Automatic electroplating target manufacturing device
Through the automated electroplating target manufacturing device, the problems of plating defects and data recording in the preparation of solid nuclear target electroplating are solved, and the plating quality and production stability are improved, which is suitable for mass production of solid nuclear targets.
Patent Information
- Application Number
- CN202422229795.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-12
- Publication Date
- 2025-08-15
- Estimated Expiration
- 2034-09-12
AI Technical Summary
In the prior art, the electroplating preparation of solid nuclear targets lacks automated control, resulting in an increase in internal defects of the plating layer and the inability to effectively record production data, affecting the nuclide yield and drug quality.
An automated electroplating target manufacturing device is designed, including a transparent electroplating tank body, main control bottom box and touch screen control system, to realize the circulation of the plating solution and automatic parameter adjustment, combined with the discrete electroplating tank design, avoid cross-contamination and improve production stability.
It has achieved the reduction of coating defects, improved the production stability and nuclide output of solid nuclear targets, reduced the frequency of manual operation, and is suitable for mass production of solid nuclear targets.
Smart Images
Figure CN223226199U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of target making, in particular to an automated electroplating target making device. Background Art
[0002] Radionuclides are widely used in fields such as nuclear medicine, industry, and agriculture. The targets bombarded by the beam in the production and preparation of radionuclides can be divided into three types: solid, liquid, and gas. Solid targets are highly sought after due to their higher yields compared to liquid and gas targets. Solid targets can be formed using methods such as electroplating, pressing and sintering, and foil. Electroplating is the mainstream method for forming targets in the production of radionuclides such as copper-64 and gallium-68.
[0003] Electroplating preparation of solid nuclear targets has strict process control requirements. Internal defects will directly lead to a reduction in the actual distance of the beam in the target, reduce the probability of nuclear reactions, and affect the yield of nuclides. Manual control often leads to reduced quality of the nuclear target due to misoperation, and it is impossible to obtain a coating with good bonding, uniform overall distribution, few internal defects, and a smooth surface. Moreover, the target preparation mode that relies entirely on manual control cannot effectively record production data, which is not conducive to process quality control of nuclide drug production. The electroplating preparation technology of solid nuclear targets is significantly different from traditional electroplating. There is no mature automated target preparation module on the market. Since the raw materials of isotope targets are relatively expensive, isotope ions are not supplemented during the electroplating preparation of solid nuclear targets, which leads to an increase in internal defects in the coating and the appearance of surface defects such as nodules and sharp protrusions. Utility Model Content
[0004] The purpose of the present invention is to provide an automated electroplating target making device in order to solve the above problems.
[0005] The utility model achieves the above-mentioned purpose through the following technical solutions:
[0006] The automated electroplating target making device includes a main control bottom box, an upper cavity shell and a transparent electroplating tank body, wherein the upper cavity shell is installed on the top of the main control bottom box, a tank placement cavity is provided in the upper cavity shell, the transparent electroplating tank body is placed in the tank placement cavity, a take-and-place hole is provided on the top cavity wall of the tank placement cavity, a cavity flip cover plate is installed along the hole of the take-and-place hole through a plate hinge, the transparent electroplating tank body consists of a tank cavity body, a tank base installed at the bottom of the tank cavity body, and a tank cover body buckled on the top of the tank cavity body, a plating cavity tank is provided in the tank cavity body, a bracket is provided in the middle of the top surface of the tank base, a target holder is installed in the bracket, and a target holder is embedded on the tank cover body. An anode connection socket is provided, and the anode connection socket is connected to the platinum anode arranged at the bottom of the tank cover body. A cathode wiring socket is installed on the outer wall of the tank base, and a copper column is buried in the tank base. The cathode wiring socket is electrically connected to the target holder through the copper column. A peristaltic drive pump body is installed on the outer side of the upper cavity shell, and a pump head assembly is installed on the peristaltic drive pump body. A cavity shell socket is embedded in the shell wall of the upper cavity shell, and two groups of circulation holes are provided on the side wall of the tank cavity body. Pagoda joints are installed on the outer hole edges of the two groups of circulation holes, and both ends of the liquid pipe on the pump head assembly are respectively connected to the two pagoda joints.
