower supporting cross bar, and is used to support the tray so that it is located at a certain height.

6. The wafer box placement platform for packaging according to claim 5, characterized in that: The tray is made of plastic, and the bottom support is made of metal.

7. The wafer box placement platform for packaging according to claim 5, characterized in that: The upper supporting cross bar and the lower supporting cross bar are both arranged in a cross shape, the vertical bar is connected to the center position of the cross, and the vertical bar is located at the center position of the placement platform.

8. The wafer box placement platform for packaging according to claim 5, wherein: The vertical rod is provided with a storage box with adjustable height.

9. The wafer box placement platform for packaging according to claim 5, wherein: The upper supporting cross bar and the vertical bar are hollow metal bars, and the lower supporting cross bar is a solid metal bar.

10. The wafer box placement platform for packaging according to claim 5, wherein: A moving wheel is provided below the lower supporting cross bar.

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