[0007] Furthermore, a processor, a switch and a power supply are installed inside the box body of the main control bottom box, and a network port socket and a power socket are embedded and installed on the back box shell of the main control bottom box.
[0008] Furthermore, the two groups of cavity shell sockets are respectively connected to the anode connection socket and the cathode connection socket via plug wires.
[0009] Furthermore, a touch screen is fixedly mounted on the top of the upper cavity shell via a screen mounting frame, and the touch screen is communicatively connected to the processor.
[0010] Furthermore, an indicator light and a power button are installed on the front shell wall of the upper cavity shell.
[0011] Furthermore, a plurality of rubber foot pads are installed on the bottom of the main control bottom box.
[0012] Furthermore, heat dissipation holes are provided on the side box walls of the main control bottom box.
[0013] Furthermore, an air outlet is provided on the slot cover.
[0014] Furthermore, the platinum anode is a spiral electrode.
[0015] The beneficial effects are: the transparency of the electroplating tank can reach more than 90%, which is convenient for directly observing the reaction conditions during experiments or target production;
[0016] The power supply connection position uses a socket design, which is easy to connect and not easy to fall off. The positive and negative sockets are distinguished by color. The black socket is connected to the negative pole of the power supply, and the red socket is connected to the positive pole of the power supply.
[0017] The target holder is installed in the groove of the electroplating tank base. The target holder can be replaced according to different target nuclides to achieve the preparation of solid targets of the same nuclide in various shapes.
[0018] The plating solution circulation design can eliminate the extreme concentration difference during the electroplating process, accelerate the bubble disappearance rate, and reduce plating defects;
[0019] The spiral design of the platinum anode increases the anode area while preventing air bubbles from wrapping and causing circuit breaker.
[0020] The electroplating chassis and electroplating tank are discretely designed, and multiple types of solid nuclear target strips can be electroplated by replacing the electroplating tank body, and cross contamination can be avoided;
[0021] The touch screen panel controls the parameter input of the high-precision DC source and the peristaltic pump (including the peristaltic drive pump body and pump head assembly). The power supply current and pump speed are adjustable, and the parameter values can be set in time periods and automatically executed, realizing automation, reducing the frequency of manual operation by personnel, and improving the overall stability of the process. It can be used for mass production of solid nuclear targets. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 This is a front structural diagram of the automated electroplating target making device of the present invention;
[0023] Figure 2 This is a schematic top view of the structure of the automated electroplating target making device of the present invention;
[0024] Figure 3 This is a left-side structural schematic diagram of the automated electroplating target making device of the present invention;
[0025] Figure 4 This is a rear structural schematic diagram of the automated electroplating target making device of the present invention;
[0026] Figure 5 This is a schematic diagram of the internal structure of the control box of the automated electroplating target making device of the present invention;
[0027] Figure 6 It is a schematic diagram of the transparent electroplating tank structure of the automated electroplating target making device of the present invention.
[0028] The following are the descriptions of the reference numerals:
[0029] 1. Main control base box; 2. Upper cavity shell; 3. Transparent electroplated tank body; 31. Tank cover; 32. Tank cavity body; 33. Tank base; 34. Pagoda connector; 35. Cathode connection socket; 36. Copper column; 37. Target holder; 38. Platinum anode; 39. Anode connection socket; 4. Cavity shell socket; 5. Pump head assembly; 6. Peristaltic drive pump body; 7. Touch screen; 8. Indicator light; 9. Power button; 10. Cavity flap; 11. Plate hinge; 12. Network port socket; 13. Power socket; 14. Heat dissipation hole; 15. Rubber foot pad; 16. Processor; 17. Switch; 18. Power supply. DETAILED DESCRIPTION
[0030] The present invention will be further described below with reference to the accompanying drawings and embodiments:
[0031] like Figure 1-6 As shown, the automated electroplating target making device is composed of a main control bottom box 1, an upper cavity shell 2 and a transparent electroplating tank body 3;
[0032] The upper cavity shell 2 is installed on the top of the main control bottom box 1. A slot placement cavity is provided in the upper cavity shell 2. The transparent electroplated tank body 3 is placed in the slot placement cavity. A take-and-place hole is opened on the top cavity wall of the slot placement cavity. A cavity flip cover plate 10 is installed along the hole of the take-and-place hole by rotating through the plate hinge 11 to facilitate the take-and-place of the transparent electroplated tank body 3.
[0033] The transparent electroplating tank body 3 consists of a tank cavity body 32, a tank base 33 installed at the bottom of the tank cavity body 32, and a tank cover body 31 buckled on the top of the tank cavity body 32. The tank cavity body 32 is provided with a plating cavity that runs through from top to bottom, with a small bottom opening and a large top opening. A bracket is provided in the middle of the top surface of the tank base 33, and a target holder 37 is installed in the bracket. The tank base 33 at the bottom of the tank cavity body 32 is fixed by screws, and the gap between them is sealed by a sealing ring to prevent leakage and isolate the plating solution from contacting the non-plating area of the target holder 37, thereby achieving control of the shape and size of the nuclear target. The target holder can be replaced according to different target nuclides to achieve the preparation of solid targets of the same nuclide with various shapes.
[0034] An anode connection socket 39 is embedded in the tank cover 31 and connected to a platinum anode 38 at the bottom of the tank cover 31. A cathode connection socket 35 is installed on the outer wall of the tank base 33. A copper post 36 is embedded in the tank base 33. The cathode connection socket 35 is electrically connected to the target holder 37 via the copper post 36. Both the anode connection socket 39 and the cathode connection socket 35 are banana sockets, with the anode in red and the cathode in black, for easy marking and plugging.
[0035] A peristaltic drive pump body 6 is installed on the outer side of the upper cavity shell 2, and a pump head assembly 5 is installed on the peristaltic drive pump body 6. A cavity shell socket 4 is embedded in the shell wall of the upper cavity shell 2. The cavity shell socket 4 has two groups, namely positive and negative pole sockets, which are also distinguished by red and black;
[0036] Two groups of circulation holes are provided on the side wall of the tank cavity body 32, and the outer hole edges of the two groups of circulation holes are installed with pagoda joints 34. The two ends of the liquid pipe on the pump head assembly 5 are respectively connected to the two pagoda joints 34 to realize the circulation of the liquid in the electroplating cavity.
[0037] like Figures 1-6 As shown, the present invention also discloses the following multiple more optimized specific structures:
[0038] A processor 16, a switch 17 and a power supply 18 are installed inside the main control box 1. A network port socket 12 and a power socket 13 are embedded on the back shell of the main control box 1 for connecting to the power supply and the network.
[0039] The two groups of cavity shell sockets 4 are respectively connected to the anode connection socket 39 and the cathode connection socket 35 through plug wires.
[0040] A touch screen 7 is fixedly mounted on the top of the upper cavity shell 2 via a screen mounting frame for touch control and display. The touch screen 7 is communicatively connected to the processor 16 .
[0041] An indicator light 8 and a power button 9 are mounted on the front wall of the upper cavity shell 2 to display the working status of the device.
[0042] A plurality of rubber pads 15 are installed on the bottom of the main control bottom box 1 .
[0043] Heat dissipation holes 14 are provided on the side walls of the main control bottom box 1 .
[0044] The tank cover 31 is provided with two groups of air outlets, which are symmetrically distributed on the tank cover 31 .
[0045] The platinum anode 38 is a spiral electrode, which increases the anode area while preventing bubbles from wrapping and causing short circuits. The outer layer of the platinum anode 2 is wrapped with PTFE material, and the conductive part is platinum material, which is difficult to be corroded by the plating solution.
[0046] like Figures 1-6The transparent plating tank 3 in the automated electroplating target making device shown is made entirely of acrylic material. After polishing, the transparency can reach over 90%, which facilitates direct observation of the reaction during experiments or production of targets. The anode connection socket 39 and the cathode connection socket 35 are plug-in to provide power, making the connection convenient and not prone to falling off. The positive and negative sockets are distinguished by color. The pagoda connector is made of PTFE, which can form a seal through material elastic compensation to prevent the plating solution from leaking intermittently from the threads. The plating solution circulation design can eliminate the concentration difference during the electroplating process, accelerate the bubble extinction rate, and reduce coating defects.
[0047] The upper chamber shell 2 and the transparent electroplating tank 3 are discretely designed and connected through a plug. The transparent electroplating tank can be replaced to achieve electroplating preparation of various types of solid nuclear targets and avoid cross contamination.
[0048] The cavity wall of the trough placement cavity is provided with a through hole for convenient entry and exit of the tube. When in use, the transparent electroplating trough body 3 is placed in the trough placement cavity (for the convenience of observation and experiment, it can also be taken out and placed on the outside), and then the two sets of cavity shell sockets 4 are respectively connected to the anode connection socket 39 and the cathode connection socket 35 through plug wires, and the pagoda connector 34 is connected to the driving hose of the peristaltic pump (including the peristaltic drive pump body 6 and the pump head assembly 5). During electroplating, the high-precision DC source and the peristaltic pump parameter input are controlled by the touch screen 7 and the processor. The current and pump speed of the power supply 18 are adjustable, and the parameter values can be set in time periods and automatically executed to improve the stability of solid nuclear target preparation. The power supply 18 provides DC power.
[0049] Those skilled in the art should understand that the present invention is not limited by the above-mentioned embodiments. The above-mentioned embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, and these changes and improvements shall fall within the scope of the present invention to be protected.
Claims
1. An automated electroplating target making device, characterized in that: The utility model comprises a main control bottom box, an upper cavity shell and a transparent electroplating tank body, wherein the upper cavity shell is installed on the top of the main control bottom box, a tank placement cavity is provided in the upper cavity shell, the transparent electroplating tank body is placed in the tank placement cavity, a take-and-place hole is provided on the top cavity wall of the tank placement cavity, a cavity flip cover plate is installed along the hole of the take-and-place hole through the plate hinge, the transparent electroplating tank body is composed of a tank cavity body, a tank base installed at the bottom of the tank cavity body, and a tank cover body buckled on the top of the tank cavity body, an electroplating cavity tank is provided in the tank cavity body, a bracket is provided in the middle of the top surface of the tank base, a target holder is installed in the bracket, and a positive electrode is embedded on the tank cover body. A cathode connection socket is provided on the outer wall of the tank base, and a copper column is embedded in the tank base. The cathode connection socket is electrically connected to the target holder through the copper column. A peristaltic drive pump body is installed on the outer side of the upper cavity shell, and a pump head assembly is installed on the peristaltic drive pump body. A cavity shell socket is embedded on the shell wall of the upper cavity shell, and two groups of circulation holes are provided on the side wall of the tank cavity body. Pagoda joints are installed on the outer hole edges of the two groups of circulation holes, and both ends of the liquid pipe on the pump head assembly are respectively connected to the two pagoda joints.
2. The automated electroplating target making device according to claim 1, wherein: The processor, switch and power supply are installed inside the box body of the main control bottom box, and the network port socket and power socket are embedded and installed on the back box shell of the main control bottom box.
3. The automated electroplating target making device according to claim 1, wherein: The two groups of cavity shell sockets are respectively connected to the anode connection socket and the cathode connection socket through plug wires.
4. The automated electroplating target making device according to claim 2, wherein: A touch screen is fixedly mounted on the top of the upper cavity shell via a screen mounting frame, and the touch screen is communicatively connected to the processor.
5. The automated electroplating target making device according to claim 1, wherein: An indicator light and a power button are installed on the front shell wall of the upper cavity shell.
6. The automated electroplating target making device according to claim 1, wherein: A plurality of rubber pads are installed on the bottom of the main control bottom box.
7. The automated electroplating target making device according to claim 1, wherein: The side box walls of the main control bottom box are provided with heat dissipation holes.
8. The automated electroplating target making device according to claim 1, wherein: An air outlet is provided on the slot cover.
9. The automated electroplating target making device according to claim 1, wherein: The platinum anode is a spiral electrode.